As more and more crimes about credit card appears, and every country¡¦s government pursues the improvement of efficiency, the smart card system has greater and greater market potential. The international credit card organizations forecasts 5 million million dollar-market of smart card relative systems. The IC Card System has been introduced to Taiwan since 20 years ago, but the government has never tried hard to make it popular. Facing the great potential market now, how do Taiwan¡¦s firms of IC Card Industry enter international markets and get competitive advantage? This is just the topic of this thesis. In recent years, the economy of main countries in world is in recession, and the United States is threatened seriously the terrorism. All the small countries whose economy depends on these dominant ones, such as the Asian four-dragons, are affected. Fortunately, Mainland China who has cheap human resource and enormously large market, takes an innovating open-door policy in recent years, bringing a new hope to the world¡¦s economy. With the trend of globalization and internationalization, and the change of the condition between the Taiwan Strait, what kind of competitive strategies should the firms of Taiwan¡¦s IC Card Industry take to get competitive advantage in national market for survival in future, is just our issue. First of all, we analyze the world¡¦s economy, the IT industry in Taiwan, and the IC Card Industry in Taiwan; then we use Porter¡¦s Diamond Model to find out Taiwan¡¦s national competitive advantage as below: 1. Taiwan has high quality human resource capable of design and complex process work. 2. Taiwan¡¦s enterprises have the advantage of flexibility and mobility. 3. Taiwan has the advantage of expanding business toward Mainland China. Secondly, we develop several strategies for Taiwan¡¦s IC Card Industry by Ansoff¡¦s and Porter¡¦s theories as follow: 1.Moving manufacturing center to the Mainland China; 2.Targeting the Mainland China as Main Market; 3.Taking good use of the advantage of second generation IC Card System. Finally, we do case study of Vstar Electronics Inc., the No.1 firm of Taiwan¡¦s IC Card Industry, to know the practical strategy and compare with theoretical ones. As one member of Taiwan¡¦s IC Card Industry, we hope to do something for the industry, by this study and some suggestion for the government.

None

none

Three-dimensional integrated circuits (3D-IC) have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs while also helping to reduce wire delay and increase memory throughput. While this technology offers many potential advantages, it also produces large thermal mismatch stress in 3D-IC structures employing Through-Silicon-Via (TSV). The stress distribution in silicon and interconnect is affected by the via diameter and layout geometry. TSV-induced stress effects on electron/hole mobility and device performance will be studied for the widely used 6-transistor (6T) SRAM cell. Simulation results in this study show that static noise margin (SNM), Read Margin (RM) and write margin (WM) tend to increase with decreasing electron mobility or increasing hole mobility. Considering TSV-induced stress, we propose that for practical layouts of TSV-based 3D-IC, p-type substrates should be placed further away from TSVs or closer to the smaller TSVs if multiple TSVs exist. / text

3D stacked ICs (3D-SICs) with multiple dies interconnected by through-silicon-vias(TSVs) are considered as a technology driver and proven to have overwhelming advantagesover traditional ICs with a single die in a package in terms of performance, powerconsumption and silicon overhead. However, these “super chips” bring new challengesto the process of IC manufacturing; among which, testing 3D-SICs is the major andmost complex issue to deal with. In traditional ICs, tests can usually be performedat two stages (test instances), namely: a wafer sort and a package test. Whereas for3D-SICs, tests can be performed after each stacking event where a new die is stackedover a partial stack. This expands the set of available test instances. A combination ofselected test instances where a test is performed (active test instance) is known as a testflow. Test time is a major contributor to the total test cost. Test time changes with theselected test flow. Therefore, choosing a cost effective test flow which will minimizesthe test time is absolutely essential.This thesis focuses on finding an optimal test flow which minimizes the test timefor a given 3D-SIC. A mathematical model has been developed to evaluate the test timeof any test flow. Then a heuristic has been proposed for finding a near optimal test flowwhich minimizes the test time. The performance of this approach in terms of computationtime and efficiency has been compared against the minimum test time obtainedby exhaustive search. The heuristic gives good results compared to exhaustive searchwith much lesser computation time.

A mixed-signal reconfigurable platform gives the designer the choice of implementing systems using the benefits of both analog and digital circuits. The subject of this research is the implementation and application of mixed-signal reconfigurable systems utilizing floating-gate transistors and field programmable analog/digital arrays. Basic analog circuits using floating-gate CMOS devices have been developed for this research. Floating-gate based analog circuits reduce the effects of inherent property mismatch present in analog circuits. Various circuit blocks including current mirrors, gilbert multipliers, and $G_m-C$ filters were designed and experimentally demonstrated to show reduced mismatch effects. Such floating-gate transistors and circuits are the basis for the reconfigurable systems developed in this research. To enable high-performance reconfigurable systems, sub-micron and sub-$100 nm$ CMOS process nodes were used in this research. Scaling of Floating-gate devices is a key issue at small nodes. Test structures were created to verify the programming capability for floating-gate devices at various process nodes. Experimental results show scalability of floating-gate devices along with effective charge programming ability. A floating-gate based reconfigurable mixed-signal platform using Field-Programmable Array of Analog-Digital Devices (FPAADD) has been created and experimentally verified. Further FPAADD systems augmented with a CPU based digital back-end were developed to enable greater applications for such reconfigurable systems. Experimental functionality and circuits/systems created using FPAADD based systems were demonstrated for this research work.

