At present , the smart IC card multiple applications have been accepted widely and gradually in all levels of the society. Nowadays it's not surprise for one person to own several IC cards. But such a situation will make the IC cards overload in one's purse if these varying IC card applications are not integrated appropriately. It causes cardholders' embarrassment in using them. Thus, results contract the main purpose of the IC card¡¦s invention which would prove the convenient management for multiple applications. In this study, the management of integration for multi-application in one card was implemented . According to retail and marketing report with the service trade in America and Europe, 80% profit come from 20% loyal customer, so maintain existing loyalty of customer and improve them purchase and how about develop the new travelers continuously, let them become loyal customer is important . The dividend accumulates some and exchanges goods, and can enjoy the favorable practice to consume to hold the card in the special trade company, has already solemnly become a tool which attract customers to consume continuously with, but has observed various kinds of savings cards that the society has already existed now or accumulated a card and has been only limited to applying to the single trade company or the single group, cause consumers to reduce greatly too in maintaining customer's loyal validity in the inconvenience on of using. This research is directed against this shortcoming promptly, develop one set and jointly accumulate the operation way to click, analyses its financial feasibility. Direct against this disappearance, if can develop one set and jointly accumulate some mechanisms of exchanging goods together, can create the win-win situation. In the research structure of this research, collect relevant industry's information that the dividend accumulates some operation at first, by accumulating the cognition with the foundation of some industries and understanding to the dividend. Then regarded as the key goal of this research by way of planning one set and jointly accumulating the operation that is clicked. And, in order to probe into the actual feasibility of this operation way, utilize computer software to build and construct a financial assessment model linked dynamically, include relevant operation materials and the operation ways of the parameter and pictures advised in among them. And the financial affairs utilizing the financial model to make predict the reference basis that can be assessed as investment.

As the the development stage of IC design industry changes, the IC design companies in Taiwan increasingly become more and more. Taiwan design industry ranks the second place in the world, following behind the American IC design industry. The technology becomes maturer and the company scale becomes larger. The demand of the integration is a very important trend for the IC design industry. The resources Taiwan companies have are not enough to sustain the competitive advantage in the global competition. From the viewpoint of markets and products, the systematic companies own the power to decide the product standards. The product development is inclined to the development of Digital Home Integretion. This study is based on the RBV theory to observe the way to compete during the different IC design companies, the industrial analysis by the Five Forces model, and the degree of commanding the demands of customers. Finally, we hope to find out some KSFs (Key Success Factors) of Taiwan IC design companies and IC design industry. This study finds that the scope of product line becomes more and more important. How to decide and develop the new product line efficiently and successfully is a KSF in the future of the IC industry. In the past, Taiwan IC design companies owned the competitive advatege by low-cost stratege, but it is not the KSF in the modern time. The company will focus on the development of integration, brand, and the demand of the product market. We interviewed the executives of the different IC companies in Taiwan, and regarded those companies as our target companies of case study to analyze their KSFs. We discussed their strategies and KSFs by the model of this study. We also find the KSFs may change as the time moves. Key Words¡GIC industry, resource-based theory, KSFs

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Abstract¡G The main aim of this paper is to utilizing the Shadow Moirè method to study the moisture effect on the warpage of PBGA IC package under the IR-reflow process. An environmental controlled box is designed and built. Three combinations of different moisture and temperature status are chosen for the purpose of study. The result shows that the moisture and temperature change do yielding the change of the warpage of the IC package.

The main aim of this study is to extending the holographic interferometry technique to measure the effect of the temperature ramp-up rate on the warpage of IC packages in the IR-reflow process . It is noted that both the warpage and the ambient temperature change can cause image fringes. Therefore, an auxiliary sphere is used to identify the fringe numbers caused by the ambient temperature change during the experiment. Then, the Taguchi method will be deduced to study the effect of the temperature ramp-up rate and peak waiting temperature on the warpage of PBGA package in the IR-reflow process.

The main aim of this paper is using the moiré interferometry to measure interface of the IC package structure materials. The moiré interferometry with high sensitivity can use the fringes to measure displacement field in small structure materials. The objective of this study is to obtain displacement fields the interfacial adhesion of the substrate and epoxy by using the moiré interferometry. The peeling strain, shearing strain and tensile strain at the interface adhesion are distinguished by utilizing the experiment of data of u-displacement fields and v-displacement field. Finally, a turning point of failure, in found.

Abstract The study on SOC of article is one of package way for CSP. The SOC transmits messages by Solder Ball joining the board. It can make the volume of product decrease, but the reliability reduces on using. So the reliability of Solder Ball is a very important topic for study. The article for Solder Ball uses the Mixed-Viscoplastic way to simulate the warpage state of SOC when the temperature of Solder Ball rises by ANSYS. Then using the Viscoplastic material parameter simulates the acts by TCT experiment and checks the suitable Fatigue Model to get the analysis results turn into the reliability data. The reliability data puts to the proof with the experimental reliability data and compares differences to other documents.

The main aim of this paper is to study for the warpage and von Mises stress of PBGA package caused by the variations of mechanical properties of materials in IR-reflow process. At first, taking advantage of the package symmetry only one quarter of the package was modeled by MSC. Marc. The influence of heat transfer was considered by comparing the results of Coupled mechanical-heat transfer analysis and Mechanical analysis. In the second part, the coefficient of thermal expansions and elastic modulus of molding compound and substrate are selected as the four control factors, and the influence of the four control factors to the warpage and von Mises stress were observed. At last, emperical formulas to predicted warpage and von Mises stress values were obtained.

Abstract This study is dedicated to discussing Semiconductor Industrial Cluster competitive advantages on both shores of the Taiwan Straits, and finding out Taiwan IC design industries co-competition strategies with Main Land China. The theory base on the Industrial Cluster by Michael E. Porter. The analytical tool is Diamond Structure of The Competitive Advantage of nations by Michael E. Porter. There are four dimensions¡GFactor Endowments, Demand Conditions, Firm Strategy, Structure, and Rivalry, Related and Supporting Industries, and another two factors¡G Government and Chance. The conclusions of this study are presented as follows: 1. Taiwan IC design industries must make use of Main Land China IC design resource to increase Taiwan competitive advantages. 2. For increase IC design human resource supply purpose. The industrial policy made by Taiwan government must be changed to recruit Hi-Tec engineer from Main Land China. 3. Taiwan has on geography and culture market competitive advantage, IC design industries should participate in establishing China industrial standard. 4. Build up Taiwan's own brand. 5. Build up patent alliance to increase Taiwan IC design industrial competitive advantages. 6. Globalize the enterprise-integrated resource.

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