Submitted by FELIPE AUGUSTO DARRIBA BATTAGLIN null (darriba@bol.com.br) on 2016-08-17T23:44:40Z No. of bitstreams: 1 DIS_MEST2016_BATTAGLIN FELIPE.pdf: 6951544 bytes, checksum: 2d13cd64aaec5226e6031c18795aaca7 (MD5) / Approved for entry into archive by Ana Paula Grisoto (grisotoana@reitoria.unesp.br) on 2016-08-19T18:47:28Z (GMT) No. of bitstreams: 1 battaglin_fad_me_soro.pdf: 6951544 bytes, checksum: 2d13cd64aaec5226e6031c18795aaca7 (MD5) / Made available in DSpace on 2016-08-19T18:47:28Z (GMT). No. of bitstreams: 1 battaglin_fad_me_soro.pdf: 6951544 bytes, checksum: 2d13cd64aaec5226e6031c18795aaca7 (MD5) Previous issue date: 2016-07-06 / Filmes de alumina foram depositados a partir de uma nova metodologia de deposição a plasma, utilizando o pó de acetilacetonato de alumínio (AAA) como precursor. Em trabalho prévio do grupo, foi demonstrada a viabilidade do sputtering do AAA em plasmas de argônio para deposição de filmes finos. Os bons resultados obtidos estimularam o desenvolvimento do presente trabalho, visando o aperfeiçoamento da metodologia de deposição. Para isso, primeiramente foram investigados os efeitos da alteração da composição química da atmosfera do plasma, por meio da incorporação de diferentes proporções de oxigênio (O2%) ao argônio, tornando o processo um sputtering reativo. As deposições foram realizadas espalhando-se o pó do AAA no eletrodo inferior de um sistema de plasma acoplado capacitivamente. Argônio, oxigênio ou a mistura de ambos foram admitidos até a pressão de 11,0 Pa. O plasma foi gerado pela aplicação de sinal de radiofrequência (13,56 MHz, 150 W) ao eletrodo contendo o pó, mantendo-se o eletrodo superior, também utilizado como porta-amostras, aterrado. O tempo de deposição foi de 90 minutos. Investigou-se o efeito da O2%, variada de 0 a 100%, nas propriedades dos filmes. Na etapa subsequente, filmes foram depositados por sputtering reativo utilizando-se a condição considerada ótima na última etapa do trabalho (O2% = 25%) e mantendo-se as condições de pressão, potência e tempo de tratamento constantes. Todavia, ao invés de aterrar o porta-amostras, pulsos retangulares negativos (600 V, 2 kHz, 1-100% de ciclo de trabalho) foram aplicados, promovendo bombardeamento iônico durante a deposição por sputtering reativo. O efeito do ciclo de trabalho dos pulsos nas propriedades dos filmes foi avaliado. Na última etapa do trabalho, filmes foram depositados pelo sputtering reativo a partir de atmosferas contendo 25% de O2 e 75% de Ar e em condições mais energéticas que as utilizadas nos ciclos anteriores. Para tal um primeiro conjunto de amostras foi preparado mediante aquecimento resistivo do porta-amostras (410ºC) em plasma de menor pressão (4,0 Pa) que a anteriormente utilizada. O tempo de deposição foi de 28 minutos. Um segundo conjunto de amostras foi preparado associando-se bombardeamento iônico de mais alta energia, pela aplicação de pulsos de 1200 V (20% ciclo de trabalho) ao porta-amostras e também reduzindo a pressão da atmosfera de deposição para 4,0 Pa. Nesta condição, o tempo de deposição foi de 60 minutos. Comparou-se os resultados obtidos nestes experimentos aos equivalentes obtidos anteriormente. A espessura da camada foi obtida por meio de um perfilômetro e a taxa de deposição pela razão entre espessura e tempo de deposição. A composição elementar e a estrutura molecular dos filmes foram investigadas através das técnicas de espectroscopia de retroespalhamento Rutherford e de absorção no infravermelho, respectivamente. Difração de raios X foi utilizada para investigar a microestrutura dos filmes. Inspeções na morfologia e composição química das superfícies foram conduzidas associando microscopia eletrônica de varredura e espectroscopia de energia dispersiva. A rugosidade foi derivada de perfis topográficos adquiridos por perfilometria e microscopia de força atômica, enquanto a molhabilidade da superfície foi determinada através da técnica de gota séssil. De forma geral, os filmes depositados apresentaram contribuições de grupos orgânicos e de inorgânicos relacionados à alumina amorfa. O aumento da O2% afetou a cinética do plasma, proporcionando alterações na taxa de deposição (1 a 25 nm/min), rugosidade (1 a 13 nm) e redução na concentração de carbono proveniente do precursor, de 43% (O2% = 0%) para 6% (O2% = 100%). Com o aumento na O2% também foram encontradas variações na densidade dos filmes, dentro da faixa de 0,7 a 1,9 g/cm³, e tendência de queda no ângulo de contato de 53 para 17°. Por sua vez, quando o bombardeamento iônico é associado ao processo de deposição, altera-se a taxa de crescimento dos filmes (3 a 29 nm/min) e a morfologia da superfície, por meio do alívio de tensões internas e aumento da estabilidade física da estrutura resultante. A composição química não sofreu alterações, devido as condições do sputtering reativo permanecerem inalteradas nas deposições. Já a rugosidade e a molhabilidade da superfície apresentaram comportamentos condizentes com os resultados da morfologia e topografia. Quando condições mais energéticas de deposição foram empregadas, filmes óxidos com contaminações orgânicas foram obtidos para