The goal of this research was to develop new experimental techniques to quantitatively study the interfacial fracture of micro-contact thin film interconnects used in microelectronic applications under monotonic and cyclic loadings. The micro-contact spring is a new technology that is based on physical vapor deposited thin film cantilevers with a purposely-imposed stress gradient through the thickness of the film. These "springs" have the promise of being the solution to address near-term wafer level probing and long-term high-density chip-to-next level microelectronic packaging challenges, as outlined by the International Technology Roadmap for Semiconductors. The success of this technology is, in part, dependent on the ability to understand the failure mechanism under monotonic and cyclic loadings. This research proposes two experimental methods to understand the interfacial fracture under such monotonic and fatigue loading conditions. To understand interfacial fracture under monotonic loading, a fixtureless superlayer-based delamination test has been developed. Using stress-engineered Cr layer and a release layer with varying width, this test can be used to measure interfacial fracture toughness under a wide range of mode mixity. This test uses common IC fabrication techniques and overcomes the shortcomings of available methods. The developed test has been used to measure the interfacial fracture toughness for Ti/Si interface. It was found that for low mode mixity Ti/Si thin film interfaces, the fracture toughness approaches the work of adhesion which is essentially the Ti-Si bond energy for a given bond density. In addition to the monotonic decohesion test, a fixtureless fatigue test is developed to investigate the interfacial crack propagation. Using a ferromagnetic material deposited on the micro-contact spring, this test employs an external magnetic field to be able to drive the interfacial crack. Fatigue crack growth can be monitored by E-beam lithography patterned metal traces that are 10 to 40nm wide and 1 to a few µm in spacing. The crack initiation and propagation can be monitored through electrical resistance measurement. In the conducted experiments, it is seen that the interfacial delamination does not occur under fatigue loading, and that the micro-contact springs are robust against interfacial fracture for probing and packaging applications.

Thesis (M.S.)--Oregon State University, 2010. / Printout. Includes bibliographical references (leaves 139-143). Also available on the World Wide Web.

Integration of sensors and silicon-based electronics for harsh environment applications is driven by the automotive industry and the maturity of semiconductor processes that allow embedding sensitive elements onto the same chip without sacrificing the performance and integrity of the electronics. Sensor devices post-processed on top of electronics by surface micromachining allow the addition of extra functionality to the fabricated ICs and creating a sensor system without significant compromise of performance. Smart sensors comprised of sensing structures integrated with silicon carbide-based electronics are receiving attention from more industries, such as aerospace, defense and energy, due to their ability to operate in very demanding conditions. This thesis describes the design and implementation of a novel, integrated thin film temperature sensor that uses a half-bridge arrangement to measure thin film platinum sensitive elements. Processes have been developed to fabricate temperature insensitive thin film tantalum nitride resistors which can be combined with the platinum elements to form the temperature transducing bridge. This circuit was designed to be integrated with an existing silicon carbide-based instrumentation amplifier by post-CMOS processing and to be initially connected to the bond pads of the amplifier input and output ports. Thin films fabricated using the developed TaN and Pt processes have been characterized using resistive test structures and crystallographic measurements of blanket thin film layer samples, and the relationship between the measurement results obtained has been analyzed. An initial demonstration of temperature sensing was performed using tantalum nitride and platinum thin film resistor element chips which were fabricated on passivated silicon substrates and bonded into high temperature packages. The bridge circuit was implemented by external connections through a printed circuit board and the bridge output was connected to a discrete instrumentation amplifier to mimic the integrated amplifier. The temperature response of the circuit measured at the output of the amplifier was found to have sensitivity of 844 μV·°C–1 over the temperature range of 25 to 100 °C. Two integrated microfabrication process flows were evaluated in this work. The initial process provided a very low yield for contact resistance structures between TaN and Pt layers, which highlighted problems with the thin film platinum deposition process. Multiple improvement options have been identified among which removal of the dielectric layer separating TaN and Pt layers and thicker Pt film were considered and a redesign of both layout and the process flow has resulted in improved yield of platinum features produced directly on top of TaN features. Temperature sensitivity of the integrated sensor devices was found to depend significantly on parasitic elements produced by thin film platinum step coverage, the values of which were measured by a set of resistive test structures. A new microfabrication design has enabled the production of a group of integrated temperature sensors that had a sensitivity of 150.84 μV·°C–1 in the temperature range between 25 and 200 °C on one of the fabricated wafers while the best fabricated batch of sensors had a sensitivity of 1079.2 μV·°C–1.

