The field of hybrid electronics of molecules and traditional semiconductors is deemed to be a realistic route towards possible use of molecular electronics. Such hybrid electronics finds its potential technological applications in nuclear detectors, near-infrared detectors, organic thin film transistors and gas sensors. Specifically Metal / organic / n-Silicon structures in this regard are mostly reported to have two regimes of charge transport at lower and higher applied voltages in such two terminal devices. The fact is mostly attributed to the change in conduction mechanism while moving from lower to higher applied voltages. These reports describe interactions between the semiconductors and molecules in terms of both transport and electrostatics but finding the exact potential distribution between the two components still require numerical calculations. The challenge in this regard is to give the exact relations and the transport models, towards practical quantification of charge transport properties of metal / organic / inorganic semiconductor devices. Some of the most exiting questions in this regard are; whether the existing models are sufficient to describe the device performances of the hybrid devices or some new models are needed? What type of charge carriers are responsible for conduction at lower and higher applied voltages? What is the source of such charge carriers in the sandwiched organic layer between the metal and inorganic semiconductors? How the transition applied voltage for the change in conduction mechanism is determined? What is the role of dopants in the organic layer semiconductors? What are the possible explanations for observed temperature effects in such devices? In present work the charge transport properties of metal / metal-phthalocyanine / n-Si structures with low (ND = 4×1014 cm-3), medium (ND = 1×1016 cm-3) and high (ND = 2×1019 cm-3) doped n-Si as injecting electrode and the effect of air exposure of the vacuum evaporated metal-phthalocyanine film in these structures is investigated. The results obtained through temperature dependent electrical characterizations of the structures suggest that in terms of dominant conduction mechanism in these devices Schottky-type conduction mechanism dominates the charge transport in low-bias region of these devices up to 0.8 V, 0.302 V and 0.15 V in case of low, medium and high doped n-Silicon devices. For higher voltages, in each case of devices, the space-charge-limited conduction, controlled by exponential trap distribution, is found to dominate the charge transport properties of the devices. The interface density of states at the CuPc / n-Si interface of the devices are found to be lower in case of lower work function difference at the CuPc / n-Si interface of the devices. The results also suggest that the work function difference at the CuPc / n-Si interface of these devices causes charge transfer at the interface and these phenomena results in formation of interface dipole. The width of the Schottky depletion region at the CuPc / n-Si interface of these devices is found to be higher with higher work function difference at the interface. The investigation of charge transport properties of Al / ZnPc / medium n-Si and Au / ZnPc / medium n-Si devices suggest that the Schottky depletion region formed at the ZnPc / n-Si interface of these devices determines the charge transport in the low-bias region of both the devices. Therefore, the Schottky-type (injection limited) and the space-charge-limited (bulk limited) conduction are observed in the low and the high bias regions of these devices, respectively. The determined width of the Schottky depletion region at the ZnPc / n-Si interface of these devices is found to be similar for both the devices, therefore, the higher work function difference at the metal / ZnPc interface of the devices has no influence on the Schottky depletion region formed at the ZnPc / n-Si interface of the devices. The similar diode ideality factor, barrier height and the width of the Schottky depletion region, determined for both of these devices, demonstrates that these device characteristics originate from ZnPc / n-Si interface of these devices. Therefore, the work function difference at the metal / ZnPc interface of these devices has no noticeable influence on the device properties originating from ZnPc / n-Si interface in these devices. The investigation of charge transport properties of Al / CuPc / low n-Si devices with and without air exposure of the CuPc film, before depositing metal contact demonstrate that Schottky-type conduction mechanism dominates the charge transport in these devices up to bias of 0.45 V in case devices with the air exposure, and up to 0.8 V in case devices without the air exposure. This decrease in the threshold voltage, for the change in conduction mechanism in the devices, is attributed to wider Schottky depletion width determined at the CuPc / n-Si interface of the devices without the air exposure of CuPc film. For higher voltage the space-charge-limited conduction controlled by exponential trap distribution, is found to dominate the charge transport properties of the devices without the air exposure of CuPc, and in case of devices with the air exposure of CuPc film, the SCLC is controlled by single dominating trap level probably introduced by oxygen impurities.