a deposição que empregou aquecimento resistivo do porta-amostras. Nesta condição, devido a redução na pressão total, mesmo com o aquecimento resistivo a taxa de deposição foi maior (~ 6 vezes) que aquela obtida sem aquecimento. Para a situação em que bombardeamento iônico de alta energia foi utilizado, estrutura e composição química similares ao do composto precursor foram obtidas. Os resultados são interpretados em termos dos processos predominantes em cada uma das metodologias empregadas. / Alumina films were deposited by a new plasma deposition method using aluminum acetylacetonate (AAA) powder as precursor. In a previous study by our group, the feasibility of AAA sputtering in argon plasmas for thin films deposition was demonstrated. The good results obtained stimulated the development of this work, aiming at the improvement of the deposition methodology. For this, the effects of modifications in the chemical composition of the plasma atmosphere were first investigated, through the use of different oxygen to argon proportions (O2%), making the process a reactive sputtering. The depositions were performed by spreading the AAA powder on the lower electrode of a capacitively coupled plasma system. Argon, oxygen or a mixture of both were admitted up to a pressure of 11.0 Pa. Application of radiofrequency power (13.56 MHz, 150 W) to the powder covered electrode generated the plasma, keeping the upper electrode, also used as a sample holder, grounded. Deposition times of 90 minutes were used. The effects of varying the oxygen proportion from 0 to 100%, on the film properties were studied. In the subsequent stage, films were deposited by reactive sputtering using the condition considered best in the last stage of the work (O2% = 25%) and keeping the pressures, power and treatment time constant. Instead of grounding the sample holder, however, negative rectangular pulses (600 V, 2 kHz, 1-100% duty cycle) were applied, promoting ion bombardment during the deposition by reactive sputtering. The influence of the pulse duty cycle on the properties of the films was evaluated. In the last study stage, films were deposited by reactive sputtering from atmospheres containing 25% O2 and 75% Ar and with more energetic conditions than those used in previous cycles. For such, a first samples set was prepared by resistive heating of the sample holder (410ºC) in a lower plasma pressure (4.0 Pa) than that previously used. The deposition time was 28 minutes. A second samples set was carried out associating ion bombardment of the highest energy, by the application of the 1200 V pulses (20% duty cycle) to the sample holder and also reducing the pressure of the deposition atmosphere to 4.0 Pa. In this condition, the deposition time was 60 minutes. The results obtained in these experiments were compared to the equivalent obtained previously. Film thickness was obtained by profilometry and the deposition rate calculated as the ratio between the thickness and deposition time. Elemental composition and molecular structure of the films were investigated using Rutherford backscattering and infrared absorption spectroscopy, respectively. X-ray diffraction was used to investigate the microstructure of the films. Surface morphology and chemical composition were studied using scanning electron microscopy and energy dispersive spectroscopy. Roughness was derived from topographic profiles acquired by profilometry and atomic force microscopy, whereas the surface wettability was determined using the sessile drop technique. In general, the deposited films showed contributions from organic and inorganic groups related to amorphous alumina. Increasing in O2% affected the plasma kinetics, providing changes in deposition rate (1 to 25 nm/min), roughness (1 to 13 nm) and reduction in the carbon concentration coming from the precursor, 43% (O2% = 0%) to 6% (O2% = 100%). With the increase in O2% it was also found variations in the films density, within the range from 0.7 to 1.9 g/cm³, and a downward trend in the contact angle of 53 to 17°. In turn, when the ion bombardment is associated with the deposition process, changes are found in the deposition rate (3 to 29 nm/min) and the surface morphology, through the internal strains relief and increased in the physical stability of resulting structure. The chemical composition did not suffer changes because the conditions of the reactive sputtering remain unchanged in the depositions. The roughness and surface wettability showed behavior consistent with the morphology and topography results. When more energetic conditions were employed, oxide films with organic contaminations were obtained for the deposition which applied the sample holder resistive heating. In this condition, due to the reduction in the total pressure, even with the resistive heating the deposition rate was higher (~ 6 times) than that obtained without heating. For the situation which high-energy ion bombardment was used, the structure and chemical composition similar to the precursor were obtained. The results are interpreted in terms of the prevailing processes in each of the methodologies applied.