An evaporating meniscus formed by a wetting °uid in a heated capillary slot with capillary driven °flow is numerically and experimentally investigated at the microscale and pore scale. In the microscale analysis, the contact line region of an extended evaporating thin ¯lm meniscus is numerically investigated to study the influence of °uid properties on the heat transfer. The governing equations to describe the fluid °flow, heat and mass transfer phenomena in an evaporating extended meniscus are grouped uniquely as function of °uid dependent parameters, namely the interline heat flow number and heat pipe ¯figure of merit. A physical interpretation of these parameters is presented. Numerical experiments conducted with different working °fluids show that a °uid with a high interline heat °flow parameter and heat pipe ¯figure of merit also has a high cumulative heat transfer in the micro region encompassing the evaporating thin ¯lm. In the pore scale analysis, the evaporation from a pentane meniscus in a heated capillary slot is experimentally and numerically investigated to study how the wetting characteristics are influenced with heat input. In the experimental investigation, a test set up is fabricated with a heated glass capillary slot that is partially immersed in a constant temperature bath with constant °uid level. A novel aspect of this experiment is that both the wicking height and steady state evaporation mass flow rate are measured simultaneously. Based on a macroscopic force balance, the apparent contact angle of the evaporating meniscus is experimentally estimated from the wicking height and mass flow rate. This is compared with the results obtained using evaporating thin ¯lm theory. The experimentally estimated contact angle is higher than that obtained from the thin ¯lm model but both experiment and theory show similar trends. In the numerical study, a ¯finite volume numerical model of an evaporating meniscus in a heated capillary slot (simulating the above experimental condition) is developed for predicting the wicking height and mass flow rate. This model includes: (i) one-dimensional heat transfer and °uid °flow in the liquid and vapour regions of the capillary slot, (ii) one{dimensional evaporating thin ¯lm model for the meniscus region, and (iii) two-dimensional conduction heat transfer in the capillary wall. Correlations obtained from the evaporating thin{¯lm theory in terms of cumulative heat transfer and apparent contact angle are applied to the pore level problem. The problem is solved iteratively between the micro and pore scales till convergence is achieved. The wicking height is influenced by the change in apparent contact angle and the pressure drops to flow of liquid and vapor in the capillary slot that is a function of evaporation mass °ow rate. Heat input to the capillary slot increases both the contact angle in the evaporating meniscus and the frictional pressure drops in the liquid and vapor regions. In the present study, the influence of increased contact angle is more significant and the liquid and vapor pressure drops are negligible. The trends in the wicking height, mass flow rate and conductance are similar to the experimental data. The proposed numerical approach using correlations from thin ¯lm theory to link the micro and macro scales yields results that are consistent with experimental data. The results show that the change in contact angle can degrade the ability of the liquid to wet the pore and hence result in a lower heat transfer coefficident.

