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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
271

A Standalone Wire Database for Routing and Tracing in Xilinx Virtex, Virtex-E, and Virtex-II FPGAs

Steiner, Neil Joseph 19 September 2002 (has links)
Modern FPGAs contain routing resources easily exceeding millions of wires. While mainstream design flows and place-and-route tools make very good use of these routing resources, they do so at the cost of very significant processing time. A well established alternative scheme is to modify or generate configuration bitstreams directly, resulting in more dynamic designs and shorter processing times. This thesis introduces a complete set of alternate wire databases for Xilinx Virtex, Virtex-E, and Virtex-II FPGAs, suitable for standalone use or as an addition to the JBits API. The databases can be used to route or trace through any device in these families, and can generate the necessary bitstream configurations with the help of JBits or an independent bitstream interface. / Master of Science
272

Debugger interface pro Java PathFinder model checker / Debugger interface for Java PathFinder model checker

Vávra, Štěpán January 2014 (has links)
The aim of this work is to integrate Java PathFinder into Java Platform Debugger Architecture. That is, to allow using Java PathFinder instead of a common Java Virtual Machine for the purpose of debugging Java applications in any modern Java Integrated Development Environment with all its advantages such as various kinds of breakpoints, direct stepping in opened source files, and call stack and object inspection. The resulting work provides users with all the features they are used to while debugging Java applications. None of this requires any external tools, editors or a complicated setup. Therefore, users are able to view, debug and understand the program state while replaying an error trace in Java PathFinder. The key part of the study is an implementation of the Java Debug Wire Protocol Agent as an extension for Java PathFinder. That makes JPF more complete as a Virtual Machine in the eyes of the community and the Java users in general. Powered by TCPDF (www.tcpdf.org)
273

Development of Diamond Sensors for Beam Halo and Compton Spectrum Diagnostics after the Interaction Point of ATF2 / Développement de capteurs diamant pour mesurer le halo du faisceau et le spectre des électrons de recul Compton après le point d’interaction d'ATF2

