Compared to wafer based solar cells, thin film solar cells greatly reduce material cost and thermal budget due to low temperature process. Monolithically manufacturing allows large area fabrication and continuous processing. In this work, several photovoltaic thin films have been developed by rf-PECVD including a-Si:H and μc-Si, both intrinsic and doped on Corning 4 inch glass substrate at low temperature. The conductivity of n type and p type μc-Si at 180ºC was 17S/cm and 7.1E-2S/cm, respectively. B dopants either in a-Si:H or μc-Si films require higher plasma power to get active doping. The B2H6-to-SiH4 flow ratio for p type μc-Si lies from 0.01 to 0.025. Chamber conditions have critical effect on film quality. Repeatable and superior results require a well-established cleaning passivation procedure. Moreover, μc-Si films have been deposited from pure silane on glass substrate by modified rf-ICP-CVD. The deposition rate has been dramatically increased to 5Å/s due to little H2 dilution with crystalline fraction was around 69%, and 6.2Å/s with crystalline fraction 45%. Microstructure started to form at 150ºC with a thin incubation layer on the glass substrate, and became fully dense conical conglomerates around 300nm where conductivity and crystallinity saturated. Additionally, a-SiGe:H films have been developed by modified rf-ICP-CVD. The optical band gaps have been varied from 1.25 to 1.63eV by changing SiH4-to-GeH4 ratio. Also high temperature resulted in low bandgap. Cross-section TEM showed some microcrystllites appeared near interface region. Heterojunction solar cells on p type c-Si wafer have been fabricated using films developed in this thesis. Interference fringes in EQE disappeared on either textured substrate or cells with lift-off contacts. Maximum EQE was 87% around 700nm. I-V curves have also been studied where the interesting kink suggests a counter-diode has formed between emitter region and contacts.

The structure and the energy band gap of hydrogenated amorphous silicon carbide are theoretically revised. In the light of defect pool model, density of states distribution is investigated for various regions of mobility gap. The films are deposited by plasma enhanced chemical vapor deposition system with various gas concentrations at two different, lower (30 mW/cm2) and higher (90 mW/cm2), radio frequency power densities. The elemental composition of hydrogenated amorphous silicon carbide films and relative composition of existing bond types are analyzed by x-ray photoelectron spectroscopy measurements. The thicknesses, deposition rates, refractive indices and optical band gaps of the films are determined by ultraviolet visible transmittance measurements. Uniformity of the deposited films is analyzed along the radial direction of the bottom electrode of the plasma enhanced chemical vapor deposition reactor. The molecular vibration characteristics of the films are reviewed and analyzed by Fourier transform infrared spectroscopy measurements. Electrical characteristics of the films are analyzed by dc conductivity measurements. Conduction mechanisms, such as extended state, nearest neighbor and variable range hopping in tail states are revised. The hopping conductivities are analyzed by considering the density of states distribution in various regions of mobility gap. The experimentally measured activation energies for the films of high carbon content are too low to be interpreted as the difference between Fermi level and relevant band edge. This anomaly has been successfully removed by introducing hopping conduction across localized tail states of the relevant band. In other words, the second contribution lowers the mobility edge towards the Fermi level.

