Les traitements plasma présentent un outil efficace, économique et écologique pour la fonctionnalisation de surfaces. Pour cette technique, l’étude du dépôt et de l’adhésion de molécules et précurseurs dans le régime de la sous-monocouche présente un intérêt majeur, car elle définit les propriétés de la surface et l’adhésion de la couche déposée sur le substrat. L’adhésion des molécules lors de la phase initiale du dépôt est contrôlée par les espèces dans le plasma ainsi que par leurs distributions énergétiques et angulaires. Dans le cadre de ce projet, une approche multidisciplinaire combinant calculs DFT et techniques expérimentales pour la préparation et la caractérisation des dépôts dans la sous-monocouche a été utilisée. Des dépôts de PS et PMMA, préparés par bombardement d’Ar sur une surface d’Ag, ont été caractérisés par XPS et ToF-SIMS. La quantité de matière déposée augmente bien avec le temps de dépôt, ou la dose d’irradiation. Les analyses par TOF-SIMS ont également montré que la proportion des grands fragments augmente au détriment des petits. Ceci est contraire aux résultats attendus et peut seulement être expliqué par la recombinaison de petits fragments sur la surface du collecteur. Cette hypothèse est supporté des calculs DFT qui ont montré que l’énergie d’adsorption des petits fragments est plus grande que celle des grands et, par conséquent, leur probabilité d’adsorption doit être également plus élevée. Les calculs DFT ont été étendus sur d’autres substrats, notamment du Si, Pt et Al2O3 et ont montrés que l’énergie d’adhésion est la plus élevée sur Si et Pt / Plasma surface treatments present an efficient, economical and ecological tool for surface functionalization. For this technique the deposition and adhesion of molecules and precursors in the sub-monolayer range are of utmost interest, since this layer defines the surface properties and the adhesion between deposit and substrate. The species in the plasma and their energy and angular distributions control the deposition process. To get insights into the latter, a multidisciplinary approach combining DFT calculations with experimental techniques is used for the preparation and characterisation of sub-monolayer deposits of PS and PMMA. The deposits are prepared by sputter deposition using an Ar beam and analysed by ToF-SIMS and XPS. The amount of deposited matter increases well with deposition time or fluence. ToF-SIMS analyses showed also that the proportion of large fragments on the collector surface is increasing with fluence, although the opposite was expected. This can only be explained by the recombination of smaller fragments to form larger ones. This hypothesis is supported by DFT calculations which showed that the adsorption energy, and hence the adsorption probability, is higher for the small fragments than for the large ones. DFT calculations have been extended to Si, Pt and Al2O3 substrates, showing that adsorption energies are highest for Si and Pt

Die vorliegende Arbeit beschreibt einen neuartigen Fügeprozess, das sogenannte reaktive Fügen bzw. Bonden. Hierbei werden sich selbsterhaltene exotherme Reaktionen in nanoskaligen Schichtsystemen als lokale Wärmequelle für das Fügen unterschiedlichster Substrate der Mikrosystemtechnik verwendet. Das Bonden mit den reaktiven Systemen unterscheidet sich von herkömmlichen Verfahren der Aufbau- und Verbindungstechnik primär dadurch, dass durch die rasche Reaktionsausbreitung bei gleichzeitig kleinem Reaktionsvolumen die Fügetemperaturen unmittelbar auf die Fügefläche beschränkt bleiben. Entgegen den herkömmlichen Fügeverfahren mit Wärmeeintrag im Volumen, schont das neue Verfahren empfindliche Bauteile und Materialien mit unterschiedlichsten thermischen Ausdehnungskoeffizienten lassen sich besser verbinden. In der vorliegenden Arbeit werden die Grundlagen zur Dimensionierung, Prozessierung und Integration der gesputterten reaktiven Materialsysteme beschrieben. Diese Systeme werden verwendet, um heterogene Materialien mit unterschiedlichen Durchmessern innerhalb kürzester Zeit auf Wafer-Ebene und bei Raumtemperatur zu bonden. Die so erzeugten Verbindungen werden hinsichtlich der Mikrostruktur, der Zuverlässigkeit sowie der Dichtheit untersucht und bewertet. Zusätzlich wird die Temperaturverteilung in der Fügezone während des Fügeprozesses mit numerischen Methoden vorhergesagt.

No description available.