O óxido de zinco é um material semicondutor que apresenta alta transparência óptica no espectro visível, alta energia de ligação de éxcitons e piezoeletricidade. Por suas propriedades, ele é utilizado na área de sensores, eletrodos transparentes e dispositivos optoeletrônicos. No entanto, sua utilização ainda é limitada pela dificuldade de obtenção de condutividade tipo p, cujo principal dopante é o nitrogênio, devido à assimetria de dopagem ocasionada por defeitos intrínsecos do material, dopagem em valências diferentes das esperadas e formação de níveis de aceitadores profundos na banda proibida. A aplicação em dispositivos piezoelétricos também exige alta resistividade e ótimas propriedades cristalinas. Muitos processos de deposição estabelecidos hoje ainda utilizam altas temperaturas, o que impede sua deposição sobre superfícies ou substratos sensíveis a altas temperaturas. O objetivo deste trabalho é desenvolver técnicas de deposição de filmes de ZnO, principalmente em baixas temperaturas ( 100°C), pelo método de magnetron sputtering de rádio frequência, para avaliar a influência dos gases de processo nas características estruturais, estequiométricas, elétricas e ópticas dos filmes. Para isso, foram obtidos filmes utilizando pressão total de argônio, e pressões parciais de argônio e oxigênio e argônio e nitrogênio, utilizando alvo cerâmico de óxido de zinco ou alvo metálico de zinco. Para alvo de ZnO, filmes com condutividade tipo n foram obtidos em ambiente de argônio, em condições que geraram deficiências de oxigênio. Filmes altamente resistivos foram obtidos com a utilização de pressão parcial de oxigênio no gás de processo, em condições que resultaram em filmes estequiométricos, inclusive com condutividade tipo p. Condutividade tipo p mais alta foi observada, apenas por ponta quente, para uma amostra obtida em argônio logo após a utilização de nitrogênio na câmara de processo, que provavelmente sofreu influência da dopagem não intencional do cobre, que foi identificado como um contaminante do processo devido à estrutura da câmara. Para alvo de Zn, observou-se a formação de nitreto de zinco, que demonstrou alta capacidade de oxidação em ambiente atmosférico, e portanto, transforma-se naturalmente ao longo do tempo ou por processos de oxidação térmica em ZnO dopado com nitrogênio. Filmes de ZnO produzidos a partir de nitreto de zinco foram os únicos dos testados que apresentaram fotoluminescência característica do ZnO, mesmo para processos onde não houve aquecimento intencional. / Zinc oxide is a multifunctional semiconductor, which presents high optical transparency in the visible range, high exciton binding energy and piezoelectricity. Due to its properties, ZnO is used in several areas, such as sensors, transparent electrodes and optoelectronics. However, its usage is still limited by the lack of p-type conductivity, which is very difficult to achieve because of intrinsic material defects, unwanted valence states of doping elements and formation of deep acceptor levels. Piezoelectric devices also demand high electrical resistivity and excellent crystallographic properties. Many current deposition processes still apply high temperatures, preventing material deposition onto temperature sensitive substrates and surfaces. The main goal of this investigation is to develop low temperature ( 100°C) deposition techniques by radio frequency magnetron sputtering, to evaluate the influence of process gases in structural, stoichiometric, electrical and optical properties. Thin films were obtained using either pure argon, argon and oxygen or argon and nitrogen partial pressures, by sputtering ceramic ZnO or metallic Zn targets. For ZnO target, n-type conductivity was achieved in argon environment, by creating oxygen deficient films. High resistivity was observed by using oxygen partial pressure, resulting in stoichiometric material and changing carrier type from electrons to holes. Higher p-type conductivity was observed, only by Seebeck measurement, for a nonintentionally heavily doped sample, as there was copper originating from the deposition chamber. For Zn target, zinc nitride formation was observed, showing high capability of transforming itself into nitrogen-doped ZnO by air exposure or thermal annealing. ZnO films produced from zinc nitride were the only ones that exhibited photoluminescence, even when there was no intentional heating involved.

La photocatalyse est une technique émergente de traitement des déchets qui nécessite un faible apport d’énergie présentée sous forme lumineuse. L’emploi de catalyseurs supportés autorise une séparation efficace des produits de réaction, en dépit d’une réduction de leur surface spécifique. De par les avantages qu’offre la pulvérisation réactive (bonne tenue mécanique, synthèse sur substrats froids, contrôle aisé de la microstructure, …), la synthèse de revêtements de TiO2 par cette technique fait l’objet de recherches intensives.Après une description des mécanismes mis en jeu lors d’une réaction photocatalytique, les phénomènes physiques à la base de la synthèse de revêtements céramiques par pulvérisation réactive à haute pression sont détaillés. Afin de s’affranchir de la contamination du catalyseur par le sodium du verre, une barrière de diffusion de SiNx est intercalée. Les influences de la position du substrat par rapport au flux de vapeur métallique, de la température de recuit, de la pression totale et de l’épaisseur des films catalyseurs sur leurs propriétés physicochimiques et photocatalytiques sont étudiées, autorisant la formulation d’hypothèses quant aux liens qui les unissent. Enfin, des premiers travaux portant sur la synthèse d’un photocatalyseur TiO2-xNy cristallisé in situ à haute pression sont présentés. / AThe photocatalysis is a new way of organic pollutants treatments which needs a low energy supplied under light wave. The use of supported catalyst allows an efficient separation of the reaction products, in spite of their specific area reduction. Owing to the advantages that offers reactive sputtering (good mechanical adhesion, synthesis on cold substrates, easy control of the microstructure, …), the synthesis by this technique of the most promising semiconductor photocatalyst, namely the titanium dioxide, is the subject of intensive researchs. After a description of the mechanisms occurring during a photocatalytic reaction, the physical phenomena at the origin of the ceramic coating synthesis are detailed. In order to hinder the sodium contamination of the catalyst from the glass substrate, a SiNx diffusion barrier is intercalated. The influences of the substrate position relatively to the metallic flux, the annealing temperature, the total pressure and the TiO2 coating thickness on the physico-chemical and photocatalytic properties are investigated allowing the formulation of hypothetic relations combining them. Finally, first studies on in situ crystallized TiO2-xNy photocatalyst deposited at high pressure are presented.