abstract: The realization of Silicon based photonic devices will enable much faster data transmission than is possible today using the current electronics based devices. Group IV alloys germanium tin (GeSn) and silicon germanium tin (SiGeSn) have the potential to form an direct bandgap material and thus, they are promising candidates to develop a Si compatible light source and advance the field of silicon photonics. However, the growth of the alloys is challenging as it requires low temperature growth and proper strain management in the films during growth to prevent tin segregation. In order to satisfy these criteria, various research groups have developed novel chemical vapor deposition (CVD) reactors to deposit the films. While these reactors have been highly successful in depositing high crystal quality high Sn concentration films, they are generally expensive set-ups which utilize several turbomolecular/cryogenic pumps and/or load-lock systems. An more economical process than the state-of-the art to grow group IV materials will be highly valuable. Thus, the work presented in this dissertation was focused on deposition of group IV semiconductor thin films using simplified plasma enhanced CVD (PECVD) reactors. Two different in-house assembled PECVD reactor systems, namely Reactor No. 1 and 2, were utilized to deposit Ge, GeSn and SiGeSn thin films. PECVD technique was used as plasma assistance allows for potentially depositing the films at growth temperatures lower than those of conventional CVD. Germane (GeH4) and Digermane (Ge2H6) were used as the Ge precursor while Disilane (Si2H6) and tin chloride (SnCl4) were used as the precursors for Si and Sn respectively. The growth conditions such as growth temperature, precursor flow rates, precursor partial pressures, and chamber pressure were varied in a wide range to optimize the growth conditions for the films. Polycrystalline Ge films and SiGeSn films with an Sn content upto 8% were deposited using Reactor No. 1 and 2. Development of epitaxial Ge buffers and GeSn films was accomplished using a modified Reactor No. 2 at temperatures <400oC without the aid of ultra-high vacuum conditions or a high temperature substrate pre-deposition bake thereby leading to a low economic and thermal budget for the deposition process. / Dissertation/Thesis / Doctoral Dissertation Materials Science and Engineering 2020

UV and deep-UV selective photodiodes from visible-blind to solar-blind were realized based on a Si-doped (InxGa1–x)2O3 thin film with a monotonic lateral variation of 0.0035<x<0.83. Such layer was deposited by employing a continuous composition spread approach relying on the ablation of a single segmented target in pulsed-laser deposition. The photo response signal is provided from a metal-semiconductor-metal structure upon backside illumination. The absorption onset was tuned from 4.83 to 3.22 eV for increasing x. Higher responsivities were observed for photodiodes fabricated from indium-rich part of the sample, for which an internal gain mechanism could be identified. VC 2016 AIP Publishing LLC.

No description available.

All solid state Li-ion batteries (thin film micro batteries) have become inevitable for miniaturized devices and sensors as power sources. Fabrication of electrode materials for batteries in thin film form has been carried out with the existing technologies used in semiconductor industry. In the present thesis, radio frequency (RF) sputtering has been chosen for deposition of cathode material (ceramic oxides) thin films because of several advantages such as precise thickness control and deposition of compound thin films with equivalent composition. Conventional sputtering involves fabrication of thin film using custom made pellet according to the specification of sputter gun. However several issues such as target breaking are inevitable with the pellet sputtering. To forfend the issues, powder sputtering has been implemented for the deposition of various thin film cathodes in an economically feasible approach. Optimization of various process parameters during film deposition of cathode materials LiCoO2, Li2MnO3, LiNixMnyO4, mixed oxide cathodes of LiMn2O4, LiCoO2 and TiO2 etc., have been executed successfully by the present approach to achieve optimum electrochemical performance. Thereafter the optimized process parameters would be useful for selection of cathode layers for micro battery fabrication. Chapter 1 gives a brief introduction to the Li ion and thin film solid state batteries. It also highlights the advantages of powder sputtering compared to conventional pellet sputtering. In Chapter 2, the materials used and methods employed for the fabrication of thin film electrodes and analytical characterizations have been discussed. In chapter 3, implementation of powder sputtering for the deposition of LiCoO2 thin films has been discussed. X-Ray diffraction (XRD), X-Ray photoelectron spectroscopy (XPS) and electrochemical investigations have been carried out and promising results have been achieved. Charge discharge studies delivered a discharge capacity of 64 µAh µm-1 cm-2 in the first cycle in the potential range 3.0-4.2 V vs. Li/Li+. The possible causes for the moderate cycle life performance have been discussed. Systematic investigations for RF power optimization for the deposition of Li2-xMnO3-y thin films have been carried out. Galvanostatic charge discharge studies delivered a highest discharge capacity of 139 µAh µm-1cm-2 in the potential window 2.0-3.5 V. Thereafter, effect of LMO film thickness on electrochemical performance has been studied in the thickness range 70 nm to 300 nm. Films of lower thickness delivered higher discharge capacity with good cycle life than the thicker films. These details are discussed in chapter 4. In Chapter 5, fabrication and electrochemical performance of LiNixMnyO4 thin films are presented. LMO thin films have been deposited on nickel coated stainless steel substrates. The as deposited films were annealed at 500 °C in ambient conditions. Nickel diffuses in to LMO film and results in LiNixMnyO4 (LMNO) film. These films were further characterized. Electrochemical studies were conducted up to higher potential 4.4 V resulted in discharge capacities of the order of 55 µAh µm-1cm-2. In chapter 6, electrochemical investigations of mixed oxide thin films of LiCoO2 and LiMn2O4 have been carried out. Electrochemical investigations have been carried out in the potential window 2.0–4.3 V and a discharge capacity of 24 µAh µm-1cm-2 has been achieved. In continuation, TiO2 powder was added to the former composition and the deposited films were characterized for electrochemical performance. The potential window as well as the discharge capacity enhanced after TiO2 doping. Electrochemical characterization has been carried out in the potential window 1.4–4.5 V, and a discharge capacity of 135 µAh µm-1cm-2 has been achieved. Finally chapter 7 gives overall conclusions and future directions to the continuation of the work.

