<p>The aim was to develop, manufacture and evaluate diffractive lenses, or diffractive optical elements (DOE), for use in correlation with a camera to add perspective in pictures. The application is a miniaturized submarine developed in order to perform distant exploration and analysis in harsh and narrow environments. The idea is to project a laser pattern upon the observed structure and thereby add geometrical information to pictures acquired with an onboard CMOS camera. The design of the DOE-structures was simulated using the optimal rotational angle method (ORA). A set of prototype DOEs were realized using a series of microelectromechanical system (MEMS) processes, including photolithography, deposition and deep reactive-ion etching (DRIE). The projected patterns produced by the manufactured DOEs were found to agree with the simulated patterns except for the case where the DOE feature size was too small for the available process technology to handle. A post-processing software solution was developed to extract information from the pictures, called Laser Camera Measurement (LCM). The software returns the x, y and z coordinate of each laser spot in a picture and provides the ability to measure a live video stream from the camera. The accuracy of the measurement is dependent of the distance to the object. Some of the patterns showed very promising results, giving a 3-D resolution of ~0.6 cm, in each dot, at a distance of 1 m from the camera. Lengths can be resolved up til 3 m distance from the submarine.</p> / <p>Tillämpningen finns i en miniatyriserad ubåt framtagen för utforskning och analys av svåråtkomliga och trånga håligheter. Målet var att designa, tillverka och utvärdera en diffraktiv lins (DOE) för användning tillsammans med en kamera för att skapa perspektiv i bilder. Idén var att projicera ett lasermönster på objektet och därmed lägga till geometrisk information till bilderna tagna med CMOS kameran. Utformningen av DOE-strukturerna simulerades med the optimal rotational angle method (ORA). En uppsättning av prototyp DOE-linser tillverkades med hjälp av en serie mikrostrukturteknikprocesser, bland annat fotolitografi, deponering och plasmaetsning. Mönster projicerade med de tillverkade DOE-linserna stämde väl överens med önskade mönster, med undantag för de DOEs där strukturstorleken underskred processens begränsningar. En programvara, kallad Laser Camera Measurement (LCM), utvecklades för att extrahera information från bilderna. Programvaran returnerar x, y, och z koordinaterna för varje laserpunkt i en bild och ger möjlighet att mäta i en kontinuerlig videoström från kameran.  Mätosäkerheten är beroende av avståndet till objektet. Vissa mönster gav mycket lovande resultat, med en 3-D upplösning på ~0.6 cm, i varje punkt, på ett avstånd av 1 m från kameran. Längder kan upplösas upp till 3 m från kameran där ett så kallat far-field uppstår.</p> / DADU

<p>This thesis explores the potential of multifunctional silicon-based microsystems for advanced integrated nanospacecraft (AIN). Especially, multifunctional microsystems with the coexistant functions of communications and thermal management implemented in multilayer silicon stacks are approached with systems study. Host vehicles, composed of microsystems, including micro/nano-spacecraft and spherical rovers are contemplated with respect to future performance and implications, system level design, and breadboard realizations. A module of great importance, named the "integrated communications and thermal management system for advanced integrated spacecraft" or ICTM, symbolizes the achievements within the field of self-contained microsystems and is a prioritized entity throughout the thesis. The ICTM is natively placable onboard all types of highly miniaturized craft.</p><p>The single AIN spacecraft and future clusters of these are investigated with respect to future full scale implementation of space systems designed and implemented with the distributed reconfigurable nanospacecraft cluster (DRNC) concept. Here, a true entanglement of microsystems technology (MST) and miniaturized spacecraft technology can revolutionize the applications, cost, and span of conceivable space missions.</p><p>An intended communications scenario supporting a data rate of 1 Mbps, for the transmitter, is achieved during 6 minutes with a maximum continuous power dissipation of 10 W. Thermal simulations support the expectation, of a thermally biased ICTM, that the module is capable of supporting this energy burst, by using the mechanisms of heat storage and heat switches, and still fulfilling the requirements imposed by AIN type of spacecraft. In addition, multiple functional surfaces for the ICTM are evaluated with respect to equilibrium temperature and process compatibility. The tailored surfaces provide temperature control using micromachining methods.</p><p>A design of a micromachined Ka-band front end with several MST enabled features is presented including e.g. vias, phase-shifters, and antennas. Similar antennas have been manufactured resulting in an evaluation of ring- and slot-antennas on silicon substrate. Based on a primitive version of the ICTM, a S-band patch antenna has been successfully implemented and characterized. Included in the thesis is a microthruster, an enabling technology for DRNC.</p>

