To fully exploit the potential of gallium nitride (GaN) devices for optoelectronics and power electronic applications, the structures of device need to be investigated and optimized. In particular carrier densities, conductivities and localised charges can have a significant impact to device performances. Electrical scanning probe microscopy techniques, including scanning capacitance microscopy (SCM), conductive atomic force microscopy (C-AFM) and kelvin probe force microscopy (KPFM), were utilized to study the structures of nitride devices such as high electron mobility transistors (HEMTs), light emitting diodes (LEDs) and junction diodes. These results combine with other characterisation techniques to give an enhanced understanding about the nitride structures. Leakage currents are one of the major challenges in HEMTs, especially leakages in buffer layers which deteriorate the breakdown voltage of the devices. To achieve an insulating buffer layer, carbon doping is usually used to compensate the unintentional n-type doping of nitride materials. Here, I show that vertical leakage can originate from the formation of inverted hexagonal pyramidal defects during the low temperature growth of an AlGaN:C strain relief layer. The semi-polar facets of the defects enhanced the oxygen incorporation and led to the formation of leakage pathways which were observed using SCM. Leakage occurring at HEMT surfaces will lead to current collapses of devices. In this work, I discovered nano-cracks on a HEMT surface. C-AFM showed enhanced conductivity along these nano-cracks. A model based on stress relaxation analysis was proposed to explain the drop of surface potential along the nano-cracks. Advances in the quality of epitaxial GaN grown by MOVPE have been facilitated by understanding the formation of defects within the materials and structures. However, hillocks as a specific type of defects have not been intensively studied yet. In this work, three types of hillocks were discovered on GaN p-i-n diodes and a GaN film grown on patterned sapphire substrates. It was found that pits were always present around the centres of hillocks. Multi-microscopy results showed these pits were developed from either an inversion domain or a nano-pipe or a void under the sample surface. Formation of hillocks was usually associated with a change of growth condition, such as an increase in Mg doping or a decrease in growth temperature and gas flows, despite the formation mechanism is still unclear. GaN$_{1-x}$As$_x$ is a highly mismatched alloy semiconductor whose band-gap can be engineered across the whole visible spectrum. For this reason and the potential to achieve high p-type doping, GaN$_{1-x}$As$_x$ is a promising material for optoelectronic applications. However, the growth of GaN$_{1-x}$As$_{x}$ at intermediate As fraction while maintaining a high conductivity and uniformity of the material is still challenging. Two n-GaN/p-GaN$_{1-x}$As$_x$ diodes with different Ga flows were investigated. Both samples demonstrated that highly Mg-doped GaN$_{1-x}$As$_x$ with high As fraction is achievable. However, the samples contained both amorphous and polycrystalline regions. The electrical scanning probe microscopy results suggested the amorphous structure has a lower hole concentration and hence conductivity than the polycrystalline structure. Nevertheless, there is still a lack of understanding about the electrical properties and conduction mechanisms of the GaN$_{1-x}$As$_x$ alloy.

