A geração global de resíduo eletrônico (REEE) cresce a uma taxa de cerca de 40 milhões de toneladas por ano. Este constante incremento na geração dos REEEs somado às recentes legislações tem impulsionado pesquisas focadas no desenvolvimento de processos para recuperação de materiais e sustentabilidade da indústria eletroeletrônica. Dentro destes resíduos encontram-se as placas de circuito impresso (PCIs) que estão presentes na maioria dos EEEs, têm composição heterogênea que varia conforme a fonte, país de proveniência e época, e tecnologia de fabricação. Assim, este trabalho teve por objetivo a realização de rota hidrometalúrgica (extração sólido/líquido) e biohidrometalúrgica para reciclagem de placas de circuito impresso provenientes de impressoras visando a recuperação de cobre. Para tanto fez-se inicialmente a caracterização da PCI e o desenvolvimento de uma rota combinada de processamento físico seguida por processo hidrometalúrgico ou biohidrometalúrgico. O processamento físico e de caracterização foi composto por etapas de cominuição, separação magnética, classificação granulométrica, visualização em lupa binocular, microscópio eletrônico de varredura acoplado com detector de energia dispersiva de raios X (MEV/EDS), digestão ácida, perda ao fogo e análise química por AAS e ICP. Já, o processamento hidrometalúrgico foi composto por duas etapas de extração sólido/líquido: a primeira em meio sulfúrico e a segunda em meio sulfúrico oxidante. Para os ensaios de biolixiviação utilizou-se uma cepa bacteriana composta por 3 espécies microbianas: Acidithiobacillus ferrooxidans, Acidithiobacillus thiooxidans e Leptospirillum ferrooxidans. Verificou-se que a placa possui 4 camadas de Cu intercaladas por fibra de vidro, é lead free e seus componentes representam 53,3 % do seu peso. A porcentagem em massa correspondente ao material não magnético é de 74,6 % e do magnético 25,4 %. Os materiais moído e não magnético apresentaram tendência em se acumular nas frações mais grossas. Já na fração magnética, o acúmulo do material ocorreu na fração mais fina (0,053 mm). A separação dos metais através de classificação granulométrica não foi possível. A PCI estudada é composta por: 44% de metais, 28,5 % de polímeros e 27,5 % de cerâmicas. Sendo: Ag-0,31 %; Al3,73 %; Au0,004 %; Cu 32,5 %; Fe1,42 %; Ni0,34 %; Sn0,96 % e Zn0,64 %. A extração de Cu no processamento hidrometalúrgico foi de 100 % e o fator de recuperação 98,46 %, o que corresponde a uma recuperação de 32 kg de Cu em 100 kg de PCI. Já no processamento biohidrometalúrgico, a extração de Cu alcança 100 % quando utilizados 2 % de densidade de polpa e 100 % de inóculo. O fator de recuperação é de 100 % e a recuperação de Cu em 100 kg de PCI é de 32,5 kg. O processamento hidrometalúrgico apresenta como vantagens quando comparado ao biohidrometalúrgico: menor tempo de extração (8 h versus 4 dias); seletividade de Cu; maior densidade de polpa (10 % versus 2 %). Já a biolixiviação utiliza menor temperatura de trabalho (36 ºC versus 75 ºC) e dispensa a etapa de separação magnética. / The increase in the generation of waste electrical and electronic equipment (WEEE), 40 tons per year, allied with the enactment of new laws encouraged researches focused on the developing of processes to reclaim materials and on the sustainability of the electrical and electronics industry. Whithin the WEEEs, printed circuit boards (PCB) composition is heterogeneous and varies according to several factors, including: kind of EEE, when and where it was produced and fabrication technology. The goal of this work is to perfom a hydrometallurgical route (solid/liquid extraction) and a biohydrometallurgical route to recycle PCB from discarded printers aiming the recovery of copper. To do so, the first step is to characterize the PCB and the development of a combined fisical processing followed by hydrometallurgical and biohydrometallurgical routes. The fisical and the characterization processes, in that order, consisted on griding, magnetic separation, granulometric screening, visual assessement by binocular magnifier, scanning electron