The instability under bias voltage stress and low mobility of hydrogenated amorphous silicon (a-Si:H) thin film transistor (TFT), produced by plasma enhanced chemical vapor deposition (PECVD) technique, are the main problems impeding the implementation of active matrix arrays for light emitting diode display panels and their peripheral circuitry. Replacing a-Si:H by hydrogenated nanocrystalline silicon film (nc-Si:H) seems a solution due to its higher mobility and better stability. Therefore nc-Si:H TFT was produced and investigated in this thesis. All TFT layers (doped nc-Si:H, intrinsic nc-Si:H and insulator films) were produced separately, characterized by optical (UV-visible and FTIR spectroscopies, XRD) and electrical (current-voltage, I-V) methods, and optimized for TFT application. Afterwards the non self-aligned bottom-gate TFT structure was fabricated by the photolithographic method using 2-mask set. The n+ nc-Si:H films, used for TFT drain/source ohmic contacts, were produced at high H2 dilution and at several RF power densities (PRF). The change of their lateral resistivity (rho) was measured by reducing the film thickness via reactive ion etching. The rho values rise below a critical film thickness, indicating the presence of the disordered and less conductive incubation layer. The optimum PRF for the lowest incubation layer was determined. Among the deposition parameters only increased NH3/SiH4 flow rate ratio improved the insulating properties of the amorphous silicon nitride (a-SiNx:H) films, chosen as the TFT gate dielectric. The electrical characteristics of two TFTs with a-SiNx:H having low leakage current, fabricated at different NH3/SiH4 ratios (~19 and ~28) were compared and discussed. The properties (such as crystallinity, large area uniformity, etc.) of the nc-Si:H film as TFT channel layer, were found to depend on PRF. For the films deposited at the center of the PECVD electrode the change from an amorphous dominant structure to a nanocrystalline phase took place with increasing PRF, whereas those at the edge had always nanocrystalline nature, independent of PRF. The two different TFTs produced at the center of the electrode with a-Si:H and nc-Si:H grown at low and high PRF, respectively, were compared through their I-V characteristics and electrical stability under the gate bias voltage stress. Finally, nc-Si:H TFT structure, produced and optimized in this work, was analyzed through gate-insulator-drain/source capacitor by capacitance-voltage (C-V) measurements within 106-10-2 Hz frequency (F) range. The inversion regime was detected at low F without any external charge injection. Besides, ac hopping conductivity in the nc-Si:H bulk was extracted from the fitting results of the C-F curves.

The production of low cost, large area display systems requires a light emitting material compatible with the standard silicon (Si) based complementary metal oxide semiconductor (CMOS) technology. The crystalline bulk Si is an indirect band semiconductor with very poor optical properties. On the other hand, hydrogenated amorphous Si (a-Si:H) based wide gap alloys exhibit strong visible photoluminescence (PL) at room temperature, owing to the release of the momentum conservation law. Still, the electroluminescence (EL) intensity from the diodes based on these alloys is weak due to the limitation of the current transport by the localized states. In the frame of this work, first, the luminescent properties of amorphous silicon nitride (a-SiNx:H) thin films grown in a plasma enhanced chemical vapor deposition (PECVD) system were analyzed with respect to the nitrogen content. Then, the doping effciency of p- and n-type hydrogenated nanocrystalline Si (nc-Si:H) films was optimized via adjusting the deposition conditions. Next, the junction quality of these doped layers was checked and further improved in a homojunction pin diode. Heterojunction pin light emitting diodes (LEDs) were fabricated with a-SiNx:H as the luminescent active layer. The EL effciency of the fresh diodes was very low, as expected. As a solution, the diodes were electro-formed under high electric field leading to nanocrystallization accompanied by a strong visible light emission from the whole diode area. The current-voltage (I-V) and EL properties of these transformed diodes were investigated in detail.

