Abstract One of the features in Taiwan market is price competition. What makes it even worse are the outflow of investment, more demand on environmental protection, increase of labor cost, and the limit of national policy. These factors make business hardly earn profits. And therefore, how to gain reasonably with limited resources and survive in the competition are the difficulties we need to overcome in Taiwan. Printed Circuit Board played a key role in ¡§Taiwan Financial Miracle¡¨ for the past 10 years. However, the manufacturers now have no choice but to search for new niche to meet the change on the whole business environment. The headquarters staying in Taiwan have to face even more harsh conditions, which come from the demand of cost-down, the price competitions among the same industry. Therefore, it becomes essential to adjust Product Mixed in order to fit the insufficient Product Resources. My study puts focus on ¡§Most Constrained Station¡¨ from the Theory of Constraint. It helps PCB manufacturers, who suffers slim profit, find out the best Products Mixed in accordance of Throughput Contribution. Each product brings different profit and cost. Some may share common resources, and some may not, when they are put in the process line. Therefore, to continue forward in the age of slim-profit, the complex of Product Mixed and earnings becomes prominent. Studying Theory of Constraint, I aim to bring forth the best solution on processing contribution by means of figuring out the Throughput Chain in Most Constrained Station and analysis of application on Most Constrained Station. And then I will conclude with the best production strategy for the PCB manufacturer as the main thesis of the research.

In this thesis, we study the discontinuity structure electromagnetic effect of multilayer printed circuit board in three sections. In first section, we introduced a modeling approach which is based on transmission line theory , and simulated with a series of test boards ,such as regular and irregular power delivery system and multilayer with via structure, finally ,we confirmed that the modeling approach is an efficient simulation and agreed fairly well with 3D full-wave method. In second section, we demonstrated the return current is disrupted at the via or broken at the power / ground plane with slots , the impedance becomes extremely high at the resonance frequencies of the power / ground plane cavity and via could be a major cause of the simultaneous switching noise generation, signal quality problem, and edge radiated emission in multi-layer PCB. In final section, we provided a effective reduction mechanism to eliminate the noise or EMI, which has been achieved using island with shorting vias and combining with the modeling approach can simulate and estimate effectively.

O avanço da tecnologia de aparelhos eletro-eletrônicos favorece a troca constante dos equipamentos. O freqüente descarte de aparelhos obsoletos se torna um problema de sustentabilidade e também um problema ambiental devido ao seu acúmulo em aterros. A solução para minimizar estes impactos é a reciclagem de seus componentes. Por esta razão, o principal objetivo deste trabalho é estudar o processamento das placas de circuito impresso de telefones celulares através de operações unitárias de Tratamento de Minérios e hidrometalurgia a fim de se recuperar o cobre contido nas placas. Para isso, inicialmente, placas de circuito impresso foram processadas em moinho de martelos, a fim de liberar os materiais, em seguida foi feita a separação magnética do material cominuído. Com a fração não magnética foi feita a separação eletrostática e o material foi separado em: fração condutora, mista e não condutora, com cada fração foi feita a classificação granulométrica e, posteriormente, realizaram-se ensaios de caracterização como pirólise, digestão em água régia e análise química de espectroscopia de emissão óptica por indução de plasma. Os processos hidrometalúrgico aplicados para a recuperação de cobre nas placas de circuito impresso de aparelhos celulares obsoletos envolvem etapas lixiviação com ácido sulfúrico na ausência e na presença de peróxido de hidrogênio. Os resultados da caracterização mostraram que as placas de circuito impresso de celulares após a moagem possuem 24% de cerâmicas; 12,7% de polímeros e 63,3% de metais. Além disso, após a classificação granulométrica e a separação eletrostática os materiais não se concentraram em nenhuma fração especifica, portanto o processamento mecânico visando a recuperação de metais deve contemplar a moagem e a separação magnética. / The technology advancement of electro-electronics devices favors the constant equipment exchange. The frequent disposal of obsolete equipment becomes a sustainability problem and also an environmental problem due to their accumulation in landfills. One possible solution to minimize these impacts is the recycling of their components. For this reason the aim goal of this study is processing of printed circuit boards of mobile phones utilizing unit operation of ore treatment and hydrometallurgy to recover the copper contained in the printed. Therefore, initially printed circuit boards were processed on a hammer mill to release the materials, then it was made magnetic separation of comminuted material. With the non-magnetic fraction was made electrostatic separation in which the material was separated into: conductive, mixed and non-conductive fraction, with each fraction was made grain sized classification and then assays were performed analysis of characterize as pyrolysis, digestion in aqua regia and chemical analysis of inductively coupled plasma atomic emission spectroscopy. Hydrometallurgical processes applied to the cooper recovery in printed circuit boards of obsolete mobile phones, involve steps leaching with sulfuric acid in the absence and presence of hydrogen peroxide. The characterization results showed that the printed circuit boards of mobile phones after grinding have ceramics 24%, polymers 12.7% and metals 63.3%. Moreover, after grain sized classification and electrostatic separation the materials didn\'t concentrate in no specific fraction, therefore the mechanical processing in order to recover metals should include grinding and magnetic separation.

