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Orientadores: Amauri Garcia, Wislei Riuper Ramos Osório / Tese (doutorado) - Universidade Estadual de Campinas, Faculdade de Engenharia Mecânica / Made available in DSpace on 2018-08-21T02:28:07Z (GMT). No. of bitstreams: 1 Garcia_LeonardoRicheli_D.pdf: 14084477 bytes, checksum: f9b96fac198700cfcafeecf1edca6f9b (MD5) Previous issue date: 2012 / Resumo: A preocupação ambiental sobre a toxicidade do Pb combinada com normas rígidas, estão gradualmente proibindo a aplicação de Pb em ligas de soldas. As ligas alternativas Sn-Ag e Sn-Bi podem estar entre as mais promissoras candidatas à substituição das ligas de solda sem chumbo em função de apresentarem propriedades compatíveis com as da liga Sn-Pb. A fim de adequar os produtos aos novos requisitos, produtores de componentes microeletrônicos necessitam desenvolver novas ligas de solda. Estudos sobre a influência da taxa de resfriamento sobre a microestrutura e as propriedades mecânicas resultantes e as características de recobrimento dessas ligas necessitam ser realizados. Esse trabalho tem exatamente esse objetivo, e no qual é realizado um estudo experimental comparativo das principais características da tradicional liga Sn-Pb e das ligas Sn-Ag e Sn-Bi visando a aplicação dessas ligas como ligas alternativas de solda. As seguintes atividades foram desenvolvidas para atingir tais propósitos: i) solidificação unidirecional das ligas Sn-Ag (hipoeutética Sn-2%Ag e eutética Sn-3,5%Ag) e Sn-Bi (Sn-10, 20 e 40%Bi); ii) ensaios de mergulho de lâminas de cobre nas ligas Sn-Ag e Sn-Bi fundidas e; iii) ensaios de tração de acordo com as especificações da norma ASTM E 8M/04. Foi utilizado um dispositivo de solidificação vertical ascendente para obter os lingotes das ligas e os correspondentes perfis térmicos. Variáveis térmicas de solidificação como: taxa de resfriamento, velocidade de solidificação e tempo local de solidificação foram determinadas para as ligas Sn-Ag e Sn-Bi. Essas variáveis experimentais foram correlacionadas com os espaçamentos dendríticos secundários (l2) e foram propostas equações experimentais de crescimento dendrítico. A espessura da camada solidificada, a área recoberta e as microestruturas resultantes das ligas no substrato de cobre foram avaliadas após o ensaio de mergulho em diferentes temperaturas. Verificou-se que, considerando-se as ligas Sn-Ag e Sn-Bi examinadas, a liga Sn- 40%Bi apresenta maior resistência mecânica e a liga Sn-3,5%Ag apresenta molhabilidade similar quando comparada com a tradicional liga de solda Sn-40%Pb / Abstract: The increasingly environmental concern over the toxicity of Pb combined with strict regulations, are gradually banning the application of Pb-based solders. Sn-Ag and Sn-Bi solder alloys are among the most promising candidates for Pb-free alternatives due to their compatible properties with the Sn-Pb solder alloy. In order to adequate products to such restriction requirements, electronic components manufacturers have to meet such requirements by developing new lead-free solder alloys. Studies focusing on the influence of the cooling rate on the resulting microstructures and on both the mechanical properties and recovery of these alloys need to be carried out. This work has precisely such objective, in which a comparative experimental study of the main features of the traditional Sn-Pb alloy and Sn-Ag and Sn-Bi alloys is carried out with a view to application of the latter alloys as alternative solder materials. The following activities were developed to attain such purpose: i) unidirectional solidification of Sn-Ag alloys (hypoeutectic Sn-2 wt.% Ag, eutectic Sn-3.5 wt.% Ag), and Sn-Bi alloys (Sn-10, 20 and 40 wt.% Bi); ii) copper blades dipped in both molten Sn-Ag and Sn-Bi alloys (hot dipping) and iii) tensile testing according to specifications of ASTM standard E 8M/04. An upward vertical solidification system has been used to obtain the alloys ingots and their correspondent thermal profiles. Solidification thermal variables such as: the cooling rate, tip growth rate and local solidification time have been determined for Sn-Ag and Sn-Bi alloys. Such experimental variables have been correlated with secondary dendrite arm spacings (l2) and experimental equations of dendritic growth have been proposed. The thickness of the coating layers, the spreading areas and the resulting microstructures of these alloys on the copper substrates were evaluated after the hot dipping procedures at different temperatures. It was found that, of the examined Sn-Ag and Sn-Bi alloys, the Sn-40 wt.% Bi alloy has offered the highest mechanical strength and the Sn- 3.5 wt.% Ag alloy has shown similar wettability when compared with the traditional Sn-40 wt.% Pb solder alloy / Doutorado / Materiais e Processos de Fabricação / Doutor em Engenharia Mecânica

This work deals with technology of rework and repairs of electronic soldering assemblies. The work is primarily focused on the rework and repairs of electronic soldering assemblies with the light emitting diode. The theoretical part describes the technological methods of soldering and reworking of electronic assemblies, their diagnostics, evaluation of their influence on reliability and functional properties. The practical part is focused on the real application of technological procedures of rework and repairs, their testing and evaluation. Furthermore there is described and tested the influence of thermal load during soldering on the properties of light emitting diodes.