Neste trabalho, foram realizados estudos de propriedades elétricas e de eletroluminescência em diodos emissores de luz (OLED) contendo modulação energética de poços de potencial para elétrons e buracos (tipo I), poços esses posicionados na região central da camada ativa. A camada ativa é composta por poços simples e duplos, de espessura de 5 e 10nm, de Poli (fenilenovinileno), PPV (Eg = 2,4 eV), dispostos entre duas barreiras de Polifluoreno ou PFO (Eg = 3,0 eV) de espessura 40 nm. Os filmes de PFO foram obtidos a partir de uma solução em Clorofórmio via spin coating e os de PPV a partir de um precursor solúvel em agua via spin assistant LbL, técnica essa que permitiu o crescimento alternado de filmes de PFO e filmes extremamente finos de PPV mesmo em vista da ortogonalidade de seus solventes. Camadas injetoras de polieletrólitos foram depositadas adjacentes ao catodo para diferenciar injeção eletrônica da injeção de buracos. Foram feitos dispositivos contendo somente uma camada de PFO de 80 nm, chamados referência, para comparação do efeito dos poços nos dispositivos com um e dois poços de potencial. Na caracterização foram utilizadas as técnicas de microscopia confocal, com o intuito de demonstrar o crescimento efetivo das camadas, e medidas elétricas de corrente (IxV) e eletroluminescência (LxV) por voltagem. Medidas do perfil de intensidade ao longo do filmes e espectros de fotoluminescência em três regiões distintas da área total do dispositivo mostraram que as camadas de PPV de aproximadamente 5 e 10 nm estavam homogêneas e que recobriam bem as camadas de PFO. Os espectros de eletroluminescência dos dispositivos mostraram que as diferenças energéticas entre os orbitais π (ΔEHOMO= 0,54 eV) e π* (ΔELUMO = 0,37 eV) do PFO e PPV foram suficientes para causar o aprisionamento e recombinação dos portadores dentro do poço, resultando em emissões características do PPV com picos bem definidos próximos a 520 nm, bastante distintas das emissões dos dispositivos referência, contendo somente PFO (banda larga e não definida de emissão com λ > 480 nm). A presença dos poços de potencial alterou significativamente as propriedades dos dispositivos levando a diminuição da voltagem de acendimento (Von) para 3,5 V mesmo para dispositivos contendo camada injetora que dificultava a injeção eletrônica. Quando há apenas um poço de potencial na camada ativa dos dispositivos, com ou sem camada injetora, o regime de corrente para voltagens abaixo de 3,5 V é ôhmico e unipolar, sendo ditado por buracos, mas quando a voltagem é maior do que 3,5 V o regime de corrente fica limitado pelo portador minoritário, o elétron. Surpreendentemente, quando são colocados dois poços na camada ativa, separando os portadores, tanto corrente como a formação excitônica e consequente recombinação, ficam sujeitas a um processo de tunelamento do portador majoritário, o buraco. / In this work, studies of electrical properties and electroluminescence in organic light emitting diodes (OLED) containing energetic modulation of potential wells for charge carriers (type I), positioned in the central region of active layer. The active layer is composed of single and double wells of Poly (phenylenevinylene), PPV (2.4 eV), arranged between two barriers of polyfluorene, PFO (3.0 eV), with 40 nm thickness. The PFO films were obtained from a chloroform solution by spin coating and PPV from a water soluble precursor via spin assistant LbL technique, a technique that has allowed the alternate growth of PFO films and extremely thin PPV films from a orthogonal solvent to chloroform, water. Injection layers of polyelectrolytes were deposited adjacent to the cathode to differentiate electronic injection from hole injection. Confocal microscopy measurements showed that the PPV layer of 5 to 10nm thickness were homogeneous and covered PFO layers entirely. Electroluminescence measurements of the devices showed that the energetic difference between π (ΔEHOMO = 0.54 eV) and π* (ΔELUMO = 0.37 eV) orbitals from PFO and PPV were enough to cause the charge carriers efficient trapping and recombination in the well, resulting in PPV characteristic emission peaks near to 520 nm, quite different from the reference device emission containing only PFO (broad emission band in the lower energy range). The current measurements showed that the presence of potential wells in the middle of the active layer is responsible for effective change in electrical properties of devices such as carrier density n, μ the mobility and conductivity. When there is only one potential well in the active layer, with or without injection layer, the current regime for voltages below 3.5 V is ohmic and unipolar, being dictated by holes, but when the voltage is greater than 3.5 V current regime is limited by the minority carrier, the electron. Surprisingly, when two wells are placed in the active layer, separating the carriers, both current as the excitonic formation and subsequent recombination are subject to a tunneling process by the majority carrier, the hole.