The doctoral thesis deals with an experimental study of several diagnostic techniques intended for plasma diagnostics and diagnostics of thin films during reactive sputter deposition. A relatively novel probe diagnostic technique called Floating harmonic probe for measurement of the ion density and electron tem- perature in technological low-temperature plasma is studied. A Langmuir probe is commonly used, however, its application in conditions where non-conducting films are being deposited can be problematic or unreliable. The floating harmonic probe measurement technique deals with this inherent problem of the Langmuir probe. The Floating harmonic probe results are compared to those obtained by a classical Langmuir probe in non-reactive DC continuously driven discharge, and its applicability in reactive regime during deposition of iron oxide thin films is proved. The work deals also with a modification of the Floating harmonic probe called Phase Delay Harmonic Analysis Method which is intended for diagnostics of pulsed driven discharges. The second part of the thesis is devoted to a new proposed method for in-situ diagnostics of thin films. This method monitors the capacitance and resistance of a thin film during deposition up to the frequencies in the kHz range. This new method could be used for...

Des films minces de pérovskites NdNiO3 et SmxCa1-xMnO3 ont été synthétisés par co-pulvérisation magnétron et leurs propriétés thermochromes ont été étudiées dans le domaine infrarouge. Dans un premier temps, l'étude du nickelate NdNiO3 a montré la possibilité de synthétiser la phase pérovskite en utilisant un recuit de cristallisation sous air à basse température (550°C). Nous avons mis en évidence une cristallisation compétitive entre la phase orthorhombique thermochrome et une phase rhomboédrique non thermochrome qui est largement influencée par les paramètres d'élaboration : pression de dépôt, épaisseur des couches, température de recuit... L'obtention de ces deux phases a permis d'étudier plus précisément les mécanismes d'oxydation et de réduction intervenant lors du dépôt et lors du traitement thermique respectivement. Parallèlement à cette étude, des couches minces de SmxCa1-xMnO3, ont été également synthétisées par co-pulvérisation. Après une optimisation des conditions expérimentales permettant d'obtenir des films stoechiométriques et des analyses structurales (MEB, DRX), les comportements électriques et optiques des films ont été suivis en fonction de la température (mesure 4 pointes et IRTF). Le composé Sm0,5Ca0,5MnO3 présente une température de transition proche de la température ambiante ainsi qu'un contraste optique dans le très proche et le moyen infrarouge. Les mesures de la transmittance optique dans le domaine visible-proche infrarouge ont permis d'évaluer la dépendance du gap optique avec la température. A 20°C, celui-ci est proche de 0,7 eV. Le manganite SmxCa1-xMnO3 est donc un bon candidat pour la régulation thermique et la furtivité infrarouge / NdNiO3 and SmxCa1-xMnO3 perovskites thin films were synthesized by magnetron co-sputtering process and the thermochromic properties have been studied in the infrared range. At first, the study of the NdNiO3 nickelate has established the timeliness to synthesise the perovskite phase using a subsequent annealing crystallisation in air at moderate temperature (550°C). We have demonstrated a competitive crystallisation between the thermochromic orthorhombic phase and a non-thermochromic rhombohedral phase largely influenced by experimental parameters: deposition pressure, layer thickness, annealing temperature... The presence of these two phases allowed to clarify more precisely the oxidation mechanisms involved during the deposition process and the reduction mechanisms occurring during the heat treatment. At the same time, the SmxCa1-xMnO3 system was synthesised also as thin films. The first step includes developing the experimental conditions to obtain stoichiometric films using two separate targets. After structural analyses (SEM, XRD), the electrical and optical behaviours of films were analysed using the four probe configuration and the FTIR spectroscopy versus temperature respectively. As result, the metal-insulator transition of the Sm0,5Ca0,5MnO3 compound is close to the room temperature and the film shows an interesting optical contrast in the near and mid-infrared ranges. The optical transmittance measurements in the visible-near infrared range were used to evaluate the optical gap dependence with temperature. At room temperature, the optical gap is close to 0.7 eV. Finally, SmxCa1-xMnO3 manganite is a good candidate for thermal regulation and infrared furtivity

Cette thèse porte principalement sur la caractérisation électrique et la modélisation physique d'éléments mémoires émergents de type OxRRAM (Oxide Resistive Random Access Memory) intégrant soit un oxyde de nickel, soit un oxyde de hafnium. Une fois la maturité technologique atteinte, ce concept de mémoire est susceptible de remplacer la technologie Flash qui fait encore figure de référence. Les principaux avantages de la technologie OxRRAM reposent sur une très bonne compatibilité avec les filières CMOS, un faible nombre d'étapes de fabrication, une grande densité d'intégration et des performances attractives en termes de fonctionnement. Le premier objectif de ce travail concerne le diélectrique employé dans les cellules. Il s'agit d'apporter des éléments factuels permettant d'orienter un choix technologique sur la méthode d'élaboration de l'oxyde de nickel (oxydation thermique ou pulvérisation cathodique réactive) puis d'évaluer les performances de cellules à base d'oyxde de hafnium. Le second objectif est d'approfondir la compréhension des mécanismes physiques responsables du changement de résistance des dispositifs mémoire par une approche de modélisation physique des phénomènes opérant lors des phases d'écriture et d'effacement, sujet encore largement débattu dans la communauté scientifique. Le troisième objectif de cette thèse est d'évaluer, par le biais de caractérisations électriques, les phénomènes parasites intervenant dans les éléments mémoires de type 1R (élément résistif sans dispositif d'adressage) et, en particulier, la décharge capacitive apparaissant lors de leur programmation (opérations d'écriture). / This work is focused on the electrical characterization and physical modeling of emerging OxRRAM memories (Oxide Resistive Random Access Memory) integrating nickel or hafnium oxide. After reaching maturity, this memory concept is likely to replace the Flash technology which is still a standard in the CMOS industry. The main advantages of resistive memories technology is their good compatibility with CMOS processes, a small number of manufacturing steps, a high integration density and their attractive performances in terms of memory operation. The first objective of this thesis is to provide enough informations allowing to orientate the elaboration process of the active nickel oxide layer (thermal oxidation, reactive sputtering) then to compare the performances of the fabricated cells with devices featuring a hafnium oxide layer. The second objective is to understand the physical mechanisms responsible of the device resistance change. A physical model is proposed allowing to apprehend SET and RESET phenomenon in memory devices, subject which is still widely debated in the scientific community. The third objective of this thesis is to evaluate electrical parasitic phenomenon observed in 1R-type memory elements (resistive element without addressing device), in particular the parasitic capacitance appearing during cell programming (writing operation).

