Due to the current public demand of faster, more powerful, and more reliable electronic devices, research is prolific these days in the area of high electron mobility transistor (HEMT) devices. This is because of their usefulness in RF (radio frequency) and microwave power amplifier applications including microwave vacuum tubes, cellular and personal communications services, and widespread broadband access. Although electrical transistor research has been ongoing since its inception in 1947, the transistor itself continues to evolve and improve much in part because of the many driven researchers and scientists throughout the world who are pushing the limits of what modern electronic devices can do. The purpose of the research outlined in this paper was to better understand the mechanical stresses and strains that are present in a hybrid AlGaN (Aluminum Gallium Nitride) / GaN (Gallium Nitride) HEMT, while under electrically-active conditions. One of the main issues currently being researched in these devices is their reliability, or their consistent ability to function properly, when subjected to high-power conditions. The researchers of this mechanical study have performed a static (i.e. frequency-independent) reliability analysis using powerful multiphysics computer modeling/simulation to get a better idea of what can cause failure in these devices. Because HEMT transistors are so small (micro/nano-sized), obtaining experimental measurements of stresses and strains during the active operation of these devices is extremely challenging. Physical mechanisms that cause stress/strain in these structures include thermo-structural phenomena due to mismatch in both coefficient of thermal expansion (CTE) and mechanical stiffness between different materials, as well as stress/strain caused by "piezoelectric" effects (i.e. mechanical deformation caused by an electric field, and conversely voltage induced by mechanical stress) in the AlGaN and GaN device portions (both piezoelectric materials). This piezoelectric effect can be triggered by voltage applied to the device's gate contact and the existence of an HEMT-unique "two-dimensional electron gas" (2DEG) at the GaN-AlGaN interface. COMSOL Multiphysics computer software has been utilized to create a finite element (i.e. piece-by-piece) simulation to visualize both temperature and stress/strain distributions that can occur in the device, by coupling together (i.e. solving simultaneously) the thermal, electrical, structural, and piezoelectric effects inherent in the device. The 2DEG has been modeled not with the typically-used self-consistent quantum physics analytical equations, rather as a combined localized heat source* (thermal) and surface charge density* (electrical) boundary condition. Critical values of stress/strain and their respective locations in the device have been identified. Failure locations have been estimated based on the critical values of stress and strain, and compared with reports in literature. The knowledge of the overall stress/strain distribution has assisted in determining the likely device failure mechanisms and possible mitigation approaches. The contribution and interaction of individual stress mechanisms including piezoelectric effects and thermal expansion caused by device self-heating (i.e. fast-moving electrons causing heat) have been quantified. * Values taken from results of experimental studies in literature

Certains domaines d'applications tels que l'aérospatial, l'automobile ou le forage de haute profondeur peuvent nécessiter la visualisation de certains paramètres physiques dans des environnements hostiles. Les capteurs microélectroniques basés sur le silicium y atteignent souvent leurs limites, qui sont qualifiées de conditions " sévères ". Ce travail se base principalement sur l'étude de solutions de capteurs mécaniques fonctionnant en conditions sévères. Le principe de ces capteurs repose sur l'exploitation de transistors de mesures HEMT à base de nitrures III-V (III-N), à la fois piézoélectriques et semiconducteurs, qui reste stable en conditions sévères. La compréhension des interactions entre physique des semiconducteurs et physique des matériaux ainsi que la caractérisation de structures possibles pour la détection mécanique représentent les principaux enjeux de ce sujet de thèse. La modélisation mécanique analytique et numérique des structures étudiées a permis d'appréhender le comportement de structures piézoélectriques multicouches. Le couplage de ce modèle électromécanique avec un modèle électronique du capteur a permis d'établir la faisabilité du principe de détection ainsi que la linéarité de la réponse du capteur. La caractérisation des prototypes réalisés en cours de thèse ont corroboré la linéarité du capteur tout en faisant apparaître l'influence de nombreux effets parasites réduisant sa sensibilité à savoir les effets de résistance parasites et de piézorésistances variables.