Abstract The demands toward the development of simple and cost-effective fabrication methods of metallic structures with high lateral resolution on different substrates - applied in many fields of technology, such as in microelectronics, optoelectronics, micromechanics as well as in sensor and actuator applications - gave the idea to perform this research. Due to its simplicity, laser-assisted chemical liquid-phase deposition (LCLD) has been investigated and applied for the metallization of surfaces having practical importance (Si, GaAs, SiO2, Si3N4, etc.) since the beginning of the 80s. By the invention of novel substrates (polyimide, porous silicon), it was adequate to work out new precursors or just adopt old ones and optimise LCLD in order to fabricate metallic micro-patterns upon these materials for various purposes. According to the motivations mentioned above, LCLD was utilized for the fabrication of palladium (Pd) micro-patterns on polyimide (PI), polyimide/copper flexible printed circuit boards (PCBs), fused silica (SiO2) and silicon (Si). The selective metallization of porous silicon (PS) has been carried out with nickel (Ni). Depending on the types of lasers, either the focusing (Ar+ laser beam) or diaphragm projection (KrF and XeCl excimer laser pulses) method was employed. In the course of the work, various precursors of the corresponding metals have been investigated and utilized. In the beginning, the pyrolytic decomposition of palladium-amine complex ions ([Pd(NH3)4]2+) on PI by a scanned and focused Ar+ laser beam was optimised and discussed. Thick (up to several micrometers) and narrow (~ 10 μm) Pd conductor lines with electrical conductivity close to that of the bulk were obtained. In the continuation of these investigations, the precursor was developed further. [Pd(NH3)4]2+ was mixed with the solution of formaldehyde (HCOH) in order to induce the reduction of the metal complex ions. To our knowledge, we were the first - so far - who applied this solution and described the reaction. With the proper choice of the laser parameters, thin Pd films as catalyst layers for electroless copper plating were deposited utilizing Ar+ and excimer lasers as well. The chemically plated copper deposits - upon the obtained Pd film - have excellent electrical and good mechanical properties. In the second part of the thesis, three practical applications (metallization of via holes drilled in PI/Cu flexible PCBs, end-mirror fabrication on single-mode optical fibers, and carbon nanotube growth on Pd activated Si and Si/SiO2 substrates) of Pd LCLD were realized. The previously presented [Pd(NH3)4]2+ and [Pd(NH3)4]2+/HCOH precursors were employed for creating the catalyst Pd layers for the carbon nanotube chemical vapor-phase deposition and for the autocatalytic electroless chemical copper plating, respectively. Finally, a simple novel method was introduced for the area-selective metallization of PS. Since the surface of PS reduces spontaneously most metals from their aqueous solutions, it is difficult to realize localized metal deposition from liquid-phase precursors on it. We proposed the application of a stable Ni plating bath from which the metal deposits only when the PS is irradiated with photons having wavelength shorter than 689 nm, thus making possible an area-selective laser-assisted metal deposition. The deposited metal structures and patterns were analysed by field emission scanning electron microscopy (FESEM) equipped with energy dispersive spectrometer (EDS), by the milling and imaging modes of a focused ion beam system (FIB), optical microscopy, profilometry, resistance, and by reflectance measurements.