The research in permanent magnet thin films focuses on the search of new materials and methods to increase the prevalent data storage limit. In the recent past the work towards the application of these films to micro systems have also gained momentum. Materials like samarium cobalt with better magnetic properties and temperature stability are considered to be suitable in this regard. The essential requirement in miniaturization of these films is to deposit them on silicon substrates that can alleviate the micro fabrication process. In this work, an effort has been made to deposit SmCo films with better magnetic properties on silicon substrates. In the deposition of SmCo, the composition of the deposited films and the structural evolution are found to play an important role in determining the magnetic properties. Proper control over these parameters is essential in controlling the magnetic properties of the deposited films. SmCo being a two component material the composition of the films is dependent on the nature of the source and the transport of the material species from source to substrate. On the other hand, structural evolution is dependent on the energetical considerations between the SmCo lattice and substrate lattice. This most often is dominated by the lattice match between the condensing lattice and the substrate lattice. As such Si does not provide good lattice match to SmCo lattice. Hence suitable underlayers are essential in the deposition of these films. Materials like W, Cu, Mo and Cr were used as underlayers. Out of all these Cr is found to provide good lattice match and adhesion to SmCo lattice. Sputtering being the common deposition tool, SmCo could be sputtered either from the elemental targets of Sm and Co or from the compound target of SmCo5. Sputtering of elemental targets of Sm and Co provides the flexibility of varying the composition whereas sputtering from the SmCo alloy target provides to flexibility of controlling the structural evolution by different process parameters. In this work two different techniques namely Facing Target Sputtering (FTS) and Ion Beam Sputter Deposition (IBSD) were followed in depositing SmCo films. In FTS technique, SmCo films were directly deposited on silicon substrates by simultaneous sputtering of samarium and cobalt targets facing each other. This sputtering geometry enabled to achieve films with a wide composition range of 55 – 95 at. % of cobalt in single deposition. The resulting composition variation and material property variation were investigated in terms of process parameters like pressure, temperature, SubstrateTarget Distance (STD) and InterTarget Distance (ITD). The composition distribution of the films was found to be dependent on the thermalisation distances and the mean free path available during the transport. To explain the process and the composition variation, a simulation model based on Monte Carlo method has been employed. The simulated composition variation trends were in good agreement with that of the experimental observations. IBSD, known for its controlled deposition, was employed to deposit both Cr (as an underlayer) and SmCo films. Cr with close epitaxial match with SmCo induces structural evolution in deposited films. The initial growth conditions were found to play a dominant role in the structural evolution of these Cr films. Hence, initial growth conditions were modified by means of oblique incidence and preferential orientation of (200) plane was obtained. With three different angles of incidence, three different surface orientations of Cr films were achieved. These films were then used as structural templates in the deposition of SmCo films. The influence of parameters like composition, impurities, film thickness, beam energy, ion flux, annealing, angles of incidence and underlayer properties on the structural and magnetic properties of SmCo was studied. The structural evolution of SmCo has been found to depend on the structural orientation of Cr underlayers. This followed the structural relation of SmCo(100)||Cr(110)||Si(100) and SmCo(110)||Cr(100)||Si(100). A mixed surface plane orientation was observed in the case of mixed orientation Cr template. The magnetic coercivities were found to increase from 50 Oe to 5000 Oe with the change in the structure of the deposited films.