microscopy with energy dispersive X-ray spectroscopy (SEM/EDS), acid digestion, loss on fire, and chemical analyzes by AAS and ACP-OES. The hydrometallurgical stage consisted on two steps: solid/liquid extraction by sulfuric acid leaching and solid/liquid extraction by sulfuric acid leaching with an oxidizing agent. The bioleaching tests used a mixed bacterial strain: Acidithiobacillus ferrooxidans, Acidithiobacillus thiooxidans and Leptospirillum ferrooxidans. The results showed that PCB consisted on 4 layers of copper and fiber glass, not possesing lead (leadfree) on its composition and its components constitute 53.3 % weight percentage. The non-magnetic fraction (NMA) weight percentage represents 74.6 %, the magnetc fraction (MA) represents 25.4 %. The grinded material and the non-magnetic fraction presented an inclination to build up on thickest fractions. On the magnetic fraction this behavior occurred on the thinnest fraction (0.053 mm). The metal separation using granulometric screening was not possible and the visual assessement by binocular magnifier was conclusive for this research. The composition of the studied PCB is: 44 % metal, 28.5 % polymer and 27.5 % ceramics. Beeing: Ag-0.31 %, Al-3.73 %, Au-0.004 %, Cu-32.5 %, Fe-1.42 %, Ni-0.34 %, Sn-0.96 %, Zn-0.64 % and other metals-4.10 %. Copper extraction in the hydrometallurgical process achieved 100 % and the recuperation factor 98.46 %, which means a recovery of 32 kg of copper in 100 kg of PCB. However in biohydrometallurgical process, the copper extraction reached 100 % on the forth day using a 2 % pulp density and 100 % inoculum. The recuperation factor achieved 100 % and, therefore, copper recovery in 100 kg of PCB is equivalent to 32.5 kg. The hydrometallurgical processing has many advantages compared to the biohydrometallurgical processing: a smaller extraction time (8 h versus 4 days); Cu selectivity; higher pulp density (10 % versus 2 %). However, bioleaching uses an inferior working temperature (36 ºC versus 75 ºC) and dont require magnetic separation.

Electromagnetic compatibility remains an important topic in the design and manufacturing of printed circuit boards (PCBs). Compatibility of these devices with their surroundings is becoming increasingly difficult as a modern PCB can have hundreds or thousands of parts, operating on many layers, and all at high speed. One such part is a via and its clearance, or via hole, commonly required in multilayer circuits where vertical connections between layers are used. The via hole may be exposed to large electromagnetic fields within the PCB. Although electrically small, the via hole provides a pathway for the fields to excite the exterior, either directly or through coupling to adjacent structures. To quantify this process, the near fields and radiation of an excited via hole are analysed, and are the focus of this thesis. The near fields of the via hole are first decoupled into electric and magnetic fields of the 'static' type. In both cases a series solution for two regions, one outside, and one inside the layers is constructed. The coefficients of the terms of the series are chosen to best satisfy the boundary behaviour of the fields on the conducting surfaces and across the hole. The criteria for assessing quality of the solution is based on the least squares method (LSM). Linear equation systems for both models are derived, and as no numerical integration or discretisation is required, an efficient and robust implementation to find the near fields is developed. Transformation into the far field is then achieved through surface integration of relevant field quantities close to the via hole. The far fields are best viewed as that due to two dipoles, of the magnetic and electric type, with strength and orientation depending on how the via hole is excited. It is shown that the two dipole model is sufficient to find the radiation from a 1mm diameter via hole at a frequency up to 8 GHz. Of further interest is how the choice of via hole dimensions affects the dipole moments and the near fields solved earlier are a key to this understanding.