InAs/GaSb superlattices are an attractive material system for infrared light emitting diodes, due to the ability to tune the band gap throughout most of the infrared regime. A key consideration in the epitaxial growth of these heterostructures is crystalline material quality. In developing thick layers of epitaxially grown material, there are moderate amounts of elastic strain that can be incorporated into a heterostructure, beyond which deformations will form that will alleviate the lattice mismatch. This thesis investigates the optical and electronic properties of lattice-mismatched and strained materials through the study of thick dual-color light emitting diodes, broadband light emitting diodes, and InAs/GaSb superlattice devices developed on GaAs substrates and GaAs integrated circuits. A dual-color infrared light emitting diode is demonstrated emitting in the mid-wave infrared band at 3.81 μm and 4.72 μm. The design of the device stacks two independently operable InAs/GaSb superlattices structures on top of one another, so that 10 μm of material is grown with molecular beam epitaxy. Each layer is lattice-matched to a GaSb substrate. At quasi-continuous operation, radiances of 5.48 W/cm2-sr and 2.67 W/cm2-sr are obtained. A broadband light emitting diode spanning the mid-wave infrared is demonstrated with eight stages of InAs/GaSb superlattices individually tuned to a different color. The performance of the device is compared with an identical eight stage device emitting in the middle of the mid-wave infrared. The emission of the fabricated broadband device spans from 3.2 μm to 6 μm with peak radiance of 137.1 mW/cm2-sr. Growth of antimonide-based devices on GaAs is desirable to the relative transparency of semi-insulating substrates throughout the infrared, and as semi-insulating GaSb substrates are not available. The growth of bulk GaSb on GaAs is explored through different techniques in order to confine relaxation due to lattice mismatch strain to the GaSb/GaAs interface. A low temperature nucleation technique with a thin GaSb wetting layer is found to have the best overall surface morphology, although screw dislocations are a prominent feature on all samples. The dislocations and overall surface roughness are not found to destructively impact the overall device quality, as four stage InAs/GaSb superlattice devices grown on GaAs substrates are found to have superior electroluminescent emission and external quantum efficiency compared to an identical device grown on a GaSb substrate due to the higher substrate transparency and superior thermal properties. Epitaxy on electronics growth techniques on GaAs integrated circuits are developed to bypass the hybridization process in light emitting diode development. Chips obtained from Quorvo, Inc. are found to endure ultra-high vacuum molecular beam epitaxy environment at higher temperatures with silicon nitride encapsulation, and a low temperature oxide removal technique is developed using an atomic hydrogen source. Chemical-mechanical polishing techniques are developed to create an “epi-ready” substrate surface. Ultimately, no photoluminescent emission is observed from InAs/GaSb superlattices grown on GaAs integrated circuits, although electroluminescent emission is still possible.

Optoelectronic devices operating in the mid-wave (3-5 Μm) and long-wave (8-12 Μm) infrared (IR) regions of the electromagnetic spectrum are of a great interest for academic and industrial applications. Due to the lack of atmospheric absorption, devices operating within these spectral bands are particularly useful for spectroscopy, imaging, and dynamic scene projection. Advanced IR imaging systems have created an intense need for laboratory-based infrared scene projector (IRSP) systems which can be used for accurate simulation of real-world phenomena occurring in the IR. These IRSP systems allow for reliable, reproducible, safe, and cost-effective calibration of IR detector arrays. The current state-of-the-art technology utilized for the emitter source of IRSP systems is thermal pixel arrays (TPAs) which are based on thin film resistor technology. Thermal pixel array technology has fundamental limitations related to response time and maximum simulated apparent temperature, making them unsuitable for emulation of very hot (> 700 K) and rapidly evolving scenes. Additionally, there exists a need for dual wavelength emitter arrays for IRSP systems dedicated to calibration of dual wavelength detector arrays. This need is currently met by combining the spectral output from two separate IRSP systems. This configuration requires precise alignment of the output from both systems and results in the maximum radiance being limited to approximately half that of the capability of a given emitter array due to the optics used to combine the outputs. The high switching speed inherent to IR light-emitting diodes (LEDs) and the potential for high power output makes them an appealing candidate to replace the thermal pixel arrays used for IRSP systems. To this end, research has been carried out to develop and improve the device performance of IR LEDs based on InAs/GaSb type-II superlattices (T2SLs). A common method employed to achieve high brightness from LEDs is to incorporate multiple active regions, coupled by tunnel junctions. Tunnel junctions must provide adequate barriers to prevent carrier leakage, while at the same time remain low in tunneling resistance to prevent unwanted heating. The performance of two tunnel junction designs are compared in otherwise identical four stage InAs/GaSb superlattice LED (SLED) devices for application in IRSP systems. This research culminated in the development of a 48 Μm pitch, 512$times512 individually addressable mid-wave IR LED array based on a sixteen stage, InAs/GaSb T2SL device design. This array was hybridized to a read-in integrated circuit and exhibited a pixel yield greater than 95 %. Projections based on single element emitter results predict this array will be able to achieve a peak apparent temperature of 1350 K within the entire 3-5 Μm band. These results demonstrate the feasibility of emitter arrays intended for IRSP systems based on InAs/GaSb SLED devices. Additionally, a dual wavelength 48 Μm pitch, 8x8 emitter array based on InAs/GaSb T2SL LEDs was developed and demonstrated. This design incorporates two separate, 16 stage InAs/GaSb SL active regions with varying InAs layer thicknesses built into a single vertical heterostructure. The device architecture is a three terminal device allowing for independent control of the intensity of each emission region. Each emitter region creates a contiguous pixel, capable of being planarized and mated to drive electronics.