No description available.

The purpose of this research is to develop a systematic methodology for the innovative design of Gravity Single Site IC Test Handler. First, basic characteristics of Gravity Single Site IC Test Handler are deduced. Next, all possible variants of function structure are synthesized by using the functional analysis method. Next, a system of kinematic notation is used to generate the principle solutions of each function in a functional structure and all possible design concepts of Gravity Single Site IC Test Handler are created. Then, promising design concepts are evaluated by using the decision matrix method. Finally, feasible design concepts of Gravity Single Site IC Test Handler are provided, and then optimum Gravity Single Site IC Test Handler can be synthesized by using the theory of kinematic design. Based on the foreging, four innovative design conceps of Gravity Single Site IC Test Handler are created step by step. The results of this work are of benefit to the development and innovative design for new Gravity Single Site IC Test Handler¡C

This research regards ASE(Advanced Semiconductor Engineer) company as the subject of studying, combine with two subjects of resources construct and competitive advantage, to discuss that the ASE technology receives process and the situation of resource constructing. The main research purpose, is to probe into constructing of the resource and ability organized, how move and transfer knowledge that outside make to and organize the inside effectively, and via the study mechanism of, make useful knowledge organize the memory to store and spread after absorbing , melting and putting into inside, become the foundation of organization key ability. This research adopt ¡§case study method¡¨, choose ASE by the way of depth interview, to combine the relevant paper and develop the proposition to report the resource constructing process comprehensively deeply. The main conclusion has: The ASE, to accumulate and to study experience, and strong study willing, carry on with the technological provider FCT in the dynamic course of technological transfer, study to latent know-how and skill of management in a lot of different nature nearer and nearer in a proper order, and play an aggressive role in the course of technological transfer, learn tactic knowledge and cooperate with the characteristic of technology to launch the corresponding study activity during the process of transferring, and after accumulating certain knowledge resource foundation, have build up the competitive advantage by the knowledge learning. In addition, ASE set the cross-function mechanism that communicates and role crossing over department boundary person while organizing, in order to improve the horizontal communication. This suggestion on this industry development is: 1.Key ability is obtained, cultivation, subordinate to a ministry can not be reached shortly. So, short-term interests may not represent and succeed for a long time . 2.Key value of ability come from value of customer, because one urviv grasp customer need new value e in market early than competitor only.

Abstract This study is probing into the lasting competitive strategy of innovative IC design company. The greatest difference between innovative IC design company and imitating type IC design company is : The innovative IC design company creates profits with the means of innovating, compete in the new market with new thinking and with new products, take a broad view of the future. But the imitating type IC design company keep the profits of the currently product market by means of imitating, attempt to improve efficiency or price competition. The leading rival's advantage must be sustainable, and that the competitor can not make the same advantage by imitating in the near future. Therefore, how to set up lasting competition advantage by way of innovating (Sustainable Competitive Advantage, SCA), is the theme of this study. The company face the IC design industry which change with each passing day while beginning to pursue the lasting competition advantage. Whom want to take the lead , they have to know : How to make products positioning? When is the opportune moment to learn which kind of enterprise's ability? When is the opportune moment to get ready of enterprise resources? How to produce the biggest enterprise value by the least recource? IC design company, even have super strong research and development groups , the specification of the products is in the leading industry , but only depend on cutting down the cost and pursue profits or organization reform, it is unable to set up great enterprises; A century remarkable enterprises can often defend tenaciously of key value and can be long lasting . Facing changing fast IC design industry, which industry should be focus on? Consumer IC , LCD driver IC , network application IC or niche memory? Which way should involve? Is package , testing or end customers of systematic products? A Hedgehog insist on the doing simple things well, often surpassed a multi-purpose clever fox; Even in the times of science and technology with rapid change, follow the steps of scramble , walk and then run is still an effective way of a enterprise management strategy. This study refer to Michael E. Porter ¡¥s book (Competitive Strategy) , competitive strategy and key theme industry's analysis , rival's analysis and strategy positioning. To provide the analysis of the growth and decline of five major factor in general environment and industry's environment , competitor's analysis, competitive strategy positioning, and then make the best of the advantage and choose the excellent position. In studying through wheel of competitive strategy , IC company¡¦s main aspect clear showing, and analyse through the latest industry's information , show out the subject matter and choose in each main aspect of each competitive strategy, and then match out the best innovative competitive strategy in each aspect.