The design, fabrication, and characterizations of the spin-polarized AlxGa1-xN/GaN HEMT structure have been achieved for spintronic application. By band calculation within linear combination of atomic orbitals and two-band k·p methods, the theoretical spin-splitting energy and minimum-spin-splitting surface of wurtzite structure have been investigated as a function of the Fermi wavevector with various strain-relaxations. Base on these results, the design of host material of the nonballistic spin-FET has also been proposed. By optimizing the Al composition and n2DEG, the Fermi surface of two-dimensional electron gas is supposed to reach the minimum-spin-splitting surface to produce resonant spin-lifetime. Because the high quality AlxGa1-xN/GaN HEMT structure is necessary for realizing the spin-FET, the influence of the growth conditions on the polarity and structure quality of the GaN epilayer have been studied on the sample grown by plasma-assisted molecular beam epitaxy. Ga-polar AlGaN/GaN heterostructures on c-Al2O3 has been realized by growing over the Al-rich AlN nucleation layer. And the reduction of interface roughness and threading dislocation scatterings of the electrons in two-dimensional electron gas has also been achieved by growing GaN epilayer under slightly Ga-rich condition. Furthermore, the effect of different types of threading dislocation on the electron mobility of the AlxGa1-xN/GaN HEMT structure has been investigated as well. At low temperature, the electron mobility of two-dimensional electron gas in AlGaN/GaN heterostructures is majorly scattered by the edge type dislocation rather than the screw type. The designs of proposed host material for spin-FETs have been realized through growing high quality spin-polarized AlxGa1-xN/GaN HEMT structures with various Al composition (x= 0.191 ¡V 0.397) grown on c-Al2O3 by metalorganic vapor phase epitaxy. The high mobility (10682 cm2/Vs at 0.4 K), flat interface (surface roughness < 0.5 nm), and high quality HEMT provide a good environment to study the spin-splitting energy. To investigate the spin-splitting energy as functions of the Fermi wavevector, the Shubnikov-de Haas measurements were performed. A large spin-splitting energy (10.76 meV) has been fabricated in Al0.390Ga0.61N/GaN HEMT structure with kf = 8.14 ¡Ñ 108 m-1 for the host material of the Datta-Das spin-FET. And for the first time, the minimum-spin-splitting surface has been experimentally generated in Al0.390Ga0.61N/GaN HEMT structure with kf = 8.33 ¡Ñ 108 m-1 for the host material of the nonballistic spin-FET.

<p>SiC MESFETs and GaN HEMTs have an enormous potential in high-power amplifiers at microwave frequencies due to their wide bandgap features of high electric breakdown field strength, high electron saturation velocity and high operating temperature. The high power density combined with the comparably high impedance attainable by these devices also offers new possibilities for wideband power microwave systems. In this thesis, Class C switching response of SiC MESFET in TCAD and two different generations of broadband power amplifiers have been designed, fabricated and characterized. Input and output matching networks and shunt feedback topology based on microstrip and lumped components have been designed, to increase the bandwidth and to improve the stability. The first amplifier is a single stage 26-watt using a SiC MESFET covering the frequency from 200-500 MHz is designed and fabricated. Typical results at 50 V drain bias for the whole band are, 22 dB power gain, 43 dBm output power, minimum power added efficiency at P 1dB is 47 % at 200 MHz and maximum 60 % at 500 MHz and the IMD3 level at 10 dB back-off from P 1dB is below ‑45 dBc. The results at 60 V drain bias at 500 MHz are, 24.9 dB power gain, 44.15 dBm output power (26 W) and 66 % PAE.</p><p>In the second phase, two power amplifiers at 0.7-1.8 GHz without feed back for SiC MESFET and with feedback for GaN HEMT are designed and fabricated (both these transistors were of 10 W). The measured maximum output power for the SiC amplifier at Vd = 48 V was 41.3 dBm (~13.7 W), with a PAE of 32 % and a power gain above 10 dB. At a drain bias of Vd= 66 V at 700 MHz the Pmax was 42.2 dBm (~16.6 W) with a PAE of 34.4 %. The measured results for GaN amplifier are; maximum output power at Vd = 48 V is 40 dBm (~10 W), with a PAE of 34 % and a power gain above 10 dB. The SiC amplifier gives better results than for GaN amplifier for the same 10 W transistor.</p><p>A comparison between the physical simulations and measured device characteristics has also been carried out. A novel and efficient way to extend the physical simulations to large signal high frequency domain was developed in our group, is further extended to study the class-C switching response of the devices. By the extended technique the switching losses, power density and PAE in the dynamics of the SiC MESFET transistor at four different frequencies of 500 MHz, 1, 2 and 3 GHz during large signal operation and the source of switching losses in the device structure was investigated. The results obtained at 500 MHz are, PAE of 78.3%, a power density of 2.5 W/mm with a switching loss of 0.69 W/mm. Typical results at 3 GHz are, PAE of 53.4 %, a power density of 1.7 W/mm with a switching loss of 1.52 W/mm.</p> / Report code: LIU-TEK-LIC-2008:32