<p>Microsystem interfaces to the macroscopic surroundings and within the microsystems themselves are formidable challenges that this thesis makes an effort to overcome, specifically for enabling a spacecraft based entirely on microsystems. The NanoSpace-1 nanospacecraft is a full-fledged satellite design with mass below 10 kg. The high performance with respect to mass is enabled by a massive implementation of microsystem technology – the entire spacecraft structure is built from square silicon panels that allow for efficient microsystem integration. The panels comprise bonded silicon wafers, fitted with silicone rubber gaskets into aluminium frames. Each module of the spacecraft is added in a way that strengthens and stiffens the overall spacecraft structure.</p><p>The structural integrity of the silicon module as a generic building block has been successfully proven. The basic design (silicon, silicone, aluminium) survived considerable mechanical loads, where the silicon material contributed significantly to the strength of the structural element. Structural modeling of the silicon building blocks enables rapid iterative design of e.g. spacecraft structures by the use of pertinent model simplifications.</p><p>Other microsystem interfaces treats fluidic, thermal, and mechanical functions. First, solder sealing of microsystem cavities was demonstrated, using screen-printed solder and localized resistive heating in the microsystem interface. Second, a dismountable fluidic microsystem connector, using a ridged silicon membrane, intended for monopropellant thruster systems, was developed. Third, a thermally regulated microvalve for minute flows, made by a silicon ridge imprint in a stainless steel nipple, was investigated. Finally, particle filters for gas interfaces to microsystems, or between parts of fluidic microsystems, were made from sets of crossed v-grooves in the interface of a bonded silicon wafer stack. Filter manufacture, mass flow and pressure drop characterization, together with numeric modeling for filter design, was performed.</p><p>All in all this reduces the weight and volume when microsystems are interfaced in their applications.</p>

<p>Spacecraft on interplanetary missions or advanced satellites orbiting the Earth all require propulsion systems to complete their missions. Introducing microelectromechanical systems technology to the space industry will not only reduce size and weight of the propulsion system, but can also increase the performance of the mission.</p><p>Fluid handling systems are used in chemical and electric propulsion. Some components incorporated in a fluidic handling system are presented and evaluated in this work.</p><p>Microsystems are very sensitive to contamination. Reliable, robust, and easily integrated filters were modeled, manufactured, and experimentally verified.</p><p>A fluid connector, designed to withstand large temperature variations and aggressive propellants was manufactured and characterized. Similar designs was also be used as a thermally activated minute valve.</p><p>The feasibility of a cold gas system for precise attitude control has been demonstrated. Steps towards improving the performance (from specific im-pulse 45 s) have been taken, by the integration of suspended heater elements.</p><p>For electric propulsion, two thermally regulated flow restrictors have been characterized. These devices can fine-tune the propellant flow to e.g. an ion engine.</p><p>A single-use valve using a soldered seal has also been successfully dem-onstrated within a pressure range of 5 to 100 bar.</p><p>The microsystem-based propulsion systems of tomorrow’s spacecraft need to be demonstrated in space, in order to gain necessary credibility. </p>

Direct wafer bonding has been identified as an en-abling technology for microelectromechanical systems (MEMS). As the complexity of devices increase and the bonding of multiple patterned wafers is required, there is a need to understand the factors that lead to bonding failure. Bonding relies on short-ranged surface forces, thus flatness deviations of the wafers may prevent bonding. Bonding success is determined by whether or not the surface forces are sufficient to overcome the flatness deviations and deform the wafers to a common shape. A general bonding criterion based on this fact is developed by comparing the strain energy required to deform the wafers to the surface energy that is dissipated as the bond is formed. The bonding criterion is used to examine the case of bonding bowed wafers with etch patterns on the bonding surface. An analytical expression for the bonding criterion is developed using plate theory for the case of bowed wafers. Then, the criterion is implemented using finite element analysis, to demonstrate its use and to validate the analytical model. The results indicate that wafer thickness and curvature are important in determining bonding success and that the bonding criterion is independent of wafer diameter. Results also demonstrate that shallow etched patterns can make bonding more difficult while deep features, which penetrate through an appreciable thickness of the wafer, may facilitate bonding. Design implications of the model results are discussed in detail. Preliminary results from experiments designed to validate the model, agree with the trends seen in the model, but further work is required to achieve quantitative correlation. / Singapore-MIT Alliance (SMA)