Grâce à ses excellentes propriétés physiques et chimiques (stable thermiquement, bon conducteur électrique et de chaleur, ductile, très dur mécaniquement, bonne inertie chimique), le matériau tantale et son nitrure TaNx sont utilisés comme revêtement de surface des outils, résistance électrique, barrière de diffusion au cuivre, croissance de nanotubes par un procédé chimique catalytique en phase vapeur. C’est ce matériau et son nitrure que nous avons étudiés lors de cette thèse.Aujourd’hui les exigences des industriels nécessitent que la pulvérisation cathodique magnétron (PCM) puisse être appliquée aux pièces de formes complexes. La principale limitation de cette méthode de dépôt est que la plupart des particules pulvérisées sont neutres. Pour contrôler l’énergie et la trajectoire des particules pulvérisées, des nouveaux procédés IPVD (Ionized Physical Vapor Deposition) ont été développés pour ioniser les atomes pulvérisés. Le procédé RF-IPVD (Radio-Frequency Ionized Physical Vapor Deposition) permet, grâce à une boucle placée entre la cible et le substrat et polarisée en RF, de créer un second plasma permettant d’ioniser la vapeur pulvérisée. Un autre procédé a été développé : nommé HIPIMS (High Power Impulse Magnetron Sputtering), ce procédé utilise une alimentation fournissant des impulsions de courte durée et de forte puissance au lieu d’une alimentation DC. Les particules pulvérisées peuvent être ionisées dans le plasma magnétron qui est très dense lors des impulsions. Nous avons réalisé des couches minces de Ta par PCM, RF-IPVD et HIPIMS, et des couches minces de TaNx par PCM et HIPIMS. Les différentes propriétés des décharges et des couches minces sont étudiées et comparées dans ce mémoire. / Thanks to their excellent physical and chimical characteristics such as good stability with temperature, good conductor of heat and electricity, ductility, hardness, chemical inertness and good corrosion resistance, tantalum and its nitride are used in a wide variety of applications such as wear and corrosion-resistant materials, thin film transistors, diffusion barrier for copper and for carbon nanotube grown by CCVD process (catalytically chemical vapor deposition). For some recent industrial demand, it is necessary to deposit on substrates with complex shape. The main disadvantage of the conventional magnetron sputtering (CMS) is that most of the sputtered particles are neutral. To controle the energy and the path of sputtered particles, new magnetron sputtering techniques have been developed for ionizing a significant fraction of sputtered material. A new sputtering process called RF-IPVD consists in ionizing the sputtered vapor by adding second plasma by a RF coil between the target and the substrate. Another method called HIPIMS (High Power Impulsed Magnetron Sputtering), uses high power impulse instead of DC power. During the impulse, the sputtered Ta atoms are ionized in the dense plasma. We have deposited Ta thin films by CMS, RF-IPVD and HIPIMS and TaNx thin films by CMS and HIPIMS. The objective of this thesis is to compare the properties of discharges and thin films deposited by these different techniques.