In Silizium-Nanokristall-Speichern werden im Gate-Oxid eines Feldeffekttransistors eingebettete Silizium Nanokristalle genutzt, um Elektronen lokal zu speichern. Die gespeicherte Ladung bestimmt dann den Zustand der Speicherzelle. Ein wichtiger Aspekt in der Technologie dieser Speicher ist die Erzeugung der Nanokristalle mit einerwohldefinierten Größenverteilung und einem bestimmten Konzentrationsprofil im Gate-Oxid. In der vorliegenden Arbeit wurde dazu ein sehr flexibler Ansatz untersucht: die thermische Ausheilung von SiO2/SiOx (x < 2) Stapelschichten. Es wurde ein Sputterverfahren entwickelt, das die Abscheidung von SiO2 und SiOx Schichten beliebiger Zusammensetzung erlaubt. Die Bildung der Nanokristalle wurde in Abhängigkeit vom Ausheilregime und der SiOx Zusammensetzung charakterisiert, wobei unter anderem Methoden wie Photolumineszenz, Infrarot-Absorption, spektroskopische Ellipsometrie und Elektronenmikroskopie eingesetzt wurden. Anhand von MOS-Kondensatoren wurden die elektrischen Eigenschaften derart hergestellter Speicherzellen untersucht. Die Funktionalität der durch Sputterverfahren hergestellten Nanokristall-Speicher wurde erfolgreich nachgewiesen. / In silicon nanocrystal memories, electronic charge is discretely stored in isolated silicon nanocrystals embedded in the gate oxide of a field effect transistor. The stored charge determines the state of the memory cell. One important aspect in the technology of silicon nanocrystal memories is the formation of nanocrystals near the SiO2-Si interface, since both, the size distribution and the depth profile of the area density of nanocrystals must be controlled. This work has focussed on the formation of gate oxide stacks with embedded nanocrystals using a very flexible approach: the thermal annealing of SiO2/SiOx (x < 2) stacks. A sputter deposition method allowing to deposit SiO2 and SiOx films of arbitrary composition has been developed and optimized. The formation of Si NC during thermal annealing of SiOX has been investigated experimentally as a function of SiOx composition and annealing regime using techniques such as photoluminescence, infrared absorption, spectral ellipsometry, and electron microscopy. To proof the concept, silicon nanocrystal memory capacitors have been prepared and characterized. The functionality of silicon nanocrystal memory devices based on sputtered gate oxide stacks has been successfully demonstrated.

No description available.

No description available.

In Silizium-Nanokristall-Speichern werden im Gate-Oxid eines Feldeffekttransistors eingebettete Silizium Nanokristalle genutzt, um Elektronen lokal zu speichern. Die gespeicherte Ladung bestimmt dann den Zustand der Speicherzelle. Ein wichtiger Aspekt in der Technologie dieser Speicher ist die Erzeugung der Nanokristalle mit einerwohldefinierten Größenverteilung und einem bestimmten Konzentrationsprofil im Gate-Oxid. In der vorliegenden Arbeit wurde dazu ein sehr flexibler Ansatz untersucht: die thermische Ausheilung von SiO2/SiOx (x < 2) Stapelschichten. Es wurde ein Sputterverfahren entwickelt, das die Abscheidung von SiO2 und SiOx Schichten beliebiger Zusammensetzung erlaubt. Die Bildung der Nanokristalle wurde in Abhängigkeit vom Ausheilregime und der SiOx Zusammensetzung charakterisiert, wobei unter anderem Methoden wie Photolumineszenz, Infrarot-Absorption, spektroskopische Ellipsometrie und Elektronenmikroskopie eingesetzt wurden. Anhand von MOS-Kondensatoren wurden die elektrischen Eigenschaften derart hergestellter Speicherzellen untersucht. Die Funktionalität der durch Sputterverfahren hergestellten Nanokristall-Speicher wurde erfolgreich nachgewiesen. / In silicon nanocrystal memories, electronic charge is discretely stored in isolated silicon nanocrystals embedded in the gate oxide of a field effect transistor. The stored charge determines the state of the memory cell. One important aspect in the technology of silicon nanocrystal memories is the formation of nanocrystals near the SiO2-Si interface, since both, the size distribution and the depth profile of the area density of nanocrystals must be controlled. This work has focussed on the formation of gate oxide stacks with embedded nanocrystals using a very flexible approach: the thermal annealing of SiO2/SiOx (x < 2) stacks. A sputter deposition method allowing to deposit SiO2 and SiOx films of arbitrary composition has been developed and optimized. The formation of Si NC during thermal annealing of SiOX has been investigated experimentally as a function of SiOx composition and annealing regime using techniques such as photoluminescence, infrared absorption, spectral ellipsometry, and electron microscopy. To proof the concept, silicon nanocrystal memory capacitors have been prepared and characterized. The functionality of silicon nanocrystal memory devices based on sputtered gate oxide stacks has been successfully demonstrated.