Photovoltaics (PV) is fast emerging as an attractive renewable energy technology due to concerns of global warming, pollution and scarcity of fossil fuel supplies. However to compete in the global energy market, solar cells need to be cheaper and more energy efficient. Silicon is the favorite semiconductor used in solar photovoltaic cells because of its ubiquity and established technology, but due to its indirect bandgap silicon is a poor absorber and light emitter. Thin film cells play an important role in low cost photovoltaics, but at the cost of reduced efficiencies when compared to wafer based cells. There remains much untapped potential in thin-film solar cells which this work has attempted to exploit through exploring novel approaches of enhancing the efficiency of thin film cells using the optical properties of sub-wavelength metal nanoparticles. Metals are considered as strong absorbers of light because of their large free-electron density. How can metals improve light trapping in solar cells? This question has raised several eyebrows and this thesis is an attempt to show that metal nanoparticles can be useful in producing efficient solar cells. Subwavelength metal particles support surface modes called surface plasmons when light is incident on them, which cause the particles to strongly scatter light into the underlying waveguide or substrate, enhancing absorption. The process of coupling thin film silicon waveguide modes to plasmonic metals using unpolarised light at normal incidence is applied to silicon-based solar cells and light emitting diodes, and enhanced photocurrent and electroluminescence is realized with potential for further optimisation and improvement. The results from this study correspond to a current increase of up to 19% from planar wafer based cells and up to 33% increase from 1.25 micron thin-film silicon-on-insulator structures for the AM1.5 global spectrum. We also report for the first time an up to twelve fold increase in electroluminescence signal from 95nm thick light-emitting diodes. From the results we conclude that this method which involves simple techniques of nanoparticle deposition and characterization could hold important implications in the improvement of thin-film silicon cell absorption / emission efficiencies where conventional methods of light trapping are not feasible, resulting in promising near-term applications of surface plasmons in photovoltaics and optoelectronics.

This research represents the first effort to apply vertical cavity surface emitting lasers (VCSELs) to the monitoring of interferometric fiber optic sensors. Modulation of the drive current causes thermal tuning of the laser light frequency. Reflection of this frequency-modulated light from a fiber Fabry-Perot interferometer (FFPI) sensor produces fringe patterns which can be used to measure the optical path difference of the sensor. Spectral characteristics were measured for 850nm VCSELs to determine the combination of dc bias current, modulation current amplitude and modulation frequency for which single mode VCSEL operation and regular fringe patterns are achieved. The response characteristics of FFPI sensors were determined experimentally for square, triangular, saw-tooth waveforms at frequencies from 10kHz to 100kHz. The dependence of VCSEL frequency on the dc bias current was determined from spectral measurements to be ~165GHz/mA. An independent measurement of this quantity based on counting fringes from the FFPI sensor as the laser modulated was in good agreement with this value. The effect of optical feedback into the laser was also studied. By observing the fringe shift as the FFPI sensor was heated, a fractional change in optical length with temperature of 6.95 X 10-6/°C was determined in good agreement with previous measurements on a 1300nm single mode fiber. The performance of 850nm VCSEL/FFPI systems was compared with their counterparts using 1300nm distributed feedback (DFB) lasers. The results of these experiments show that the 850nm VCSEL/FFPI combination gives regular fringe patterns at much lower bias current and modulating current amplitudes than their 1300nm DFB/FFPI counterparts.

