Bandpass filters are an essential component of wireless communication systems that only transmits frequencies corresponding to the communication band and rejects all other frequencies. As the deployment of 5G draws nearer, first deployments are expected in 2020 [1], the need for viable filters at the new frequency bands becomes more imminent. Size and performance are two critical considerations for a filter that will be used in emerging mobile communication applications. The high frequency of 5G communication, 28 GHz as opposed to sub 6 GHz for nearly all previous communication protocols, means that previously utilized lumped component based solutions cannot be implemented since they are ill-suited for mm-wave applications. The focus of this work is the miniaturization of a high-performance filter. The Substrate Integrated Waveguide (SIW) is a high performance and promising structure and Low Temperature Co-Fired Ceramic (LTCC) is a high-performance material that both can operate at higher frequencies than the technologies used for previous telecommunication generations. To miniaturize the structure, a compact folded four-cavity SIW filter is designed, implemented and tested. The feeding structure is integrated into the filter to exploit the System on Package (SoP) attributes of LTCC and further reduce the total area of the filter individually and holistically when looking at the final integrated system. Two unique three dimensional (3D) integrated SoP LTCC two-stage SIW single cavity filters and one unique four-cavity filter all with embedded planar resonators are designed, fabricated and tested. The embedded resonators create a two-stage effect in a single cavity filter. The better single cavity design provides a 15% fractional bandwidth at a center frequency of 28.12 GHz, and with an insertion loss of -0.53 dB. The fabricated four-cavity filter has a 3-dB bandwidth of .98GHz centered at 27.465 GHz, and with an insertion loss of -2.66 dB. The designs presented highlight some of the previously leveraged advantages of SoP designs while also including additions of embedded planar resonators to feed the SIW cavity. The integration of both elements realizes a compact and high-performance filter that is well suited for future mm-wave applications including 5G.

Typical microwave components such as antennas are large in size and occupy considerable space. Since multiple standards are utilized in modern day systems and thus multiple antennas are required, it is best if a single component can be reconfigured or tuned to various bands. Similarly phase shifters to provide beam scanning and polarization reconfigurable antennas are important for modern day congested wireless systems. Tunability of antennas or phase shifting between antenna elements has been demonstrated using various techniques which include magnetically tunable components on ferrite based substrates. Although this method has shown promising results it also has several issues due to the use of large external electromagnets and operation in the magnetically saturated state. These issues include the device being bulky, inefficient, non-integrable and expensive. In this thesis, we have tried to resolve the above mentioned issues of large size and large power requirement by replacing the large electromagnets with embedded bias windings and also by operating the ferrites in the partially magnetized state. New theoretical models and simulation methodology have been used to evaluate the performance of the microwave passive components in the partially magnetized state. A multilayer ferrite Low Temperature Cofired Ceramic (LTCC) tape system has been used to verify the performance experimentally. There exists a good agreement between the theoretical, simulation and measurement results. Tunable antennas with tuning range of almost 10 % and phase shifter with an FoM of 83.2/dB have been demonstrated in this work, however the major contribution is that this has been achieved with bias fields that are 90 % less than the typically reported values in the literature. Finally, polarization reconfigurability has also been demonstrated for a circular patch antenna using a low cost additive manufacturing technique. The results are promising and indicate that highly integrated ferrite based tunable components are feasible in small form factor, without the need of the large electromagnets and coils, and thus can be operated at very low bias levels as compared to the ones which are operated in the saturated state with external bias mechanisms.

Master’s thesis deals with the optimalization of low-temperature cofired ceramic lamination process that affects the final quality of 3D structures (eg., channels, cavities, membranes, etc.). The paper evaluates the influence of lamination parameters (pressure, temperature, time) on the formation of defects in the structure, which were detected by appropriate methods. The last parts describes designed and simulation cooling water system using LTCC technology.

