No description available.

Interconnects in power module result in thermal interfaces. The thermal interfaces degrade under thermal cycling, or chemical loading. Moreover, the reliability of thermal interfaces can be especially problematic when the interconnecting area is large, which increases its predisposition to generate defects (voids, delamination, or nonuniform quality) during processing. In order to improve the quality of the bonding process, as well as to be able to accurately assess interface reliability, it would be desirable to have a simple, reliable, and nondestructive measurement technique that would produce a 2-d map of the interface thermal resistance across a large bonded area. Based on the transient thermal method of JEDEC standard 51-14, we developed a measurement technique that involves moving a thermal sensor discretely across a large-area bonded substrate and acquiring the interface thermal resistance at each location. As detailed herein, the sensor was fabricated by packaging an IGBT bare die. An analytical thermal model was built to investigate the effects of thermal sensor packaging materials and structural parameters on the sensitivity of the measurement technique. Based on this model, we increased the detection sensitivity of the sensor by modifying the size of the sensor substrate, the material of the sensor substrate, the size of the IGBT bare die, the size of the heat sink, and the thermal resistance between sample and the heat sink. The prototype of the thermal sensor was fabricated by mounting Si IGBT on copper substrate, after which the Al wires were ultrasonic bonded to connect the terminals to the electrodes. The sensor was also well protected with a 3-d printed fixture. Then the edge effect was investigated, indicating the application of the thermal sensor is suitable for samples thinner than the value in TABLE 2 3. The working principle of the movable thermal sensor – Zth measurement and its structure function analysis – was then evaluated by sequence. The Zth measurement was evaluated by measuring the Zth change of devices induced by degradation in sintered silver die-attach layer during temperature cycling. At the end of the temperature cycling, failure modes of the sintered silver layer were investigated by scanning electron microscope (SEM) and X-ray scanning, to construct a thermal model for FEA simulation. The simulation results showed good agreement with the measured Zth result, which verified the accuracy of the test setup. The sensitivity of structure function analysis was then evaluated by measuring thermal resistance (Rth) of interface layers with different thermal properties. The structure function analysis approach successfully detected the Rth change in the thermal interface layer. The movable thermal sensor was then applied for 2d-mapping of the interface Rth of a large-area bonded substrate. Examining the test coupons bonded by sintered silver showed good and uniform bonding quality. The standard deviation of Rth is about 0.005 K/W, indicating the 95% confidence interval is about 0.01 K/W, which is commonly chosen as the error of measurement. The sensitivity of the movable thermal sensor was evaluated by detecting defects/heat channels of differing sizes. The 2-d mapping confirmed that the thermal sensor was able to detect defect/heat channel sizes larger than 1x1 mm2. The accuracy of the sensitivity was verified by FEA simulation. Moreover, the simulated results were consistent with the measured results, which indicates that the movable sensor is accurate for assessing interface thermal resistance. In summary, based on structure function analysis of the transient thermal impedance, the concept of a movable thermal sensor was proposed for two-dimensional mapping of interface thermal resistance. (1) Preliminary evaluation of this method indicated both transient thermal impedance and structure function analysis were sensitive enough to detect the thermal resistance change of thermal interface layers. With the help of transient thermal impedance measurement, we non-destructively tested the reliability of sintered silver die-attach layer bonded on either Si3N4 AMB or AlN DBA substrates. (2) An analytical thermal model was constructed to evaluate the design parameters on the sensitivity and resolution of the movable thermal sensor. A detailed design flow chart was provided in this thesis. To avoid edge effect, requirements on thickness and materials of test coupon also existed. Test coupon with smaller thermal conductivity and larger thickness had a more severe edge effect. (3) The application of the movable sensor was demonstrated by measuring the 2-d thermal resistance map of interface layers. The results indicated for bonded copper plates (k = 400 W/mK) with thickness of 2 mm, the sensor was able to detect defect/heat channel with size larger than 1x1 mm2. / Doctor of Philosophy / Interconnects in power module result in thermal interfaces. The thermal interfaces degrade during operation and their reliability can be especially problematic when the interconnecting area is large. In order to improve the quality of the bonding process, as well as to be able to accurately assess interface reliability, it would be desirable to have a simple, reliable, and nondestructive measurement technique that would produce a 2-d map of the interface thermal resistance across a large bonded area. Based on the transient thermal method of JEDEC standard 51-14, we developed a measurement technique that involves moving a thermal sensor discretely across a large-area bonded substrate and acquiring the interface thermal resistance at each location. As detailed herein, the sensor was fabricated by packaging an IGBT bare die, which allowed us to get a 2-d map of the interface thermal resistance. A thermal model was also constructed to guide the design of the sensor, to increase its performance. Moreover, the preliminary test of the test setup was conducted to prove its feasibility for the sensor. Eventually, the sensor’s performance and application was demonstrated by measuring the 2-d thermal resistance map of the bonded interfaces.