Man’s desire to replicate/mimic the nature’s creation provided an impetus and inspiration to the rapid advancements and progress made in the sensors and actuators technology. A normal human being has five basic sensory organs, which helps and guides him in performing the routine tasks. This underlines the importance of basic sensory organs in a human life. In a similar fashion, sensors and actuators are of paramount importance for most of the science and engineering applications. The aim of the present thesis work is to explore the application of piezoelectric ZnO thin films deposited on a flexible substrate for the development of sensors and actuators. Detailed study was performed on the suitability of three different flexible substrates namely Phynox, Kapton and Mylar. However, Phynox alloy substrate was found to be a suitable substrate material for the above mentioned applications. Sputtering technique was chosen for the deposition of ZnO thin films on to Phynox substrate. The necessary process parameters were optimized to achieve good quality piezoelectric thin films. In the present work, sensors have been developed by utilizing the direct piezoelectric effect of ZnO thin films deposited on Phynox alloy substrate. These includes a flow sensor for gas flow rate measurement, impact sensor for non-destructive material discrimination study and a Thin Film Sensor Array (TFSA) for monitoring the impact events. On the other hand, using the converse piezoelectric effect of ZnO thin films, actuators have also been developed. These include a thin film micro actuator and a Thin Film Micro Vibrator (TFMV) for vibration testing of micro devices. The thesis is divided into following seven chapters. Chapter 1: This chapter gives a general introduction about sensors and actuators, piezoelectric thin films, flexible substrates, thin film deposition processes and characterization techniques. A brief literature survey of different applications of piezoelectric thin films deposited on various flexible substrates in device development is presented. Chapter 2: A novel flexible metal alloy (Phynox) and its properties along with its applications are discussed in this chapter. ZnO thin films were deposited on Phynox substrate by Rf reactive magnetron sputtering technique. The sputtering process parameters such as: Ar:O2 gas ratio, substrate temperature and RF power were optimized for the deposition of good quality piezoelectric ZnO thin films. The deposited ZnO thin films were characterized using XRD, SEM, AFM and d31 coefficient measurement techniques. Chapter 3: It reports on the comparative study of properties of piezoelectric ZnO thin films deposited on three different types of flexible substrates. The substrate materials employed were a metal alloy (Phynox), polyimide (Kapton), and polyester (Mylar). Piezoelectric ZnO thin films deposited on these flexible substrates were characterized by XRD, SEM, AFM and d31 coefficient measurement techniques. A vibration sensing test was also performed for the confirmation of good piezoelectric property. Compared to the polymer flexible substrates, the metal alloy flexible substrate (Phynox) was found to be more suitable for integrating ZnO thin film for sensing applications. Chapter 4: The development of a novel gas flow sensor for the flow rate measurement in the range of L min-1 is presented in this chapter. The sensing element is a Phynox alloy cantilever integrated with piezoelectric ZnO thin film. A detailed theoretical analysis of the experimental set–up showing the relationship between output voltage generated and force at a particular flow rate has been discussed. The flow sensor is calibrated using an in-house developed testing set-up. Chapter 5: This chapter is divided into two sections. Section 5.1 reports on the development of a novel packaged piezoelectric thin film impact sensor and its application in non-destructive material discrimination studies. Different materials (Iron, Glass, Wood and Plastic) were successfully discriminated by using the developed impact sensor. The output response of impact sensor showed good linearity and repeatability. The impact sensor is sensitive, reliable and cost-effective. Section 5.2 reports on the development of a Thin Film Senor Array (TFSA) for monitoring the location and magnitude of the impact force. The fabricated TFSA consists of evenly distributed ZnO thin film sensor array. Chapter 6: It consists of two sections. Section 6.1 reports on the fabrication of micro actuator using piezoelectric ZnO thin film integrated with flexible Phynox substrate. A suitable concave Perspex mounting was designed for the actuator element. The actuator element was excited at different frequencies for the supply voltages of 2V, 5V and 8V. The developed micro actuator has the potential to be used as a micro pump for pumping nano liters to micro liters of fluids. Section 6.2 reports the design and development of a portable ready to use Thin Film Micro Vibrator (TFMV). The TFMV is capable of providing the vibration amplitude in the range of nanometer to micrometer. A thin silicon diaphragm was used as a test specimen for its vibration testing studies using the developed TFMV. The TFMV is light-weight and have internal battery, hence no external power supply is required for its functioning. Chapter 7: The first section summarizes the salient features of the work presented in this thesis. In the second section the scope for carrying out the further work is given.

