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This thesis presents the design and fabrication of a re-configurable micromirror array which can be used as a component of an optical microspectrometer. In an optical microspectrometer, an array of mechanically positionable micromirrors can be implemented as a reconfigurable exit slit to selectively focus particular wavelengths of a diffracted spectrum onto the detector stage. The signal to noise ratio and response time of an optical microspectrometer can be vastly improved by this technique. In the approach presented here, a hybrid bulk- and surface- micromachining process is demonstrated for fabrication of a 1XN array of micromirrors. The reconfigurable micromirrors presented here comprise of two elements, a surfacemicromachined positioning mechanism, and a bulk-micromachined mirror. These elements are finally integrated using a flip-chip bonding technique. The integrated micromirror assembly can be positioned by means of a driving mechanism consisting of arrayed electrothermal actuators. Various techniques for fabricating the micromirror array components are discussed in detail in this thesis along with a review of techniques applicable for integrating the individual components. In order to enhance the efficiency of the positioning system, the classic electrothermal actuators were redesigned in this research. The modified design of thermal actuators is introduced in this thesis. An analysis of the modified thermal actuators is also presented to demonstrate the validity of the suggested modifications.

This master thesis deals with the technology anodic soldering. It focuses mainly on soldering sandwich glass-silicon structures. Describes the soldering method and highlights its advantages. Theoretically discusses the different methods used soldering these structures and assess their possible benefits. This work explores practical ways possible soldering methods on a particular device. These different soldering methods evaluated on the basis of achieved quality connections. This thesis examines the anodic soldering at low temperatures, while there are demands on the shortening of the technological process.

Práce se zabývá popisem jednotlivých typů zdrojů s důrazem na izolované topologie. Poté je rozebírána nejvhodnější volba pro zdroj na anodické bondování, kde jsou kladeny požadavky na vysoké výstupní napětí s malým proudem. Další část rozebírá problematická místa návrhu a na co je třeba dávat pozor. Poté je proveden vlastní návrh zdroje s popisem optimalizačních kroků. Tento zdroj je odsimulován. Dva rozdílné přístupy k realizaci takového zdroje jsou poté porovnány a nejlepší je vybrán. Je ukázána možnost, jak realizovat bipolární výstup. V poslední části je tento zroj sestaven a proměřeny jeho parametry.

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A microfluidic reactor for synthesizing cadmium selenide (CdSe) quantum dots (QDs) was synthesized out of a silicon wafer and Pyrex glass. Microfabrication techniques were used to etch channels into the silicon wafer. Holes were wet-drilled into the Pyrex glass using a diamond-tip drill bit. The Pyrex wafer was anodically bonded to the etched silicon wafer to enclose the microfluidic reactor. Conditions for anodic bonding were created by exposing the stacked substrates to 300V at ~350oC under 5.46N of force. A syringe containing a room temperature CdSe solution was interfaced to the microfluidic reactor by using Poly (dimethylsiloxane) (PDMS) as an interface. The reactor was placed on a hot plate at 225oC, creating thermodynamic conditions for the QD chemical reaction to occur within the etched channels. Tygon® tubing transported solutions in and out of the microfluidic reactor. The CdSe solution was injected into the reactor by a syringe pump at an injection rate of 5 mL/hr, with a channel length of 2.5 cm. While in the microfluidic channels, QD residence time of approximately 30 seconds was sufficient enough for nucleation and growth of QDs to occur. The QD size was characterized by fluorescence full-width-half-maximum (FWHM), which is directly proportional to size distribution. The FWHM of the QDs synthesized was 38 nm, with a peak wavelength of 492 nm. By controlling combinations of pump rate and channel length, a range of QD sizes was able to be consistently synthesized through the microfluidic reactor with significant repeatability and reproducibility.

