This study focuses on development a planar power module with low thermal impedance and thermo-mechanical stress for high density integration of power electronics systems. With the development semiconductor technology, the heat flux generated in power device keeps increasing. As a result, more and more stringent requirements were imposed on the thermal and reliability design of power electronics packaging. In this dissertation, a boundary-dependent RC transient thermal model was developed to predict the peak transient temperature of semiconductor device in the power module. Compared to conventional RC thermal models, the RC values in the proposed model are functions of boundary conditions, geometries, and the material properties of the power module. Thus, the proposed model can provide more accurate prediction for the junction temperature of power devices under variable conditions. In addition, the transient thermal model can be extracted based on only steady-state thermal simulation, which significantly reduced the computing time. To detect the peak transient temperature in a fully packaged power module, a method for thermal impedance measurement was proposed. In the proposed method, the gate-emitter voltage of an IGBT which is much more sensitive to the temperature change than the widely used forward voltage drop of a pn junction was monitored and used as temperature sensitive parameter. A completed test circuit was designed to measure the thermal impedance of the power module using the gate-emitter voltage. With the designed test set-up, in spite of the temperature dependency of the IGBT electrical characteristics, the power dissipation in the IGBT can be regulated to be constant by adjusting the gate voltage via feedback control during the heating phase. The developed measurement system was used to evaluate thermal performance and reliability of three different die-attach materials. From the prediction of the proposed thermal model, it was found that the conventional single-sided power module with wirebond connection cannot achieve both good steady-state and transient thermal performance under high heat transfer coefficient conditions. As a result, a plate-bonded planar power module was designed to resolve the issue. The comparison of thermal performance for conventional power module and the plate-bonded power module shows that the plate-bonded power module has both better steady-state and transient thermal performance than the wirebonded power module. However, due to CTE mismatch between the copper plate and the silicon device, large thermo-mechanical stress is induced in the bonding layer of the power module. To reduce the stress in the plate-bonded power module, an improved structure called trenched copper plate structure was proposed. In the proposed structure, the large copper plate on top of the semiconductor can be partitioned into several smaller pieces that are connected together using a thin layer copper foil. The FEM simulation shows that, with the improved structure, the maximum von Mises stress and plastic strain in the solder layer were reduced by 18.7% and 67.8%, respectively. However, the thermal impedance of the power module increases with reduction of the stress. Therefore, the trade-off between these two factors was discussed. To verify better reliability brought by the trenched copper plate structure, twenty-four samples with three different copper plate structures were fabricated and thermally cycled from -40°C to 105°C. To detect the failure at the bonding layer, the curvature of these samples were measured using laser scanning before and after cycling. By monitoring the change of curvature, the degradation of bonding layer can be detected. Experimental results showed that the samples with different copper plate structure had similar curvature before thermal cycle. The curvatures of the samples with single copper plate decreased more than 80% after only 100 cycles. For the samples with 2 × 2 copper plate and the samples with 3 × 3 copper plate, the curvatures became 75.8% and 77.5% of the original values, respectively, indicating better reliability than the samples with single copper plate. The x-ray pictures of cross-sectioned samples confirmed that after 300 cycles, the bonding layer for the sample with single copper plate has many cracks and delaminations starting from the edge. / Ph. D.

