Semester project deals with the theoretical processing of reflow soldering. Describes the process of reflow soldering, description of intermetallic compounds, the influence of heating factor on the reliability and strength of soldered joints.Also deals with the preparation of cross-section, X-ray control, thermal cycling and description of test boards.

The Diploma thesis is focused on reballing of BGA packages with the device PACE TF 2700. It describes the general types of BGA packages, their defects, importance of thermal management to the solder techniques, where it is also talked about the meaning of solders and fluxes for the joint. The work informs about the most common methods of reballing, the proper handling of components and the current situation with BGA stencils on the market. It briefly describes the device operation of PACE TF 2700, that is working on the convection and IR principle of heating components. It deals with the manufacturing of the template, dummy BGA packages, the test plates, creation of the thermo profile, comparing and examining the defects and their causes, which had the most significant impact on the results. The achievements would serve for comparing them with the results of the future laboratory exercises or as a subject for further works.

Philipp Hoffmann Untersuchung zur Fixierung von Knorpelgewebe mittels laserinduzierter Koagulation Aus der Chirurgischen Tierklinik der Veterinärmedizinische Fakultät der Universität Leipzig, angefertigt im Forschungszentrum für Medizintechnik und Biotechnologie GmbH, Bad Langensalza Eingereicht im Januar 2012 97 Seiten, 59 Abbildungen, 9 Tabellen, 318 Literaturangaben 10 Seiten Anhang Schlüsselwörter: Laser, Löten, Knorpelgewebe, Zugfestigkeit, thermische Schäden Gelenkerkrankungen zählen zu den häufigsten Ursachen von Bewegungseinschränkungen in der Human- und Veterinärmedizin. Neben der konservativen Therapie gibt es zahlreiche chirurgische Therapieansätze, unter denen die verschiedenen Verfahren der autologen Chondrozytenimplantation (ACI) vermehrt in den Fokus gerückt sind. Als unbefriedigend stellt sich aktuell die Fixierung der Implantate bzw. Transplantate dar. Ziel der vorliegenden Arbeit war es, zunächst in vitro, unter Nutzung von Gelenkknorpelgewebe aus Kadavermaterial (Schwein, Rind), ein Verfahren einzuarbeiten, mit dem es möglich ist, durch laserinduzierte Koagulation eines Lötmittels eine Verbindung zwischen zwei Knorpelfragmenten bei einer möglichst geringen Gewebeschädigung herzustellen. Als Lötmittel war ein geeignetes Chromophoren-Protein-Gemisch (CPG) herzustellen, welches so auf die Wellenlänge des zur Verfügung stehenden Lasers angepasst wurde, dass die Herstellung von Lötverbindungen möglich war. Die mechanische Festigkeit der Lötverbindungen wurde in verschiedenen Studien zur Optimierung der Lötmittelzusammensetzung und der Lasereinstellungen durch die Bestimmung der Zugkraft geprüft. Ebenso wurden Untersuchungen zum Auftreten thermischer Schäden am Gewebe durch das lasergestützte Löten vorgenommen. Ausgehend von der Untersuchung der Absorptionseigenschaften verschiedener Chromophore und Proteine wurden verschiedene, auf die Wellenlänge des Lasers (810 nm Diodenlaser) abgestimmte, CPG unter Verwendung des Farbstoffes Indocyaningrün (ICG), welcher in dem in der Humanmedizin zugelassenen Diagnostikum ICG-Pulsion® (PULSION Medical Systems AG, München) enthalten ist, und bovinem Serumalbumin (BSA) hergestellt. Knorpelgewebe absorbiert die Strahlung des Diodenlasers (810 nm) kaum (μa ≈ 0 bis 0,02 cm-1). Das Lötmittel (ICG + BSA), dessen Absorptionsmaximum mit 790 nm nah an der Emissionswellenlänge des Lasers liegt, absorbiert hingegen in diesem Wellenlängenbereich gut. Dadurch kann eine direkte