This master's thesis deals with issue of lead-free soldering in protective atmosphere with focus on wetting test. Theorethical part is focused on the types of lead-free solders, wettability tests performed on solder joints, different types of soldering or comparison of influence of the base material in regards to the wetting of the solder. The goal of practical part is testing and comparison of spreadability of selected lead-free solder on two conductive surfaces with different concentration of oxygen in protective nitrogen atmosphere. Testing has been performed on ceramic substrate which differs this method from others, performed on organic substrate. For an over-melted solder, the crystal-growth on surface in regards to protective atmosphere concentration is shown.

<p><a>Low reflow temperature solder interconnect technology based on Sn-Bi alloys is currently being considered as an alternative for Sn-Ag-Cu solder alloys to form solder interconnects at significantly lower melting temperatures than required for Sn-Ag-Cu alloys. </a></p> <p>A new low temperature interconnect technology based on Sn-Bi alloys is being considered for attaching Sn-Ag-Cu (SAC) solder BGAs to circuit boards at temperatures significantly lower than for homogeneous SAC joints. Microstructure development studies of reflow and annealing, including Bi diffusion and precipitation, are important in understanding mechanical reliability and failures paths in the resulting heterogeneous joints. Experiments in several SAC-SnBi geometries revealed that Bi concentration profiles deviate from local equilibrium expected from the phase diagram, with much higher local concentrations and lower volume fractions of liquid than expected during short-time high temperature anneals in the two-phase region. As annealing time increased and Sn grain coarsening occurred, the compositions and fractions revert to the phase diagram, suggesting an “anti-Scheil” effect. A Bi interface segregation model based on Bi segregation at Sn grain boundaries was developed to explain the Bi distribution characteristics in Sn during two-phase annealing process. </p> <p>Besides hybrid joints, microstructural evolution after reflow and aging, especially of intermetallic compound (IMC) growth at solder/pad surface finish interfaces in homogeneous SnBi LTS joints, is also important to understanding fatigue life and crack paths in the solder joints. This study describes intermetallic growth in homogeneous solder joints of Sn-Bi eutectic alloy and Sn-Bi-Ag alloys formed with electroless nickel-immersion gold (ENIG) and Cu-organic surface protection (Cu-OSP) surface finishes. Experimental observations revealed that, during solid state annealing following reflow, the 50nm Au from the ENIG surface finish catalyzed rapid (Au,Ni)Sn₄ intermetallic growth at the Ni-solder interface in both Sn-Bi and Sn-Bi-Ag homogeneous joints, which led to significant solder joint embrittlement during fatigue testing. Further study found that the growth rate of (Au,Ni)Sn₄ intermetallic could be reduced by In and Sb alloying of SnBi solders and is totally eliminated with Cu addition. Fatigue testing revealed Au embrittlement is always present in solder joints without Cu, even with In and Sb additions due to (Au,Ni)Sn₄ formation. The fatigue reliability of Cu-containing alloys is better on ENIG due to the formation of (Ni,Cu,Au)₆Sn₅ at the solder-surface finish interface instead of (Au,Ni)Sn₄.</p> <p>With the development of SnBi LTSs, a new generation alloy called HRL1 stands out for its outstanding reliability during thermal cycling and drop shock testing. This study focused on microstructure evolution in SnBi eutectic, SnBiAg eutectic and HRL1 solders (MacDermid Alpha) homogeneous joints and hybrid joints with SAC305 formed with ENIG and Cu-OSP surface finishes. Experimental results revealed that with more microalloying elements, HRL1 has significantly refined microstructure and slower Sn grain growth rate during solid-state aging compared with SnBi and SnBiAg eutectic alloys. Intermetallic compound growth study showed that during solid state annealing following reflow, the (50nm) Au from the ENIG finish catalyzed rapid (Au,Ni)Sn₄ intermetallic growth at the Ni-solder interface in both Sn-Bi and Sn-Bi-Ag homogeneous joints, which led to significant solder joint embrittlement during creep and fatigue loading. However, (Au,Ni)Sn₄ growth and gold embrittlement was completely eliminated for HRL1 due to Cu additions in it, and HRL1 has significantly better fatigue reliability than SnBi and SnBiAg eutectic alloys on both OSP and ENIG surface finishes.</p>

I describe the construction of a calcium matter-wave interferometer. The interferometer is based on a Ramsey-Borde scheme, and uses a thermal beam of atoms excited by an optical-frequency transition in calcium. In our experiment four pi/2 pulses of light are delivered to the atoms, which split and recombine the wave functions of the atoms. Our experimental design minimizes first-order Doppler shifts, and allows for the cancellation of systematic errors including phase shifts due to rotation and acceleration. I describe the individual components of the interferometer and its assembly. The requirements for the electronics used in the experiment as well as their design and performance are described in great detail. I also give an overview of the techniques used to passively stabilize the laser and optical components. Finally, I report on the current status of the experiment as well as detail future work to be done on the apparatus.