Liu, Shan 02 July 2015 (has links)
L'étude détaillée des distributions transverses du halo du faisceau est importante du point de vue des pertes de faisceau et du contrôle du bruit de fond dans ATF2 et les futurs collisionneurs linéaires (FLC). Un nouveau type de capteur diamant sous vide (DSv) déplacable, avec quatre pistes, a été conçu et développé pour la mesure des distributions transverses du halo du faisceau et la détection du spectre des électrons de recul Compton après le point d'interaction (IP) d'ATF2, qui est un prototype à basse énergie (1.3 GeV) de la section de focalisation finale pour les projets de collisionneurs linéaires ILC et CLIC.Cette thèse présente les études du halo du faisceau et des électrons de recul Compton, ainsi que la caractérisation, les études de performance et les tests des capteurs diamant (DS), tant sur PHIL, un photo-injecteur à basse énergie (<10 MeV) au LAL, que sur ATF2. Les résultats des premières mesures du halo du faisceau, utilisant des wire scanner (WS) et un DSv, sur ATF2 sont également présentés et comparés dans cette thèse.Des simulations utilisant Mad-X et CAIN ont été réalisées afin d'estimer le nombre d'électrons composant le halo du faisceau ainsi que le nombre d'électrons de recul Compton. Les résultats des simulations ont indiqué qu'une grande gamme dynamique, supérieure 10⁶ , est nécessaire pour une mesure simultanée du cœur du faisceau, du halo du faisceau et des électrons de recul Compton. Un DSv mono-cristallin, fabriqué par CVD (Chemical Vapor Deposition), a été développé dans ce but.Avant l'installation du capteur diamant, une première tentative de mesure du halo du faisceau a été effectuée en 2013, en utilisant les wire scanners (WS) actuellement installés sur ATF2. En raison de leur dynamique limitée de ~10³ , la distribution du halo du faisceau a été mesurée seulement jusqu'à ~±6σ dans la ligne d'extraction (EXT). Un paramétrage des distributions mesurées du halo du faisceau a montré que les distributions mesurées sont cohérentes avec des mesures faites précédemment, en 2005, sur l'ancienne ligne faisceau d'ATF. Durant ces mesures, une distribution asymétrique du halo vertical du faisceau a été observée pour la première fois en utilisant le WS situé après l'IP, son origine est actuellement sous investigation en utilisant le DSv.Des études pour caractériser des capteurs diamants de dimensions 4.5x4.5x0.5 mm³ ont été réalisées en utilisant des sources α et β. Les paramètres de transport des porteurs de charge (durée de vie, vitesse de saturation, etc.) ont été obtenus en utilisant la technique des courants transitoires (TCT). Par ailleurs, la linéarité de la réponse du DS a été testée sur PHIL avec différentes intensités de faisceau après la fenêtre de sortie de d'accélération. Un signal maximum de 10⁸ électrons a été mesuré, avec une réponse linéaire jusqu'à 10⁷ électrons. Des études similaires de la linéarité ont été faites pour le DSv sur ATF2. Nous avons pu y exploiter avec succès, pour la première fois une gamme dynamique de ~10⁶ , permettant de mesurer simultanément le cœur du faisceau (~10⁹ électrons) et le halo du faisceau (~10³ électrons). Le pick-up électromagnétique induit par le passage du cœur du faisceau et des effets de saturation, qui sont les limitations empêchant actuellement le DSv d'atteindre une gamme dynamique supérieure à 10⁶ , ont également été identifiés et étudiés.Les premières mesures de la distribution horizontale du halo, en utilisant le DSv, ont été effectuées jusqu'à ~±20σx , et ont permis de prouver que le halo du faisceau est collimaté par les ouvertures de la ligne ATF2. Une distribution horizontale du halo compatible avec les paramétrages de 2005 et 2013 a été confirmée. La possibilité de détecter les électrons de recul Compton a été étudiée. Différentes solutions pour accroître la sensibilité des mesures ont été proposées. / The investigation of beam halo transverse distributions is an important issue for beam losses and background control in ATF2 and in Future Linear Colliders (FLC). A novel in vacuum diamond sensor (DSv) scanner with four strips has been designed and developed for the investigation of beam halo transverse distributions and also for the diagnostics of Compton recoil electrons after the interaction point (IP) of ATF2, a low energy (1.3 GeV) prototype of the final focus system for ILC and CLIC linear collider projects. This thesis presents the beam halo and Compton recoil electrons studies as well as the characterization, performance studies and tests of the diamond sensors (DS) both at PHIL, a low energy (<10 MeV) photo-injector at LAL, and at ATF2. First beam halo measurement results using wire scanners (WS) and DSv at ATF2 are also presented and compared in this thesis. Simulations using Mad-X and CAIN were done to estimate the rate of the beam halo and Compton recoil electrons. Simulation results have indicated that a large dynamic range of more than 10⁶ is needed for a simultaneous measurement of the beam core, beam halo and Compton recoil electrons. A single crystalline Chemical Vapor-Deposition (sCVD) based DSv was developed for this purpose. Prior to the diamond detector installation, first attempt of beam halo measurements have been performed in 2013 using the currently installed WS. With a limited dynamic range of ~10³ , the beam halo distribution was measured only up to ~±6σ in the extraction (EXT) line. Parametrizations of the measured beam halo distribution showed a consistent distribution with previous measurements done in 2005 at the old ATF beam line. Meanwhile, an asymmetric vertical beam halo distribution was observed for the first time using the post-IP WS, the origin of which is currently under investigation using the DSv.Studies to characterize DS pads with dimensions of 4.5x4.5x0.5 mm³ were carried out using the α and β sources. Charge carrier transport parameters (lifetime, saturation velocity etc.) were obtained using the transient-current technique (TCT). Furthermore, the linearity of the DS response was tested at PHIL with different beam intensities in air: a maximum signal of 108 electrons was measured with a linear response up to 10⁷ electrons. Similar linearity studies were done for the DSv at ATF2, where we have successfully demonstrated and confirmed for the first time a dynamic range of ~10⁶ by a simultaneous beam core (~10⁹ e-) and beam halo (~10³ e-) measurement using the DSv. Present limitations due to signal pick-up and saturation effects, which prevent the DSv from reaching a dynamic range higher than 10⁶ , were also studied.First measurements of the horizontal beam halo distribution using the DSv were performed up to ~±20σx, where the beam halo was proved to be collimated by the apertures. Horizontal beam halo distributions consistent with the 2005 and 2013 parametrizations were confirmed. The possibility of probing the Compton recoil electrons has been investigated and different ways to increase their visibility have been proposed.
274

Avaliação do arraste dos fios de solda durante o processo de moldagem por transferência no encapsulamento de memórias DRAM