Solar cells convert sunlight into electrical energy using the photo effect. With a mar-ket share of 60%, multicrystalline silicon (mc-Si) is the most frequently used absorber material. Standard mc-Si ingots are directionally solidified in a fused silica (SiO2) crucible, which exhibits a silicon nitride (Si3N4) inner coating. After the entire raw material has been melted, the nucleation takes place on the Si3N4 inner coating at the bottom of the crucible. This results in an inhomogeneous initial grain structure and an increased fraction of dislocation clusters in the upper part of the ingot, which decrease the quality of standard mc-Si. Therefore, the global goal is the development of a cost-effective technology that reduces the formation of clusters and enhances the quality of mc-Si ingots. One way of achieving that goal is to produce the so-called \"high performance multi crystalline silicon\" (HPM-Si). During the directional solidification silicon raw material remains unmelted at the bottom of the SiO2 crucible, whereby crystallization does start on the silicon feedstock a few millimeters above the crucible bottom. Compared to standard mc-Si, a finer grained structure with many small grains is formed, which are separated by so-called random grain boundaries. Since the movement of dislocations across this grain boundary type has rarely been observed, the risk of formation of dislocation clusters, which have a negative impact on the efficiency of solar cells, is greatly reduced for HPM-Si. However, the disadvantage of the HPM-Si compared to the mc-Si is the yield loss resulting from the unmelted raw material at the crucible bottom. Hence, the aim of the present work is to produce mc-Si with a fine-grained structure in combination with a high fraction of random grain boundaries without the disad-vantage of yield loss. In order to investigate the grain structure in dependence of the nucleation conditions G1 ingots having a mass of 14.5 kg and dimensions of 220x220x130 mm³ were directional solidified in a furnace. The analysis of the grain structure with respect to the grain size, grain orientation and the random grain boundary length fraction and the comparison with the HPM-Si reference crystal took place on horizontal wafers with a thickness of 3mm. One possibility to influence the grain structure of mc-Si could be the variation of the cooling conditions before the start of crystallization at the crucible bottom. In a first series of experiments, a gas-flowed cooling plate, positioned below the crucible, was used. An increased gas flow increases the axial heat flow downwards and the cooling rate below the crucible bottom in the same direction. The detected cooling rate, measured by a thermocouple in the silicon melt 5 mm above the crucible bottom, varied in a range between 0.06-1.5 K/min. An increased cooling rate increases the supercooling, with a maximum of 2K. The analysis of the grain structure shows that a reduction in the cooling rate in combination with the lowest supercooling minimizes the average grain size and increases the fraction of random grain boundaries. However, an HPM-Si like grain structure (grain size and fraction of random grain boundaries comparable to HPM-Si) could not completely produced. Furthermore, due to the extended process time, the wafer yield is reduced, whereby the reduction of the cooling rate is not a preferable method for the industrial process. In a second experimental series, which took place under constant cooling rates, the influence of an additional nucleation layer on the initial grain structure was investigated. For this purpose, the additional nucleation layer was applied on the already existing Si3N4 inner coating on the crucible bottom. In order to adjust a HPM-Si like grain structure, the contact angle of the silicon melt on the additional nucleation layer should be lower than on the Si3N4 inner coating. The theoretical basis for this hypothesis is the relationship between the contact angle and the nucleation energy, which states that a reduced contact angle lowers the nucleation energy and can ultimately lead to more nuclei. Furthermore, in order to avoid melting, the additional nucleation layer must have a higher melting point than silicon. Suitable materials for the application as a foreign seed sample are SiC, SiO2 and Al2O3, which are used in the form of particles with different sizes. The production of the additional nucleation layer was carried out by a spraying as well as by an embedding procedure. These layers exhibit different thermal conductivity as well as surface roughness. Embedded nucleation layers generate higher roughness values than sprayed nucleation layers. The analysis of the grain structure identified the surface roughness as the main influencing factor on the initial grain size. While an increased surface roughness (Rq>100μm) results in a fine-grained structure (average grain size: <2mm²) comparable to HPM-Si, the average grain size increases (>2 mm²) with a reduced surface roughness (Rq<100μm). However, the analysis of the grain boundary relationship shows that the fraction of random grain boundaries does not correlate with the average grain size. Only a ma-terial dependency was detected. All SiO2 nucleation layers generate an increased fraction of random grain boundaries, comparable to the HPM-Si material. In contrast, the fraction of random grain boundaries was reduced for all SiC nucleation layers. This result is probably established with the different thermal conductivities of the used materials. The increased thermal conductivity of the sample with the SiC nucleation layers increases the cooling rate, promoting dendritic growth. In contrast the lower thermal conductivity of the SiO2 nucleation layers reduces the cooling rate and dendritic growth is suppressed. Since dendrites exhibit a Σ3 grain boundary relationship in the center, the fraction of this grain boundary type increases for SiC nucleation layers and the fraction of random grain boundaries decreases. In this thesis, various possibilities for influencing the grain structure have been pre-sented. A SiO2 nucleation layer with a roughness value Rq> 200μm represents an industrially relevant solution for the production of mc-Si with comparable properties to the HPM-Si without the disadvantages of yield loss. Hence, it was possible to in-crease the yield with comparable material quality, whereby the production costs could be reduced. Some first crucible manufacturers have already transferred the use of the SiO2 nucleation layers on top of the already existing Si3N4 inner coating at the crucible bottom to production.

