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<p> Compact mathematical models used to simulate the static V-I characteristics of bipolar junction transistors are investigated. An abbreviated Gummel-Poon model and various modified Ebers-Moll models employed in computer network analysis programs are compared on the basis of their ability to simulate the common-emitter static characteristics of a silicon double-diffused transistor, the ease of the model parameter evaluation, the compromise between simplicity of model and accuracy of simulation and the ability to represent physical processes of transistor.</p> / Thesis / Master of Engineering (MEngr)

abstract: Space exploration is a large field that requires high performing circuitry due to the harsh environment. Within a space environment one of the biggest factors leading to circuit failure is radiation. Circuits must be robust enough to continue operation after being exposed to the high doses of radiation. Bandgap reference (BGR) circuits are designed to be voltage references that stay stable across a wide range of supply voltages and temperatures. A bandgap reference is a piece of a large circuit that supplies critical elements of the large circuit with a constant voltage. When used in a space environment with large amounts of radiation a BGR needs to maintain its output voltage to enable the rest of the circuit to operate under proper conditions. Since a BGR is not a standalone circuit it is difficult and expensive to test if a BGR is maintaining its reference voltage. This thesis describes a methodology of isolating and simulating bandgap references. Both NPN and PNP bandgap references are simulated over a variety of radiation doses and dose rates. This methodology will allow the degradation due to radiation of a BGR to be modeled easily and affordably. It can be observed that many circuits experience enhanced low dose rate sensitivity (ELDRS) which can lead to failure at low total ionizing doses (TID) of radiation. A compact model library demonstrating degradation of transistors at both high and low dose rates (HDR and LDR) will be used to show bandgap references reliability. Specifically, two bandgap references being utilized in commercial off the shelf low dropout regulators (LDO) will be evaluated. The LDOs are reverse engineered in a simulation program with integrated circuit emphasis (SPICE). Within the two LDOs the bandgaps will be the points of interest. Of the LDOs one has a positive regulated voltage and one has a negative regulated voltage. This requires an NPN and a PNP based BGR respectively. This simulation methodology will draw conclusions about the above bandgap references, and how they operate under radiation at different doses and dose rates. / Dissertation/Thesis / Masters Thesis Electrical Engineering 2019

Traditionally, the design of continuous time active filters usually has a trade offbetween low-voltage and high dynamic range. One way to solve this problem is companding technology. There are two methods for companding filters. The first method utilizes the exponential I-V characteristics of BJT in the saturation region. In order to reduce the cost andintegrate the analog and digital circuits, the other method was exploited using CMOS process. In this project, a new first-order low pass log-domain filter based on CMOS parasitic vertical BJTwill be proposed. This filter has higher frequency response than previous circuits. We will first employ Hspice to simulate the log-domain filter to ensure the correctness of the circuit and make it a reliable reference with the circuit layout. After summarizing all the simulations and analyses, the chip will be fabricated with 0.35um CMOS technology.

京都大学 / 0048 / 新制・課程博士 / 博士(工学) / 甲第19312号 / 工博第4109号 / 新制||工||1633(附属図書館) / 32314 / 京都大学大学院工学研究科電子工学専攻 / (主査)教授 木本 恒暢, 教授 引原 隆士, 准教授 船戸 充 / 学位規則第4条第1項該当 / Doctor of Philosophy (Engineering) / Kyoto University / DFAM