With increased focus on miniaturization and high performance in electronics, thermal management is a very important area of research today. In multiple applications such as portable electronics, consumer electronics, military applications, automobile, power electronics, high performance computing, etc. innovative thermal management strategies are necessary. In this work, two novel approaches to dissipate redundant heat better- first by novel carbonaceous-nanoparticle additives to develop thermal interface materials with superior performance and the second by using advanced metal additive manufacturing techniques to design and analyze metal-lattice based heat sinks are presented. Thermal Interface Materials with multiple carbon-based nanoparticle fillers such as coal-derived Multi Layered Graphene (MLG), standard reduced Graphene Oxide (rGO), Multi-Walled Carbon Nano Tubes (MWCNTs), and Graphene Nano-Platelets (GNPs) in thermal paste were synthesized and seen to have superior heat dissipation properties. Also, graphene was synthesized from coal through an in-house, facile, scalable and cost-effective process. The enhancement in thermal conductance varies from ~70% in the coal-MLG to ~14% in MWCNTs-based TIMs. Noteworthy is ~3.5 times larger enhancement in thermal performance with the in-house coal-derived-MLG as compared to the commercially available g-MLG. At a 3% wt. fraction of coal-MLG, enhancement in thermal conductance was almost 120% higher compared to the base thermal grease. In the second part, metal lattice-based heat sinks are designed for additive manufacturing for use in passive cooling of high-flux thermal management. A parametric optimization based on the lattice geometry, thickness, and height subject to additive manufacturing constraints is conducted. Intricate metal lattices with low mass based on the Simple Cubic, Octet, and Voronoi structures were generated by implicit modelling in nTopology® and their thermal performance was analyzed through numerical analysis using commercial CFD packages. The Voronoi lattice performed best with a significant improvement in thermal performance (~18% reduction in junction temperature difference with respect to ambient) as compared to a standard baseline Longitudinal heat Sink (LHS), while reducing the mass of the heat sink by ~2.1 times. Such optimized metal lattice-based heat sinks can lead to significant downsizing, reduction in overall mass and cost in applications where thermal management is critical with a need for low mass. We believe that such novel scalable materials and processes suited for mass production could be critical in meeting the material, design and product development needs to tackle the thermal management challenges of the future. / Master of Science / With increase in demand of high power and performance in electronics, there is a concurrent increase in redundant heat that needs to be dissipated. With enhanced focus and push towards electric vehicles, defense, consumer electronics, datacenter and supercomputing applications, electronics cooling is a critical area of research today. There are two primary resistances to heat- as it is removed from electronics package to the surrounding atmosphere – due to the thin layer of a material called Thermal Interface Material (TIM) at the interface between the heat sink and the package, and the resistance offered by the heat sink itself. In this work, a two-pronged approach for better cooling in electronics is presented. Firstly, carbon-based nano-sized particles are used to synthesize novel TIMs that provide superior heat transport capabilities as compared to a standard baseline. In the second approach, complex metal-lattice based heat sinks are designed for manufacturing with advanced techniques such as metal 3D printing. Multiple carbon-based nano-particle additives such as Multi Layered Graphene synthesized from coal (MLG), standard commercially available reduced Graphene Oxide (rGO), Multi-Walled Carbon Nano Tubes (MWCNTs), and Graphene Nano-Platelets (GNPs) are dispersed in thermal paste and all of the resulting composites were found to remove heat better from electronics packages. The improvement in this ability varies from ~70% in the coal-MLG to ~14% in MWCNTs-based TIMs. Noteworthy is ~3.5 times larger enhancement in the heat transport ability with the use of in-house coal-derived-MLG as compared to the commercially available g-MLG. At an 3% wt. fraction of coal-MLG, there was a 1.2x increase in thermal performance as compared to the base thermal grease. Also, it is significant to mention that MLG was synthesized from coal through an in-house, facile scalable and cost-effective process. In the second part, metal lattice-based heat sinks designed for metal 3D printing for use in passive cooling of electronics was investigated. Multiple geometric parameters such as the lattice type, thickness, and height subject to additive manufacturing constraints were studied. Intricate metal lattices with low mass based on three structures- Simple Cubic, Octet, and Voronoi were generated by implicit modelling, and their thermal performance was predicted by computer based-simulations using commercial CFD packages. The Voronoi lattice performed best with a significant reduction (~18%) in junction temperature difference with the surrounding atmosphere- as compared to a standard baseline rectangular heat sink design, while simultaneously reducing the mass of the heat sink by ~2.1 times. Such optimized metal lattice-based heat sinks can lead to significant reduction in overall mass, size, and cost in weight sensitive applications. We believe that such novel scalable materials, designs, and processes suited for mass production could be critical in meeting the material, design and product development needs to tackle the thermal management challenges of the near future.