The field of hybrid electronics of molecules and traditional semiconductors is deemed to be a realistic route towards possible use of molecular electronics. Such hybrid electronics finds its potential technological applications in nuclear detectors, near-infrared detectors, organic thin film transistors and gas sensors. Specifically Metal / organic / n-Silicon structures in this regard are mostly reported to have two regimes of charge transport at lower and higher applied voltages in such two terminal devices. The fact is mostly attributed to the change in conduction mechanism while moving from lower to higher applied voltages. These reports describe interactions between the semiconductors and molecules in terms of both transport and electrostatics but finding the exact potential distribution between the two components still require numerical calculations. The challenge in this regard is to give the exact relations and the transport models, towards practical quantification of charge transport properties of metal / organic / inorganic semiconductor devices. Some of the most exiting questions in this regard are; whether the existing models are sufficient to describe the device performances of the hybrid devices or some new models are needed? What type of charge carriers are responsible for conduction at lower and higher applied voltages? What is the source of such charge carriers in the sandwiched organic layer between the metal and inorganic semiconductors? How the transition applied voltage for the change in conduction mechanism is determined? What is the role of dopants in the organic layer semiconductors? What are the possible explanations for observed temperature effects in such devices? In present work the charge transport properties of metal / metal-phthalocyanine / n-Si structures with low (ND = 4×1014 cm-3), medium (ND = 1×1016 cm-3) and high (ND = 2×1019 cm-3) doped n-Si as injecting electrode and the effect of air exposure of the vacuum evaporated metal-phthalocyanine film in these structures is investigated. The results obtained through temperature dependent electrical characterizations of the structures suggest that in terms of dominant conduction mechanism in these devices Schottky-type conduction mechanism dominates the charge transport in low-bias region of these devices up to 0.8 V, 0.302 V and 0.15 V in case of low, medium and high doped n-Silicon devices. For higher voltages, in each case of devices, the space-charge-limited conduction, controlled by exponential trap distribution, is found to dominate the charge transport properties of the devices. The interface density of states at the CuPc / n-Si interface of the devices are found to be lower in case of lower work function difference at the CuPc / n-Si interface of the devices. The results also suggest that the work function difference at the CuPc / n-Si interface of these devices causes charge transfer at the interface and these phenomena results in formation of interface dipole. The width of the Schottky depletion region at the CuPc / n-Si interface of these devices is found to be higher with higher work function difference at the interface. The investigation of charge transport properties of Al / ZnPc / medium n-Si and Au / ZnPc / medium n-Si devices suggest that the Schottky depletion region formed at the ZnPc / n-Si interface of these devices determines the charge transport in the low-bias region of both the devices. Therefore, the Schottky-type (injection limited) and the space-charge-limited (bulk limited) conduction are observed in the low and the high bias regions of these devices, respectively. The determined width of the Schottky depletion region at the ZnPc / n-Si interface of these devices is found to be similar for both the devices, therefore, the higher work function difference at the metal / ZnPc interface of the devices has no influence on the Schottky depletion region formed at the ZnPc / n-Si interface of the devices. The similar diode ideality factor, barrier height and the width of the Schottky depletion region, determined for both of these devices, demonstrates that these device characteristics originate from ZnPc / n-Si interface of these devices. Therefore, the work function difference at the metal / ZnPc interface of these devices has no noticeable influence on the device properties originating from ZnPc / n-Si interface in these devices. The investigation of charge transport properties of Al / CuPc / low n-Si devices with and without air exposure of the CuPc film, before depositing metal contact demonstrate that Schottky-type conduction mechanism dominates the charge transport in these devices up to bias of 0.45 V in case devices with the air exposure, and up to 0.8 V in case devices without the air exposure. This decrease in the threshold voltage, for the change in conduction mechanism in the devices, is attributed to wider Schottky depletion width determined at the CuPc / n-Si interface of the devices without the air exposure of CuPc film. For higher voltage the space-charge-limited conduction controlled by exponential trap distribution, is found to dominate the charge transport properties of the devices without the air exposure of CuPc, and in case of devices with the air exposure of CuPc film, the SCLC is controlled by single dominating trap level probably introduced by oxygen impurities.:1 INTRODUCTION 3 1.1 Organic / Inorganic Semiconductor Interfaces 5 1.2 Organic / Metal Interfaces 6 1.3 Organic Material / Semiconductor Interfaces 6 1.4 Interface Dipoles at Organic / Inorganic Interfaces 7 1.5 Objectives of the Study 9 1.6 Research Methodology 10 1.7 References 12 2 BASIC CONCEPTS OF ORGANIC ELECTRONICS 16 2.1 Localized and Delocalized Orbital in Organic Semiconductors 16 2.2 Operating principle of some basic organic / inorganic devices 19 2.3 Electronic Structure of an Organic Solid 20 2.4 Validity Limits of band model and the tunneling model 21 2.5 Dark Electric Conduction 23 2.6 Injection of Carriers from Electrodes 24 2.7 References 26 3 MATERIALS AND DEVICE FABRICATION 27 3.1 Assembly of the hybrid organic / inorganic structures 27 3.2 The Vacuum Systems for Device Fabrication 27 3.3 The n-Si substrates 29 3.4 The Organic semiconductors; CuPc and ZnPc 30 3.5 Sample Fabrication Procedures 32 3.5.1 Experimental Details of Samples Prepared at PCRET labs 32 3.5.2 Experimental details of samples Prepared at TU Chemnitz labs 33 3.6 References 34 4 METHODS FOR DATA ANALYSIS 35 4.1 The Dominant Conduction Mechanisms in the Devices 35 