<p dir="ltr">Increasing power density and power consumption in electronic devices require heat dissipating components with high thermal conductivity to prevent overheating and improve performance and reliability. Polymers offer the advantages of low cost and weight over conventional metallic components, but their intrinsic thermal conductivity is low. Previous studies have shown that the thermal conductivity of polymers can be enhanced by aligning the polymer chains or by adding high thermal conductivity fillers to create percolation paths within the polymeric matrix. To further enhance the in-plane thermal conductivity, the conductive fillers can be aligned preferentially, but this leads to a lower increase in performance in the cross-plane direction. Yet, the cross-plane thermal conductivity plays a vital role in dissipating heat from active devices and transmitting it to the surrounding environment. Alternatively, when the fillers are aligned to enhance cross-plane thermal transport, the enhancement in the in-plane direction is limited. There is a need to develop polymer composites with an approximately isotropic increase in thermal performance compared to their neat counterparts.</p><p dir="ltr">To achieve this goal, in this study, I combine conductive fibers and fillers to enhance thermal conductivity of polymers without significantly inducing thermal anisotropy while preserving the mechanical performance of the matrix. I employ three approaches to enhance the thermal conductivity () of thermoset polymeric matrices. In the first approach, I fabricate thermally conductive polymer composites by creating an emulsion consisting of eutectic gallium indium alloy (EGaIn) liquid metal in the uncured polydimethylsiloxane (PDMS) matrix. In the second approach, I infiltrate mats formed from chopped fibers of Ultra High Molecular Weight Polyethylene (UHMWPE) with an uncured epoxy resin. Finally, the third approach combines the two previous methods by infiltrating the UHMWPE fiber mat with an emulsion of the liquid metal and uncured epoxy matrix.</p><p dir="ltr">To evaluate the thermal performance of the composites, I use infrared thermal microscopy with two different experimental setups, enabling independent measurement of in-plane and cross-plane thermal conductivity. The results demonstrate that incorporating thermally conductive fillers enhances the overall conductivity of the polymer composite. Moreover, I demonstrate that the network structure achieved by the fiber mat, in combination with the presence of liquid metal, promotes a more uniform increase in the thermal conductivity of the composite in all directions. Additionally, I assess the impact of filler incorporation and filler concentration on matrix performance through tension, indentation, and bending tests for mechanical characterization of my materials.</p><p dir="ltr">This work demonstrates the potential of strategic composite design to achieve polymeric materials with isotropically high thermal conductivity. These new materials offer a solution to the challenges posed by higher power density and consumption in electronics and providing improved heat dissipation capabilities for more reliable devices.</p>

Exponential growth of heat flux densities in commercial and industrial electronics, and compact heat exchangers demand surfaces and heat sinks with high dissipation rate capabilities. Among different technologies proposed to meet these demands, high-porosity metal foams have attracted the attention of many investigators due to their higher surface area densities as well as higher thermal performance due to the turbulence and tortuosity generated in the flow due to their structure. One of the disadvantages of such metal foams, however, is the attendant higher pressure drop or pumping power penalty. This thesis was undertaken to investigate whether channels partially filled with metal foams can reduce the required pumping power with a minimal loss in thermal performance. The thermo-hydraulic (T-H) performance factor J/F<sup>1/3, where J is the Colburn-J factor and F is the friction factor, was used to compare the relative performance of foams for various values of blocking fractions (B), where B is defined as the ratio of the height of the foam to the height of the channel. The metal foam samples considered were 10 PPI (pores per inch) 6101-T6 Aluminum, with porosity of ∼ 94 − 96%, and B of 1/6, 1/3, 2/3, 5/6, and 1. Each of these samples was attached to an aluminum slab embedded in one of the walls, which had a patch heater that acted as a heat source. A modification was made to all B < 1 configurations by attaching an aluminum plate on top, which then separated the foam-free and the foam-filled flows completely. These configurations are denoted by a 'P' in their names (e.g. B = 1/3P is the plated modification of B = 1/3). Experiments were conducted in an in-house designed wind tunnel, with a test section of 45" in length and a cross-section of 3"X3". Reynolds number (based on channel hydraulic diameter and inlet velocity) was varied from 1,000 to 15,000 to capture the flow domains from laminar to turbulent. The data