Neste trabalho filmes finos de silício amorfo hidrogenado (a-Si:H) foram depositados no reator magnetron sputtering do laboratório de sistemas integráveis (LSI), a temperaturas menores que 100 °C, pela introdução do gás hidrogênio junto com o de argônio para pulverização de um alvo de silício policristalino. As condições de deposição investigadas estão compreendidas em pressões totais de 5 e 10 mTorr para as quais a potência de RF variou de 150 a 300 W, para a menor pressão, e de 200 a 300 W, para a maior pressão, sendo que para cada condição de potência a concentração de hidrogênio nos gases de descarga variou de pelo menos 0 % a no máximo 60 %. Como os substratos utilizados foram carbono vítreo, lâminas oxidadas de silício e placas de vidro para microscópio óptico os filmes depositados sobre o carbono foram caracterizados por RBS, os depositados sobre as lâminas oxidadas de silício por FTIR e medidas IV e os depositados sobre o vidro por espectroscopia de absorção óptica na região do ultravioleta-visível. A caracterização RBS forneceu informações tanto sobre o tipo e quantidade de impurezas eventualmente incorporadas durante a deposição como sobre a densidade superficial do silício que permitiu a obtenção da densidade volumétrica pela utilização dos parâmetros de espessura obtidos pela técnica de perfilometria. Através da análise dos espectros FTIR o hidrogênio incorporado pode ser quantificado na forma de mono e polihidretos de silício. As medidas IV foram realizadas através de contatos de alumínio, evaporados sobre os filmes, para a obtenção tanto da condutividade de escuro como da fotocondutividade e a análise dos espectros de absorção óptica dos filmes permitiu a obtenção tanto dos valores de energia do gap óptico, pelo método Tauc, como do parâmetro B que é inversamente proporcional à largura da cauda das bandas de valência e de condução que por sua vez aumentam com o aumento da densidade de defeitos dos filmes. Desta forma os filmes que apresentaram as maiores fotosensibilidades (razão entre a fotocondutividade e a condutividade de escuro), consideradas para a escolha dos melhores resultados, foram os depositados a 10 mTorr uma vez que eles apresentam uma maior concentração tanto de ligações SiH 2 como de SiH 3 e menores concentrações totais de hidrogênio incorporado ao filme que os filmes depositados a 5 mTorr o que acabou contribuindo para a diminuição da densidades de estados localizados da banda de mobilidade, provavelmente devido a nucleação de cristais, o que ocorre tipicamente para filmes depositados por sistemas magnetron sputtering a grandes pressões totais e grandes pressões parciais de hidrogênio, estando, desta forma, tanto as ligações SiH 2 como SiH 3 situadas nos contornos de grão. Assim os filmes depositados a 10 mTorr apresentam concentrações quase nula de ligações SiH, mas as maiores fotosensibilidades. / In this work thin films of hydrogenated amorphous silicon (a-Si:H) were deposited in the magnetron sputtering reactor of the Laboratório de Sistemas Integráveis (LSI), at temperatures lower than 100 °C, by the introduction of hydrogen and argon gasses for the sputtering of a policrystalline silicon target. The deposition conditions investigated are total pressures of 5 and 10 mTorr for which the RF power varied from 150 to 300 W, for the lowest pressure, and from 200 to 300 W, for the highest pressure. For each power condition the hydrogen concentration in the discharge gases ranged from 0 % to maximum 60 %. The substrates used were glassy carbon, for RBS characterization, oxidized silicon wafers for FTIR and IV measurements and glass plate for optical microscope and visible-ultraviolet spectroscopy absorption. The RBS characterization provided information about both the type and quantity of impurity incorporated during the deposition and the amorphous silicon superficial density that allowed obtaining the volumetric density by the utilization of the thickness parameter obtained by the profilometry technique. Through the analyses of the FTIR spectra the hydrogen incorporated could be quantified in the form of mono and poli silicon hydrides. The IV measurements were performed, through aluminum contacts evaporated on the films, to obtain the dark and photoconductivity and the films ultraviolet-visible absorption spectra. Through ultraviolet-visible analysis was possible to obtain both the optical energy gap values, by the Tauc method, and the B parameter, which is inversely proportional to the valence and conduction tail width. The B parameter increases with the defect density of the films. Thus, the films that showed the biggest photosensitivity (relation between the photoconductivity and dark conductivity) were deposited at 10 mTorr. These films showed a higher concentration of both SiH 2 and SiH 3 bonds but a lower concentration of total hydrogen incorporated, which contributed to the decrease of the density of states in the mobility band, probably due to the nucleation of crystals typical of films deposited by the magnetron sputtering system at high pressure and high hydrogen concentration. In this way the SiH 2 and SiH 3 would be in the grain boundary. So the films deposited at 10 mTorr showed almost null concentration of SiH bonds, but the highest photosensitivities.

Neste trabalho filmes finos de silício amorfo hidrogenado (a-Si:H) foram depositados no reator magnetron sputtering do laboratório de sistemas integráveis (LSI), a temperaturas menores que 100 °C, pela introdução do gás hidrogênio junto com o de argônio para pulverização de um alvo de silício policristalino. As condições de deposição investigadas estão compreendidas em pressões totais de 5 e 10 mTorr para as quais a potência de RF variou de 150 a 300 W, para a menor pressão, e de 200 a 300 W, para a maior pressão, sendo que para cada condição de potência a concentração de hidrogênio nos gases de descarga variou de pelo menos 0 % a no máximo 60 %. Como os substratos utilizados foram carbono vítreo, lâminas oxidadas de silício e placas de vidro para microscópio óptico os filmes depositados sobre o carbono foram caracterizados por RBS, os depositados sobre as lâminas oxidadas de silício por FTIR e medidas IV e os depositados sobre o vidro por espectroscopia