<p>The aim of the research work presented here, is to contribute to the adaptation of electronic packaging towards the needs of high frequency applications. As the field of electronic packaging stretches over several very different professional areas, it takes an interdisciplinary approach to optimize the technology of electronic packaging. Besides this, an extensive knowledge of industrial engineering should be an essential part of this undertaking to improve electronic packaging. Customary advances in technology are driven by new findings and a continuous development of processes in clearly defined fields. However, in the field of the higher levels of the interconnection hierarchy, that is external to the chip level interconnections and chip packaging, it is supposed that a wide combination of disciplines and technical creativity, instead of advanced technology in a special area should produce most added value.</p><p>The thesis is divided into five areas, interlinked by the overall aim of there advantages to the common goal. These areas are the Printed Wiring Board (PWB) technology, PWB connections using flexible printed circuit boards, multiconductor cable connections, shielded enclosures and the related EMC issues, and finally the cooling of electronics. A central issue was to improve the shielded enclosures to be effective also at very high frequencies; it will be shown that shielded enclosures without apertures can cope with frequencies up to and above 15 GHz. Due to this enclosure without apertures, it was necessary to develop a novel cooling structure. This cooling structure consists of a heat sink where the PCB’s are inserted in close contact to the cooling fins on one side, whereas the other side of the heat sink is cooled by forced ventilation. The heat transfer between these parts is completely inside the same body. Tests carried out on a prototype have shown that the performance of the cooling structure is satisfactory for electronic cooling.</p><p>Another problem area that is addressed are the interconnect problems in high frequency applications. Interconnections between parts of a local electronic system, or as within the telecom and datacom field between subscribers, are commonly accomplished by cable connections. In this research work multiconductor cables are examined and a patented novel cable-connector for high frequency use is presented. Further, an experimental complex soldering method between flexible printed circuits boards and rigid printed circuits boards, as part of connections between PCBs, is shown. Finally, different sectors of the PCB technology for high frequency applications are scrutinized and measurements on microstrip structures are presented.</p>

The thesis aims to develop a prototype for a Smart Case for Remote Radio Kits at the department of Demo &amp; Event at Ericsson in Kista.The smart case consists of a mechanical structure (the case itself with ) and an electronic system that includes a temperature sensor, a LCD display showing the temperature, a GPS (global positioning system) module for positioning the case, a GSM (Global System for Mobile Communications) module and a microcontroller Arduino UNO. The Case is modelled in 3D with the help of CAD software and then printed with a 3D printer. A down-scaled prototype is built with the help of the 3D printer and the 2D drawing will be used when the full scaled model is produced. The Arduino UNO handles temperature sensor and GPS measurements, LCD display, and the transmission of measurement data using GSM module via text message (SMS) to a cell phone or to a server over the Internet. The projected ended up with all the drawings and models finished for the Case as well as the implementation of down-scaled prototypes. The electrical system was tested and finished individually. But the complete system cannot be assembled inside the Case due to the time limitation. This means that the project can be further extended, where a full scale model can be developed and the electrical control system can be assembled together and mounted inside the Case.

Thesis (M.S.)--State University of New York at Binghamton, Department of Mechanical Engineering, 2005. / Includes bibliographical references (leaves 70-72).

<p>Företag kan behöva förändra sitt sätt att arbeta av flera olika skäl. Marknaden ställer krav på billigare lösningar med bibehållen kvalitet. Myndigheter ställer krav på större miljö­hänsyn. Syftet med den här uppsatsen är att granska tre olika företags förändringsarbete i samband med att RoHS-direktivet föreskrev att bly inte skall användas vid lödning. Ett företag har helt ställt om sin produktion, ett företag kör blandad produktion och ett av företagen endast en liten produktion med blyfritt eftersom dess kunder omfattas av de undantag som finns i direktivet. Undersök­ningen har utförts som kvalitativa intervjuer med miljö- och processansvariga på de olika före­tagen och visar att företagen haft olika strategier för att lyckas med omställningsarbetet. Mina huvudsakliga slutsatser är att förändringsarbetet påverkas av kontakter med olika nätverk samt möjligheten att praktiskt prova en ny process och i betydligt mindre utsträckning av formellt ledningsarbete såsom miljöledningssystem.</p>