Title from PDF of title page. / Document formatted into pages; contains 155 pages. / Thesis (M.S.E.E.)--University of South Florida, 2003. / Includes bibliographical references. / Text (Electronic thesis) in PDF format. / ABSTRACT This research effort advances millimeter-wave transistor modeling in a current RF/Microwave circuit simulator (Agilent's Advanced Design System-ADS) for small-signal noise and large signal simulations. The device modeled is a metamorphic High Electron Mobility Transistor (mHEMT) supplied by Raytheon RF components. Because of their structure, these new low noise devices are used in this work to test the abilities to accurately model in the sub 0.5dB noise figure territory and to study model prediction into W-band (75-110 GHz). New modeling issues discussed in this thesis involve the effects of noise modeling in relation to the small-signal model parameters. The noise modeling identifies two methods of extraction and how to determine good noise data. / ABSTRACT: Other modeling topics addressed are the use of an advanced nonlinear model, and the ability to optimize for gain compression in the nonlinear model. Several measurement systems were used in the extraction and validation of this modeling effort. They consist of the ATN NP5 noise system, Maury Automated Tuner System, Agilent's IC-CAP, and Gateway's Special. The concept behind using these systems was to construct a complete modeling reference for a transistor and validate it against noise parameter and nonlinear measured data. Since the modeling work for this thesis is built on previous work, one goal has been to bring past USF field-effect transistor (FET) modeling efforts up to date and refine them for future use. The noise measurements were compared to results from Raytheon to validate the USF ATN noise parameter measurement system. Also the IC-CAP modeling system has been validated in measuring the test devices using the Maury load-pull system. / ABSTRACT: Small-signal and noise modeling were accomplished using techniques standardized from several technical papers and prior USF Ph.D. work relative to the model extraction. The IC-CAP modeling software also provided a straightforward platform for large-signal model extraction that is documented in this thesis. Using optimization in ADS, a final nonlinear was created. Measured DC, S-parameter, noise parameters, harmonic power, TOI, load-pull, and efficiency measurements were shown to compare well with model data simulated in ADS. Temperature scaling was also executed using a linear approximation of model values over measured temperatures in the noise model. The results presented show that the models developed illustrate good fitting of the behavior of the mHEMT device. / System requirements: World Wide Web browser and PDF reader. / Mode of access: World Wide Web.

Heterostructures of the materials system GaN/AlGaN/GaN were grown by molecular beam epitaxy on 6H-SiC substrates and high electron mobility transistors (HEMTs) were fabricated. For devices with large gate periphery an air bridge technology was developed for the drain contacts of the finger structure. The devices showed DC drain currents of more than 1 A/mm and values of the transconductance between 120 and 140 mS/mm. A power added efficiency of 41 % was measured on devices with a gate length of 1 µm at 2 GHz and 45 V drain bias. Power values of 8 W/mm were obtained. Devices with submicron gates exhibited power values of 6.1 W/mm (7 GHz) and 3.16 W/mm (25 GHz) respectively. The rf dispersion of the drain current is very low, although the devices were not passivated. / Heterostrukturen im Materialsystem GaN/AlGaN/GaN wurden mittels Molekularstrahlepitaxie auf 6H-SiC-Substraten gewachsen und High-Electron-Mobility-Transistoren (HEMTs) daraus hergestellt. Für Bauelemente mit großer Gateperipherie wurde eine Air-Bridge-Technik entwickelt, um die Drainkontakte der Fingerstruktur zu verbinden. Die Bauelemente zeigten Drainströme von mehr als 1 A/mm und Steilheiten zwischen 120 und 140 mS/mm. An Transistoren mit Gatelängen von 1 µm konnten Leistungswirkungsgrade (Power Added Efficiency) von 41 % (bei 2 GHz und 45 V Drain-Source-Spannung) sowie eine Leistung von 8 W/mm erzielt werden. Bauelemente mit Gatelängen im Submikrometerbereich zeigten Leistungswerte von 6,1 W/mm (7 GHz) bzw. 3,16 W/mm (25 GHz). Die Drainstromdispersion ist sehr gering, obwohl die Bauelemente nicht passiviert wurden.

