The material and device characteristics of InGaN/GaN heterojunction bipolar transistors (HBTs) grown by metalorganic chemical vapor deposition are examined. Two structures grown on sapphire with different p-InxGa1-xN base-region compositions, xIn = 0.03 and 0.05, are presented in a comparative study. In a second experiment, NpN-GaN/InGaN/GaN HBTs are grown and fabricated on free-standing GaN (FS-GaN) and sapphire substrates to investigate the effect of dislocations on III-nitride HBT epitaxial structures. The performance characteristics of HBTs on FS-GaN with a 20×20 m2 emitter area exhibit a maximum collector-current density of ~12.3 kA/cm2, a D.C. current gain of ~90, and a maximum differential gain of ~120 without surface passivation. For the development of deep-ultraviolet optoelectronics, several various structures of optically-pumped lasers at 257, 246, and 243 nm are demonstrated on (0001) AlN substrates. The threshold-power density at room temperature was reduced to as low as 297 kW/cm2. The dominating polarization was measured to be transverse electric in all cases. InAlN material was developed to provide lattice matched, high-bandgap energy cladding layers for a III-N UV laser structure. This would alleviate strain and dislocation formation in the structure, and also mitigate the polarization charge. However, a gallium auto-doping mechanism was encountered which prevents the growth of pure ternary InAlN, resulting instead in quaternary InAlGaN. This phenomenon is quantitatively examined and its source is explored.

The present work investigates the technology development of state-of-the-art SiGe and SiGeC Heterojunction Bipolar Transistors (HBT) by means of technology computer aided design (TCAD). The objective of this work is to obtain an advanced HBT very close to the real device not only in its process fabrication steps, but also in its physical behavior, geometric architecture, and electrical results. This investigation may lead to achieve the best electrical performances for the devices studied, in particular a maximum operating frequency of 500 GHz. The results of this work should help to obtain more physical and realistic simulations, a better understanding of charge transport, and to facilitate the development and optimization of SiGe and SiGeC HBT devices.The TCAD simulation kits for SiGe/SiGeC HBTs developed during our work have been carried out in the framework of the STMicroelectronics bipolar technology evolution. In order to achieve accurate simulations we have used, developed, calibrated and implemented adequate process models, physical models and extraction methodologies. To our knowledge, this work is the first approach developed for SiGe/SiGeC HBTs which takes into account the impact of the strain, and of the germanium and carbon content in the base, for both: process and electrical simulations.In this work we will work with the successive evolutions of B3T, B4T and B5T technologies. For each new device fMAX improves of 100 GHz, thus the technology B3T matches to 300 GHz, B4T and B5T to 400 and 500 GHz, respectively.Chapter one introduces the SiGe SiGeC heterojunction bipolar technologies and their operating principles. This chapter deals also with the high frequency AC transistor operation, the extraction methods for fMAX and the carrier transport in extremely scaled HBTs.Chapter two analyzes the physical models adapted to SiGeC strained alloys used in this work and the electrical simulation of HBT devices. This is also an important work of synthesis leading to the selection, implementation and development of dedicated models for SiGeC HBT simulation.Chapter three describes the B3T TCAD simulation platform developed to obtain an advanced HBT very close to the real device. In this chapter the process fabrication of the B3T technology is described together with the methodology developed to simulate advanced HBT SiGeC devices by means of realistic TCAD simulations.Chapter four describes the HBT architectures developed during this work. We will propose low-cost structures with less demanding performance requirements and highly performing structures but with a higher cost of production. The B4T architecture which has been manufactured in clean-room is deeply studied in this chapter. The impact of the main fabrication steps is analyzed in order to find the keys process parameters to increase fMAX without degrading other important electrical characteristics. At the end of this chapter the results obtained is used to elaborate a TCAD simulation platform taking into account the best trade-off of the different key process parameters to obtain a SiGeC HBT working at 500 GHz of fMAX.

Recently, several SiGe HBT devices fabricated on CMOS-compatible silicon on insulator (SOI) substrates (SiGe HBTs-on-SOI) have been demonstrated, combining the well-known SiGe HBT performance with the advantages of SOI substrates. These new devices are especially interesting in the context of extreme environments - highly challenging surroundings that lie outside commercial and even military electronics specifications. However, fabricating HBTs on SOI substrates instead of traditional silicon bulk substrates requires extensive modifications to the structure of the transistors and results in significant trade-offs. The present work investigates, with measurements and TCAD simulations, the performance and reliability of SiGe heterojunction bipolar transistors fabricated on silicon on insulator substrates with respect to operation in extreme environments such as at extremely low or extremely high temperatures or in the presence of radiation (both in terms of total ionizing dose and single effect upset).