Stracke, Márcio Rafael 06 June 2018 (has links)
Submitted by JOSIANE SANTOS DE OLIVEIRA (josianeso) on 2018-10-01T11:47:12Z No. of bitstreams: 1 Márcio Rafael Stracke_.pdf: 1667083 bytes, checksum: 7f8c37d9c5a822527980feaaec50278e (MD5) / Made available in DSpace on 2018-10-01T11:47:13Z (GMT). No. of bitstreams: 1 Márcio Rafael Stracke_.pdf: 1667083 bytes, checksum: 7f8c37d9c5a822527980feaaec50278e (MD5) Previous issue date: 2018-06-06 / HT Micron / Com o avanço da microeletrônica, cada vez mais surgem dispositivos eletrônicos portáteis. Isso traz diversos desafios à cadeia de semicondutores, desde o projeto, no desenvolvimento de circuitos integrados menores e mais eficientes até o encapsulamento, uma vez que os componentes tem ficado menores, mais finos e com um número maior de pinos de entrada e saída. Esses desafios estão presentes em todos os processos de fabricação de um chip e podemos citar a moldagem como um processo crítico em especial. A tecnologia de moldagem por transferência, que está consolidada e é a principal utilizada neste processo, necessita de cuidados especiais na otimização de seus parâmetros e materiais, tendo em vista os fatores citados e a consequente redução do diâmetro dos fios que realizam a interconexão do die com o substrato. Neste cenário, o wire sweep, que é o arraste destes fios de solda devido ao escoamento do encapsulante, acaba se tornando um problema, já que perdas no processo de moldagem implicam em sucatear o componente. A taxa de falhas devido a este tipo de falha podem chegar a 2,5%, segundo estudos de grandes fabricantes da cadeia de semicondutores divulgado em (SANDGREN; ROTH, 2004). Neste trabalho foi simulado o processo de moldagem de memórias DRAM com encapsulament do tipo BOC BGA, utilizando o módulo de FSI do software COMSOL. Os resultados da razão de wire sweep obtidos na simulação ficaram dentro do intervalo da média com um desvio padrão, na comparação com os valores reais medidos em peças fabricadas na condição simulada, tendo como erro máximo 15,26%. / The advancement of microelectronics makes more and more portable electronic devices emerge in our daily lives. This brings a number of challenges to the semiconductor chain, from design, to the development of smaller and more efficient integrated circuits to encapsulation, since the components have become smaller, thinner, and with a larger number of input and output pins. These challenges are present in all chip fabrication processes and we can define molding as a critical process in particular. The transfer molding technology, which is consolidated and the main one used in this process, requires special care in the optimization of its parameters and materials, since there are more and shorter wires realizing the connection between the die and the substrate. The wire sweep, which is the entrainment of the wires due to the flow of the mold compound, becomes a problem, since losses in the molding process imply scrapping the component. The failure rate due to this type of failure can reach 2.5%, according to studies by major semiconductor chain manufacturers disclosed in (SANDGREN; ROTH, 2004). In this project the DRAM memory molding process with BOC BGA encapsulation type was simulated using the FSI module in COMSOL software. Results of wire sweep ratio obtained are within the average adding or subtracting one standard deviation and the maximum error rate ranging was 15.26% considering manufactured boards using the simulation parameters.
275

Roll pass design for improved flexibility and quality in wire rod rolling

Eriksson, Conny January 2004 (has links)
The thesis treats roll pass design in wire rod rolling of stainless steel for sequences and series built up by two-symmetrical grooves. It is focused on predicting rolling flexibility, also called working range, as well as product quality. For analysing the flexibility a computer program has been developed. The minimum and maximum roll gap and corresponding bar areas for series of grooves including "oval", "round", "false round", "square" and "diamond" shapes are calculated. Six pass designs used in Swedish mills are analysed. Full-scale rolling is compared with laboratory experiments for the square-oval and false round (round)-oval series. The false round-oval series offers the largest working range and that the flexibility is smaller for pass sequences designed for high reductions. The false round-oval series are also acknowledged as a series for high quality steels and are usually better than the square-oval series having a tendency for defect formation. The thesis also includes high-speed rolling of wire rod in blocks. Here interstand tensions are utilised in order to keep the process stable. For obtaining the required dimensional tolerances of the product they are kept as low as possible. However interstand tensions could be used in order to increase the working range and move the product range towards smaller wire cross sections. For analysing this possibility, a narrow spread technology is utilised. At present time a practical problem is referred to the fixed gearings in the common blocks, which require a certain and given level of interstand tensions and corresponding reductions. This problem can however be solved by means of new block design and modern process control technology. Roll stands can be separately driven and controlled at very high speeds. Thus the eight stand blocks can be subdivided into four plus four passes blocks with a cooling line between enabling also higher productivity without violating the product quality because defect formations caused by a too high rolling temperature. The true working range of a series for a specific steel grade is however not only dependent on the possible spectrum of wire dimensions that can be obtained but might also depend on its ability to decrease or eliminate defects such as surface cracks. Thus, the behaviour of artificial V-shaped cracks in the longitudinal direction has been investigated and compared for the square-oval and false round (round)-oval series mentioned above. In agreement with other research works it was established that efficient rolling conditions for reducing the cracks are obtained when the cracks open up at the same time as their depth is reduced. If the V-shaped crack is closed by contact between its oxidized side surfaces the rolling schedule is not optimal for getting a high quality product. A deeper understanding of the experimental results was obtained by means of an FE-analysis
276