4.1.1 Schottky-type Conduction 35 4.1.1.1 The Standard Characterization Technique 38 4.1.1.2 The R. J. Bennett Technique 39 4.1.1.3 The Cheung and Cheung Technique 42 4.1.1.4 The H. Norde Technique 42 4.1.2 Space Charge Limited Conduction (SCLC) 43 4.1.3 The MIM Models to Determine Dominant Conduction Mechanism 44 4.2 Interface State Energy Distribution 46 4.3 References 48 5 CHARGE TRANSPORT PROPERTIES OF Al / CuPc / n-Si DEVICES IN DARK 50 5.1 Charge Transport Properties of Al / CuPc / low-doped n-Si Devices 51 5.1.1 Interface State Energy Distribution 65 5.2 Charge Transport Properties of Al / CuPc / medium-doped n-Si Devices 67 5.3 Charge Transport Properties of Al / CuPc / High-doped n-Si Devices 75 5.3.1 Charge Transport Properties of Al / CuPc / High-doped n-Si Devices as Metal-Insulator-Metal Structures 82 5.4 Summary 85 5.5 Final Remarks 87 5.6 References 88 6 INFLUENCE OF TOP METAL CONTACT ON CHARGE TRANSPORT PROPERTIES META / ZnPc / n-Si DEVICES IN DARK 89 6.1 Charge Transport Properties of Metal / ZnPc / Medium-doped n-Si Devices 89 6.2 Interface State Energy Distribution 99 6.3 Summary 100 6.4 Final Remarks 101 6.5 References 103 7 INFLUENCE AIR EXPOSURE ON THE CHARGE TRANSPORT PROPERTIES OF Al / CuPc / n-Si DEVICES 104 7.1 Charge Transport Properties of Al / CuPc / low n-Si Devices With (or) without air exposure of CuPc film 104 7.2 Summary 115 7.3 Final Remarks 116 7.4 References 117 8 CONCLUSIONS 118 8.1 Scope of Future Work 120 Index of Figures 121 Curriculum Vitae and List of Publications 125

Here we propose, for the first time, a new and green ethanol-thermal reaction method to synthesize highquality and pure thiophene–sulfur doped reduced graphene oxide (rGO), which establishes an excellent platform for studying sulfur (S) doping effects on the physical/chemical properties of this material. We have quantitatively demonstrated that the conductivity enhancement of thiophene–S doped rGO is not only caused by the more effective reduction induced by S doping, but also by the doped S atoms, themselves. Furthermore, we demonstrate that the S doping is more effective in enhancing conductivity of rGO than nitrogen (N) doping due to its stronger electron donor ability. Finally, the dye-sensitized solar cell (DSCC) employing the S-doped rGO/TiO₂ photoanode exhibits much better performance than undoped rGO/TiO₂, N-doped rGO/TiO₂ and TiO₂ photoanodes. It therefore seems promising for thiophene–S doped rGO to be widely used in electronic and optoelectronic devices.

Solar cells convert sunlight into electrical energy using the photo effect. With a mar-ket share of 60%, multicrystalline silicon (mc-Si) is the most frequently used absorber material. Standard mc-Si ingots are directionally solidified in a fused silica (SiO2) crucible, which exhibits a silicon nitride (Si3N4) inner coating. After the entire raw material has been melted, the nucleation takes place on the Si3N4 inner coating at the bottom of the crucible. This results in an inhomogeneous initial grain structure and an increased fraction of dislocation clusters in the upper part of the ingot, which decrease the quality of standard mc-Si. Therefore, the global goal is the development of a cost-effective technology that reduces the formation of clusters and enhances the quality of mc-Si ingots. One way of achieving that goal is to produce the so-called \"high performance multi crystalline silicon\" (HPM-Si). During the directional solidification silicon raw material remains unmelted at the bottom of the SiO2 crucible, whereby crystallization does start on the silicon feedstock a few millimeters above the crucible bottom. Compared to standard mc-Si, a finer grained structure with many small grains is formed, which are separated by so-called random grain boundaries. Since the movement of dislocations across this grain boundary type has rarely been observed, the risk of formation of dislocation clusters, which have a negative impact on the efficiency of solar cells, is greatly reduced for HPM-Si. However, the disadvantage of the HPM-Si compared to the mc-Si is the yield loss resulting from the unmelted raw material at the crucible bottom. Hence, the aim of the present work is to produce mc-Si with a fine-grained structure in combination with a high fraction of random grain boundaries without the disad-vantage of yield loss. In order to investigate the grain structure in dependence of the nucleation conditions G1 ingots having a mass of 14.5 kg and dimensions of 220x220x130 mm³ were directional solidified in a furnace. The analysis of the grain structure with respect to the grain size, grain orientation and the random grain boundary length fraction and the comparison with the HPM-Si reference crystal took place on horizontal wafers with a thickness of 3mm. One possibility to influence the grain structure of mc-Si could be the variation of the cooling conditions before the start of crystallization at the crucible bottom. In a first series of experiments, a gas-flowed cooling plate, positioned below the crucible, was used. An increased gas flow increases the axial heat flow downwards and the cooling rate below the crucible bottom in the same direction. The detected cooling rate, measured by a thermocouple in the silicon melt 5 mm above the crucible bottom, varied in a range between 0.06-1.5 K/min. An increased cooling rate increases the supercooling, with a maximum of 2K. The analysis of the grain structure shows that a reduction in the cooling rate in combination with the lowest supercooling minimizes the average grain size and increases the fraction of random grain boundaries. However, an HPM-Si like grain structure (grain size and fraction of random grain boundaries comparable to HPM-Si) could not completely produced. Furthermore, due to the extended process time, the wafer yield is reduced, whereby the reduction of the cooling rate is not a preferable method for the industrial process. In a second experimental series, which took place under constant cooling rates, the influence of an additional nucleation layer on the initial grain structure was investigated. For this purpose, the additional nucleation layer was applied on the already existing Si3N4 inner coating on the crucible bottom. In order to adjust a HPM-Si like grain structure, the contact angle of the silicon melt on the additional nucleation layer should be lower than on the Si3N4 inner coating. The theoretical basis for this hypothesis is the relationship between the contact angle and the nucleation energy, which