Carbon nanotube (CNT) forests have outstanding thermal, electrical, and mechanical properties, which have generated significant interest as thermal interface materials (TIMs). Some drawbacks to using CNTs as TIMs include poor substrate adhesion, high interface resistances inhibiting thermal transport, and lack of electrical insulation in electronic component applications. It is thus useful to be able to modify CNTs to reduce their electrical conductivity while maintaining high thermal conductivity and interface conductance, and high mechanical compliance. A recent report suggests that nanoscale oxide coatings could be applied to CNTs in forests without changing the mechanical deformation behavior of the forests. Oxide coatings could also provide environmental stability as well as better adhesion to the substrate compared to pristine CNT forests. In this study, we investigated thermal and electrical resistance of CNT forests with an oxide coating. Low-pressure chemical vapor deposition (LPCVD) was used to produce CNTs on high-conductivity Si substrates. Plasma-enhanced atomic layer deposition (PALD) was used to deposit Al2O3 on individual CNTs in forests. This process was facilitated by O2 plasma pretreatment to functionalize the surface of the CNTs and nucleate oxide growth. Several analytical techniques were used to characterize the CNT-oxide composites, including scanning electron microscopy, Raman and X-ray photoelectron spectroscopy. Thermal conductivity and thermal interface resistance were measured using a modified photoacoustic technique. The oxide coating had no significant effect on the effective thermal conductivity of the forests, in contrast to expectations of increased phonon scattering. Electrical resistivity measurements were made and a threefold increase was observed for the oxide-coated forests. This approach could emerge as a promising route to create a viable TIM for thermally conductive and electrically insulating applications.

No description available.

Dans le cadre des applications transports, et plus particulièrement de "l’avion plus électrique", avec une demande toujours plus présente de réduction d’encombrement et de poids, la tendance est à l’intégration de plus en plus poussée des convertisseurs statiques. L’augmentation de leur densité de puissance et celle des contraintes thermiques, induites par l’environnement dans lequel ces structures sont localisées, deviennent de plus en plus critiques. La gestion thermique de ces dispositifs est assurée par des systèmes de refroidissement sur lesquels sont montés les composants semi-conducteurs via un matériau d’interface thermique. Une gestion performante sera obtenue par la diminution de la résistance thermique globale entre les éléments dissipatifs et le milieu ambiant grâce en autre à l’amélioration du système de refroidissement et des propriétés thermiques des matériaux constituant le module. Or cette interface est un point délicat du transfert de chaleur car elle peut représenter plusieurs dizaines de pourcents de la résistance thermique globale. Elle nécessite donc une connaissance approfondie de son comportement aux sollicitations thermiques. Après un état de l’art sur les matériaux d’interfaces thermiques et les méthodes de caractérisation des propriétés thermophysiques des matériaux, nous proposons la mise en œuvre d’outils expérimentaux et mathématiques permettant de suivre l’éventuelle évolution de matériaux d’interfaces utilisés en électronique de puissance au cours d’un vieillissement par cyclage en température. Pour cela, deux méthodes sont présentées. La première repose sur la mesure de la résistance thermique des interfaces en régime stationnaire avec un transfert de chaleur monodimensionnel alors que la seconde, basée sur une caractérisation transitoire thermique d’un système, permet d’en identifier les constantes de temps et le réseau Résistance-Capacité du système testé. Des travaux de simulations numériques ont été menés sur les deux types de bancs expérimentaux, d’un côté pour pouvoir évaluer les pertes thermiques latérales du banc statiques, de l’autre côté pour montrer qu’il est bien possible de détecter une variation de la résistance thermique d’un matériau d’interface par l’analyse de l’impédance thermique. / In the context of transportation applications, and especially the "more electric aircraft", with