The purpose of this study is to analyze the current situation and trend over Taiwan's Specialty Chemicals of Printed Circuit Board industry. In addition, this study explores the optimal management strategy through competitive strategy theory and case study, and proposes suggestions on management stratedy to Specialty Chemicals of Printed Circuit Board industry. The key success factors were summarized from literature review and analysis of current industry status. By using these factors as variables to design the questionnaire and conducting the survey with in-depth interview, following concousions were made from the study. 1.The business advangate of Taiwan Specialty Chemicals of Printed Circuit Board industry includes the well-developed finance and stable capital support, great R&D ability, stable quality sandard, outstanding customer and after-sale service, plenty talent person for management and technology, and excellent enterprise culture. 2.Key factors affecting the competiveness among the Taiwan Specialty Chemicals of Printed Circuit Board industry are as follows. (1)Suppliers: product quality and the ability of problems solving and readily answering form suppliers. (2)Customers: identification with the brand quality and the bargaining power and purchasing amount of customers. (3)New entrants: distinctive product and technology, product differentiation and cost advantage. (4)Substitute products: function, quality, price, switching cost and R&D ability of substitute products. (5)Competitive rivalry: switching cost of customers, the integral industry growth rate and the integral actual strength of competitors. 3.The study suggests the Taiwan Specialty Chemicals of Printed Circuit Board industry to adopt the following competitive strategy. (1)Cost leadership strategy: to seek for suppliers with lower supplying cost, stable suppling and lower manpower cost. (2)Differentiation strategy: product innovation and quality. (3)Growth strategy: vertical intergration of upstream to downstream manufacturering partners and discriminiate market development.

ABSTRACT In recent years China's rapid rise and low-cost advantages, has brought the greatest impact on the printed circuit board industry, low-cost competition for the majority of Taiwanese companies are not strengths, combined with the financial crisis began in 2008, followed by 2009, the world consumer electronics market tightening, are tested in Taiwan for the production of printed circuit board industry base in the viability of manufacturers. In this study, through the study of Taiwan as a production base in case the printed circuit board companies, in the face of financial crisis in 2008, and follow-up to internal and external changes in the industry and the growth and decline of national competitiveness, the restructuring strategy is adopted to overcome the external environmental challenges of rapid change, which concludes with Taiwan as a production base of the printed circuit board industry, in the face of financial turmoil and economic environment changes and the overall production of cross-strait ECFA signed, to the advantage of strengths and talents of Taiwan culture resources, so printed circuit board manufacturing industry can continue to Taiwan as a production base, more competitive challenges towards internationalization. In this study, the research method is qualitative research in the case study method, the scope of the production base of a Taiwanese printed circuit board industry, the use of literature survey and data compilation, and the case company interviews, and data collation, the first stage first motive of enterprise transformation, analysis and use of five forces analysis and diamond model to understand the background and conditions of business transformation, the second stage, the case company interviews, SWOT analysis summarized the case company and the feasibility assessment and develop transformation strategies, and understanding of the transformation strategy of the key success factors. The study concludes on the hope that the production base in Taiwan for the printed circuit board industry in the face of changing external environment when assessing the feasibility of transformation strategy and development, and further development of Taiwan companies for the future a reference transformation strategy. Keywords¡GPrinted Circuit Board (PCB), Five Forces Analysis, Diamond Model, SWOT Analysis, Transformation Strategies

This thesis realizes miniature bandpass filters using integrated passive device technology. The bandpass filters are designed based on coupled resonator method with single-band and dual-band responses, using a transformer structure with high-density winging pattern. In addition, the designs adopt the electric- and magnetic-field cancellation and the feedback mechanism to produce transmission zeros in the filter responses for enhancing selectivity and stopband rejection. In order to satisfy the specific requirements of commercial bandpass filter products, this thesis designed and implemented a trisection filter with cross coupling on a low-loss RT/Duroid substrate to generate a transmission zero very near the passband.