This research focuses on developing a model to predict the yield of a printed circuit board manufactured on a given assembly line. Based on an extensive literature review as well as discussion with industrial partners, it was determined that there is no tool available for assisting engineers in determining reliable estimates of their production capabilities as they introduce new board designs onto their current production lines. Motivated by this need, a more in-depth study of manufacturing yield as well as the electronic assembly process was undertaken. The relevant literature research was divided into three main fields: process modeling, board design, and PCB testing. The model presented in this research combines elements from process modeling and board design into a single yield model. An optimization model was formulated to determine the fault probabilities that minimize the difference between actual yield values and predicted yield values. This model determines fault probabilities (per component type) based on past production yields for the different board designs assembled. These probabilities are then used to estimate the yields of future board designs. Two different yield models were tested and their assumptions regarding the nature of the faults were validated. The model that assumes independence between faults provided better yield predictions. A preliminary case study was performed to compare the performance of the presented model with that of previous models using data available from the literature. The proposed yield model predicts yield within 3% of the actual yield value, outperforming previous regression models that predicted yield within 10%, and artificial neural network models that predicted yield within 5%. A second case study was performed using data gathered from actual production lines. The proposed yield model continued to provide very good yield predictions. The average difference with respect to the actual yields from this case study ranged between 1.25% and 2.27% for the lines studied. Through sensitivity analysis, it was determined that certain component types have a considerably higher effect on yield than others. Once the proposed yield model is implemented, design suggestions can be made to account for manufacturability issues during the design process. / Master of Science

Det här projektet har utförts i samarbete med företaget Eskilstuna Elektronikpartner AB (EEPAB). Företaget arbetar med tillverkning av kretskort där de använder sig av ytmontering och hålmontering. Vissa mönsterkort kan vara böjda och kan därmed orsaka problem i Surface Mount Device (SMD)-linan. Syftet med projektet var att ta fram en fixtur som gör mönsterkorten planare vilket innebär att minska höjdskillnaden mellan högsta och lägsta punkten på korten. Detta för att effektivisera och förhindra stopp i produktionen. Två forskningsfrågor togs fram som fungerade som ett stöd under projektets gång: F1:Hur förbättras produktionen i en SMD-lina när mönsterkorten hålls plana? F2:Vilka faktorer bör beaktas när en fixtur tas fram för en SMD-lina? Projektet har följt en produktutvecklingsprocess där fokuset har legat på konceptstadiet. Data har samlats in genomen litteraturstudie, intervjuer samt ett formulär. Projektet resulterade i ett slutgiltigt koncept i form av en fixtur. Resultatet i projektet visar att genom att spänna fast mönsterkortets kortsidor så minskas nedböjningen. Genom planare mönsterkort minskas risken för fel mängdapplicering av lödpasta som i sin tur kan orsaka kortslutning eller en öppen slutning. Att problemen med fel mängd lödpasta minskas leder även till att manuellt arbete som tvättning och applicering av lödpasta kan reduceras. När lödpasta appliceras för hand är det även svårt att veta om rätt mängd har applicerats, detta kan även leda till problem under lödningen. Sedan kan det konstateras att designen av fixturen måste samspela med alla maskiner i SMD-linan för att inte orsaka problem eller hindra maskinerna från att utföra dess arbete. Utifrån ett koncepttest visade det sig att det framtagna konceptet gör mönsterkorten cirka 42% planare. Detta bör kunna minska problemen i SMD-linan och spara in tiden det tar att åtgärda dessa problem. Koncepttestet utfördes inte i den rätta maskinen och måste därmed undersökas ordentligt. Det var endast ett sorts mönsterkort som testades, dessa faktorer är exempel på felkällor. I framtiden bör ett flertal olika mönsterkort testas för att få en högre reliabilitet. Det behövs även tas fram en exakt tolerans för när mönsterkorten är för böjda och problem uppstår. I dagsläget finns endast maskinens egentolerans som inte stämmer särskilt bra och en generell tolerans för SMD-linor.