Schädigung des Knorpelgewebes durch die Absorption der Laserstrahlung vermieden werden. In den Studien wurden drei Lötmittel mit unterschiedlichen Anteilen an ICG (1 %, 0,25 % und 0,025 %) bei einem BSA-Gehalt von 60 % verwendet. Die Lötmittel mit 0,025 % und 0,25 % ICG wurden zur Prüfung der Zugfestigkeit der gelöteten Verbindung in Abhängigkeit von der Leistungsdichte und der Expositionszeit untersucht. Das Lötmittel mit 0,025 % ICG wurde in den Untersuchungen zur Abhängigkeit der Zugfestigkeit von der Tierspezies, der Entnahmestelle des Knorpelgewebes und der Lötmitteldicke genutzt. Einflüsse der Lagerung des Lötmittels und der Anzahl an Lötmittelpunkten auf die Zugfestigkeit wurden mit dem Lötmittel mit 0,25 % ICG untersucht. Zusätzlich war zu prüfen ob durch ein Knorpelgewebefragment hindurch das CPG zu koagulieren ist. Zur Untersuchung thermisch bedingter Schäden wurden zum einen Temperaturmessungen an der Oberfläche des Knorpelgewebes, im Bereich des Lötmittels und in verschiedenen Tiefen unterhalb des Lötmittels durchgeführt. Zum anderen erfolgten histologische Untersuchungen der Knorpelgewebeproben nach Laseranwendung. Es ist möglich, mittels laserinduzierter Koagulation eines CPG eine Verbindung von Knorpelgewebe vom Schwein und Rind herzustellen. Mit Steigerung der Leistungsdichte und Verlängerung der Expositionszeit kommt es zur Erhöhung der Zugfestigkeit. Die Zugfestigkeiten waren bei Koagulation des CPG durch das Knorpelfragment hindurch niedriger als die Zugfestigkeiten mit aufgelegtem Lötmittel. Unter Laseranwendung kommt es zu einem steilen Ansteigen der Temperatur im Lötmittel bis zum Erreichen einer Höchsttemperatur. Die Steilheit des Temperaturanstieges und die sich einstellenden Temperaturen nehmen mit Erhöhung des im Lötmittel enthaltenen ICG-Gehaltes und der am Laser eingestellten Leistung zu. Die Temperaturerhöhung ist jedoch weitgehend auf das Lötmittel und dessen Randbereiche begrenzt. Die histologischen Untersuchungen verdeutlichten, dass die Laserbestrahlung von Knorpelgewebe mittels Diodenlaser (810 nm) nur eine sehr geringe Schädigung verursacht. Unter Verwendung eines Lötmittels kommt es durch die vom Lötmittel absorbierte Energie zu Schäden am umliegenden Knorpelgewebe. Diese Schädigung ist auf Randbereiche des Lötmittels begrenzt und nimmt mit steigender Leistung und Expositionszeit zu. Bei einer Leistungsdichte von (5,09 W/cm2) konnte eine Verbindung zwischen zwei Knorpelfragmenten erzielt werden, die bei einer Zugkraft von 13,3 N/cm2 nachgibt und bei der die Schädigungen des Knorpelgewebes minimal sind. Die vorliegenden Untersuchungen haben gezeigt, dass es möglich ist, Knorpelfragmente mittels laserinduzierter Koagulation eines CPGs miteinander zu fixieren. / Philipp Hoffmann Investigation for the fixation of articular cartilage tissue using laser-induced coagulation From the Large Animal Clinic for Surgery, Faculty of Veterinary Medicine, University of Leipzig, prepared at Research Centre of Medical Technology and Biotechnology GmbH, Bad Langensalza Submitted in January 2012 97 Pages, 59 figures, 9 tables, 318 references, 10 pages appendices Keywords: laser, soldering, cartilage tissue, tensile strength, thermal damage Joint diseases are among the most common causes of restricted movement of patients in the human and veterinary medicine. In addition to the conservative therapy, there are numerous surgical therapies, under which the various methods of autologous chondrocyteimplantation, have moved increasingly into the focus of scientific and clinical interest. As problematic and unsatisfactory is currently the fixation of the implants. The aim of this study was, first in vitro, taking advantage of articular cartilage tissue from cadaver material (pig, cattle) to incorporate a process by which it is possible to produce by laser-induced coagulation of solder a connection between two cartilage fragments with the smallest possible tissue damage. As solder was a suitable chromophore-protein-mixture (CPG) to establish which it was adapted to the wavelength of the laser is available, that the production of solder joints was possible. The mechanical strength of solder joints has been examined in several studies to optimize the laser settings and the solder ingredients by determining the tensile strength. Likewise, studies on the occurrence of thermal damage to the tissues were made by the laser-assisted soldering. Based on the study of the absorption properties of various chromophores and proteins the wavelength of the laser (810 nm diode laser) was tuned, and different CPG using the dye indocyanine green (ICG), which is within the acceptable in human medicine ICG-Pulsion ® (Pulsion Medical Systems AG, Munich) is included, and bovine serum albumin (BSA) were prepared. Articular cartilage tissue absorbs the radiation of the diode laser (810 nm) hardly (uA ≈ 0 to 0.02 cm–1). The solder (ICG + BSA), whose absorption maximum at 790 nm is close to the emission wavelength of the laser is absorbed. This can be avoided direct damage to the cartilage tissue through the absorption of laser radiation. In the studies, three solders were used with different proportions of ICG (1 %, 0.25 % and 0.025 %) at a content of 60 % BSA. The solder with 0.025 % and 0.25 % ICG were studied to test the tensile strength of the soldered connection as a function of power density and exposure time. The solder containing 0.025 % ICG was used in the investigations of the dependence of tensile strength of the animal species, the donor site of the cartilage and the solder thickness. Influences of storage the solder and the number of solder dots on the tensile strength were investigated with the solder with 0.25 % ICG. In addition it was to examine if it is possible to coagulate the CPG through an articular cartilage fragment. To investigate thermally induced damage to temperature measurements were performed on the surface of the cartilage tissue in the area of the solder and at various depths below the solder. Secondly, histological examinations were made of the articular cartilage after laser application. It is possible to produce by laser-induced coagulation of a CPG an articular cartilage bonding of pig and cattle. With increasing power density and lengthening the exposure time leads to the increase in tensile strength. The tensile strengths were measured with coagulation of the CPG passed through the cartilage fragment is lower than the tensile strengths with applied solder. Under laser application leads to a steep rise in temperature in the solder to reach a maximum temperature. The rate of temperature rise increases with increasing the solder contained in ICG content and on the laser power set. The temperature rise is limited largely to the solder and its peripheral areas. The histological examinations showed that the laser irradiation of cartilage tissue using diode laser (810 nm) only a very little damage caused. Using a solder it comes through the energy absorbed by the solder and damage to the surrounding articular cartilage tissue. This damage is limited to border areas and the flux increases with increasing power and exposure time. At a power density of (5.09 W/cm2) was a connection between two cartilage fragments are obtained, which yields at a tensile force of 13.3 N/cm2 and where the damage to the cartilage tissue is minimal. The present studies have shown that it is possible cartilage fragments by laser-inducedcoagulation of a CPG to fix each other.