Electronic Industry is the leader of Taiwan manufacturing industries. Recently, the Electric Manufacture Service (EMS) of Taiwan has adopted the American professional model. In electronic products, Print Circuit Board (PCB) is a key important component with high reliability. Print Circuit Board is a customer-made product possesses unique manufacturing features, such as high quality, complicated and protracted manufacturing process, etc. The aim of this study is to evaluate whether the correct selection of the PCB supplier by the Supplier Evaluation Department is of utmost importance in assisting the establishment of a successful business among the electronic manufacturing service companies that utilizing the professional knowledge and techniques in the EMS value chain. This study integrates the management designs from ISO 9001, QS9000 and TQM to provide the evaluation system for PCB products. The related literatures were applied to the whole evaluation methodology, divided into Quality System and Processing Control. Using the Processing Control as the center, it breaks up all the product-related functional departments and processing procedures of PCB into units. According to the long-term PCB supplier evaluation experience, this study details the common mistakes and evaluation standard of each evaluation item. It also provides the related flow-charts for supplier evaluation process. The major differences of evaluation methodology between electronic and traditional industries are evaluated. Major conclusions and suggestions are obtained by simultaneously collecting a large amount of secondary information in the field, and in depth interview with the middle and high levels managers of the PCB factories. The major conclusions and suggestions are as follow: 1. Coordinate with purchasing strategy Establish an effective supplier evaluation system to select the most suitable supplier both in the quality- and cost-controls. The ordinary EMS factories will receive OEM orders of different PCB technical levels and products from different customers. This system could help finding the most suitable supplier for the job. 2. Obtain the best quality assurance for the final products According to the validation of the in-field evaluation, this study separates the analytical results into four categories. It concludes a variant table based on the levels of evaluation, manufacturing capability index and product usage. This variant table will recommend the most capable supplier in accordance with the different PCB technical levels. 3. Minimize the variation of evaluation personnel This study details the common mistakes and the evaluation standard of each evaluation item providing references to the EMS or ODM companies. After several in-field trainings, the variation of the evaluation personnel can be minimized to the least. 4. Improve the managing and manufacturing capability of PCB supplier Select the best part of the QS9000 management techniques as the references for PCB supplier to conduct the Six Sigma or Business Process Improvement (BPI). In order to improve the managing and manufacturing capability of PCB suppliers, this study suggests conducting the practical execution and prevention methods and continuous improvement activities. Through these action plans, it can decrease the unqualified rate and rejected cost, improve the management constitution, become the world-class manufacturing factories and obtain high profit.

In this thesis, vibration analyses of electronic assemblies that consist of an electronic box, printed circuit board and electronic components are presented. A detailed vibration analysis of a real electronic assembly is performed by finite element methods and vibration tests. Effects of component addition and component modeling are investigated by finite element analysis in detail. Results are compared in order to identify the most efficient, reliable and suitable method depending on the type of problem. Experimental results for the vibration of an electronic box, PCB and components are presented and discussed. Furthermore, an analytical model that represents a printed circuit board and electronic component is suggested for fixed and simply supported boundary conditions of the PCB. Different types of electronic components are modeled analytically to observe different dynamic characteristics. The validity of the analytical model is computationally checked by comparing results with those of finite element solution.

Hydropower has been around for more than a century and is considered a mature technology, but with recent advancements in power electronics and simulation capability new exciting ways to increase efficiency and reliability is possible. At Uppsala University a brushless exciter has been constructed for the experimental test rig, SVANTE. Power electronics are mounted on the shaft for control of the generator's excitation current. In addition a wireless control and measurement system is needed to provide the desired switching patterns to the power electronics and to evaluate performance of the system. In this thesis a shaft mounted embedded system for control and measurement is constructed as well as magnetic field sensors with measurement range up to 700mT. The computational power comes from a National Instruments sbRIO-9606. The system has 14 individual totem pole power electronics driving channels, 48 analog input channels for current signals and it communicates wirelessly through a bluetooth connection. The system is tested and works satisfactory but has not been mounted on the rotating side of the generator due to delays in the manufacturing.