an ever present demand for space and weight reduction, the trend is to integrate more extensive of static converters. The increase in power density and the thermal stresses induced by the environment in which these structures are located, are becoming increasingly critical. Thermal management of these devices is provided by cooling systems on which are mounted the semiconductor components via a thermal interface material. Effective management will be achieved by reducing the overall thermal resistance between the dissipative elements and the environment by improving the cooling system and thermal properties of the materials constituting the module. However, this interface is a delicate point of heat transfer because it can represent several tens of percent of the circuit total thermal resistance. It therefore requires a thorough knowledge of their behavior in thermal stresses. After a state of the art on the thermal interface materials and methods for characterizing thermophysical properties of materials, we propose the implementation of experimental and mathematical tools to monitor any change of interface materials used in power electronics during aging by temperature cycling. For this, two methods are presented. The first is based on the measurement of the thermal resistance of the interfaces with a steady one-dimensional heat transfer, while the second, based on a characterization of a transient thermal system, allows to identify the time constants and the resistor and capacitor network of the tested system. Numerical simulations were carried out on two types of experimental benches, on one side in order to assess the lateral heat losses from static bench, on the other side to show that it is possible to detect a change in the thermal resistance of a TIM with the analysis of the thermal impedance.

Thermal management is a major bottleneck for the next-but-one generation of semiconductor devices, especially the performance of SiC and GaN devices is limited by heat dissipation. This thesis evaluates four new packaging concepts with regards to thermal management: Diamond based substrates, phase change materials, Cu-Graphene composite films and anisotropic heat dissipation. Anisotropic heat dissipation is shown to be the most auspicious concept. A metal-matrix composite baseplate for a high performance power module using annealed pyrolytic graphite is created and evaluated. The baseplate shows a locally increased heat dissipation compared to a plain metal baseplate by 30 %. Furthermore, the thermal contact between device (baseplate) and cooler is of high importance. A study of different characterization methods for thermal interface materials is performed and a new method for the quantification of the thermal contact conductance is presented. The study shows that a combination of several methods is necessary so that the complete picture of heat dissipation performance of thermal interface materials becomes apparent. The new developed method allows to select the perfect thermal grease for a given combination of device and cooler. / Wärmemanagement ist eine große Herausforderung sowohl für aktuelle als auch für zukünftige Halbleiterprodukte. Speziell die nächste Produktgeneration mit SiC oder GaN Chips benötigen neue Entwärmungskonzepte, um ihr volles Potential bezüglich höherer Stromstärken zu entfalten. In dieser Arbeit wurden vier neuartige Konzepte erforscht: Diamant basierte Substrate, Phasen-Wechsel-Materialien, Cu-Graphene Kompositschichten und anisotrope Entwärmung. Es zeigte sich, dass anisotrope Entwärmung das vielversprechendste Konzept ist. Als Demonstrator wurde eine Bodenplatte mit thermisch pyrolytischen Graphiteinleger für ein Leistungsmodul gefertigt. Sie zeigt eine lokale Erhöhung der Entwärmung von 30 %. Weiter ist der thermische Kontakt zwischen Bauteil und Kühler sehr wichtig. Verschiedene Charakterisierungsmethoden für thermische Schnittstellen-Materialien wurden verglichen. Dieser Vergleich zeigt, dass eine Kombination verschiedener Methoden notwendig ist, um ein vollständiges Bild über die Leistungsfähigkeit solcher Materialien zu gewinnen. Eine neue Messmethode wurde entwickelt, um die thermische Kontakt-Leitfähigkeit zu messen. Diese neue Methode ermöglicht es, die beste Wärmeleitpaste für eine vorgegebene Kombination aus Produkt und Kühleroberfläche zu identifizieren.