obtained for the three scenarios namely - 1. Controlled-Flow Scenario 2. Pumping Power Variation with Temperature Difference, and 3. Fan-Based System were analyzed for their thermo-hydraulic performance. The extreme low blocking fractions are evaluated and compared against the dimpled/protruded surfaces, and were found to give superior performance, hence displaying potential as good turbulators. The plated configurations were found to perform better in almost all scenarios when compared to their non-plated counterparts. Furthermore, a new simplified analytical model is introduced that considers the flow in the partially-blocked region as two separate 'parallel' flows, one in the foam-free region and the other in the foam-filled region. The comparison between this novel approach and the analytical solution from the literature shows good agreement, suggesting that this simplified model may be appropriate. This model is then used for determining the foam-filled region flow ratios for the performed experiments, and a correlation is presented. / Master of Science / Portable devices, such as laptops, and mobile phones are trending towards miniaturization and simultaneously becoming more power-hungry, leading to ever-increasing heat flux densities. Growing energy and technology demands require high thermal dissipation rates to be achieved in equipment such as industrial and commercial electronics, data centers, heat exchangers in automobiles, and power plants - both renewable and non-renewable. One of the best ways to enhance convective heat transfer is by increasing the heat transfer surface area. This is traditionally done using fins. A much higher surface area can be achieved using a metal foam instead, along with improving the turbulent mixing of the fluid. The flow through the metal foam, however, faces a higher pressure drop penalty which is one of the major reasons for a continued preference for fins. In this experimental study, we aim at minimizing this pressure drop penalty of a metal-foam heat-sink along with maintaining a respectable heat transfer performance through 'partial-blocking' (filling) of the channel, where the height of the foam is lower than the total channel height. The ratio of metal foam height to the channel height is named as blocking fraction B. A general comparison of the hydraulic, thermal, and thermo-hydraulic (T-H) performance reveals that the ∼ 83.3% plated configuration is capable of superseding the baseline of full blockage. The 'plating' here denotes a slight modification - a solid plate rests on top of the metal foam, separating the foam-free and foam-filled flow. For applications with Re > 10000, ∼ 33.3% plated configuration is highly recommended. For fan-based systems, ∼ 83.3% plated, ∼ 33.3% plated, and 33.3% non-plated configurations emerge as possible alternatives to the fully-blocked case. Furthermore, while considering partial configurations, it is shown that one should go for lower PPI metal foams to improve the flow ratio inside the metal foam. For pressure-drop critical equipment, ∼ 16.7% configuration is found to perform better than the conventional double-protruded walls and other turbulence-enhancing surface treatments. Finally, this thesis presents a novel and simplified approach for estimating the flow ratios for partially-blocked channels using scaling analysis.

The task of thermal management in electrical systems has never been simple and has only become more difficult in recent years as the power electronics industry pushes towards devices with higher power densities. At the Center for Power Electronic Systems (CPES), a new approach to power electronic design is being implemented with the Integrated Power Electronic Module (IPEM). It is believed that an IPEM-based design approach will significantly enhance the competitiveness of the U.S. electronics industry, revolutionize the power electronics industry, and overcome many of the technology limits in today's industry by driving down the cost of manufacturing and design turnaround time. But with increased component integration comes the increased risk of component failure due to overheating. This thesis addresses the issues associated with the thermal management of integrated power electronic devices. Two studies are presented in this thesis. The focus of these studies is on the thermal design of a DC-DC front-end power converter developed at CPES with an IPEM-based approach. The first study investigates how the system would respond when the fan location and heat sink fin arrangement are varied in order to optimize the effects of conduction and forced-convection heat transfer to cool the system. The set-up of an experimental test is presented, and the results are compared to the thermal model. The second study presents an improved methodology for the thermal modeling of large-scale electrical systems and their many subsystems. A zoom-in/zoom-out approach is used to overcome the computational limitations associated with modeling large systems. The analysis performed in this paper was completed using I-DEAS©,, a three-dimensional finite element analysis (FEA) program which allows the thermal designer to simulate the affects of conduction and convection heat transfer in a forced-air cooling environment. / Master of Science