MEMS-based gas turbine engines are currently under development at MIT for use as a button-sized portable power generator or micro-aircraft propulsion sources. Power densities expected for the micro-engines require very high rotor peripheral speeds of 300-600m/s and high combustion gas temperatures of 1300-1700K. These harsh requirements for the engine operation induce very high stress levels in the engine structure, and thus call for qualified refractory materials with high strength. Silicon carbide (SiC) has been chosen as the most promising material for use due to its high strength and chemical inertness at elevated temperatures. However, the state-of-the art microfabrication techniques for single-crystal SiC are not yet mature enough to achieve the required level of high precision of micro-engine components. To circumvent this limitation and to take advantage of the well-established precise silicon microfabrication technologies, silicon-silicon carbide hybrid turbine structures are being developed using chemical vapor deposition (CVD) of thick SiC (up to ~70µm) on silicon wafers and wafer bonding processes. Residual stress control of thick SiC layers is of critical importance to all the silicon-silicon carbide hybrid structure fabrication steps since a high level of residual stresses causes wafer cracking during the planarization, as well as excessive wafer bow, which is detrimental to the subsequent planarization and bonding processes. The origins of the residual stress in CVD SiC layers have been studied. SiC layers (as thick as 30µm) with low residual stresses (on the order of several tens of MPa) have been produced by controlling CVD process parameters such as temperature and gas ratio. Wafer-level SiC planarization has been accomplished by mechanical polishing using diamond grit and bonding processes are currently under development using CVD silicon dioxide as an interlayer material. This paper reports on the work that has been done so far under the MIT micro-engine project. / Singapore-MIT Alliance (SMA)

Cette thèse présente la conception d'un microgyromètre MEMS triaxial. Les microgyromètres ont de nombreuses applications telles que le contrôle d'attitude de drones ou l'interfaces homme/machine. Les microgyromètres triaxiaux sont particulièrement avantageux car ils permettent de déterminer les trois composantes de la vitesse de rotation à partir d'un seule structure monolithique et planaire. Le principe de fonctionnement des gyromètres vibrants à effet Coriolis (CVG) a été étudié analytiquement, puis une structure originale de gyromètre triaxial monolithique et planaire a été conçue. Cette structure est constituée de quatre poutres encastrées sur un cadre déformable. Des prototypes en silicium ont été réalisés et caractérisés. L'arséniure de gallium (GaAs) a été sélectionné pour la réalisation en raison de ses propriétés piézoélectriques et de son fort potentiel de miniaturisation. Un système d'électrodes pour l'excitation et la détection des vibrations mécaniques a été mis au point. Deux procédés d'usinage du GaAs ont été développés, un procédé de gravure chimique et un procédé de gravure plasma permettant tous les deux de graver verticalement le GaAs sur 450 micromètres de profondeur. Le procédé de gravure plasma est compatible avec la réalisation du CVG triaxial. Des résonateurs de test en GaAs dopé Carbone ont été réalisés par gravure chimique pour mesurer l'évolution en température de la résistivité et des propriétés électromécaniques de ce matériau. Ces mesures ont permis d'estimer que les marches aléatoires angulaires du CVG triaxial sont inférieures à 0,025 degré par racine d'heure sur la gamme de température [-40°C +80°C] pour les trois axes de mesure. Ceci situe le potentiel du CVG triaxial conçu parmi les CVG MEMS les plus performants.

While the characteristic dimensions of electronic systems scale down to micro- or nano-world, their performance is greatly influenced. Micro-fabrication process or variations of the operating situation such as temperature, humidity or pressure are usual cause of dispersion. Therefore, it seems essential to co-integrate self-testing or self-adjustment routines for these microdevices. For this feature, most existing system parameter estimation methods are based on the implementation of high-resolution digital measurements of the system's output. Thus, long design time and large silicon areas are needed, which increases the cost of the micro-fabricated devices. The parameter estimation problems based on binary outputs can be introduced as alternative self-test identification methods, requiring only a 1-bit Analog-to-Digital Converter (ADC) and a 1-bit Digital-to-Analog Converter (DAC).In this thesis, we propose a novel recursive identification method to the problem of system parameter estimation from binary observations. An online identification algorithm with low-storage requirements and small computational complexity is derived. We prove the asymptotic convergence of this method under some assumptions. We show by Monte Carlo simulations that these assumptions do not necessarily have to be met in practice in order to obtain an appropriate performance of the method. Furthermore, we present the first experimental application of this method dedicated to the self-test of integrated micro-electro-mechanical systems (MEMS). The proposed online Built-In Self-Test method is very amenable to integration for the self-testing of systems relying on resistive sensors and actuators, because it requires low memory storage, only a 1-bit ADC and a 1-bit DAC which can be easily implemented in a small silicon area with minimal energy consumption.