The synthesis and optoelectronic properties of biphenyl based conjugated copolymers with varying acceptor units in the polymer backbone were investigated. The well known Donor-Acceptor Theory was used to establish the synthetic pathway for the structural modifications. Solubility issues regarding biphenyl polymer was solved by copolymerizing with soluble units. For this purpose / poly 4-(biphenyl-4-yl)- 4&rsquo / -tert butylspiro[benzo[d]imidazole-2,1&rsquo / -cyclohexane] (P1), poly 4-(biphenyl-4-yl)- 2- dodecyl-2H-benzo[d][1,2,3]triazole (P2) and poly(4-(5-(biphenyl-4-yl)-4-hexylthiophen- 2-yl)-2-dodecyl-7-(4-hexylthiophen-2-yl)-2H-benzo[d][1,2,3]triazole (P3) were synthetized using Suzuki coupling process. Electrochemical properties of these polymers were examined by cyclic voltammetry, spectroelectrochemistry and kinetic studies. Polymers P2 and P3 showed both p- and n-doping behaviors and multicolored electrochromic states. Optical studies revealed that emission color of biphenyl is tuned from blue to orange and the polymers are good candidates for light emitting diode applications. OLED application of P3 was established and outputs of the device were increased by energy transfer studies. The preliminary investigation indicated that P3 possesses promising efficiencies.

This thesis seeks to gain a better understanding on operating characteristics of the three primary color light emitting diode (LED). By applying direct, pulse and sinusoidal currents with dimming function on red, green, and blue LEDs, respectively, the operating characteristics are investigated, including electrical characteristics and their effects on the light efficiency, spectral power distribution, chromaticity on each color LED and the resultant color gamut. The analysis reveals that the illumination characteristics intimately relate to the driving current. LEDs that are driven by pulse currents with pulse-width-modulation (PWM) dimming have less color shift than those driven by direct and sinusoidal currents with amplitude modulation dimming. However, the problematic color shifting is not acceptable when LEDs with pulse current are dimmed at a lower level. Based on the investigation results, a dimming scheme with PWM and pulse- amplitude-modulation (PAM) is proposed to correct the chromaticity and hence to improve the color gamut.

This thesis proposes a novel driving circuit of the RGB light emitting diodes (LEDs) for the back-light source of the liquid crystal display. In stead of employing three dc-to-dc converters, a fly-back converter with three secondary windings is used to drive RGB-LED light bars. By adjusting the duty-ratio, the fly-back converter provides compromised voltages to RGB-LEDs in accordance with the operating modes of dimming control, so as to retain current magnitudes within the acceptable values. LEDs of three colors are dimmed by regulating the duty-ratios of three active power switches individually. By changing the ratio of the average currents of the three primary color LEDs, the color temperature range of driving can reach the requests of dimming control. As compared with a consumer product using the conventional driving circuit, the proposed circuit is obviously much simpler with less components and a higher efficiency.

AlₓGa₁₋ₓN (x>0.6) based Ultraviolet Light Emitting Diodes (UV LEDs) emit in the UV C range of 200 - 290 nm and suffer from low external quantum efficiencies (EQEs) of less than 3%. This low EQE is representative of a large number of non-radiative recombination events in the multiple quantum well (MQW) layers, which leads to high device temperatures due to self-heating at the device junction. Knowledge of the device temperature is essential to implement and evaluate appropriate thermal management techniques, in order to mitigate optical degradation and lifetime reduction due to thermal overstress. The micro-scale nature of these devices and the presence of large temperature gradients in the multilayered device structure merit the use of several indirect temperature measurement techniques to resolve device temperatures. This work will study UV LEDs with AlₓGa₁₋ₓN active layers, grown on sapphire or AlN growth substrates, and flip-chip mounted onto submounts and package configurations with different thermal properties. Thermal metrology results will be presented for devices with different electrode geometries (i.e., interdigitated and micropixel), for bulk and thinned growth substrates. The body of this work will present a comparative study of optical techniques such as Infrared (IR), micro-Raman and Electroluminescence (EL) spectroscopy for the thermal metrology of UV LEDs. The presence of horizontal and vertical temperature gradients within the device layers will be studied using micro-Raman spectroscopy, while the occurrence of thermal anomalies such as hotspots and shorting paths will be studied using IR spectroscopy. The Forward Voltage (Vf) method, an electrical junction temperature measurement technique, will also be investigated. The Vf method will be applied to the Thermal Resistance Analysis by Induced Transient (TRAIT) procedure, whereby electrical data at short time scales from an operational device will be used to discretize the junction-to- package thermal resistance pathway from the total junction- to-ambient heat path. The TRAIT procedure will be conducted on several LEDs, for comparison. The scope and applicability of each thermal metrology technique will be examined, and the merits and demerits of each technique will be exhibited.