In this thesis, research on a-Si:H Schottky diodes and a-Si:H/c-Si heterojunctions is presented with the focus on the capacitance spectroscopy and information on electronic properties that can be derived from this technique. Last years a-Si:H/c-Si heterojunctions (HJ) have received growing attention as an approach which combines wafer and thin film technologies due to their low material consumption and low temperature processing. HJ solar cells benefit from lower fabrication temperatures thus reduced costs, possibilities of large-scale deposition, better temperature coefficient and lower silicon consumption. The most recent record efficiency belongs to Panasonic with 24.7% for a cell of 100 cm² was obtained. The aim of this thesis is to provide a critical study of the capacitance spectroscopy as a technique that can provide information on both subjects: DOS in a-Si:H and band offset values in a-Si:H/c-Si heterojunctions.The first part of the manuscript is devoted to capacitance spectroscopy in a-Si:H Schottky diodes. The interest is concentrated on the simplified treatment of the temperature and frequency dependence of the capacitance that allows one to extract the density of states at the Fermi level in a-Si:H. We focus on the study of the reliability and validity of this approach applied to a-Si:H Schottky barriers with various magnitudes and shapes of the DOS. Several structures representing n-type and undoped hydrogenated amorphous silicon Schottky diodes are modeled with the help of numerical simulation softwares. We show that the reliability of the studied treatment drastically depends on the approximations used to obtain the explicit analytical expression of the capacitance in such an amorphous semiconductor.In the second part of the chapter, we study the possibility of fitting experimental capacitance data by numerical calculations with the input a-Si:H parameters obtained from other experimental techniques. We conclude that the simplified treatment of the experimentally obtained capacitance data together with numerical modeling can be a valuable tool to assess some important parameters of the material if one considers the results of numerical modeling and performs some adjustments. The second part is dedicated to capacitance spectroscopy of a-Si:H/c-Si heterojunctions with special emphasis on the influence of a strong inversion layer in c-Si at the interface. Firstly, we focus on the study of the frequency dependent low temperature range of capacitance-temperature dependencies of a-Si:H/c-Si heterojunctions. The theoretical analysis of the capacitance steps in calculated capacitance-temperature dependencies is presented by means of numerical modeling. It is shown that two steps can occur in the low temperature range, one being attributed to the activation of the response of the gap states in a-Si:H to the small signal modulation, the other one being related to the response of holes in the strong inversion layer in c-Si at the interface. The experimental behavior of C-T curves is discussed. The quasi-static regime of the capacitance is studied as well. We show that the depletion approximation fails to reproduce the experimental data obtained for (p) a-Si:H/(n) c-Si heterojunctions. Due to the existence of the strong inversion layer, the depletion approximation overestimates the potential drop in the depleted region in crystalline silicon and thus underestimates the capacitance and its increase with temperature. A complete analytical calculation of the heterojunction capacitance taking into account the hole inversion layer is developed. It is shown that within the complete analytical approach the inversion layer brings significant changes to the capacitance for large values of the valence band offset. The experimentally obtained C-T curves show a good agreement with the complete analytical calculation and the presence of the inversion layer in the studied samples is thus confirmed.

<p>When the amorphous silicon (a-Si) dangling bonds are bonded to hydrogen the concentration of the dangling bond is decreased. The resulting film is called hydrogenated amorphous silicon (a-Si:H). The reduction in the dangling bonds concentration improves the optoelectrical properties of the film. The improved properties of a-Si:H makes it possible to manufacture electronic devices including a solar cell. A solar cell device based on the hydrogenated amorphous silicon (a-Si:H) was fabricated using the Hot-Wire Chemical Vapour Deposition (HWCVD). When an n-i-p solar cell configuration is grown, the norm is that the p-doped layer is deposited from a mixture of silane (SiH4) gas with diborane (B2H6). The boron atoms from diborane bonds to the silicon atoms and because of the number of the valance electrons, the grown film becomes a p-type film. Aluminium is a group 3B element and has the same valence electrons as boron, hence it will also produce a p-type film when it bonds with silicon. In this study the p-doped layer is grown from the co-deposition of a-Si:H from SiH4 with aluminium evaporation resulting in a crystallized, p-doped thin film. When this thin film is used in the n-i-p cell configuration, the device shows photo-voltaic activity. The intrinsic layer and the n-type layers for the solar cell were grown from SiH4 gas and Phosphine (PH3) gas diluted in SiH4 respectively. The individual layers of the solar cell device were characterized for both their optical and electrical properties. This was done using a variety of experimental techniques. The analyzed results from the characterization techniques showed the films to be of device quality standard. The analysed results of the ptype layer grown from aluminium showed the film to be successfully crystallized and doped. A fully functional solar cell was fabricated from these layers and the cell showed photovoltaic activity.<br /> &nbsp / </p>