states that a reduced contact angle lowers the nucleation energy and can ultimately lead to more nuclei. Furthermore, in order to avoid melting, the additional nucleation layer must have a higher melting point than silicon. Suitable materials for the application as a foreign seed sample are SiC, SiO2 and Al2O3, which are used in the form of particles with different sizes. The production of the additional nucleation layer was carried out by a spraying as well as by an embedding procedure. These layers exhibit different thermal conductivity as well as surface roughness. Embedded nucleation layers generate higher roughness values than sprayed nucleation layers. The analysis of the grain structure identified the surface roughness as the main influencing factor on the initial grain size. While an increased surface roughness (Rq>100μm) results in a fine-grained structure (average grain size: <2mm²) comparable to HPM-Si, the average grain size increases (>2 mm²) with a reduced surface roughness (Rq<100μm). However, the analysis of the grain boundary relationship shows that the fraction of random grain boundaries does not correlate with the average grain size. Only a ma-terial dependency was detected. All SiO2 nucleation layers generate an increased fraction of random grain boundaries, comparable to the HPM-Si material. In contrast, the fraction of random grain boundaries was reduced for all SiC nucleation layers. This result is probably established with the different thermal conductivities of the used materials. The increased thermal conductivity of the sample with the SiC nucleation layers increases the cooling rate, promoting dendritic growth. In contrast the lower thermal conductivity of the SiO2 nucleation layers reduces the cooling rate and dendritic growth is suppressed. Since dendrites exhibit a Σ3 grain boundary relationship in the center, the fraction of this grain boundary type increases for SiC nucleation layers and the fraction of random grain boundaries decreases. In this thesis, various possibilities for influencing the grain structure have been pre-sented. A SiO2 nucleation layer with a roughness value Rq> 200μm represents an industrially relevant solution for the production of mc-Si with comparable properties to the HPM-Si without the disadvantages of yield loss. Hence, it was possible to in-crease the yield with comparable material quality, whereby the production costs could be reduced. Some first crucible manufacturers have already transferred the use of the SiO2 nucleation layers on top of the already existing Si3N4 inner coating at the crucible bottom to production.

In this work, the effects of epitaxial strain and film thickness on the lattice structure, microstructure, magnetization and electrical conduction of La1-xSrxCoO3 (LSCO) (x = 0.18 and 0.30) thin films have been studied using thickness-dependent film series on several types of single-crystalline substrates. Alternatively, the direct effect of strain has been probed using a piezoelectric substrate. La0.7Sr0.3CoO3 is a ferromagnetic metal, whereas La0.82Sr0.18CoO3 is at the phase boundary between the ferromagnetic metal and an insulating spin glass phase. Epitaxial biaxial strain in La1-xSrxCoO3 (x = 0.18-0.3) films is known to reduce the ferromagnetic double exchange interactions. It has further been suggested for the control of the crystal field splitting of the Co ions which may be utilized to manipulate the spin state. The LSCO (x = 0.18 and 0.30) films have been grown by pulsed laser deposition (PLD) on substrates of LaAlO3, SrTiO3, (PbMg1/3Nb2/3O3)0.72(PbTiO3)0.28 (PMN-PT) and (LaAlO3)0.3(Sr2TaAlO6)0.7 (LSAT), which provide different strain states and, in the case of PMN-PT, a reversibly controllable strain. Thickness-dependent series of La0.82Sr0.18CoO3 on SrTiO3 and LaAlO3 as well as of La0.7Sr0.3CoO3 on LSAT have been studied. The lattice parameters of the epitaxially grown films were determined from X-ray diffraction measurements (Bragg-Brentano method and reciprocal space mapping). Large tensile strains of 2% can be achieved in thicker films of up to 100 nm. On the other hand, the films under larger tensile strain have cracks and reveal ordered superstructures in HRTEM images which are tentatively attributed to ordered oxygen vacancies. The Curie temperature and the magnetic moment of the x = 0.18 films increases towards larger film thickness in qualitative agreement with the joined effects of strain relaxation and finite thickness on magnetic ordering. In order to separate the direct strain effect from the thickness effect, the Curie temperature, the magnetic moment and the (rather large) coercivity of the films have been investigated in two electrically controlled strain states for a film on PMN-PT. Non-cracked, sufficiently thick x = 0.18 films show metallic behaviour with large magnetoresistance. The crack-free x = 0.3 films on LSAT undergo an insulator-to-metal transition with increasing thickness and also show large magnetoresistance, both consistent with a percolative transport behaviour. The spin state of the Co ions appears to remain unchanged in the investigated doping range.

Transient negative capacitance effects in epitaxial ferroelectric Pb(Zr₀.₂Ti₀.₈)O₃ capacitors are investigated with a focus on the dynamical switching behavior governed by domain nucleation and growth. Voltage pulses are applied to a series connection of the ferroelectric capacitor and a resistor to directly measure the ferroelectric negative capacitance during switching. A time-dependent Ginzburg-Landau approach is used to investigate the underlying domain dynamics. The transient negative capacitance is shown to originate from reverse domain nucleation and unrestricted domain growth. However, with the onset of domain coalescence, the capacitance becomes positive again. The persistence of the negative capacitance state is therefore limited by the speed of domain wall motion. By changing the applied electric field, capacitor area or external resistance, this domain wall velocity can be varied predictably over several orders of magnitude. Additionally, detailed insights into the intrinsic material properties of the ferroelectric are obtainable through these measurements. A new method for reliable extraction of the average negative capacitance of the ferroelectric is presented. Furthermore, a simple analytical model is developed, which accurately describes the negative capacitance transient time as a function of the material properties and the experimental boundary conditions.