The temperature dependent electrical characteristics of silicon carbide power transistors – 4H-SiC metal semiconductor field-effect transistors (MESFETs) and 4H-SiC bipolar junction transistors (BJTs) have been investigated through simulation and experimental approaches. Junction temperatures and temperature distributions in devices under large power densities have been estimated. The DC and RF performance of 4H-SiC RF Power MESFETs have been studied through two-dimensional electro-thermal simulations using commercial software MEDICI and ISE. The simulated characteristics of the transistors were compared with the measurement results. Performance degradation of transistors under self-heating and high operating temperatures have been analyzed in terms of gate and drain characteristics, power density, high frequency current gain and power gain. 3D thermal simulations have been performed for single and multi-finger MESFETs and the simulated junction temperatures and temperature profiles were compared with the results from electro-thermal simulations. The reduction in drain current caused by self-heating was found to be more prominent for transistors with more fingers and it imposes a limitation on both the output power and the power density (in W/mm) of multi-fingered large area devices. Thermal issues for design of high power multi-fingered SiC MESFETs were also investigated. A couple of useful ways to reduce the self-heating effects were discussed. Trap-induced performance instabilities of the devices were analyzed by carrying out DC, transient, and pulse measurements at room and elevated temperatures. Electrical characteristics of 4H-SiC BJTs have been measured. A reduction in current gain at elevated temperatures was observed. Based on the collector current-voltage diagram measured at three different ambient temperatures the junction temperature was extracted using the assumption that the current gain only depends on the temperature. Temperature measurements have been carried out for SiC BJTs. Thermal images of a device under operation were recorded using an infrared camera. 3D thermal simulations were conducted using FEMLAB. Both the simulations and the measurement showed a significant temperature increase in the vicinity of the device when operated at high power densities, thus causing the decrease of the DC current gain. The junction temperatures obtained from the thermal imaging, simulation and extraction agree well.

<p>The temperature dependent electrical characteristics of silicon carbide power transistors – 4H-SiC metal semiconductor field-effect transistors (MESFETs) and 4H-SiC bipolar junction transistors (BJTs) have been investigated through simulation and experimental approaches. Junction temperatures and temperature distributions in devices under large power densities have been estimated. </p><p>The DC and RF performance of 4H-SiC RF Power MESFETs have been studied through two-dimensional electro-thermal simulations using commercial software MEDICI and ISE. The simulated characteristics of the transistors were compared with the measurement results. Performance degradation of transistors under self-heating and high operating temperatures have been analyzed in terms of gate and drain characteristics, power density, high frequency current gain and power gain. 3D thermal simulations have been performed for single and multi-finger MESFETs and the simulated junction temperatures and temperature profiles were compared with the results from electro-thermal simulations. The reduction in drain current caused by self-heating was found to be more prominent for transistors with more fingers and it imposes a limitation on both the output power and the power density (in W/mm) of multi-fingered large area devices. Thermal issues for design of high power multi-fingered SiC MESFETs were also investigated. A couple of useful ways to reduce the self-heating effects were discussed. Trap-induced performance instabilities of the devices were analyzed by carrying out DC, transient, and pulse measurements at room and elevated temperatures. </p><p>Electrical characteristics of 4H-SiC BJTs have been measured. A reduction in current gain at elevated temperatures was observed. Based on the collector current-voltage diagram measured at three different ambient temperatures the junction temperature was extracted using the assumption that the current gain only depends on the temperature. Temperature measurements have been carried out for SiC BJTs. Thermal images of a device under operation were recorded using an infrared camera. 3D thermal simulations were conducted using FEMLAB. Both the simulations and the measurement showed a significant temperature increase in the vicinity of the device when operated at high power densities, thus causing the decrease of the DC current gain. The junction temperatures obtained from the thermal imaging, simulation and extraction agree well. </p>

abstract: A modeling platform for predicting total ionizing dose (TID) and dose rate response of commercial commercial-off-the-shelf (COTS) linear bipolar circuits and technologies is introduced. Tasks associated with the modeling platform involve the development of model to predict the excess current response in a bipolar transistor given inputs of interface (NIT) and oxide defects (NOT) which are caused by ionizing radiation exposure. Existing models that attempt to predict this excess base current response are derived and discussed in detail. An improved model is proposed which modifies the existing model and incorporates the impact of charged interface trap defects on radiation-induced excess base current. The improved accuracy of the new model in predicting excess base current response in lateral PNP (LPNP) is then verified with Technology Computer Aided Design (TCAD) simulations. Finally, experimental data and compared with the improved and existing model calculations. / Dissertation/Thesis / Masters Thesis Electrical Engineering 2017