The present dissertation is motivated by the search for alternatives of lead-free soldering by nanoparticles of metals and their alloys. The research focuses on the possibility of replacing lead-free solders by nanoparticles. This issue is currently being addressed by the use of lead-free solders but their properties are not entirely equivalent to properties of lead-tin based alloys. The theoretical part of the dissertation first summarizes up-to date knowledge on the development of lead-free alloys currently used for soldering in the electronics. The work compares these lead-free solder candidates with previously used Pb-Sn alloys. The second section of the theoretical part is devoted to nanotechnology that offers possible solutions of problems associated with the use of lead-free solders. The text contains a description of the properties of nanocrystalline materials in comparison with those of compact alloys having the same chemical composition. The possibility of preparation of nanoparticles and potential problems associated with small particle sizes are also presented. Introduction of the experimental part focuses on the preparation of nanoparticles of pure metals and alloys by chemical and physical ways as well as on an instrumentation for characterisation and analysis. Attention is focused on the silver in nanoparticle form that exhibits the low temperature sintering effect, which is thermally activated by decomposition of oxide envelope covering the Ag nanoparticles. This factor is critical for low-temperature sintering and thus also for possible future applications. The thermal effects of the low sintering process were studied by methods of thermal analysis. The preparation of the Cu / Ag nano / Cu joints was carried out in-situ in inert atmosphere and under the action of atmospheric oxygen. In both cases varying conditions of thermal treatment were used. The cross sections of the prepared joints were then used for the metallographic analysis of the local mechanical properties of the resulting silver layer, for the chemical composition evaluation of the resulting layers of the joint, and for the microstructure study. Strength characteristics are represented by testing shear strength of individual joints.

No description available.

Die vorliegende Arbeit beschäftigt sich mit der Entwicklung, Herstellung und Charakterisierung partikelverstärkter Weich- und Weichaktivlote mit dem Ziel der Eigenschaftsverbesserung der Lötverbindungen. Ausgehend vom Stand der Wissenschaft und Technik wird ein Konzept zur Einbringung von keramischen Verstärkungspartikeln in eine Sn-Basis-Lotmatrix erarbeitet und umgesetzt. Im Falle partikelverstärkter Weichaktivlote wird durch das zusätzliche Legieren der Lotmatrix mit dem reaktiven Element Titan die Ausbildung von zwei Reaktionszonen erreicht, welche die Haftung zwischen Partikel und Matrix steigern. Die mechanischen Eigenschaften dieser Verbindungen werden gegenüber der Partikelverstärkung ohne Aktivelement weiter verbessert. Zum Fügen der Aluminium- und Alumi-niummatrix-Verbundwerkstoffe (AMC) findet ein ultraschallunterstütztes Lötverfahren Anwendung, das eine Benetzung ohne den Einsatz von Flussmitteln ermöglicht. Die hergestellten Lötverbindungen zeichnen sich durch gesteigerte Verbindungsfestigkeiten, vor allem bei erhöhten Temperaturen, sowie eine verbesserte Kriechbeständigkeit aus. Aufgezeigt wird das Potenzial der Lote anhand von Zug- und Scherzugversuchen sowie Kriechuntersuchungen, die mit den Ergebnissen der Mikrostrukturanalyse und der fraktografischen Bewertung korreliert werden. Die Arbeit schließt mit einer Diskussion und sich daraus ergebenden Folgerung. Weiterhin liefert sie Ansätze für weitere Forschungstätigkeiten auf diesem Gebiet. / This thesis deals with the development, manufacturing and characterisation of particle-reinforced solders and active solders to improve the mechanical properties of soldered joints. Based on the state of the art, a concept for embedding of ceramic particles in a Sn-based filler matrix is planed and realised. In the case of particle-reinforced active solders two interfacial reaction layers which increase the bonding between the particles and the filler matrix are formed due to the alloying by the reactive element Ti. The mechanical properties of these joints are improved in comparison to particle-reinforced solders without surface-active elements. For joining of aluminium and aluminium matrix composites (AMC), an ultrasound-supported soldering process was used, that accomplishes a fluxless wetting. The produced joints are featured by an improved joining strength, mainly at elevated temperatures, and an increased creep resistance. The potential of the developed solders is performed by tensile and shear as well as creep tests that are correlated with the results of the micro-structural and fractographical analysis. The Discussion and the drawn conclusions summarise the work and give new approaches for following investigations.