This thesis documents the design, manufacturing, and assembly of a flexible thermoelectric device. Such a device has immediate use in haptics, medical, and athletic applications. The governing theory behind the device is explained and a one dimensional heat transfer model is developed to estimate performance. This model and consideration for the manufacturing and assembly possibilities are the drivers behind the decisions made in design choices. Once the design was finalized, manufacturing methods for the various components were explored. The system was created by etching copper patterns on a copper/polyimide laminate and screen printing solder paste onto the circuits. Thermoelectric elements were manually assembled. Several proof of concept prototypes were made to validate the approach. Development of the assembly process also involved proof of concept prototyping and partial assembly analysis. A full scale device was produced and tested to assess its thermoelectric behavior. The resulting performance was an interface temperature drop of 3 °C in 10 seconds with 1.5 A supplied, and a maximum temperature drop of 9.9 °C after 2 minutes with 2.5 A supplied. While the measured behavior fell short of predictions, it appears to be adequate for the intended purpose. The differences appear to be due to larger than expected thermal resistances between the device and the heat sinks and some possible degradation of the thermoelectric elements due to excess solder coating the edges.

En raison de la demande de miniaturisation croissante dans l’industrie microélectronique, il est nécessaire de développer des circuits imprimés multicouches (PCB, Printed Circuit Board) présentant une densité d’interconnections de plus en plus élevée. Avec leurs bonnes propriétés physico-chimiques et mécaniques et un relatif faible coût, les matériaux composites à base de résine époxy sont des matériaux de premier choix pour ce type d’application. Cependant, la réduction de la taille des connexions électriques de cuivre (largeur < 1 µm), implique que l’adhésion cuivre/époxy soit améliorée. Dans la littérature, des études ont montré que le taux de réticulation des résines epoxy est un paramètre clé, contrôlant la résistance chimique de la résine epoxy (vis-à-vis des procédés industriels d’impression de cuivre par voie chimique) et les propriétés d’adhésion du cuivre sur le substrat composite.L’objectif de cette thèse est d’étudier de façon approfondie la cinétique de réticulation d’un composite époxy/silice (ABF) utilisé en production de masse dans l’industrie microélectronique afin de proposer un protocole de fabrication des circuits imprimés en fonction du taux de réticulation.Le comportement rhéologique du matériau composite en fonction du taux de réticulation a été étudié par analyse mécanique dynamique (DMA). L’influence du taux de réticulation sur les processus de gélification et de vitrification est présentée et une analyse du comportement viscoélastique de la résine epoxy près de la transition vitreuse est discutée. Le modèle WLF est utilisé pour décrire la dynamique de réseau du polymère. La cinétique de réticulation du composite a été étudiée in situ en spectroscopie proche-infrarouge (NIR) et en calorimétrie différentielle à balayage (DSC) en modes isotherme et non-isotherme. L’analyse iso-conversionnelle a permis de déterminer l’énergie d’activation de la réaction de réticulation. Cependant, une modélisation plus approfondie de la cinétique de réticulation a été nécessaire en raison d’une contribution de diffusion s’ajoutant à la contribution chimique de la réaction. Cette étude a montré que les cinétiques de réticulation peuvent être décrites par le modèle auto-catalytique d’ordre n combiné aux modèles de Rabinowitch et WLF-modifié, modèles tenant compte de la contribution de diffusion. Ce modèle a permis de prédire le comportement du matériau dans une large gamme temps/température et d’établir le diagramme Température-Temps-Transformation du matériau .Compte tenu de l’importance du taux de réticulation sur les propriétés d’adhésion des connexions électriques de cuivre, une méthode de mesure du taux de réticulation sur des PCB industriels a été développée. La spectroscopie infrarouge en réflexion diffuse (DRIFTS) s’est avérée être une technique d’analyse parfaitement adaptée. L’influence du taux de réticulation sur