Flow measurements related to gas exchange applications

Laurantzon, Fredrik January 2012 (has links)
This thesis deals with flow measuring techniques applied to steady and pulsating gas flows relevant to gas exchange systems for internal combustion engines. Gas flows in such environments are complex, i.e. they are inhomogeneous, three-dimensional, unsteady, non-isothermal and exhibit significant density changes. While a variety of flow metering devices are available and have been devised for such flow conditions, the performance of these flow metersis to a large extent undocumented when a strongly pulsatile motion is superposed on the already complex flow field. Nonetheless, gas flow meters are commonly applied in such environments, e.g. in the measurement of the air flow to the engine or the amount of exhaust gas recirculation. The aim of the present thesis is therefore to understand and assess, and if possible to improve the performance of various flow meters under highly pulsatile conditions as well as demonstrating the use of a new type of flow meter for measurements of the pulsating mass flow upstream and downstream the turbine of a turbocharger. The thesis can be subdivided into three parts. The first one assesses the flow quality of a newly developed flow rig, designed for measurements of steady and pulsating air flow at flow rates and pulse frequencies typically found in the gas exchange system of cars and smaller trucks. Flow rates and pulsation frequencies achieved and measured range up to about 200 g/s and 80 Hz, respectively. The time-resolved mass flux and stagnation temperature under both steady and pulsating conditions were characterized by means of a combined hot/cold-wire probe which is part of a newly developed automated measurement module. This rig and measurement module were used to create a unique data base with well-defined boundary conditions to be used for the validation of numerical simulations, but in particular, to assess the performance of various flow meters. In the second part a novel vortex flow meter that can measure the timedependent flow rate using wavelet analysis has been invented, verified and extensively tested under various industrially relevant conditions. The newly developed technique was used to provide unique turbine maps under pulsatile conditions through time-resolved and simultaneous measurements of mass flow, temperature and pressure upstream and downstream the turbine. Results confirm that the quasi-steady assumption is invalid for the turbine considered as a whole. In the third and last part of the thesis, two basic fundamental questions that arose during the course of hot/cold-wire measurements in the aforementioned high speed flows have been addressed, namely to assess which temperature a cold-wire measures or to which a hot-wire is exposed to in high speed flows as well as whether the hot-wire measures the product of velocity and density or total density. Hot/cold-wire measurements in a nozzle have been performed to test various hypothesis and results show that the recovery temperature as well as the product of velocity and stagnation density are measured. / QC 20120510
277

Wire bond failure Mechanism and microstructure analysis

Jang, Herng-Shuoh 01 July 2002 (has links)
The Au-Al bond is a commonly used interconection in IC package.The different composition for Au wire will change the different IMC growth. In this study, we will discuss the pure Au wire, and little Pd or Cu addition in Au wire reacted with Al pad for thermal aging, and we will give the models for these cases.
278