Les propriétés électro-thermo-mécaniques remarquables qui peuvent apparaître dans les nanofils de silicium font l'objet d'un nombre croissant de travaux de recherche. Ces travaux de thèse de nature fortement expérimentale, visent à donner une meilleure connaissance de ces propriétés dans le cas de nanofils, en silicium monocristallin, fabriqués par approche descendante. Pour caractériser la piézorésistivité, deux méthodes de chargement mécaniques ont été développées : la flexion 4 points de puce et la traction/compression in situ avec un actionneur MEMS. La méthode 3ω a été choisie pour des mesures de conductivité thermiques. Ces propriétés ont été étudiées en fonction de la température et la contrainte dans une station sous pointes cryogénique.Les résultats montrent que les nanofils fabriqués à partir de substrats SOI amincis peuvent, de manière inattendue, être fortement contraints en compression après fabrication. Les nanofils de type p présentent, même en régime de mesure dynamique, des coefficients piézorésistifs élevés qui décroissent fortement avec la température et permettent une détection intégrée de mouvement de MEMS avec une limite de détection inférieure à l'Angström. Les mesures thermiques confirment l'effet d'échelle attendu de la conductivité thermique, la décroissance avec la température est compatible avec les résultats théoriques et expérimentaux précédemment publiés.

Pulsed LASER deposition (PLD) is widely recognized as excellent deposition technique owing to stoichiometric transfer of target material, easy preparation and high quality. Thin films from few nanometers to micrometer regime can be fabricated with equal ease. Although a batch process is not suitable for mass scale industrial production, PLD is a versatile technique, efficient and convenient for high quality basic research.  This thesis illustrates the use of PLD technique to study the emerging trends in tailoring multifunctional magnetic thin films both from basic nanoscience and device development point of view.      After a comprehensive review of magnetism in chapter 1: entitled ‘A journey through classical to modern trends in magnetism, and multifunctional thin film devices’ followed by a reasonably thorough discussion on Pulsed Laser thin film technique in Chapter 2, we present: Studies of tailoring composite high energy product permanent magnetic FePtB based thin films for applications in NEMS /MEMS, (Chapter 3). Study of search for new multiferroic materials by investigating the properties of Chromites. Crystalline Chromites are antiferromagnetic below 150oC.  However depositing thin films by PLD of the crystalline 95.5% dense targets produced by Surface Plasma Sintering, we discovered that the resulting films were amorphous and ferromagnetic beyond room temperature. Moreover advanced spectroscopic techniques revealed that the amorphized state is metallic with Cr in a mixed valence state.   An understanding of the underlying physics of the observed phenomenon has been carried out based on first principles calculations.  These results are now being considered for publication in a high profile journal.  Extensive studies on the films showing that these materials are ferromagnetic, but not ferroelectric are discussed in chapter 4. A preliminary presentation of these studies was pier reviewed and published in MRS symposium proceedings. Fabrication of Room temperature, Transparent, high moment soft ferromagnetic amorphous Bulk metallic glass based FeBNbY thin films by PLD, suitable for Nanolithography in NEMS/MEMS device development .  (Chapter 5) From a basic study point of view on new trends on magnetism we present: 4. The use of PLD technique to demonstrate room temperature ferromagnetism in undoped MgO, and V-doped MgO thin films.  Both of these oxides which do not contain any intrinsically magnetic elements and are diamagnetic in their bulk form belong to a new class of magnetic films, the so called d0magnets signifying that robust above room temperature ferromagnetism arising from defects and controlled carriers and no occupied d-states can be tailored in semiconductors and insulators.  These, mostly ZnO and MgO based thin films which may be classified as Dilute Magnetic Semiconductors, DMS, and Dilute Magnetic Insulators, DMI, are now the materials of active interest in future Electronics involving components which exploit both charge and spin of electrons in the arena of SPINTRONICS. Extensive characterization of magnetic, electrical, optical properties and microscopic structure has ensured development of high quality magnetic materials for future applications. Further research on these promising materials is expected to yield new generation spintronic devices for better performance in terms of efficiency, energy consumption and miniaturization of sizes. / QC 20120511