Plasma enhanced chemical vapor deposition systems are massively deployed to grow numerous thin film coatings including hydrogenated amorphous silicon. A new deposition chamber was designed, procured, and constructed to investigate the plasma properties of a 100% silane (SiH4) glow discharge with varying chamber pressure and inter-electrode spacing. A Hiden EQP1000 ion mass spectrometer sampled the plasma from the substrates point of view. Ion energy distributions were obtained using four different excitation sources +DC, –DC, radio frequency (at 13.56 MHz), and the DC Saddle Field (DCSF) in the tetrode configuration. The shape of the ion energy distributions was constant for the capacitively coupled +DC, –DC, and rf (at higher pressures of 75 and 160 mTorr) glow discharges. The shape of the ion energy distributions for the DCSF plasma exhibited a double peak or saddle structure analogous to radio frequency plasmas. The width between the peaks (peak separation) was controlled by the pressure and the semi-transparent cathode to semi-transparent anode distance. Ion energy distributions from the DCSF plasma concurred with rf and +DC ion energy distributions at specific pressures and inter-electrode distances. This result demonstrates the versatility of the DCSF glow discharge system. Moreover, control of the peak separation is modeled to be iii equivalent to controlling the critical ratio (ion transit time in the sheath to the electron oscillating period), and/or the inferred electron oscillating sheath potential. The DCSF possesses a fusion of rf and +DC methods. The long high energy tail or constant background are indicative of a +DC high voltage sheath in which there is an increasing fraction of collisionless ions as the anode-cathode distance increases. These collisionless ions are provided by the oscillating electrons (or rf nature) of the DCSF method. Higher order silane (silicon containing) ions increase in relative intensity with increasing inter-electrode spacing for the +DC, –DC, and rf plasmas. These higher order silane ions are also detected in the DCSF plasma, and can be reduced at either lower pressure or lower cathode to anode or cathode to substrate distances.

Plasma enhanced chemical vapor deposition systems are massively deployed to grow numerous thin film coatings including hydrogenated amorphous silicon. A new deposition chamber was designed, procured, and constructed to investigate the plasma properties of a 100% silane (SiH4) glow discharge with varying chamber pressure and inter-electrode spacing. A Hiden EQP1000 ion mass spectrometer sampled the plasma from the substrates point of view. Ion energy distributions were obtained using four different excitation sources +DC, –DC, radio frequency (at 13.56 MHz), and the DC Saddle Field (DCSF) in the tetrode configuration. The shape of the ion energy distributions was constant for the capacitively coupled +DC, –DC, and rf (at higher pressures of 75 and 160 mTorr) glow discharges. The shape of the ion energy distributions for the DCSF plasma exhibited a double peak or saddle structure analogous to radio frequency plasmas. The width between the peaks (peak separation) was controlled by the pressure and the semi-transparent cathode to semi-transparent anode distance. Ion energy distributions from the DCSF plasma concurred with rf and +DC ion energy distributions at specific pressures and inter-electrode distances. This result demonstrates the versatility of the DCSF glow discharge system. Moreover, control of the peak separation is modeled to be iii equivalent to controlling the critical ratio (ion transit time in the sheath to the electron oscillating period), and/or the inferred electron oscillating sheath potential. The DCSF possesses a fusion of rf and +DC methods. The long high energy tail or constant background are indicative of a +DC high voltage sheath in which there is an increasing fraction of collisionless ions as the anode-cathode distance increases. These collisionless ions are provided by the oscillating electrons (or rf nature) of the DCSF method. Higher order silane (silicon containing) ions increase in relative intensity with increasing inter-electrode spacing for the +DC, –DC, and rf plasmas. These higher order silane ions are also detected in the DCSF plasma, and can be reduced at either lower pressure or lower cathode to anode or cathode to substrate distances.