Le besoin pressant de substitution du plomb dans les alliages de soudure a conduit à une introduction très rapide de nouveaux alliages sans plomb dont la connaissance en termes de comportement n'est pas assez approfondie. En effet, d'autres problématiques sont apparues (l'augmentation de la température du procédé de soudage, trop grand choix disponible dans les alliages alternatifs) alors que les problèmes relatifs aux alliages actuels sont restés sans réponse (le changement incessant de la microstructure des alliages de soudure, la méthodologie empirique prédisant la durée de vie). Tous les paramètres cités ci-dessus modifient la stabilité et la fiabilité des performances spécifiques de l'alliage de soudure et par conséquence, de tout le module électronique.De plus, avec la miniaturisation de l'électronique et les conditions d'environnement de plus en plus sévères, ces obstacles deviennent critiques et les solutions actuelles ne sont plus compatibles. Les demandes de ce marché deviennent donc de plus en plus strictes en termes de prédiction de durée de vie et de contrôle de fiabilité.L'objectif de ce projet est de comprendre et de concevoir une nouvelle formulation d'alliage sans plomb afin de développer une alternative à l'alliage plombé haute température et un alliage pour les applications haute fiabilité et en accord avec les directives gouvernementales. Des approches expérimentales avancées comme la nano-indentation, le suivi de l'évolution de la microstructure par SEM et par EDS mapping, l'étude des effets du vieillissement thermique sur la croissance de la taille des grains avec de la lumière croisée polarisée de microscopie optique etc seront utilisées pour développer un alliage sans plomb qui convienne aux exigences des applications automobile et pipeline / The urgent need for removing lead from solder alloys led to the very fast introduction of lead-free solder alloys without a deep knowledge of their behaviour. As a consequence, additional issues raised (increased thermally induced problems during soldering process, a too wide range of possible available alternative alloy formulations), while problems related to current solder alloys remained unsolved (the constant change of the solder alloy microstructure, empirical predicting lifetime methodology). All the above mentioned issues alter stability and reliability of the application specific performances of the solder alloy, and subsequently of the whole electronic module. These problems become critical and are no longer compatible, as the market goes towards miniaturization and harsh environment conditions. These market trends now require stricter life time prediction and reliability control. Objective of this project is to understand and design a novel lead-free solder formulation to develop a potential alternative to lead-based high temperature melting point solder for high reliability requirements and in accordance with governmental directives. An advanced experimental approach like nanoindentation, microstructure evolution with SEM and EDS mapping, thermal aging effects on continuous grain size growth with cross polarized light of optical microscopy etc. would be implemented to develop doped-SAC lead-free solders for the best-fit to requirements in automotives and pipelines applications

Sn-Pb solder has long been used in the Electronics industry. But, due to its toxic nature and environmental effects, certain restrictions are made on its use and therefore many researchers are looking to replace it. Sn-3.0Ag-0.5Cu (SAC) solders are suggested as lead-free replacements but their coarse microstructure and formation of hard and brittle Inter-Metallic Compounds (IMCs) like Ag₃Sn and Cu₆Sn₅ have limited their use in high temperature applications. In this research work, RE elements, mostly lanthanum (La), are used as potential additives to SAC alloys. They reduce the surface free energy, refine the grain size and improve the mechanical and wetting properties of SAC alloys. An extensive experimental work has been performed on the microstructure evolution, bulk mechanical properties, individual phase (matrix and IMCs) mechanical properties, creep behavior and wettability performance of the SAC and SAC-La alloys, with different (La) doping. SEM and EDS have been used to follow the continuous growth of the IMCs at 150°C and 200°C and thus provide a quantitative measure in terms of their size, spacing and volume fraction. Grain size is measured at regular intervals starting from 10 hours up to 200 hours of thermal aging using Optical Microscope with cross polarized light. Bulk mechanical properties are evaluated using tensile tests at low strain rates. Individual phase mechanical properties like Young's modulus, hardness, strain rate sensitivity index and bulge effects are characterized with nanoindentation from 100 µN up to 5000 µN loadings at different temperatures of 25°C, 45°C, 65°C and 85°C. Creep experiments are performed at elevated temperatures with good fitting of Dorn creep and back-stress creep models. Activation energy measurements are made at 40°C, 80°C and 120°C. Wettability testing on copper substrates is used for surface tension, wetting force and contact angle measurements of SAC and SAC-La doped alloys at 250°C and 260°C.