de absorção óptica na região do ultravioleta-visível. A caracterização RBS forneceu informações tanto sobre o tipo e quantidade de impurezas eventualmente incorporadas durante a deposição como sobre a densidade superficial do silício que permitiu a obtenção da densidade volumétrica pela utilização dos parâmetros de espessura obtidos pela técnica de perfilometria. Através da análise dos espectros FTIR o hidrogênio incorporado pode ser quantificado na forma de mono e polihidretos de silício. As medidas IV foram realizadas através de contatos de alumínio, evaporados sobre os filmes, para a obtenção tanto da condutividade de escuro como da fotocondutividade e a análise dos espectros de absorção óptica dos filmes permitiu a obtenção tanto dos valores de energia do gap óptico, pelo método Tauc, como do parâmetro B que é inversamente proporcional à largura da cauda das bandas de valência e de condução que por sua vez aumentam com o aumento da densidade de defeitos dos filmes. Desta forma os filmes que apresentaram as maiores fotosensibilidades (razão entre a fotocondutividade e a condutividade de escuro), consideradas para a escolha dos melhores resultados, foram os depositados a 10 mTorr uma vez que eles apresentam uma maior concentração tanto de ligações SiH 2 como de SiH 3 e menores concentrações totais de hidrogênio incorporado ao filme que os filmes depositados a 5 mTorr o que acabou contribuindo para a diminuição da densidades de estados localizados da banda de mobilidade, provavelmente devido a nucleação de cristais, o que ocorre tipicamente para filmes depositados por sistemas magnetron sputtering a grandes pressões totais e grandes pressões parciais de hidrogênio, estando, desta forma, tanto as ligações SiH 2 como SiH 3 situadas nos contornos de grão. Assim os filmes depositados a 10 mTorr apresentam concentrações quase nula de ligações SiH, mas as maiores fotosensibilidades. / In this work thin films of hydrogenated amorphous silicon (a-Si:H) were deposited in the magnetron sputtering reactor of the Laboratório de Sistemas Integráveis (LSI), at temperatures lower than 100 °C, by the introduction of hydrogen and argon gasses for the sputtering of a policrystalline silicon target. The deposition conditions investigated are total pressures of 5 and 10 mTorr for which the RF power varied from 150 to 300 W, for the lowest pressure, and from 200 to 300 W, for the highest pressure. For each power condition the hydrogen concentration in the discharge gases ranged from 0 % to maximum 60 %. The substrates used were glassy carbon, for RBS characterization, oxidized silicon wafers for FTIR and IV measurements and glass plate for optical microscope and visible-ultraviolet spectroscopy absorption. The RBS characterization provided information about both the type and quantity of impurity incorporated during the deposition and the amorphous silicon superficial density that allowed obtaining the volumetric density by the utilization of the thickness parameter obtained by the profilometry technique. Through the analyses of the FTIR spectra the hydrogen incorporated could be quantified in the form of mono and poli silicon hydrides. The IV measurements were performed, through aluminum contacts evaporated on the films, to obtain the dark and photoconductivity and the films ultraviolet-visible absorption spectra. Through ultraviolet-visible analysis was possible to obtain both the optical energy gap values, by the Tauc method, and the B parameter, which is inversely proportional to the valence and conduction tail width. The B parameter increases with the defect density of the films. Thus, the films that showed the biggest photosensitivity (relation between the photoconductivity and dark conductivity) were deposited at 10 mTorr. These films showed a higher concentration of both SiH 2 and SiH 3 bonds but a lower concentration of total hydrogen incorporated, which contributed to the decrease of the density of states in the mobility band, probably due to the nucleation of crystals typical of films deposited by the magnetron sputtering system at high pressure and high hydrogen concentration. In this way the SiH 2 and SiH 3 would be in the grain boundary. So the films deposited at 10 mTorr showed almost null concentration of SiH bonds, but the highest photosensitivities.

Objective of the present work is a broad investigation of the so called "target poisoning" during magnetron deposition of TiN in an Ar/N2 atmosphere. Investigations include realtime in-situ ion beam analysis of nitrogen incorporation at the Ti sputter target during the deposition process and the analysis of particle uxes towards and from the target by means of energy resolved mass spectrometry. For experiments a planar, circular DC magnetron, equipped with a 2 inch titanium target was installed in an ultrahigh vacuum chamber which was attached to the beam line system of a 5 MV tandem accelerator. A manipulator allows to move the magnetron vertically and thereby the lateral investigation of the target surface. During magnetron operation the inert and reactive gas flow were adjusted using mass flow controllers resulting in an operating pressure of about 0.3 Pa. The argon flow was fixed, whereas the nitrogen flow was varied to realize different states of target poisoning. In a fi?rst step the mass spectrometer was used to verify and measure basic plasma properties e.g. the residual gas composition, the behavior of reactive gas partial pressure, the plasma potential and the dissociation degree of reactive gas molecules. Based on the non-uniform appearance of the magnetron discharge further measurements were performed in order to discuss the role of varying particle fluxes across the target during the poisoning process. Energy and yield of sputtered particles were analyzed laterally resolved, which allows to describe the surface composition of the target. The energy resolving mass spectrometer was placed at substrate position and the target surface was scanned by changing the magnetron position correspondingly. It was found, that the obtained energy distributions (EDF) of sputtered particles are influenced by their origin, showing signi?ficant differences between the center and the erosion zone of the