This work reports the experimental and numerical study of the thermal management of Li-ion battery packs under the context of electric vehicle (EV) or hybrid EV (HEV) applications. Li-ion batteries have been extensively demonstrated as an important power source for EVs or HEVs. However, thermal management is a critical challenge for their widespread deployment, due to their highly dynamic operation and the wide range of environments under which they operate. To address these challenges, this work developed several experimental platforms to study adaptive thermal management strategies. Parallel to the experimental effort, multi-disciplinary models integrating heat transfer, fluid mechanics, and electro-thermal dynamics have been developed and validated, including detailed CFD models and lumped parameter models. The major contributions are twofold. First, this work developed actively controlled strategies and experimentally demonstrated their effectiveness on a practical sized battery pack and dynamic thermal loads. The results show that these strategies effectively reduced both the parasitic energy consumption and the temperature non-uniformity while maintaining the maximum temperature rise in the pack. Second, this work established a new two dimensional lumped parameter thermal model to overcome the limitations of existing thermal models and extend their applicable range. This new model provides accurate surface and core temperatures simulations comparable to detailed CFD models with a fraction of the computational cost. / Ph. D. / Li-ion batteries have been widely used today as power source of electric vehicles (EV) or hybrid electric vehicles (HEV). Thermal management represents an important issue for the safe and efficiency of Li-ion batteries in EVs and HEVs. Thermal issues can lead to decreased energy efficiency, reduced battery lifetime, and even catastrophic failures. However, effective thermal management of Li-ion batteries is challenging due to several reasons, including the highly dynamic operation of the batteries and the wide range of ambient conditions under with the vehicles operate. To address these challenges, this work studied the thermal management problem through both experimental and numerical methods. Experimentally, actively controlled strategies have been designed and tested on our customized experimental platforms, and the results demonstrated the effectiveness such strategies. Numerically, multidisciplinary models have been developed and validated to provide comprehensive information of battery operation, and furthermore to simulate operation under extreme conditions that are difficult study experimentally. This dissertation reports both the experimental and numerical results, with a detailed analysis of their implications and applications.

Yes / The ever-increasing demand for high-processing electronic systems has unequivocally called for improved microprocessor performance. However, increasing microprocessor performance requires increasing power and on-chip power density, both of which are associated with increased heat dissipation. Electronic cooling using fins have been identified as a reliable cooling approach. However, an investigation into the thermal behaviour of fin would help in the design of miniaturized, effective heatsinks for reliable microprocessor cooling. The aim of this paper is to investigates the simultaneous effects of surface roughness, porosity and magnetic field on the performance of a porous micro-fin under a convective-radiative heat transfer mechanism. The developed thermal model considers variable thermal properties according to linear, exponential and power laws, and are solved using Chebychev spectral collocation method. Parametric studies are carried using the numerical solutions to establish the influences of porosity, surface roughness, and magnetic field on the microfin thermal behaviour. Following the results of the simulation, it is established that the thermal efficiency of the micro-fin is significantly affected by the porosity, magnetic field, geometric ratio, nonlinear thermal conductivity parameter, thermogeometric parameter and the surface roughness of the micro-fin. However, the performance of the micro-fin decreases when it operates only in a convective environment. In addition, we establish that the fin efficiency ratio which is the ratio of the efficiency of the rough fin to the efficiency of the smooth fin is found to be greater than unity when the rough and smooth fins of equal geometrical, physical, thermal and material properties are subjected to the same operating condition. The investigation establishes that improved thermal management of electronic systems would be achieved using rough surface fins with porosity under the influences of the magnetic field. / Supported in part by the Tertiary Education Trust Fund of Federal Government of Nigeria, and the European Union’s Horizon 2020 research and innovation programme under grant agreement H2020-MSCA-ITN- 2016SECRET-722424.