À medida que a tecnologia de perfuração de poços desenvolveu-se nos últimos anos, explorando cada vez maiores profundidades, os efeitos do desgaste e corrosão têm aumentado proporcionalmente. Uma forma de viabilizar a exploração em águas profundas é revestir as ligas de aço de menor custo com ligas especiais de melhores propriedades, como a liga Inconel® 625. Os parâmetros de soldagem utilizados para a deposição de camadas sobre o substrato influenciam diretamente na qualidade e nas propriedades desses revestimentos. O objetivo deste trabalho foi determinar a influência das principais variáveis de soldagem sobre a dureza ao riscamento e coeficiente de atrito da superfície originada após a deposição de cordões de solda para revestimento. Foi utilizada a técnica de soldagem TIG alimentado automaticamente com duplo arame aquecido. As variáveis estudadas foram: Corrente de Soldagem; Velocidade de Soldagem; Corrente para Aquecimento do Material de Adição; Velocidade de Alimentação do Material de Adição e Composição do Gás de Proteção. Para a realização do estudo foi elaborado um planejamento experimental (DoE), composto central, de 05 fatores, totalizando 32 condições, cada uma correspondendo a cordões de solda depositados com diferentes conjuntos de variáveis. Os cordões foram submetidos ao ensaio de riscamento, onde foram medidos a área do sulco e o coeficiente de atrito da superfície. Os riscos gerados foram analisados em tribômetro para obtenção da topografia em 3D, e em Microscópio Eletrônico de Varredura (MEV). A análise da influência das variáveis de soldagem sobre a área do sulco e o coeficiente de atrito foi realizada pela metodologia de superfície de resposta (RSM). Foram obtidos modelos matemáticos de 1ª e 2ª ordem correlacionando as variáveis de soldagem à área do sulco e ao coeficiente de atrito da superfície. Também foram geradas superfícies que correlacionam as variáveis às respostas. Observou-se que as variáveis de principal influência sobre a área do sulco são a velocidade de soldagem, corrente do arame e gás de soldagem, e que a velocidade de alimentação do arame possui forte influência quando relacionada com as outras variáveis de processo. Para o coeficiente de atrito, os fatores de maior influência foram as correlações entre as variáveis, principalmente a corrente de soldagem. / As well drilling technology has developed in recent years, exploring ever greater depths, the effects of wear and corrosion have increased proportionately. One way to make deep-water exploration feasible is to coat lower-cost steel alloys with special alloys of better properties, such as the Inconel® 625 alloy. The welding parameters used for deposition of layers on the substrate directly influence the quality and properties of these coatings. The objective of this work was to determine the influence of the main welding variables on the hardness to scratch and surface friction coefficient originated after the deposition of weld beads for coating. The GTAW welding technique was automatically fed with double heated wire. The variables studied were: Welding Current; Welding Speed; Current for Heating the Addition Material; Feed Speed of Addition Material and Shielding Gas Composition. Design of Experiments (DoE) technique was applied, central composite, of 05 factors, totalizing 32 conditions, each corresponding to weld beads deposited with different sets of variables. The beads were subjected to the scratch test, where the scar area and the surface friction coefficient were measured. The scratches were analyzed in tribometer to obtain the topography in 3D, and Scanning Electron Microscope (SEM). The analysis of the influence of the welding variables on the scar area and the friction coefficient was performed by the response surface methodology (RSM). First and second order mathematical models were obtained, correlating the welding variables to the scar area and the surface friction coefficient. Surfaces that correlate variables with responses were also generated. It was observed that the variables of main influence on the scar area are the welding speed, wire current and welding gas, and that the wire feed speed has a strong influence when related to the other process variables. For the coefficient of friction, the factors of greater influence were the correlations among the variables, mainly the welding current.