target. These results are interpreted in terms of laterally different states of target poisoning, which results in a variation of the surface binding energy. Consequently the observed energy shift of the EDF indicates the metallic or already poisoned fraction on target surface. Furthermore the EDF's obtained in reactive sputtering mode are broadened. Thus a superposition of two components, which correspond to the metallic and compound fractions of the surface, is assumed. The conclusion of this treatment is an discrete variation of surface binding energy during the transition from metallic to compound target composition. The reactive gas target coverage as derived from the sputtered energy distributions is in reasonable agreement with predictions from model calculations. The target uptake of nitrogen was determined by means of ion beam analysis using the 14N(d, )12C nuclear reaction. Measurements at varying nitrogen gas flow directly demonstrate the poisoning eff?ect. The reactive gas uptake saturates at a maximum nitrogen areal density of about 1.1016 cm-2 which corresponds to the stoichiometric limit of a 3 nm TiN layer. At sufficiently low reactive gas flow a scan across the target surface discloses a pronounced lateral variation of target poisoning, with a lower areal density in the target race track compared to the target center and edge. Again the findings are reproduced by model calculations, which confirm that the balance of reactive gas injection and sputter erosion is shifted towards erosion in the race track. Accomplished computer simulations of the reactive sputtering process are similar to Berg's well known model. Though based on experimental findings the algorithm was extended to an analytical two layer model which includes the adsorption of reactive gas as well as its different kinds of implantation. A distribution of ion current density across the target diameter is introduced, which allows a more detailed characterization of the processes at the surface. Experimental results and computer simulation have shown that at sufficiently low reactive gas flow, metallic and compound fractions may exist together on the target surface, which is in contradiction to previous simulations, where a homogeneous reactive gas coverage is assumed. Based on the results the dominant mechanisms of nitrogen incorporation at different target locations and at varying reactive gas admixture were identified. / Gegenstand der Arbeit ist die Untersuchung der Targetvergiftung beim reaktiven Magnetronsputtern von TiN in Argon-Sticksoff Atmosphäre. Die Untersuchungen beinhalten die Echtzeit in-situ Ionenstrahlanalyse des Stickstoffeinbaus in das Titantarget während des Depositionsprozesses sowie die Analyse der Teilchenflüsse vom – und hin zum Sputtertarget mittels energieaufgelöster Massenspektrometrie. Das Magnetron wurde in einer Vakuumkammer installiert, welche an die Beamline des 5 MV Tandembeschleunigers angeschlossen war. Die Position des Magnetrons konnte mittels eines Manipulator verändert werden, was die laterale Untersuchung der Targetoberfläche ermöglichte. Während des Magnetronbetriebes wurde der Argonfluss in die Kammer konstant gehalten, während der Stickstofffluss variiert wurde um verschiedene Ausprägungen der Targetvergiftung zu erreichen. In einem ersten Schritt wurden die Eigenschaften des Plasmas, z.B. die Zusammensetzung des Sputtergases, das Verhalten des Reaktivgaspartialdruckes, das Plasmapotenzial und der Dissoziationsgrad der Reaktivgasmoleküle im Plasma, mit dem Massenspektrometer ermittelt. Aufgrund der ungleichmäßigen Gasentladung vor dem Magnetrontarget, wurden auch lateral variierende Teilchenflüssen und eine ungleichmäßige Targetvergiftung angenommen. Die Energie und die Ausbeute von gesputterten Teilchen wurde deshalb lateral aufgelöst untersucht. Das Massenspektrometer wurde zu diesem Zweck am Ort des Substrates positioniert und die Targetoberfläche konnte gescannt werden indem die Magnetronposition verändert wurde. Die so aufgenommenen Energieverteilungen der gesputterten Teilchen zeigen eine räumliche Abhängigkeit. Teilchen die aus dem Targetzentrum stammen unterscheiden sich hinsichtlich ihrer Energie signifikant von den Teilchen die in der Target-Erosionszone gesputtert werden. Dieses Resultat zeigt die ungleichmäßige Targetvergiftung, wodurch es zu einer Veränderung der Oberflächenbindungsenergie kommt. Über die Verschiebung in der Energieverteilung lässt sich somit der Zustand der Targetoberfläche beschreiben. Diese experimentellen Ergebnisse zeigen Übereinstimmung mit den Ergebnissen der Modellrechnungen. Der Stickstoffgehalt des Targets wurde weiterhin mittels Ionenstrahlanalyse (NRA) bestimmt. Messungen bei verschiedenen Stickstoffflüssen demonstrieren direkt die Vergiftung des Targets. Die maximale Stickstoffkonzentration sättigt bei einem Wert, der dem Stickstoffgehalt in einer ca. 3 nm dicken Titannitridschicht entspricht. Bei ausreichend niedrigem Stickstofffluss zeigt die Messung quer über den Targetdurchmesser eine Variation im Stickstoffgehalt. Die Stickstoffkonzentration in der Erosionszone ist deutlich geringer als im Targetzentrum oder am Targetrand. Die Resultate wurden wiederum durch Modellrechnungen bestätigt. Die durchgeführten Computersimulationen basieren auf Sören Bergs Modell des reaktiven Sputterprozesses. Der Algorithmus wurde jedoch auf der Basis der experimentellen Ergebnisse erweitert. Das Modell beinhaltet nun Mechanismen des Reaktivgaseinbaus in das Target, wie Adsorption, Implantation und Recoilimplantation. Des Weiteren wurde die Ionenstromverteilung als Funktion des Targetdurchmessers in das Modell aufgenommen, was eine detailliertere Beschreibung des Prozesses ermöglicht. Die experimentellen Ergebnisse und die Resultate der Computersimulation zeigen, dass bei niedrigen Reaktivgasflüssen metallische und vergiftete Bereiche auf der Targetoberfläche gemeinsam existieren. Das ist im Widerspruch zu älteren Simulationen, in denen von einer homogenen Targetbedeckung durch das Reaktivgas ausgegangen wird. Basierend auf den Ergebnissen wurden die dominierenden Mechanismen des Reaktivgaseinbaus in das Sputtertarget, in Abhängigkeit von der Position und von der Sputtergaszusammensetzung, identifiziert.