In this dissertation, three major contributions are presented in a photovoltaic (PV) energy system. Firstly, a three-port grid-forming (GFM) microinverter and a lithium-ion battery pack are integrated at the back of PV panel. As a result, they form an AC-PV energy system module that produces an AC output voltage. The technoeconomic analysis, battery capacity optimization, PV panel size optimization, electrical and thermal model of batteries, battery heat generation model, battery management system and thermal management system are discussed in the AC-PV module by using stochastic analysis and battery test results. Secondly, a three-phase 540 KVA bidirectional inverter and a 1.86 MWh lithium-ion battery energy storage system (BESS) were integrated at the Florida Solar Energy Center (FSEC). A case study is performed for this system by acquiring the energy consumption of the building, the reduced energy consumption, the battery testing, the load shifting, and the peak shaving. The total harmonic distortion (THD) values are also provided. Among eight power management scenarios, the scenarios that include PV panels are satisfied via simulation. However, the scenarios that do not include PV panels are analyzed and presented based on the real-world setting measurements. Thirdly, a modified droop control method is designed for grid-tied and off-grid scenarios. The simulation results are obtained based on three scenarios. The first one is that the voltage and frequency regulation control algorithm is discussed when GFM inverters have the equal power ratings. Then, the load sharing control algorithm is determined based on different GFM inverters' power ratings. The last scenario includes Grid connection. Loads are added and removed from the system to ensure that the frequency and voltage stability is the range of continuous operation. The coupling reactance effect on power sharing is investigated.

Power electronics are used for a wide variety of purposes, including in electric vehicles and e-VTOL aircraft. Nonetheless, thermal oscillation of the junction temperature due to transient load conditions remains a significant problem. In this study, an intermittent jet impingement was applied, along with transient heat flux boundary conditions of 100W, 200W, and 300W, to a thermal test chip at a frequency of 0.5 Hz (70% duty) to examine whether such an approach can successfully minimize junction temperature fluctuations, and thus, increase the durability of the Si chips. The findings of the experiments combining intermittent pulsation with varying heat fluxes show reduced hot spot temperature oscillations of 10%, 12.5%, and 16.7% at 100W, 200W, and 300W, respectively, at a Reynolds number of 8850. Hence, the use of pulsating jets provides better control over temperature fluctuation compared to steady jets. An enhancement factor is employed to characterize the merits of using pulsating jets. Compared to steady jets, the temperature oscillation coefficient shows that the use of pulsating jets enables a higher reduction in temperature oscillation at the same time averaged Re number. A correlation is proposed to calculate the enhancement factor for pulsating jets. Then, a transient numerical model is developed to estimate the frequency effect of the intermittent jet impingement to minimize temperature fluctuations due to transient heat-flux boundary conditions. To this end, pulsating-jet-velocity and heat-flux frequencies ranging between 1 Hz and 25 Hz are examined. Compared to the steady jet, the use of the intermittent jet provides excellent control of the maximum temperature limit across the studied frequencies. In addition, the vorticity rings introduced during the jet’s off period enable lower minimum temperature limit values compared to the steady jet approach, reaching as low as 5 Hz. However, below 5 Hz, the minimum temperature becomes higher than that obtained in the steady jet approach. Furthermore, 19.2 Hz is the threshold frequency below which the intermittent jet effect can be exploited to reduce temperature oscillation. No noticeable reduction in temperature fluctuation occurs above 19.2 Hz due to the higher time constant of the studied chip than the periodic times of the studied frequencies above 19.2 Hz. A temperature oscillation coefficient (ƞ) is then introduced to demonstrate the intermittent jet approach’s effectiveness for reducing temperature oscillation in isolation from the maximum temperature limitation effect. The results further reveal 8.2 Hz as the critical frequency below which the reduction in temperature oscillation is much more pronounced for the intermittent jet approach compared to the steady jet approach. A transient heat-transfer coefficient (HTC) study is also conducted to understand the role played by the vorticity rings in enhancing the HTC during the off period of the jets in the intermittent pulsation approach. To this end, a reduced model is generated to calculate the transient HTC during the decay of temperature during the off period of the pulsation. Direct jet impingement on silicon-based chips results in variations in spatial