Although the majority of wireless receiver subsystems have moved to digital signal processing over the last decade, the low noise amplifier (LNA) remains a crucial analogue subsystem in any design being the dominant subsystem in determining the noise figure (NF) and dynamic range of the receiver as a whole. In this research a novel LNA configuration, namely the LC-ladder and capacitive shunt-shunt feedback topology, was proposed for use in the implementation of very wideband LNAs. This was done after a thorough theoretical investigation of LNA configurations available in the body of knowledge from which it became apparent that for the most part narrowband LNA configurations are applied to wideband applications with suboptimal results, and also that the wideband configurations that exist have certain shortcomings. A mathematical model was derived to describe the new configuration and consists of equations for the input impedance, input return loss, gain and NF, as well as an approximation of the worst case IIP3. Compact design equations were also derived from this model and a design strategy was given which allows for electronic design automation of a LNA using this configuration. A process for simultaneously optimizing the circuit for minimum NF and maximum gain was deduced from this model and different means of improving the linearity of the LNA were given. This proposed design process was used successfully throughout this research. The accuracy of the mathematical model has been verified using simulations. Two versions of the LNA were also fabricated and the measured results compared well with these simulations. The good correlation found between the calculated, simulated and measured results prove the accuracy of the model, and some comments on how the accuracy of the model could be improved even further are provided as well. The simulated results of a LNA designed for the 1 GHz to 18 GHz band in the IBM 8HP process show a gain of 21.4 dB and a minimum NF of only 1.7 dB, increasing to 3.3 dB at the upper corner frequency while maintaining an input return loss below -10 dB. After steps were taken to improve the linearity, the IIP3 of the LNA is -14.5 dBm with only a small degradation in NF now 2.15 dB at the minimum. The power consumption of the respective LNAs are 12.75 mW and 23.25 mW and each LNA occupies a chip area of only 0.43 mm2. Measured results of the LNA fabricated in the IBM 7WL process had a gain of 10 dB compared to an expected simulated gain of 20 dB, however significant path loss was introduced by the IC package and PCB parasitics. The S11 tracked the simulated response very well and remained below -10 dB over the feasible frequency range. Reliable noise figure measurements could not be obtained. The measured P1dB compression point is -22 dBm. A 60 GHz LNA was also designed using this topology in a SiGe process with ƒT of 200 GHz. A simulated NF of 5.2 dB was achieved for a gain of 14.2 dB and an input return loss below -15 dB using three amplifier stages. The IIP3 of the LNA is -8.4 dBm and the power consumption 25.5 mW. Although these are acceptable results in the mm-wave range it was however found that the wideband nature of this configuration is redundant in the unlicensed 60 GHz band and results are often inconsistent with the design theory due to second order effects. The wideband results however prove that the LC-ladder and capacitive shunt-shunt feedback topology is a viable means for especially implementing LNAs that require a very wide operating frequency range and also very low NF over that range. / Thesis (PhD(Eng))--University of Pretoria, 2011. / Electrical, Electronic and Computer Engineering / unrestricted