The electronic market is continually moving towards higher power densities. As a result, the demand on the cooling is increasing. Focus has to be put on the whole thermal management chain, from the component to be cooled to the ambient. Thermal interface materials are used to efficiently transfer heat between two mating surfaces or in some cases across larger gaps. There are several different thermal interface materials with various application areas, advantages and disadvantages. This study aimed to evaluate thermal and mechanical properties of graphite sheets and graphite gap pads. The work was done in cooperation with Ericsson AB. A test rig based on the ASTM D5470 standard was used to measure the thermal resistance and thermal conductivity of the materials at different pressures. It was found that several graphite sheets and gap pads performed better than the materials used in Ericsson’s products today. According to the tests, the thermal resistance could be reduced by about 50 % for the graphite sheets and 90 % for the graphite gap pads. That was also verified by placing the materials in a radio unit and comparing the results with a reference test. Both thermal values and mechanical values were better than for the reference materials. However, the long term reliability of graphite gap pads could be an issue and needs to be examined further. / Elektronikbranschen rör sig mot högre elektriska effektertätheter, det vill säga högre effekt per volymenhet. Som en följd av detta ökar också efterfrågan på god kylning. Kylningen måste hanteras på alla nivåer, från komponenten som ska kylas, ända ut till omgivningen. Termiska interface material (TIM) används för att förbättra värmeöverföringen mellan två ytor i kontakt med varandra eller för att leda värmen över större gap. Det finns flera olika TIM med olika tillämpningsområden, fördelar och nackdelar. Denna studie gick ut på att utvärdera termiska och mekaniska egenskaper hos grafitfilmer och så kallade ”graphite gap pads” då de används som TIM. Projektet gjordes i sammarbete med Ericsson AB. En testuppställning baserat på ASTM D5470-standarden användes för att utvärdera värmeledningsförmågan och den termiska resistansen hos de olika materialen vid olika trycknivåer. Resultaten visade att flera grafitfilmer och ”gap pads” presterade bättre än materialen som används Ericssons produkter idag. Enligt testerna skulle den termiska resistansen kunna minskas med 50 % för grafitfilmerna och 90 % för ”gap padsen”. Materialens fördelaktiga egenskaper verifierades i en radioenhet där temperaturerna kunde sänkas i jämförelse med ett referenstest med standard-TIM. De nya materialen var mjukare än referensmaterialen och skulle därför inte orsaka några mekaniska problem vid användning.  Den långsiktiga tillförlitligheten för grafitbaserade ”gap pads” måste dock undersökas vidare eftersom de elektriskt ledande materialen skulle kunna skapa kortslutningar på kretskorten.

Thermoelectric generators (TEG) are re-emerging technology that can be used to recover heat waste from commercial and industrial processes to generate electricity, enhancing fuel utilization and lowering greenhouse gas emissions. TEG modules are solid-state heat engines that produce no noise or vibration during operation. Notably, TEG modules are also able to operate at low-temperature differences, which makes them ideal for a wide range of heat waste recovery applications. Annular thermoelectric generator (ATEG) modules are optimal in applications where either the heat source or sink are round in shape. Bi2Te3 solution-based compounds are of significant interest in the application of thermoelectric materials (TE) used in low-temperature cooling and power generation applications. The main objective of the current work is to design a mechanically reliable ring-shaped ATEG module with a predictable performance using spark plasma sintered Bi2Te3 TE material for low temperature waste heat recovery applications. In terms of structure, this work is divided into two parts. The first part investigates how the use of a powder pre-treatment technique affects the mechanical and thermoelectric properties of P- and N-type Bi2Te3. In addition, part one also presents the measurements of these materials’ mechanical and thermoelectric properties, which serve as inputs for the finite element models used to design thermoelectric modules with parallel and perpendicular configurations vis-a-vis the sintering pressing direction. The second part evaluates the thermoelectric performance and thermal stresses of a ring-shaped ATEG couple that