l’étape de “desmear” du procédé de fabrication a également été étudiée. Cette étape, constituée d’une phase de gonflement de la résine epoxy (swelling) suivie d’une attaque oxydante au permanganate et d’une étape de réduction, est déterminante quant à la rugosité de surface obtenue et donc l’adhésion du cuivre sur le substrat composite. Une méthode originale a été développée pour déterminer le profil de diffusion de l’agent de gonflement (sweller) au sein du matériau, méthode alliant microtomie et analyse chromatographique. L’effet des conditions de “swelling” sur la rugosité finale du matériau a été déterminé par microscopie à force atomique (AFM). Des tests d’adhésion du cuivre ont également été réalisés afin d’étudier l’influence du taux de réticulation de la résine epoxy et de la rugosité de surface du composite sur la force d’adhésion. Finalement, une bonne adhésion du cuivre (environ 4 N/cm) pour des surfaces de faible rugosité (< 10 nm). / Due to the increasing miniaturization in microelectronics the manufacturing of densely interconnected multilayer printed-circuit boards (PCB) is needed. With their well-balanced physico-chemical and mechanical properties and low cost, epoxy-based composites are insulating materials of prime choice. However, to achieve interconnections at a lower scale (copper line width down to ca. 1 µm), the adhesion between the composite substrate and the copper interconnections must be enhanced. Previous studies showed that the degree of curing of the epoxy matrix (i.e. conversion of crosslinking reaction) is one key-parameter, driving the matrix chemical and mechanical resistance (during the PCP manufacturing process) and the composite/copper line adhesion properties.In this work we present and discuss an in-depth study of the curing kinetics of an epoxy/silica composite (ABF) relevant to the microelectronics industry. The final objective is to propose a process protocol of the PCB manufacturing as function of the degree of curing.The rheological behaviour of the composite material is investigated by dynamic mechanical analysis (DMA). The gelation and vitrification mechanisms are presented as a function of the degree of curing. The viscoelastic behavior of the epoxy matrix near the glass-transition is studied and is shown to be well-described by the WLF model.The curing kinetics of the epoxy composite are studied by in situ near-infrared (NIR) spectroscopy and both isothermal and non-isothermal differential scanning calorimetry (DSC). Iso-conversional analyses are performed to determine the apparent activation energy of the curing reaction. Due to a non-negligible contribution of the diffusion part in the curing reaction, further modelling was needed to achieve a complete description of the curing kinetics. This study showed that the curing kinetic is well-described by the nth-order autocatalytic fitting model in combination with the Rabinowitch/modified-WLF models, taking into account the diffusion contribution. This model is used to predict the material behaviour in a wide time/temperature range and to propose a Temperature-Time-Transformation diagram of the material.Due to the influence of the degree of curing on the adhesion of copper electrical lines, an experimental method for the measurement of the degree of curing of industrial PCB was developed. Diffuse-reflectance infrared spectroscopy (DRIFTS) is found to be a versatile and accurate technique. The influence of the degree of curing on the “desmear” step of the PCB manufacturing process is studied as well. The “desmear” step proceeds in the swelling of the epoxy matrix and the subsequent permanganate etching and reduction reactions. The “desmear” step is quite important regarding the composite surface roughness and, as a consequence, the adhesion of the copper lines. An original method for the determination of the diffusion profile of the sweller through the depth of the material was developed using microtomy and chromatography. The effect of swelling experimental parameters on the final roughness of the composite is determined by atomic force microscopy (AFM). Adhesion tests of copper lines on the composite substrate are performed to study the influence of the initial degree of curing and the roughness on the peel strength. Good adhesion of copper (about 4 N/cm) is achieved for a low substrate roughness (< 10 nm).