Die vorliegende Arbeit beschreibt einen neuartigen Fügeprozess, das sogenannte reaktive Fügen bzw. Bonden. Hierbei werden sich selbsterhaltene exotherme Reaktionen in nanoskaligen Schichtsystemen als lokale Wärmequelle für das Fügen unterschiedlichster Substrate der Mikrosystemtechnik verwendet. Das Bonden mit den reaktiven Systemen unterscheidet sich von herkömmlichen Verfahren der Aufbau- und Verbindungstechnik primär dadurch, dass durch die rasche Reaktionsausbreitung bei gleichzeitig kleinem Reaktionsvolumen die Fügetemperaturen unmittelbar auf die Fügefläche beschränkt bleiben. Entgegen den herkömmlichen Fügeverfahren mit Wärmeeintrag im Volumen, schont das neue Verfahren empfindliche Bauteile und Materialien mit unterschiedlichsten thermischen Ausdehnungskoeffizienten lassen sich besser verbinden. In der vorliegenden Arbeit werden die Grundlagen zur Dimensionierung, Prozessierung und Integration der gesputterten reaktiven Materialsysteme beschrieben. Diese Systeme werden verwendet, um heterogene Materialien mit unterschiedlichen Durchmessern innerhalb kürzester Zeit auf Wafer-Ebene und bei Raumtemperatur zu bonden. Die so erzeugten Verbindungen werden hinsichtlich der Mikrostruktur, der Zuverlässigkeit sowie der Dichtheit untersucht und bewertet. Zusätzlich wird die Temperaturverteilung in der Fügezone während des Fügeprozesses mit numerischen Methoden vorhergesagt.

System on Chip (SoC) and System in Package (SiP) are two electronic technologies that involve integrating multiple functionalities onto a single platform. When the platform is a single wafer, as in SOC, it requires the ability to deposit various materials that enable the different functions on to an underlying substrate that can host the electronic circuitry. Transition metal oxides which have a wide range of properties are ideal candidates for the functional material. Si wafer on which micro-electronics technology is widely commercialized is the ideal host platform. Integrating oxides with Si, generally in the form of thin films as required by microelectronics technology, is however a challenge. It starts with the fact that the properties of crystalline oxides to be exploited in performing various functions are direction dependent. Thus, thin films of these oxides need to be deposited on Si in certain crystallographic orientations. Even if a suitably oriented Si wafer surface were available, it does not always provide for epitaxial growth a critical requirement for controlling the crystalline orientation of thin films. This is because Si surface is covered by an amorphous oxide of Si (SiOx). Thus, during growth of the functional oxide, an ambience in which the Si itself will not oxidize needs to be provided. In addition, during thin film growth on either Si or SiOx surface stresses are generated from various sources. Stress and its relaxation are also associated with the formation and evolution of defects. Both, stress and defects need to be managed in order to harness their beneficial effects and prevent detrimental ones. Given the requirement of SoC technology and the problem associated, the research work reported in this thesis was hence concerned with the precise controlling the stress and microstructure in oxide thin films deposited on Si substrates. In order to do so a versatile, ultra high vacuum (UHV) thin film with a base pressure of 10-9 Torr was designed and built as part of this study. The chamber is capable of depositing films by both sputtering (RF & DC) and pulsed laser ablation (PLD). The system has been designed to include an optical curvature measurement tool that enabled real-time stress measurement during growth. Doped zirconia, ZrO2, was chosen as the first oxide to be deposited, as it is among the few oxides that is more stable than SiOx. It is hence used as a buffer layer. It is shown in this thesis that a change in the growth rate at nucleation can lead to (100) or (111) textured films. These two are among the most commonly preferred orientation. Following nucleation a change in growth rate does not affect orientation but affects stress. Thus, independent selection of texture and stress is demonstrated in YSZ thin films on Si. A quantitative model based on the adatom motion on the growth surface and the anisotropic growth rates of the two orientations is used to explain these observations. This study was then subsequent extended to the growth on platinized Si another commonly used Si platform.. A knowledge of the stress and microstructure tailoring in cubic zirconia on Si was then extended to look at the effect of stress on electrical properties of zirconia on germanium for high-k dielectric applications. Ge channels are expected to play a key role in next generation n-MOS technology. Development of high-k dielectrics for channel control is hence essential. Interesting stress and property relations were analyzed in ZrO2/Ge. Stress and texture in pulsed laser deposited (PLD) oxides on silicon and SrTiO3 were studied. It is shown in this thesis that stress tuning is critical to achieve the highest possible dielectric constant. The effect of stress on dielectric constant is due to two reasons. The first one is an indirect effect involving the effect of stress on phase stability. The second one is the direct effect involving interatomic distance. By stress control an equivalent oxide thickness (EOT) of 0.8 nm was achieved in sputter deposited ZrO2/Ge films at 5 nm thickness. This is among the best reported till date. Finally, the effect of growth parameters and deposition geometry on the microstructural and stress evolution during deposition of SrTiO3 on Si and BaTiO3 on SrTiO3 by pulsed laser deposition is the same chamber is described.