Roll pass design for improved flexibility and quality in wire rod rolling

Eriksson, Conny January 2004 (has links)
<p>The thesis treats roll pass design in wire rod rolling of stainless steel for sequences and series built up by two-symmetrical grooves. It is focused on predicting rolling flexibility, also called working range, as well as product quality. For analysing the flexibility a computer program has been developed. The minimum and maximum roll gap and corresponding bar areas for series of grooves including "oval", "round", "false round", "square" and "diamond" shapes are calculated. Six pass designs used in Swedish mills are analysed. Full-scale rolling is compared with laboratory experiments for the square-oval and false round (round)-oval series. The false round-oval series offers the largest working range and that the flexibility is smaller for pass sequences designed for high reductions. The false round-oval series are also acknowledged as a series for high quality steels and are usually better than the square-oval series having a tendency for defect formation. The thesis also includes high-speed rolling of wire rod in blocks. Here interstand tensions are utilised in order to keep the process stable. For obtaining the required dimensional tolerances of the product they are kept as low as possible. However interstand tensions could be used in order to increase the working range and move the product range towards smaller wire cross sections. For analysing this possibility, a narrow spread technology is utilised. At present time a practical problem is referred to the fixed gearings in the common blocks, which require a certain and given level of interstand tensions and corresponding reductions. This problem can however be solved by means of new block design and modern process control technology. Roll stands can be separately driven and controlled at very high speeds. Thus the eight stand blocks can be subdivided into four plus four passes blocks with a cooling line between enabling also higher productivity without violating the product quality because defect formations caused by a too high rolling temperature. The true working range of a series for a specific steel grade is however not only dependent on the possible spectrum of wire dimensions that can be obtained but might also depend on its ability to decrease or eliminate defects such as surface cracks. Thus, the behaviour of artificial V-shaped cracks in the longitudinal direction has been investigated and compared for the square-oval and false round (round)-oval series mentioned above. In agreement with other research works it was established that efficient rolling conditions for reducing the cracks are obtained when the cracks open up at the same time as their depth is reduced. If the V-shaped crack is closed by contact between its oxidized side surfaces the rolling schedule is not optimal for getting a high quality product. A deeper understanding of the experimental results was obtained by means of an FE-analysis</p>
279

Corrosion of Post-Tensioning Strands in Ungrouted Ducts - Unstressed Condition

Hutchison, Michael John 01 January 2013 (has links)
Recent failures and severe corrosion distress of post-tensioned (PT) bridges in Florida have revealed corrosion of the 7-wire strands in tendons. Post-tensioned duct assemblies are fitted with multiple 7-wire steel strands and ducts are subsequently filled with grout. During construction, the length of time from the moment in which the strands have been inserted into the ducts, until the ducts are grouted, is referred to as the `ungrouted' period. During this phase, the steel strands are vulnerable to corrosion and consequently the length of this period is restricted (typically to 7 days) by construction guidelines. This investigation focuses on determining the extent of corrosion that may take place during that period, but limited to strands that were in the unstressed condition. Visual inspections and tensile testing were used to identify trends in corrosion development. Corrosion induced cracking mechanisms were also investigated via wire bending and metallographic cross section evaluation. Corrosion damage on unstressed strands during ungrouted periods of durations in the order of those otherwise currently prescribed did not appear to seriously degrade mechanical performance as measured by standardized tests. However the presence of stress in the ungrouted period, as is normally the case, may activate other mechanisms (e.g., EAC) that require further investigation. As expected in the unstressed condition, no evidence of transverse cracking was observed.
280

Untersuchung der Material begrenzenden Einflüsse beim Multidrahtsägen von Silicium unter Verwendung gerader und strukturierter Drähte