It has been debated that among all the renewable energy alternatives, only solar energy offers sufficient resources to meet energy demands. Silicon thin film solar cells are at the frontier of commercial solar technology. Hot wire chemical vapour deposition (HWCVD) is the technique of choice for silicon thin film deposition due to the absence of ion bombardment and its independence toward geometry or electromagnetic properties of the substrate, as seen by plasma enhanced chemical vapour deposition (PECVD). With the implementation of nanostructures in a multi-band gap tandem solar cell, considerable improvement has been achieved over the single junction solar cells. Defect assisted tunnelling processes at the junctions between individual solar cells in a tandem structure solar cell largely affect the efficiency of these solar cells. In this contribution, the investigation toward the improvement of silicon thin films for tandem solar cell application is initiated. This study reports on the effects of hydrogen dilution and deposition time on six silicon thin films deposited at six specific deposition regimes. The thin film properties are investigated via X-Ray diffraction analysis, Raman spectroscopy, Fourier transform infra-red spectroscopy, elastic recoil detection analysis, scanning and transmission electron microscopy and UV-visible spectroscopy. This investigation revealed the dominating etching effect of atomic hydrogen with the increase in hydrogen dilution and a bonded hydrogen content (CH) exceeding 10 at.% for each of the six thin films. The optically determined void volume fraction and static refractive index remain constant, for each thin film, with the change in CH. A new deposition procedure, utilising the deposition conditions of the previously investigated thin films, is performed by HWCVD to deposit two silicon thin films. This deposition procedure involved either increasing (protocol 1) or decreasing (protocol 2) hydrogen dilution during deposition. Structural and optical variation with depth was observed for the dynamically deposited silicon thin films, with nano-voids existing across the entire cross section and bond angle variations which are indicative of good structural order. The optical absorption curves differ for the two silicon thin films whereas the optical density remains constant for both. / >Magister Scientiae - MSc

The development of functional flexible electronics is essential to enable applications such as conformal medical imagers, wearable health monitoring systems, and flexible light-weight displays. Intensive research on thin-film transistors (TFTs) is being conducted with the goal of producing high-performance devices for improved backplane electronics. However, there are many challenges regarding the performance of devices fabricated at low temperatures that are compatible with flexible plastic substrates. Prior work has reported on the change in TFT characteristics due to mechanical strain, with especially extensive data on the effect of strain on field-effect mobility. This thesis investigates the effect of gate-bias stress and elastic strain on the long-term stability of flexible low-temperature hydrogenated amorphous silicon (a-Si:H) TFTs, as the topic has yet to be explored systematically. An emphasis was placed on bias-stress measurements over time in order to obtain information on the physical mechanisms of instability. Drain current was measured over various intervals of time to track the degradation of devices due to metastability, and results were then compared across devices of various sizes under tensile, compressive, and zero strain. Transfer characteristics of the TFTs were also measured under the different conditions, to allow for extraction of parameters that would provide insight into the instability mechanisms. In addition to parameter extraction, the degradation and recovery of TFT output current was quantitatively compared for various bias-stress times across the different levels of strain. Finally, the instability mechanisms are modelled with a Markov system to further examine the effect of strain on long-term TFT operation. From the analysis of results, it was found that shallow charge trapping in the dielectric is the main mechanism of instability for short bias stress times, and did not seem to be greatly affected by strain. For longer bias stress times of over 10000 seconds, defect creation in the a-Si:H becomes a more significant contributor to instability. Both tension and compression increased defect creation compared to TFTs with zero applied strain. Compression appeared to cause the greatest increase in the rate of defect formation, likely by weakening Si-Si bonds in the a-Si:H. Tension appeared to cause a less significant increase, possibly due to a strengthening of some proportion of the Si-Si bonds caused by the slight elongation of bond length or because the applied tension relieves intrinsic compressive stress in a-Si:H film. A longer conduction path and greater dielectric area appears to increase the bias-stress and strain-related effects. Therefore reducing device size should increase the reliability of flexible TFTs.