Since the first commercial silicon carbide (SiC) transistor was released, the interest in SiC has grown exponentially [1]. The wide energy band gap, high critical electric field and thermal conductivity of silicon carbide allow it to withstand higher voltage/current gains than conventional semiconductor materials [2]. The electrical properties of SiC enable integrated devices and circuits to operate at higher voltages and temperatures. One of the most attractive applications for SiC is in inverters for photovoltaic systems, where switching time is of great importance. This thesis presents the study of two bipolar junction transistors (BJT), FSICBH15A120 of SiC and BUV48A of conventional silicon (Si). The transistors were simulated and validated experimentally, then tested in a DC/AC pv inverter with a polycrystalline solar module of 36 solar cells as power source. The simulation results showed high efficiency and low power losses. / Sedan den första kommersiella transistorn av kiselkarbid (SiC) släpptes har intresset för SiC ökat exponentiellt [1]. Det breda energibandgapet, höga kritisk elektriska fältstyrkan och termiska ledningsförmågan i SiC gör att den klarar en högre kombination av spänning/strömförstärkning än konventionella halvledarmaterial [2]. De elektriska egenskaperna av SiC gör det möjligt för integrerade komponenter och kretsar att arbeta i högre spänningar och temperaturer. Ett av de största användningsområdena för SiC är i växelriktare för solceller, där switch-tid har stor betydelse. I detta examensarbete presenteras studien av två bipolära transistorer (BJT), FSICBH15A120 av SiC och BUV48A av konventionellt kisel (Si). Transistorerna simulerades och valideras experimentellt, och slutligen jämfördes med varandra i en DC/AC-omvandlare med en polykristallin solpanel av 36 solceller som strömkälla. Hög verkningsgrad och låga energiförluster påvisades.

This thesis aims to bring an understanding to the silicon carbide (SiC) bipolar junction transistor (BJT). SiC power devices are superior to the silicon IGBT in several ways. They are for instance, able to operate with higher efficiency, at higher frequencies, and at higher junction temperatures. From a system point of view the SiC power device could decrease the cost and complexity of cooling, reduce the size and weight of the system, and enable the system to endure harsher environments. The three main SiC power device designs are discussed with a focus on the BJT. The SiC BJT is compared to the SiC junction field-effect transistor (JFET) and the metal-oxide semiconductor field-effect transistor (MOSFET). The potential of employing SiC power devices in applications, ranging from induction heating to high-voltage direct current (HVDC), is presented. The theory behind the state-of-the-art dual-source (2SRC) base driver that was presented by Rabkowski et al. a few years ago is described. This concept of proportional base drivers is introduced with a focus on the discretized proportional base drivers (DPBD). By implementing the DPBD concept and building a prototype it is shown that the steady-state consumption of the base driver can be reduced considerably.  The aspects of the reverse conduction of the SiC BJT are presented. It is shown to be of importance to consider the reduced voltage drop over the base-emitter junction. Last the impact of SiC unipolar and bipolar devices in series-resonant (SLR) converters is presented. Two full-bridges are designed and constructed, one with SiC MOSFETs utilizing the body diode for reverse conduction during the dead-time, and the second with SiC BJTs with anti-parallel SiC Schottky diodes. It is found that the SiC power devices, with their absence of tail current, are ideal devices to fully utilize the soft-switching properties that the SLR converters offer. The SiC MOSFET benefits from its possibility to utilize reverse conduction with a low voltage drop. It is also found that the size of capacitance of the snubbers can be reduced compare to state-of-the-art silicon technology. High switching frequencies of 200 kHz are possible while still keeping the losses low. A dead-time control strategy for each device is presented. The dual control (DuC) algorithm is tested with the SiC devices and compared to frequency modulation (FM). The analytical investigations presented in this thesis are confirmed by experimental results on several laboratory prototype converters. / <p>QC 20150529</p>