temperature between the center of the jet and the jet outlet location. This study introduces a jet outlet design that facilitates a more uniform spatial temperature distribution. To this end, the steady state numerical model is used to study the outlet configuration effect on spatial temperature reduction. The resultant data show that reducing the outlet size by 30% results in a 31% decrease in the spatial temperature variance between the stagnation point and hot spot locations. Five outlet configurations are also investigated: eight circular top outlets; eight circular side outlets; four square top outlets; eight square top outlets; and eight square side outlets. Analysis of the temperature profiles of these designs reveals that the configuration featuring eight top circular outlets produces the highest spatial temperature difference, while the configuration featuring four top circular outlets (1.4 mm diameter) produces the smallest difference. Specifically, the four top circular outlet design enables a 42% reduction in the spatial temperature difference, with a 3.8% decrease in the pressure drop between the main inlet and outlet. Additionally, the findings show that this configuration produces a higher increase in the hot spot heat-transfer coefficient compared to the eight top circular outlet configurations (from 18500 W/m2 0C to 22300 W/m2 0C, an increase of 20.5%), thus flattening the spatial heat-transfer coefficient radially. / Thesis / Doctor of Philosophy (PhD)

The goal of the work reported herein has been to model aspects of the electrical distribution system of an all-electric ship (AES) and to couple electrical load behavior with the thermal management network aboard the ship. The development of a thermally dependent electrical network has built upon an in-house thermal management simulation environment to replace the existing steady state heat loads with dynamic, thermally dependent, electrical heat loads. Quantifying the close relationship between thermal and electrical systems is of fundamental importance in a large, integrated system like the AES. This in-house thermal management environment, called the Dynamic Thermal Modeling and Simulation (DTMS) framework, provided the fundamental capabilities for modeling thermal systems and subsystems relevant to the AES. The motivation behind the initial work on DTMS was to understand the dynamics of thermal management aboard the ship. The first version, developed in 2007, captured the fundamental aspects of system-level thermal management while maintaining modularity and allowing for further development into other energy domains. The reconfigurable nature of the DTMS framework allowed for the expansion into the electrical domain with the creation of an electrical distribution network in support of thermal simulations. The dynamics of the electrical distribution system of the AES were captured using reconfigurable and physics-based circuit elements that allow for thermal feedback to affect the behavior of the system. Following the creation of the electrical network, subsystems and systems were created to simulate electrical distribution. Then, again using the modularity features of DTMS, a thermal resistive heat flow network was created to capture the transient behavior of heat flow from the electrical network to the existing thermal management framework. This network provides the intimate link between the thermal management framework and the electrical distribution system. Finally, the three frameworks (electrical, thermal resistive, and thermal management) were combined to quantify the impact that each system has relative to system-level operation. Simulations provide an indication of the unlimited configurations and potential design space a user of DTMS can explore to explore the design of an AES. / text

The thesis is focused on premature newborn thermomanagement. It is focused particularly on very premature and extremely premature newborns which suffer the highest level of thermolability. The theoretical part deals with the particularities of premature newborn thermoregulation, newborns' reactions to thermal stress, thermomanagement in the delivery room and providing a thermoneutral environment in the incubator. The thesis describes a method of servo-control mode of body temperature, which has not been utilised for premature newborns in Czech Republic. The aim of the thesis is to start using this method and compare it with the method of manual control. Based on the total time not meeting the standard, number of failures and other parameters to assess which method is more suitable for body temperature regulation. The research sample consists of 47 newborsn who were born between the 24th and 32nd gestational week. Quantitative data collection at one-minute intervals was conducted in the 72 hours after birth. The method choice was random. Statistically important differences between the two methods were measured regarding the total time not meeting the standards. The incidence of hyperthemia was higher during manual method, hypothermia when servo-control. Total failure amount was 19%. However, the...