L’utilisation des ultrasons pour l’imagerie présente plusieurs avantages : elle est extrêmement sure car ellen'utilise pas de radiations ionisantes et ne présente pas d'effets néfastes sur la santé. D’autre part, elle donne desrésultats d’excellente qualité avec un coût relativement faible. Historiquement, les matériaux piézoélectriques et leurscomposites ont été très tôt utilisés pour la génération d’ultrasons. Les transducteurs fabriqués à partir de ces matériauxdominent actuellement le marché des sondes ultrasonores. Cependant, pour certaines applications, ils ne peuvent pasêtre utilisés pour des raisons de dimensionnement et de limitations dues aux propriétés des matériaux. Une solutionpeut être apportée par l’utilisation des transducteurs ultrasonores capacitifs micro-usinés dits CMUTs. Ces dernierssuscitent un intérêt croissant dans le milieu de l’imagerie ultrasonore et sont considérés comme une alternativepotentielle et viable aux transducteurs piézoélectriques. Cette nouvelle technologie CMUTs est caractérisée par uneplus large bande passante, une sensibilité élevée, une facilité de fabrication et une réduction des coûts de production.Cette thèse est consacrée à la mise en place d’un certain nombre d’outils théoriques et expérimentaux permettant lamodélisation/conception, la fabrication et la caractérisation de transducteurs CMUTs à membrane circulaire pourl’émission des ultrasons. Nous commençons par développer des outils de simulation à base de calculs par élémentsfinis, permettant la compréhension et la modélisation du comportement électromécanique des CMUTs pour laconception et le dimensionnement des cellules élémentaires et des réseaux. Nous proposons par la suite un nouveauprocédé de fabrication de transducteurs CMUTs basé sur le collage anodique d’une couche de silicium monocristallind’épaisseur fixe d’une plaquette de SOI sur un substrat de verre. L’évolution du procédé de fabrication est détailléepour chaque étape technologique en soulignant à chaque fois les améliorations/modifications apportées pour unefiabilité et une répétitivité accrue associées à une connaissance des limites de faisabilité. Dans la dernière partie de cetravail, on s’intéresse à la mise en œuvre de plusieurs plateformes expérimentales permettant différentescaractérisations électromécaniques statiques et dynamiques des dispositifs CMUTs fabriqués / The use of ultrasound imaging has several advantages: it is extremely safe because it does not use ionizingradiation and has no adverse effects on health. It gives excellent quality results with a relatively low cost. Historically,piezoelectric materials and their composites have been early used for ultrasound generation. Transducers made fromthese materials dominate currently the ultrasonic probes market. However, for some applications, they can’t bebecause of design and limitation reasons due to material properties. A solution can be provided by the use ofcapacitive micromachined ultrasonic transducers CMUTs. A growing interest in the field of the ultrasound imaging isshown to this technology considered as a potential and viable alternative to piezoelectric transducers andcharacterized by a wide bandwidth, high sensitivity, ease of manufacture and reduce production costs. This thesis isdevoted to the establishment of a number of experimental and theoretical tools for the modeling/design, fabricationand characterization of circular membrane CMUTs transducers for ultrasound transmission. We begin by developingsimulation tools based on finite elements method in order to understand/model the CMUTs electromechanicalbehavior for the design and dimensioning of elementary cells and networks. Thereafter, we introduce a new CMUTtransducers fabrication process based on the anodic bonding a fixed thickness single crystal silicon layer of a SOIwafer on a glass substrate. The process evolution is detailed for each technological step highlighting everyimprovements/changes introduced for increased reliability and repeatability associated with an increased knowledgeof feasibility limits. In the last part of this work, we focus on the implementation of several experimental platformsallowing different static and dynamic electromechanical characterizations of the fabricated CMUTs devices.

<p>Bonding techniques intended for assembling space microsystems are studied in this work. One of the largest problems in bonding pre-processed semiconductor wafers are the severe process restrictions imposed by material compatibility issues. Plasma processes have shown to be good for sensitive materials integration why the influence of different plasma parameters on the bondability of wafers is particularly studied. Conventional wet chemical and field-assisted methods are also examined. The resulting bond quality is assessed in terms of mechanical strength, homogeneity, and yield.</p><p>The effect of spaceflight environment on the reliability of wafer bonds is also investigated. Both high and low temperature annealed bonds are found to be very robust. Effects observed are that low temperature bonds are reinforced by thermal cycling in vacuum and that high temperature bonds degrade slightly by low dose γ irradiation.</p><p>Adhesion quantification is important for all bonding. Development of accurate quantification methods is considered necessary since most methods at hand are limited. This work includes the development of the blister test method. Former test structures are improved to be more practical to work with and to yield low experimental scatter. A physical stress model for the improved structure is suggested with which successful predictions of fracture for different test specimen configurations are made. The blister test method is used throughout this work to assess the strength of wafer bonds. The physics background and modelling of other common test methods are also thoroughly analysed. The methods’ practical capabilities and limitations are commented; origin and mitigation of measurement errors are discussed. It is shown that all methods can be significantly improved by small means.</p><p>Weibull statistics is introduced as a tool to characterise wafer bonds. This method is suitable to use in brittle materials design as the inherent variability in strength can be properly accounted for.</p>