has been integrated between hot-side and cold-side heat exchangers. To this end, two configurations are compared with respect to their heat/electrical current flow paths: one that allows for radial flow (radial configuration), and one that allows for axial flow (axial configuration). The P- and N-type Bi2Te3 powder was treated using a mechanically agitated fluidized powder reduction facility that was built in-house. The characteristic uniaxial tensile strength of the P-type Bi0.4Sb1.6Te3 increased from 13.9 MPa to 26.3 MPa parallel to the sintering pressure, and from 16.3 MPa to 30.6 MPa perpendicular to the sintering pressure following oxide reduction using 5% H2 ˗ 95% Ar at 380 ℃ for 24 h. The figure of merit, ZT, increased from 0.35 to 0.80 and from 0.42 to 1.13 at room temperature (25 ℃) in the parallel and the perpendicular directions, respectively, after the surface oxide reduction treatment. On the other hand, the annealing effects of the oxide reduction pr-treatment of the N-type (Bi0.95 Sb0.05)2(Se0.05 Te0.95)3 using 5% H2 ˗ 95% Ar at 380 ℃ for 24 h were found to be responsible for the majority of the mechanical properties and ZT enhancement. Additionally, the characteristic uniaxial tensile strengths for this material increased from 30.4 to 34.1 MPa and from 30.8 to 38 MPa in the parallel and the perpendicular directions, respectively. The ZTmax (150 ℃) increased from 0.54 to 0.63 in both the parallel and perpendicular directions due to oxide reduction, while annealing led to an increase to 0.58 and 0.62 in the parallel and the perpendicular directions, respectively. An analytical model was constructed to compare the thermoelectric performance of the two configurations under three different hot-side thermal resistances, and a 3D coupled finite element ANSYS model was constructed to study and compare the thermal stresses of the two configurations at different dimensions. The two models were then used to create 2D maps in order to investigate the effects of ATEG couple configuration and dimensions, as well as the hot-side thermal resistance, with the goal of identifying the optimum design. The optimization of module geometry requires a trade-off between performance and mechanical reliability. The results of these investigations showed that increases in the temperature difference across the ATEG couple (ΔT) led to increases in both power and thermal stresses in both configurations. When both configurations were generating the same power at ΔT = 105 ℃, the thermal stresses in the radial configuration were as much as 67 MPa higher than those in the axial configuration due to the formation of additional tensile hoop stresses. The lowest thermal stress obtained for the axial couple configuration was 67.8 MPa, which was achieved when the couple had an outer diameter of 16 mm, an axial thickness of 1 mm, a ΔT of 14.8 ℃, and power generation of 10.4 mW per couple. The maximum thermal stress values were located at the corners of the interface between the solder and the TE rings due to the mismatched coefficient of thermal expansion. This thesis makes a novel contribution to the state-of-the-art literature in ring-shaped ATEG modules, as it details a well-characterised spark plasma sintered Bi2Te3 TE material and a methodology for designing a ring-shaped ATEG module with reliable, robust, and predictable thermoelectric and mechanical performance. The details of the contribution made by this work have been disseminated in the form of three journal publications, which have been integrated into this sandwich Ph.D. thesis. / Thesis / Doctor of Science (PhD)

Diplomová práca sa zaoberá vplyvom termálnych medzivrstiev na tepelnú kontaktnú vodi- vosť a tepelný kontaktný odpor. Práca sa zameriava na aplikáciu termálnych medzivrstiev pre vylepšenie tepelnej kontaktnej vodivosti v tepelnom spínači a v kozmických zariade- niach obecne. Teoretická časť práce stručne skúma rôzne pasívne termálne kontrolné systémy použí- vane v kozmických zariadeniach, vrátane termálnych medzivrstiev, a vysvetľuje pozadie tejto práce. Táto práca ďalej skúma rôzne termálne medzivrstvy, predovšetkým povlaky a fólie, a uvádza výber vhodnej termálnej medzivrstvy. Experimentálna časť práce skúma povrchové parametre, tepelnú vodivosť a mikrotvr-dosť medených vzoriek, ktoré slúžia ako substrát pre povlak čistého striebra. Ďalej rieši podmienky merania, metódy vyhodnocovania a samotné experimentálne merania. Experimentálne merania sú vykonané v termo-vákuovej testovacej komore a na základe výsledkov sú vyvodené závery. Pre ďalšiu prácu sú uvedené doporučenia.