Diese Arbeit beschäftigt sich mit der Bewertung des Breitband-Halbleiters ß-Ga2O3 für die Hochleistungselektronik. Daher sind Schichten, die mit metallorganischer Gasphasenepitaxie (MOVPE) gewachsen sind, und Volumenkristalle, die mit der Czochralski-Methode gewachsen sind, elektrisch und optisch charakterisiert. Dabei werden die grundlegenden Eigenschaften des Materials untersucht und mit den theoretischen Vorhersagen verglichen. Der Einfluss und die Bildung von Defekten werden untersucht. Zu Beginn zeigten die MOVPE-gewachsenen Schichten ungünstige elektrische Eigenschaften, da sie bei niedrigeren Dotierungskonzentrationen vollständig kompensiert wurden und bei höheren Ladungsträgerkonzentrationen eine geringere Ladungsträgerbeweglichkeit aufwiesen. Ein quantitatives Modell des schädlichen Einflusses inkohärenter Zwillingsgrenzen auf elektrische Eigenschaften wird entwickelt, das zeigt, dass die Verhinderung der Bildung von diesen der Schlüssel zur Verbesserung des Materials ist. Die Dichte der inkohärenten Zwillingsgrenzen wurde um 4 Größenordnungen reduziert, was zu einer verbesserten Ladungsträgerbeweglichkeit führte. Dies bietet eine vielversprechende Perspektive für den Einsatz von ß-Ga2O3 in zukünftiger Leistungselektronik. Ramanspektroskopische Untersuchungen an hoch n-dotierten Kristallen zeigen die Bildung eines Störstellenbandes, geben Einblicke in die effektivmasseartige Donatornatur von Si und Sn und zeigen zusätzliche Raman-verbotene, longitudinale Phononen-Plasmonmoden durch Streuung durch Fluktuationen der freien Ladungsträgerdichte. Die relative statische Dielektrizitätskonstante von ß-Ga2O3 senkrecht zu den Ebenen (100), (010) und (001) wird auf 10,2, 10,87 bzw. 12,4 bestimmt, die eine zuverlässige Grundlage für die Simulation und Konstruktion von Bauelementen bilden. Die Erzeugung von heller, roter Elektrolumineszenz (EL) in Sperrrichtung betriebenen Schottky-Barrieredioden auf der Basis von mit Cr und Si co-dotierten Kristallen wird gezeigt. Die EL von Cr ist repräsentativ für die Fähigkeit, die lumineszierenden Zustände anderer Übergangsmetalle anzuregen. Solche lichtemittierenden Schottky-Barrieredioden können ein neues Anwendungsgebiet von ß-Ga2O3 eröffnen. / This thesis deals with the evaluation of the wide band gap semiconductor ß-Ga2O3 for high power electronics. Therefore, layers grown with metal-organic vapor phase epitaxy (MOVPE) and bulk crystals grown by Czochralski method are electrically and optically characterized. Hereby, the fundamental properties of the material are investigated and compared with the theoretical predictions. The influence and formation of defects are investigated. At the beginning the MOVPE grown layers showed unfavorable electrical properties as they were fully compensated at lower doping concentrations and showed lowered mobility at higher charge carrier concentrations. A quantitative model of the detrimental influence of incoherent twin boundaries on electrical properties is developed showing that the prevention of the formation of these is the key to improve the material. The density of incoherent twin boundaries was reduced by 4 orders of magnitude resulting in improved charge carrier mobility. This provides a promising outlook for the use of ß-Ga2O3 in future power electronics. Raman spectroscopic investigations of highly n-type doped crystals reveal the formation of an impurity band, give insight in the effective-mass like donor nature of Si and Sn, and show additional Raman forbidden, longitudinal phonon plasmon modes due to free-electronic-charge density fluctuations scattering. The relative static dielectric constant of ß-Ga2O3 perpendicular to the planes (100), (010), and (001) is determined to 10.2, 10.87, and 12.4, respectively, which give a reliable basis for the simulation and design of devices. The generation of bright, red electroluminescence (EL) in reverse biased Schottky barrier diodes based on crystals co-doped with Cr and Si is shown. The EL of Cr is representative of the ability to excite the luminescent states of other transition metals. Such light emitting Schottky barrier diodes may open up a new application field of ß-Ga2O3.

Die vorliegende Dissertation befasst sich mit dem RF- überlagerten DC-Sputtern von Indiumzinnoxid und aluminiumdotierten Zinkoxid. Bei dem dafür entwickelten synchron gepulsten RF/DC-Verfahren werden die zu untersuchenden Materialien gleichzeitig mit Hilfe eines RF- und eines PulsDC-Generators gesputtert. Ein wesentliches Resultat der Untersuchungen ist, dass durch RF- überlagertes DCSputtern Schichten abgeschieden werden können, die im Vergleich zum DC- bzw. PulsDC-Sputtern geringere spezifische Widerstände aufweisen. Dies ist auf eine Verringerung von Defekten in den abgeschiedenen Schichten zurückzuführen. Es konnte anhand der Untersuchungen gezeigt werden, dass fur die Abscheidung von Indiumzinnoxid und aluminiumdotiertem Zinkoxid die Substrattemperatur beim RF überlagerten DC-Sputtern gegenüber dem DC-Sputtern um bis zu 100°C verringert werden kann.

