• Refine Query
  • Source
  • Publication year
  • to
  • Language
  • 3
  • Tagged with
  • 3
  • 3
  • 3
  • 2
  • 2
  • 2
  • 2
  • 2
  • 2
  • 2
  • 2
  • 2
  • 2
  • 2
  • 2
  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
1

Wafer-scale Vacuum and Liquid Packaging Concepts for an Optical Thin-film Gas Sensor

Antelius, Mikael January 2013 (has links)
This thesis treats the development of packaging and integration methods for the cost-efficient encapsulation and packaging of microelectromechanical (MEMS) devices. The packaging of MEMS devices is often more costly than the device itself, partly because the packaging can be crucial for the performance of the device. For devices which contain liquids or needs to be enclosed in a vacuum, the packaging can account for up to 80% of the total cost of the device. The first part of this thesis presents the integration scheme for an optical dye thin film NO2-gas sensor, designed using cost-efficient implementations of wafer-scale methods. This work includes design and fabrication of photonic subcomponents in addition to the main effort of integration and packaging of the dye-film. A specific proof of concept target was for NO2 monitoring in a car tunnel. The second part of this thesis deals with the wafer-scale packaging methods developed for the sensing device. The developed packaging method, based on low-temperature plastic deformation of gold sealing structures, is further demonstrated as a generic method for other hermetic liquid and vacuum packaging applications. In the developed packaging methods, the mechanically squeezed gold sealing material is both electroplated microstruc- tures and wire bonded stud bumps. The electroplated rings act like a more hermetic version of rubber sealing rings while compressed in conjunction with a cavity forming wafer bonding process. The stud bump sealing processes is on the other hand applied on completed cavities with narrow access ports, to seal either a vacuum or liquid inside the cavities at room temperature. Additionally, the resulting hermeticity of primarily the vacuum sealing methods is thoroughly investigated. Two of the sealing methods presented require permanent mechanical fixation in order to complete the packaging process. Two solutions to this problem are presented in this thesis. First, a more traditional wafer bonding method using tin-soldering is demonstrated. Second, a novel full-wafer epoxy underfill-process using a microfluidic distribution network is demonstrated using a room temperature process. / <p>QC 20130325</p>
2

Integration and Fabrication Techniques for 3D Micro- and Nanodevices

Fischer, Andreas C. January 2012 (has links)
The development of micro and nano-electromechanical systems (MEMS and NEMS) with entirely new or improved functionalities is typically based on novel or improved designs, materials and fabrication methods. However, today’s micro- and nano-fabrication is restrained by manufacturing paradigms that have been established by the integrated circuit (IC) industry over the past few decades. The exclusive use of IC manufacturing technologies leads to limited material choices, limited design flexibility and consequently to sub-optimal MEMS and NEMS devices. The work presented in this thesis breaks new ground with a multitude of novel approaches for the integration of non-standard materials that enable the fabrication of 3D micro and nanoelectromechanical systems. The objective of this thesis is to highlight methods that make use of non-standard materials with superior characteristics or methods that use standard materials and fabrication techniques in a novel context. The overall goal is to propose suitable and cost-efficient fabrication and integration methods, which can easily be made available to the industry. The first part of the thesis deals with the integration of bulk wire materials. A novel approach for the integration of at least partly ferromagnetic bulk wire materials has been implemented for the fabrication of high aspect ratio through silicon vias. Standard wire bonding technology, a very mature back-end technology, has been adapted for yet another through silicon via fabrication method and applications including liquid and vacuum packaging as well as microactuators based on shape memory alloy wires. As this thesis reveals, wire bonding, as a versatile and highly efficient technology, can be utilized for applications far beyond traditional interconnections in electronics packaging. The second part presents two approaches for the 3D heterogeneous integration based on layer transfer. Highly efficient monocrystalline silicon/ germanium is integrated on wafer-level for the fabrication of uncooled thermal image sensors and monolayer-graphene is integrated on chip-level for the use in diaphragm-based pressure sensors. The last part introduces a novel additive fabrication method for layer-bylayer printing of 3D silicon micro- and nano-structures. This method combines existing technologies, including focused ion beam implantation and chemical vapor deposition of silicon, in order to establish a high-resolution fabrication process that is related to popular 3D printing techniques. / <p>QC 20121207</p>
3

Thiol-ene and Thiol-ene-epoxy Based Polymers for Biomedical Microdevices

Vastesson, Alexander January 2017 (has links)
Within healthcare there is a market pull for biomedical devices that can rapidly perform laboratory processes, such as diagnostic testing, in a hand-held format. For this reason, biomedical devices must become smaller, more sophisticated, and easier to use for a reasonable cost. However, despite the accelerating academic research on biomedical microdevices, and especially plastic-based microfluidic chips, there is still a gap between the inventions in academia and their benefit to society. To bridge this gap there is a need for new materials which both exhibit similar properties as industrial thermoplastics, and that enable rapid prototyping in academia. In this thesis, thiol-ene and thiol-ene-epoxy thermosets are evaluated both in terms of their suitability for rapid prototyping of biomedical microdevices and their potential for industrial manufacturing of “lab-on-chips”. The first part of the thesis focuses on material development of thiol-ene and thiol-ene-epoxy thermosets. Chemical and mechanical properties are studied, as well as in vitro biocompatibility with cells. The second part of the thesis focuses on microfabrication methods for both thermosets. This includes reaction injection molding, photostructuring, and surface modification. It is demonstrated how thiol-ene and thiol-ene-epoxy both provide advantageous thermo-mechanical properties and versatile surface modifications via “thiol-click chemistry”. In the end of the thesis, two applications for both polymer platforms are demonstrated. Firstly, thiol-ene is used for constructing nanoliter well arrays for liquid storage and on-demand electrochemical release. Secondly, thiol-ene-epoxy is used to enhance the biocompatibility of neural probes by tuning their flexibility. It is concluded that both thiol-ene and thiol-ene-epoxy thermosets exhibit several properties that are highly suitable for rapid prototyping as well as for scalable manufacturing of biomedical microdevices. / <p>QC 20171003</p>

Page generated in 0.1186 seconds