Le développement des technologies de communication et de l’information nécessite des composants semi-conducteurs ultrarapides et à faible niveau de bruit. Les transistors bipolaires à hétérojonction (TBH) sont des dispositifs qui visent des applications à hautes fréquences et qui peuvent satisfaire ces conditions. L’objet de cette thèse est l’étude expérimentale et la modélisation du bruit haute fréquence des TBH Si/SiGe:C (technologie STMicroelectronics) et InP/InGaAs (III-V Lab Alcatel-Thales).Accompagné d’un état de l’art des performances dynamiques des différentes technologies de TBH, le chapitre I rappelle brièvement le fonctionnement et la caractérisation des TBH en régime statique et dynamique. La première partie du chapitre II donne la description des deux types de TBH, avec l’analyse des performances dynamiques et statiques en fonction des variations technologiques de ceux-ci (composition de la base du TBH SiGe:C, réduction des dimensions latérales du TBH InGaAs). Avec l’aide d’une modélisation hydrodynamique, la seconde partie montre l’avantage d’une composition en germanium de 15-25% dans la base du TBH SiGe pour atteindre les meilleurs performances dynamiques. Le chapitre III synthétise des analyses statiques et dynamiques réalisées à basse température permettant de déterminer le poids relatif des temps de transit et des temps de charge dans la limitation des performances des TBH. L’analyse expérimentale et la modélisation analytique du bruit haute fréquence des deux types de TBH sont présentées en chapitre IV. La modélisation permet de mettre en évidence l’influence de la défocalisation du courant, de l’auto-échauffement, de la nature de l’hétérojonction base-émetteur sur le bruit haute fréquence. Une estimation des performances en bruit à basse température des deux types de TBH est obtenues avec les modèles électriques. / In order to fulfil the roadmap for the development of telecommunication and information technologies (TIC), low noise level and very fast semiconductor devices are required. Heterojunction bipolar transistor has demonstrated excellent high frequency performances and becomes a candidate to address TIC roadmap. This work deals with experimental analysis and high frequency noise modelling of Si/SiGe:C HBT (STMicroelectronics tech.) and InP/InGaAs HBT (III-V Lab Alcatel-Thales).Chapter I introduces the basic concepts of HBTs operation and the characterization at high-frequency. This chapter summarizes the high frequency performances of many state-of-the-art HBT technologies. The first part of chapter II describes the two HBT sets, with paying attention on the impact of the base composition (SiGe:C) or the lateral reduction of the device (InGaAs) on static and dynamic performances. Based on TCAD modelling, the second part shows that a 15-25% germanium composition profile in the base is able to reach highest dynamic performances. Chapter III summarizes the static and dynamic results at low temperature, giving a separation of the intrinsic transit times and charging times involved into the performance limitation. Chapter IV presents noise measurements and the derivation of high frequency noise analytical models. These models highlight the impact of the current crowding and the self-heating effects, and the influence of the base-emitter heterojunction on the high frequency noise. According to these models the high frequency noise performances are estimated at low temperature for both HBT technologies.

SiGe is a significant enabling technology for therealization of integrated circuits used in high performanceoptical networks and radio frequency applications. In order tocontinue to fulfill the demands for these applications, newmaterials and device structures are needed. This thesis focuseson new materials and their integration into heterojunctionbipolar transistor (HBT) structures as well as using devicesimulations to optimize and better understand the deviceoperation. Specifically, a SiGeC HBT platform was designed,fabricated, and electrically characterized. The platformfeatures a non-selectively grown epitaxial SiGeC base,in situdoped polysilicon emitter, nickel silicide,LOCOS isolation, and a minimum emitter width of 0.4 μm.Alternately, a selective epitaxy growth in an oxide window wasused to form the collector and isolation regions. Thetransistors exhibited cutoff frequency (fT) and maximum frequency of oscillation (fMAX) of 40-80 GHz and 15-45 GHz, respectively.Lateral design rules allowed the investigation of behavior suchas transient enhanced diffusion, leakage current, and theinfluence of parasitics such as base resistance and CBC. The formation of nickel silicide on polysiliconSiGe and SiGeC films was also investigated. The formation ofthe low resistivity monosilicide phase was shown to occur athigher temperatures on SiGeC than on SiGe. The stability of themonosilicide was also shown to improve for SiGeC. Nickelsilicide was then integrated into a SiGeC HBT featuring aselectively grown collector. A novel, fully silicided extrinsicbase contact was demonstrated along with the simultaneousformation of NiSi on thein situdoped polysilicon emitter. High-resolution x-ray diffraction (HRXRD) was used toinvestigate the growth and stability of SiGeC base layers forHBT integration. HRXRD proved to be an effective, fast,non-destructive tool for monitoring carbon out-diffusion due tothe dopant activation anneal for different temperatures as wellas for inline process monitoring of epitaxial growth of SiGeClayers. The stability of the SiGe layer with 0.2-0.4 at% carbonwhen subjected to dopant activation anneals ranging from1020-1100&#176C was analyzed by reciprocal lattice mapping.It was found that as the substitutional carbon increases theformation of boron clusters due to diffusion is suppressed, buta higher density of carbon clusters is formed. Device simulations were performed to optimize the DC and HFperformance of an advanced SiGeC HBT structure with low baseresistance and small dimension emitter widths. The selectivelyimplanted collector (SIC) was studied using a design ofexperiments (DOE) method. For small dimensions the lateralimplantation straggle has a significant influence on the SICprofile (width). A significant influence of the SIC width onthe DC gain was observed. The optimized structure showedbalanced fT/fMAXvalues of 200+ GHz. Finally, SOI BJT transistorswith deep trench isolation were fabricated in a 0.25μmBiCMOS process and self-heating effects were characterized andcompared to transistors on bulk silicon featuring deep trenchand shallow trench isolation. Device simulations based on SEMcross-sections and SIMS data were performed and the resultscompared to the fabricated transistors. Key words:Silicon-Germanium(SiGe), SiGeC,heterojunction bipolar transistor(HBT), nickel silicide,selectively implanted collector(SIC), device simulation, SiGeClayer stability, high resolution x-ray diffraction(HRXRD),silicon-on-insulator(SOI), self-heating.