The term "topological insulator" (TI) represents a novel class of compounds which are insulating in the bulk, but simultaneously and unavoidably have a metallic surface. The reason for this is the non-trivial band topology, arising from particular band inversions and the spin-orbit interaction, of the bulk. These topologically protected metallic surface states are characterized by massless Dirac dispersion and locked helical spin polarization, leading to forbidden back-scattering with robustness against disorder. Based on the extraordinary features of the topological insulators an abundance of new phenomena and many exciting experiments have been proposed by theoreticians, but still await their experimental verification, not to mention their implementation into applications, e.g. the creation of Majorana fermions, advanced spintronics, or the realization of quantum computers. In this perspective, the 3D TIs Bi2Te3 and Bi2Se3 gained a lot of interest due to their relatively simple electronic band structure, having only a single Dirac cone at the surface. Furthermore, they exhibit an appreciable bulk band gap of up to ~ 0.3 eV, making room temperature applications feasible. Yet, the execution of these proposals remains an enormous experimental challenge. The main obstacle, which thus far hampered the electrical characterization of topological surface states via transport experiments, is the residual extrinsic conductivity arising from the presence of defects and impurities in their bulk, as well as the contamination of the surface due to exposure to air. This thesis is part of the actual effort in improving sample quality to achieve bulk-insulating Bi2Te3 films and study of their electrical properties under controlled conditions. Furthermore, appropriate capping materials preserving the electronic features under ambient atmosphere shall be identified to facilitate more sophisticated ex-situ experiments. Bi2Te3 thin films were fabricated by molecular beam epitaxy (MBE). It could be shown that, by optimizing the growth conditions, it is indeed possible to obtain consistently bulk-insulating and single-domain TI films. Hereby, the key factor is to supply the elements with a Te/Bi ratio of ~8, while achieving a full distillation of the Te, and the usage of substrates with negligible lattice mismatch. The optimal MBE conditions for Bi2Te3 were found in a two-step growth procedure at substrate temperatures of 220°C and 250°C, respectively, and a Bi flux rate of 1 Å/min. Subsequently, the structural characterization by high- and low-energy electron diffraction, photoelectron spectroscopy, and, in particular, the temperature-dependent conductivity measurements were entirely done inside the same ultra-high vacuum (UHV) system, ensuring a reliable record of the intrinsic properties of the topological surface states. Bi2Te3 films with thicknesses ranging from 10 to 50 quintuple layers (QL; 1QL~1 nm) were fabricated to examine, whether the conductivity is solely arising from the surface states. Angle resolved photoemission spectroscopy (ARPES) demonstrates that the chemical potential for all these samples is located well within the bulk band gap, and is only intersected by the topological surface states, displaying the characteristic linear dispersion. A metallic-like temperature dependency of the sheet resistance is observed from the in-situ transport experiments. Upon going from 10 to 50QL the sheet resistance displays a variation by a factor 1.3 at 14K and of 1.5 at room temperature, evidencing that the conductivity is indeed dominated by the surface. Low charge carrier concentrations in the range of 2–4*10^12 cm^−2 with high mobility values up to 4600 cm2/Vs could be achieved. Furthermore, the degradation effect of air exposure on the conductance of the Bi2Te3 films was quantified, emphasizing the necessity to protect the surface from ambient conditions. Since the films behave inert to pure oxygen, water/moisture is the most probable source of degeneration. Moreover, epitaxially grown elemental tellurium was identified as a suitable capping material preserving the properties of the intrinsically insulating Bi2Te3 films and protecting from alterations during air exposure, facilitating well-defined and reliable ex-situ experiments. These findings serve as an ideal platform for further investigations and open the way to prepare devices that can exploit the intrinsic features of the topological surface states. / Der Begriff "Topologischer Isolator" (TI) beschreibt eine neuartige Klasse von Verbindungen deren Inneres (engl. Bulk) isolierend ist, dieses Innere aber gleichzeitig und zwangsläufig eine metallisch leitende Oberfläche aufweist. Dies ist begründet in der nicht-trivialen Topologie dieser Materialien, welche durch eine spezielle Invertierung einzelner Bänder in der Bandstruktur und der Spin-Bahn-Kopplung im Materialinneren hervorgerufen ist. Diese topologisch geschützten, metallischen Oberflächenzustände sind gekennzeichnet