Gallium nitride (GaN) based high electron mobility transistors (HEMTs) offer numerous benefits for both direct current (DC) and radio frequency (RF) power technology due to their combination of large band gap, high electrical breakdown field, high peak and saturation carrier velocity, and good stability at high temperatures. In particular, AlGaN/GaN heterostructures are of great interest because of the unique conduction channel that develops as a result of the spontaneous and piezoelectric polarization that occurs in these layers. This channel is a vertically confined plane of free carriers that is often called a 2 dimensional electron gas (or 2DEG). Although these devices have shown an improvement in performance over previous heterostructures, reliability issues are a concern because of the high temperatures and electric fields that develop during operation. Therefore, characterizing electrical and thermal profiles within AlGaN/GaN HEMTs is critical for understanding the various factors that contribute to device failures. Little research has been performed to model and characterize these devices under RF bias conditions, and is therefore of great interest. Under pulsed conditions, a single cycle consists of an “on-state” period where power is supplied to the device and self-heating occurs, followed by an “off-state” period where no power is supplied to the device and the device cools. The percentage of a single cycle in which the device is powered is called the duty cycle. In this work, we present a coupled electro-thermo-mechanical finite-element model for describing the development of temperature, stress, and strain profiles within AlGaN/GaN HEMTs under DC and AC power conditions for various duty cycles. It is found that bias conditions including source-to-drain voltage, source-to-gate voltage, and pulsing frequency directly contribute to the electro-thermo-mechanical response of the device, which is known to effect device performance and reliability. The model is validated by comparing numerical simulations to experimental electrical curves (Ids-Vds) and experimental strain measurements performed using scanning joule expansion microscopy (SJEM). In addition, we show how the operating conditions (bias applied and AC duty cycle) impact the thermal profiles of the device and outline how the stress in the device changes through a pulsed cycle due to the changing thermal and electrical profiles. Qualitatively, the numerical model has good agreement across a broad range of bias conditions, further validating the model as a tool to better understand device performance and reliability.

Certains domaines d'applications tels que l'aérospatial, l'automobile ou le forage de haute profondeur peuvent nécessiter la visualisation de certains paramètres physiques dans des environnements hostiles. Les capteurs microélectroniques basés sur le silicium y atteignent souvent leurs limites, qui sont qualifiées de conditions " sévères ". Ce travail se base principalement sur l'étude de solutions de capteurs mécaniques fonctionnant en conditions sévères. Le principe de ces capteurs repose sur l'exploitation de transistors de mesures HEMT à base de nitrures III-V (III-N), à la fois piézoélectriques et semiconducteurs, qui reste stable en conditions sévères. La compréhension des interactions entre physique des semiconducteurs et physique des matériaux ainsi que la caractérisation de structures possibles pour la détection mécanique représentent les principaux enjeux de ce sujet de thèse. La modélisation mécanique analytique et numérique des structures étudiées a permis d'appréhender le comportement de structures piézoélectriques multicouches. Le couplage de ce modèle électromécanique avec un modèle électronique du capteur a permis d'établir la faisabilité du principe de détection ainsi que la linéarité de la réponse du capteur. La caractérisation des prototypes réalisés en cours de thèse ont corroboré la linéarité du capteur tout en faisant apparaître l'influence de nombreux effets parasites réduisant sa sensibilité à savoir les effets de résistance parasites et de piézorésistances variables.

This dissertation shows the properties of lithium niobate and lithium tantalate as a promising substrate for III-nitrides, addresses several problems of integrating compound semiconductor materials on LN and LT. It also suggests some solutions of the addressed problems, including furnace anneals at high temperature. While this furnace anneal improved surface smoothness and III-nitride film adhesion, it also caused the repolarization on the congruent LN (48.39 mole % of Li2O) samples. However, the repolarization was not developed in the stoichiometric LN (49.9 mole % of Li2O) samples during the identical thermal treatment. Also, the structural quality of GaN epitaxial layers showed slight improvement when grown on LT substrates over LN substrates. Conventional epitaxial growth technologies were adapted and modified to implement a successful AlGaN/GaN heterostructure on LN (LT). The heterostructure were analyzed to verify the electrical and material properties using several characterization techniques. Finally, it demonstrates AlGaN/GaN-based HEMT devices on ferroelectric materials that will allow the future development of the multifunctional electrical and optical applications.

Techn. Hochsch., Diss., 2004--Aachen.