Denna rapport utreder möjligheten till en mönsterkortslösning för en kabelbaserad kraftenhet. Denna kraftenhet är en låda som består av flera komponenter som exempelvis kraftenheter för 24V, 100V, filter och motorstyrkort för två axlar samt kraftfördelning. Kablarna i enheten är tidskrävande och dessutom kostsamma. Därför har enheten idag både hög produktionskostnad och produktionstid. Kablarna tillför, utöver höga kostnader, risk för störningar och p.g.a. mängden kablar ökar svårigheten att felsöka enheten. Simuleringar har genomförts med LT-Spice för olika RC-filter för styrsignalerna i kraftenheten. Vidare har ett kretsschema konstruerats baserat på ritningen av lådan och alla kablar som ska reduceras och hanteras av mönsterkortet. Med kretsschemat skapades en layout för mönsterkortet. Denna layout representerar alla komponenter och hur kopparledningarna ska placeras. Det ledde till att mönsterkortet utvecklades som en möjlig lösning till kraftenheten. / This report investigates the possibility for a PCB (Printed circuit board) solution for a cable-based power unit. This power unit is a box which contains multiple components as for example power units for 24v, 100v, filter and motor control boards fort wo shafts and power supply. The cables in the unit are complicated and hard to construct and also expensive. Therefore, the unit has a high production cost and high production time. Besides high costs the cables also add risks for interference and because of the amount of cables it also raises the difficulty to debug the unit. Simulations have been done with LT-Spice for constructions of different RC-filters for the steering signals in the power unit. Furthermore, a circuit diagram has been drawn based on the drawing of the power unit and all the cables that are to be reduced and handled by the circuit board. The circuit board layout was designed based on the circuit diagram. Which led to a circuit board being developed as a possible solution for the power unit.

Ställverk 85 som används av Trafikverket idag är ett signaldistributionssystem och börjar komma till slutet av sin livslängd vilket har resulterat i brist på reservdelar. Målet med det här arbetet är att identifiera de mest kritiska komponenterna i centralenheten och utdelssystemet i ställverk 85 samt utreda varför dessa komponenter felar. För att uppnå målet används det metoder som litteraturstudie, insamling av dokumentation från Trafikverket, workshop hos leverantörerna av ställverk 85 Alstom samt FMEA för att modellera fram resultat. Resultat från arbetet visar att åska är en bakomliggande orsak till att kretskorten i ställverk 85 felar för båda kretskorten som har studerats under arbetet, MDM- och TRE-kort. Utöver överspänningar vid blixtnedslag visar arbetet att transistorerna i TRE-kortet är en komponent som felar i en hög grad. För MDM-kortet finns det inte en specifik komponent som felar mer än någon annan. / Interlocking system 85, which is used by the Swedish Transport Administration today, is a signal distribution system and is coming to the end of its useful life, which has resulted in a lack of spare parts. The goal of this work is to identify the most critical components in the central unit and distribution system in interlocking system 85 and to investigate why these components fail. To achieve this goal, methods such as literature study, collection of documentation from the Swedish Transport Administration, workshop at interlocking system 85 supplier Alstom and FMEA are used to model results. Results from the work show that lightning is a major reason why the circuit boards in switchgear 85 fail for both circuit boards that have been studied during the work, MDM, and TRE boards. In addition to the lightning, the work shows that the transistors in the TRE-board are a component that fails to a great degree. For the MDM-board there is not a specific component that fails more than the other.

ITC/USA 2005 Conference Proceedings / The Forty-First Annual International Telemetering Conference and Technical Exhibition / October 24-27, 2005 / Riviera Hotel & Convention Center, Las Vegas, Nevada / This paper discusses using the CAN (Control Area Network) Bus protocol for control and status of flight test data acquisition systems. The application of the CAN (Control Area Network) on an F/A-18 aircraft will be discussed in detail.

The main purpose of this thesis was to develop a printed circuit board for Autoliv Electronics AB. This circuit board should be placed in their test equipment to support some of their camera vision systems used in cars. The main task was to combine the existing hardware into one module. To be able to achieve this, the most important factors in designing a printed circuit board was considered. A satisfying power distribution network is the most crucial one. This was accomplished by using decoupling capacitors to achieve low enough impedance for all circuits. Calculations and simulations were executed for all integrated circuits to find the correct size and numbers of capacitors. The impedance of the circuit board was tested with a network analyzer to confirm that the impedance were low enough, which was the case. System functionality was never tested completely, due to delivery problems with some external equipment.