Submitted by Renata Lopes (renatasil82@gmail.com) on 2016-12-22T13:25:11Z No. of bitstreams: 1 vahidnikoofard.pdf: 794368 bytes, checksum: 26feb8d15d2757f79f8d7dfb69b610c2 (MD5) / Approved for entry into archive by Diamantino Mayra (mayra.diamantino@ufjf.edu.br) on 2017-01-31T10:20:21Z (GMT) No. of bitstreams: 1 vahidnikoofard.pdf: 794368 bytes, checksum: 26feb8d15d2757f79f8d7dfb69b610c2 (MD5) / Made available in DSpace on 2017-01-31T10:20:21Z (GMT). No. of bitstreams: 1 vahidnikoofard.pdf: 794368 bytes, checksum: 26feb8d15d2757f79f8d7dfb69b610c2 (MD5) Previous issue date: 2015-06-30 / CAPES - Coordenação de Aperfeiçoamento de Pessoal de Nível Superior / Esta tese é composta por assuntos distintos entre si de teorias quânticas de campos onde alguns deles são descritos em espaços não-comutativos (NC). Em primeiro lugar, analisamos a dinâmica de uma partícula livre sobre uma 2-esfera e através da dinâmica das suas equações de movimento, obtivemos as perturbações NCs neste espaço de fase. Este modelo sugere uma origem para o Zitterbewegung do elétron. Depois disso, consideramos umaversãoNCdasegundaleideNewtonparaestemodelo, quefoiobtidocomestecenário geométrico aplicado a este modelo. Em seguida, discutimos um formalismo alternativo relacionado à não-comutatividade chamado DFR onde o parâmetro NC é considerado uma coordenada e demonstramos exatamente que ela tem obrigatoriamente um momento conjugado neste espaço de fase DFR, diferentemente do que alguns autores da atual literatura sobre DFR afirmam. No próximo assunto, usando o formalismo de solda que, em poucaspalavras,colocapartículascomquiralidadesopostasnomesmomultipleto,soldamos algumas versões NCs de modelos bem conhecidos como modelos de Schwinger quirais e modelos (anti) auto duais no espaço-tempo de Minkowski estendido. Em outro assunto estudado aqui, também construímos a versão NC do modelo de Jackiw-Pi com um grupo de calibre arbitrário e usamos o mapeamento bem conhecido de Seiberg-Witten para obter este modelo NC em termos de variáveis comutativos. Finalmente, utilizamos o formalismo de campos e anticampos (ou método BV) para construir a ação de Batalin-Vilkovisky (BV) do modelo Jackiw-Pi estendido e após o prEntendiocedimento de fixação de calibre chegamos a uma ação completa, pronta para quantização. / This thesis is composed of distinct aspects of quantum field theories where some of them are described in noncommutative (NC) spaces. Firstly, we have analyzed the dynamics of a free particle over a 2-sphere and through the dynamics of the equations of motion we have derived its NC perturbations in the phase-space. This model suggests an origin for Zitterbewegung feature of the electron. After that we have considered the NC version of Newton’s second law for this model, which was obtained with the geometricalscenarioappliedtothismodel. Thenwehavediscussedtheso-calledDoplicher– Fredenhagen–Roberts (DFR) alternative formalism concerning noncommutativity where the NC parameter has a coordinate role and we showed exactly that it has a conjugated momentum in the DFR phase-space, differently of what some authors of the current DFR-literature claims. In the next issue, using the soldering formalism which, in few words, put opposite chiral particles in the same multiplet, we have soldered some NC versions of well known models like the chiral Schwinger model and (anti)self dual models in the extended Minkowski spacetime. Changing the subject, we have constructed the NC spacetime version of Jackiw-Pi model with an arbitrary gauge group and we used the well known Seiberg-Witten map to obtain the NC model expressed in terms of commutative variables. Finally, we have used the field-antifield (or BV method) formalism to construct the Batalin-Vilkovisky (BV) action of the extended Jackiw-Pi model and after the gauge fixing procedure we have arrived at a quantized-ready action for this model.