durch eine masselose Dirac Dispersionsrelation und gekoppelte Helizität der Spinpolarisation, welche die Rückstreuung der Ladungsträger verbietet und somit zur Stabilisierung der Zustände gegenüber Störungen beiträgt. Auf Grundlage dieser außergewöhnlichen Merkmale haben Theoretiker eine Fülle neuer Phänomene und spannender Experimente vorhergesagt. Deren experimentelle Überprüfung steht jedoch noch aus, geschweige denn deren Umsetzung in Anwendungen, wie zum Beispiel die Erzeugung von Majorana Teilchen, fortgeschrittene Spintronik, oder die Realisierung von Quantencomputern. Aufgrund ihrer relativ einfachen Bandstruktur, welche nur einen Dirac-Kegel an der Oberfläche aufweist, haben die 3D TI Bi2Te3 und Bi2Se3 in den letzten Jahren großes Interesse erlangt. Weiterhin besitzen diese Materialien eine merkliche Bandlücke von bis zu ~0,3 eV, welche sogar Anwendungen bei Raumtemperatur ermöglichen könnten. Dennoch ist deren experimentelle Umsetzung nachwievor eine enorme Herausforderung. Das Haupthindernis, welches bis jetzt insbesondere die elektrische Charakterisierung the topologischen Oberflächenzustände behindert hat, ist die zusätzliche Leitfähigkeit des Materialinneren, welche durch Kristalldefekte und Beimischungen, sowie die Verunreinigung der Probenoberfläche durch Luftexposition bedingt wird. Die vorliegende Arbeit liefert einen Beitrag zu aktuellen den Anstrengungen in der Verbesserung der Probenqualität der TI um die Leitfähigkeit des Materialinneren zu unterdrücken, sowie die anschließende Untersuchung der elektrischen Eigenschaften unter kontrollierten Bedingungen durchzuführen. Weiterhin sollen geeignete Deckschichten identifiziert werden, welche die besonderen elektronischen Merkmale der TI nicht beeinflussen sowie diese gegen äußere Einflüsse schützen, und somit die Durchführung anspruchsvoller ex situ Experimente ermöglichen können. Die untersuchten Bi2Te3 Schichten wurden mittels Molekularstrahlepitaxie (MBE) hergestellt. Es konnte gezeigt werden, dass es allein durch Optimierung der Wachstumsbedingungen möglich ist Proben herzustellen, die gleichbleibend isolierende Eigenschaften des TI Inneren aufweisen und Eindomänen-Ausrichtung besitzen. Die zentralen Faktoren sind hierbei die Aufrechterhaltung eines Flussratenverhältnisses von Te/Bi ~8 der einzelnen Elemente, sowie die Wahl einer ausreichend hohen Substrattemperatur, um ein vollständiges Abdampfen (Destillation) des überschüssigen Tellur zu erreichen. Weiterhin müssen Substrate mit gut angepassten Gitterparametern verwendet werden, welches bei BaF2 (111) gegeben ist. Optimales MBE Wachstum konnte durch ein Zwei-Stufen Prozess bei Substrattemperaturen von 220°C und 250°C und einer Bi-Verdampfungsrate von 1 Å/min erreicht werden. Die nachfolgende Charakterisierung der strukturellen Eigenschaften, Photoelektronenspektroskopie, sowie temperaturabhängige Leitfähigkeitsmessungen wurden alle in einem zusammenhängenden Ultrahochvakuum-System durchgeführt. Auf diese Weise wird eine zuverlässige Erfassung der intrinsischen Eigenschaften der TI sichergestellt. Zur Überprüfung, ob die Leitfähigkeit der Proben tatsächlich nur durch die Oberflächenzustände hervorgerufen wird, wurden Filme mit Schichtdicken im Bereich von 10 bis 50 Quintupel-Lagen (QL; 1QL~ 1 nm) hergestellt und charakterisiert. Winkelaufgelöste Photoelektronenspektroskopie (ARPES) belegt, dass das chemische Potential (Fermi-Niveau) in allen Proben innerhalb der Bandlücke der Bandstruktur des Materialinneren liegt und nur von den topologisch geschützten Oberflächenzuständen gekreuzt wird, welche die charakteristische lineare Dirac Dispersionsrelation aufweisen. Die temperaturabhängigen Widerstandsmessungen zeigen ein metallisches Verhalten aller Proben. Bei der Variation der Schichtdicke von 10 zu 50QL wird eine Streuung des Flächenwiderstandes vom Faktor 1,3 bei 14K und 1,5 bei Raumtemperatur beobachtet. Dies beweist, dass die gemessene Leitfähigkeit vorrangig durch die topologisch geschützten Oberflächenzustände hervorgerufen wird. Eine geringe Oberflächenladungsträgerkonzentration im Bereich von 2–4*10^12 cm^−2 und hohe Mobilitätswerte von bis zu 4600 cm2/Vs wurden erreicht. Weiterhin wurden die negativen Auswirkungen auf die Eigenschaften der TI durch Luftexposition quantifiziert, welches die Notwendigkeit belegt, die Oberfläche der TI vor Umgebungseinflüssen zu schützen. Die Proben verhalten sich inert gegenüber reinem Sauerstoff, daher ist Wasser aus der Luftfeuchte höchstwahrscheinlich der Hauptgrund für die beobachtbare Verschlechterung. Darüber hinaus konnte epitaktisch gewachsenes Tellur als geeignete Deckschicht ausfindig gemacht werden, welches die Eigenschaften der Bi2Te3 Filme nicht beeinflusst, sowie gegen Veränderungen durch Luftexposition schützt. Die gewonnenen Erkenntnisse stellen eine ideale Grundlage für weiterführende Untersuchungen dar und ebnen den Weg zur Entwicklung von Bauelementen welche die spezifischen Besonderheiten der topologischen Oberflächenzustände.