Weber, Bernd 11 August 2015 (has links) (PDF)
In der vorliegenden Arbeit wurden experimentelle Untersuchungen zu Material begrenzenden Einflüssen beim Multidrahtsägen von Silicium unter Verwendung gerader und strukturierter Drähte durchgeführt. Ziel dieser Arbeit war es, den Einfluss von dünnen und strukturierten Drähten auf den Drahtsägeprozess von Silicium und die erzeugten Waferqualitäten zu untersuchen. Zusätzlich galt es, Grenzen und Potentiale für den Einsatz dieser Drähte im Sägeprozess aufzuzeigen und ein Modell zu entwickeln, das den Materialabtrag in Silicium für strukturierte Drähte beschreibt. Die in dieser Arbeit verfolgten Lösungsansätze beinhalten im ersten Teil der Arbeit die Durchführung von Sägeexperimenten mit einer Eindrahtsäge. Es wurden dünne Drähte mit Durchmesser ≤ 100 µm und zwei unterschiedliche Siliciumcarbid (SiC) Korngrößenverteilungen untersucht. Zusätzlich wurden die Normalkräfte in Vorschubrichtung variiert. Im zweiten Teil der Arbeit werden Sägeexperimente mit einer Multidrahtsäge vorgestellt. Es wurden zwei unterschiedlich strukturierte Drähte mit variierten Drahtgeschwindigkeiten und Vorschüben im Vergleich zu geradem Draht untersucht. Der industrielle Einsatz dünner Drähte im Sägeprozess zur Reduzierung des Sägeverschnitts ist derzeit auf Durchmesser von 100 µm begrenzt. Die getesteten Drähte mit geringerem Durchmesser sind nicht wirtschaftlich einsetzbar, da sie zu geringe Standzeiten aufweisen und zu einer Slurryverarmung beitragen können. Es konnte eine Slurryverarmung des Schnittspalts in Silicium beobachtet werden, die um mehrere Zentimeter in den Schnittspalt ragt und dadurch den Drahtsägeprozess negativ beeinflusst, indem Sägeriefen entstehen. Die Verschleißuntersuchungen von Sägedrähten zeigen, dass eine lineare Abnahme der Drahtdurchmesserreduzierung in Abhängigkeit der akkumulierten Eingriffslänge in Silicium auftritt. Der Prozess der Durchmesserreduzierung wird maßgeblich durch die aufgebrachte Normalkraft, welche durch die Zugfestigkeit und Härte des Drahts beeinflusst wird, die Drahtgeschwindigkeit und die verwendete Korngrößenverteilung bestimmt. Es konnte durch Sägeversuche mit Drähten unterschiedlicher Hersteller gezeigt werden, dass das beobachtete Verschleißverhalten nicht einem Drahthersteller zuordenbar ist, sondern eine globalere Gültigkeit besitzt. Der industrielle Einsatz strukturierter Drähte wirkt sich positiv auf den Sägeprozess aus. Es konnten signifikant höhere Vorschübe bei ähnlichen Kräften im Vergleich zu geraden Drähten erreicht werden. Für einen Vorschub von 0,6 mm/min sind die Kraftwerte für strukturierten Draht A im Vergleich zu geradem Draht um 40% reduziert, für Draht B um 16%. Durch die Drahtstruktur wird ein größeres Slurryvolumen durch den Schnittspalt befördert, was zu einem homogeneren Materialabtrag entlang des Schnittspalts führt. Die erhöhten Vorschübe konnten sowohl für mono- wie auch für multikristallines Siliciummaterial erreicht werden. Zusätzlich wurden homogenere Waferdicken durch den Einsatz strukturierter Drähte beim Sägeprozess erzeugt. Auf Basis der Ergebnisse für strukturierte Drähte wurde ein theoretisches Modell für den Materialabtrag entwickelt, welches die in dieser Arbeit durchgeführten Experimente gut beschreibt. / In the present work experimental analyses were carried out to investigate the material limiting influences in the multi wire sawing process of silicon while using thin and structured wires. The purpose of the work was to investigate influences on the wire sawing process and the resulting wafer qualities caused by thin and structured wires. Additionally, the purpose was to define the limits and potentials of thin and structured wires in industrial wire sawing processes and to develop a model which describes the material removal in silicon for structured wires. Experiments with two different SiC particle size distributions in combination with wire diameters of ≤ 100 µm and varying normal forces in feed direction were carried out in the first part of this work with a single wire saw. Experiments with two differently structured wires and variation of the wire speed and feed rate are shown in the second part using a multi wire saw. The actual limit for industrial sawing applications to reduce kerf loss is reached for 100 µm thin wire diameters. The tested lower wire diameters are uneconomical due to shorter durability and to aggravate slurry depletion effects. Such a depletion effect of several centimeters length which is detrimental for the wire sawing process was observed at the end of a sawing channel. The results of the experiments showed that the steel wire diameter is reduced linearly with the accumulated sawn length of silicon. The material removal process of the steel wire is significantly influenced by the normal force in feed direction and the hardness of the wire. The experiments with wires of different suppliers showed no difference in the material removal process. Therefore the abrasive wear of wires has a more global validation. The results of the experiments using differently structured wires showed that significantly lower forces in feed direction occur for a given feed rate in comparison to straight wires. The forces are reduced up to 40% for structured wire A and up to 16% for wire B for a feed rate of 0,6 mm/min. A higher slurry volume is transported due to the structure of the wire which enables a more homogeneous material removal process along the cutting channel. Higher feed rates were reached for mono- and multi crystalline silicon material. Additionally, more homogeneous wafer thicknesses were cut using structured wires.

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