Amorphous oxide semiconductor (AOS) thin-film transistors (TFTs) constitute the central theme of this thesis. Within this theme, three primary areas of focus are pursued. The first focus is the realization of a transparent three-stage ring oscillator with buffered output and an output frequency in the megahertz range. This leads to the possibility of transparent radio frequency applications, such as transparent RFID tags. At the time of its fabrication, this ring oscillator was the fastest oxide electronics ring oscillator reported, with an output frequency of 2.16 MHz, and a time delay per stage of 77 ns. The second focus is to ascertain whether a three-terminal device (i.e., a TFT) is an appropriate structure for conducting space-charge-limited-current (SCLC) measurements. It is found that it is not appropriate to use a diode-tied or gate-biased TFT configuration for conducting a SCLC assessment since square-law theory shows that transistor action alone gives rise to I proportional to V² characteristics, which can easily be mistakenly attributed to a SCLC mechanism. Instead, a floating gate TFT configuration is recommended for accomplishing SCLC assessment of AOS channel layers. The final focus of this work is to describe an assessment procedure appropriate for determining if a dielectric is suitable for use as a TFT gate insulator. This is accomplished by examining the shape of a MIM capacitor's log(J)-ξ curve, where J is the measured current density and ξ is the applied electric field. An appropriate dielectric for use as a TFT gate insulator will have a log(J)-ξ curve that expresses a clear breakover knee, indicating a high-field conduction mechanism dominated by Fowler-Nordheim tunneling. Such a dielectric produces a TFT with a minimal gate leakage which does not track with the drain current in a log(I[subscript D])-V[subscript GS] transfer curve. An inappropriate dielectric for use as a TFT gate insulator will have a log(J)-ξ curve that does not express a clear breakover knee, indicating that the dominate conduction mechanism is defect driven (i.e., pin-hole like shunt paths) and, therefore, the dielectric is leaky. It is shown that experimental log(J)-ξ leakage curves can be accurately simulated using Ohmic, space-charge-limited current (SCLC), and Fowler-Nordheim tunneling conduction mechanisms. / Graduation date: 2010