No description available.

This thesis evaluates the suitability of silicon-germanium technology for electronic systems intended for extreme environments, such as ambient temperatures outside of military specification (-55 degC to 125 degC) range and intense exposures to ionizing radiation. Silicon-germanium devices and circuits were characterized at cryogenic and high-temperatures (up to 300 degC) and exposed to ionizing radiation, providing empirical evidence that silicon-germanium is an excellent platform for terrestrial and space-based electronic applications.

No description available.

<p>SiGe is a significant enabling technology for therealization of integrated circuits used in high performanceoptical networks and radio frequency applications. In order tocontinue to fulfill the demands for these applications, newmaterials and device structures are needed. This thesis focuseson new materials and their integration into heterojunctionbipolar transistor (HBT) structures as well as using devicesimulations to optimize and better understand the deviceoperation. Specifically, a SiGeC HBT platform was designed,fabricated, and electrically characterized. The platformfeatures a non-selectively grown epitaxial SiGeC base,<i>in situ</i>doped polysilicon emitter, nickel silicide,LOCOS isolation, and a minimum emitter width of 0.4 μm.Alternately, a selective epitaxy growth in an oxide window wasused to form the collector and isolation regions. Thetransistors exhibited cutoff frequency (f_T) and maximum frequency of oscillation (f_MAX) of 40-80 GHz and 15-45 GHz, respectively.Lateral design rules allowed the investigation of behavior suchas transient enhanced diffusion, leakage current, and theinfluence of parasitics such as base resistance and C_BC. The formation of nickel silicide on polysiliconSiGe and SiGeC films was also investigated. The formation ofthe low resistivity monosilicide phase was shown to occur athigher temperatures on SiGeC than on SiGe. The stability of themonosilicide was also shown to improve for SiGeC. Nickelsilicide was then integrated into a SiGeC HBT featuring aselectively grown collector. A novel, fully silicided extrinsicbase contact was demonstrated along with the simultaneousformation of NiSi on the<i>in situ</i>doped polysilicon emitter.</p><p>High-resolution x-ray diffraction (HRXRD) was used toinvestigate the growth and stability of SiGeC base layers forHBT integration. HRXRD proved to be an effective, fast,non-destructive tool for monitoring carbon out-diffusion due tothe dopant activation anneal for different temperatures as wellas for inline process monitoring of epitaxial growth of SiGeClayers. The stability of the SiGe layer with 0.2-0.4 at% carbonwhen subjected to dopant activation anneals ranging from1020-1100&#176C was analyzed by reciprocal lattice mapping.It was found that as the substitutional carbon increases theformation of boron clusters due to diffusion is suppressed, buta higher density of carbon clusters is formed.</p><p>Device simulations were performed to optimize the DC and HFperformance of an advanced SiGeC HBT structure with low baseresistance and small dimension emitter widths. The selectivelyimplanted collector (SIC) was studied using a design ofexperiments (DOE) method. For small dimensions the lateralimplantation straggle has a significant influence on the SICprofile (width). A significant influence of the SIC width onthe DC gain was observed. The optimized structure showedbalanced f_T/f_MAXvalues of 200+ GHz. Finally, SOI BJT transistorswith deep trench isolation were fabricated in a 0.25μmBiCMOS process and self-heating effects were characterized andcompared to transistors on bulk silicon featuring deep trenchand shallow trench isolation. Device simulations based on SEMcross-sections and SIMS data were performed and the resultscompared to the fabricated transistors.</p><p><b>Key words:</b>Silicon-Germanium(SiGe), SiGeC,heterojunction bipolar transistor(HBT), nickel silicide,selectively implanted collector(SIC), device simulation, SiGeClayer stability, high resolution x-ray diffraction(HRXRD),silicon-on-insulator(SOI), self-heating.</p>