Neste trabalho é apresentada a análise de técnicas para a integração de ISFETs (Ion Selective Field Effect Transitors), através do método de montagem por viragem (Flip-chip) usando pasta de solda livre de chumbo e epóxi condutivo de prata, com o objetivo de permitir sua aplicação em Microssistemas de Análise Total (µTAS). Para os testes de integração foram construídas estruturas em dois substratos, o FR-4, pelo método de ligação por fios (wire bonding), e o LTCC, que pode ser aplicado na construção de µTAS. Como os terminais de contato do ISFET tem seu acabamento superficial em alumínio não é possível realizar a montagem por viragem utilizando equipamentos SMT, sendo necessários processos intermediários. Dois processos que permitem o uso de equipamentos SMT foram aplicados: a remetalização, onde camadas de níquel e ouro são depositadas sobre o alumínio do terminal de contato, através do banho químico eletrolítico sem eletrodo (Electroless), e protuberâncias de solda (stud ou ball bumps), que são ligadas ao alumínio do terminal de contato pelo processo conhecido como Stud Ball Bumping (SBB). Na integração do ISFET foi feita a selagem dos terminais de contato e a abertura de uma janela que permite o contato da área ativa (região de porta) do ISFET com as soluções a serem analisadas. A selagem dos terminais de contato foi feita com o fotoresiste SU-8, e a abertura da área ativa foi feita diretamente sobre os substratos de FR-4 e LTCC. Ambos processos apresentaram soldabilidade com a pasta de solda apresentando ponto de refusão em torno de 250°C, indicando que equipamentos SMT podem ser aplicados na montagem por viragem. Verificou-se que o epóxi condutivo de prata foi curado a 100°C por uma hora e também pode ser aplicado na integração do ISFET. Por fim o SU-8 usado na selagem apresentou uma boa adesão aos substratos de FR-4 e LTCC, sendo curado na mesma etapa térmica da pasta de solda e/ou epóxi condutivo de prata ou após estes processos a 150°C por trinta minutos. / In this work is shown the analysis of integration techniques of ISFET (Ion Selective Field Effect Transitor) through the Flip-chip method using lead-free solder paste and silver conductive epoxy, in order to allow its application in Micro Total Analysis System (µTAS). For integration tests two substrates have been made, the FR-4, as already used in the integration of the ISFET, but assembled through wire bonding method, and the LTCC that can be applied in the construction of µTAS. As the ISFET bonding pads has its surface finish in aluminum is not possible assembly through flip-chip method using SMT equipments, requiring intermediate processes. Two process that allow the use of SMT equipment were applied: the remetallization, where nickel and gold layers are deposited on the aluminum bonding pads, through the Electroless chemical baths, and stud or ball bumps, which are connected to bonding pads of aluminum by the process known as Stud Ball Bumping (SBB). In the ISFET integration should be made a seal in the bonding pads and a window that allows the contact of the active area (gate region) of ISFET with the solutions to be analyzed. The sealing of the bonding pads has been made with the photoresist SU-8 and the window of active area were made directly on the FR-4 and LTCC substrates. Both processes presented the solderability with the solder paste reflowed at 250°C, indicating that SMT equipments may be applied to the assembly through flip-chip method, the silver conductive epoxy was cured at 100°C for one hour and can also be applied in ISFET integration. Finally the SU-8 used to sealing have showed a good adherence to the FR-4 and LTCC substrates, being cured in the same thermal step of solder paste and/or silver conductive epoxy or after these processes at 150°C for thirty minutes.

Neste trabalho é apresentada a análise de técnicas para a integração de ISFETs (Ion Selective Field Effect Transitors), através do método de montagem por viragem (Flip-chip) usando pasta de solda livre de chumbo e epóxi condutivo de prata, com o objetivo de permitir sua aplicação em Microssistemas de Análise Total (µTAS). Para os testes de integração foram construídas estruturas em dois substratos, o FR-4, pelo método de ligação por fios (wire bonding), e o LTCC, que pode ser aplicado na construção de µTAS. Como os terminais de contato do ISFET tem seu acabamento superficial em alumínio não é possível realizar a montagem por viragem utilizando equipamentos SMT, sendo necessários processos intermediários. Dois processos que permitem o uso de equipamentos SMT foram aplicados: a remetalização, onde camadas de níquel e ouro são depositadas sobre o alumínio do terminal de contato, através do banho químico eletrolítico sem eletrodo (Electroless), e protuberâncias de solda (stud ou ball bumps), que são ligadas ao alumínio do terminal de contato pelo processo conhecido como Stud Ball Bumping (SBB). Na integração do ISFET foi feita a selagem dos terminais de contato e a abertura de uma janela que permite o contato da área ativa (região de porta) do ISFET com as soluções a serem analisadas. A selagem dos terminais de contato foi feita com o fotoresiste SU-8, e a abertura da área ativa foi feita diretamente sobre os substratos de FR-4 e LTCC. Ambos processos apresentaram soldabilidade com a pasta de solda apresentando ponto de refusão em torno de 250°C, indicando que equipamentos SMT podem ser aplicados na montagem por viragem. Verificou-se que o epóxi condutivo de prata foi curado a 100°C por uma hora e também pode ser aplicado na integração do ISFET. Por fim o SU-8 usado na selagem apresentou uma boa adesão aos substratos de FR-4 e LTCC, sendo curado na mesma etapa térmica da pasta de solda e/ou epóxi condutivo de prata ou após estes processos a 150°C por trinta minutos. / In this work is shown the analysis of integration techniques of ISFET (Ion Selective Field Effect Transitor) through the Flip-chip method using lead-free solder paste and silver conductive epoxy, in order to allow its application in Micro Total Analysis System (µTAS). For integration tests two substrates have been made, the FR-4, as already used in the integration of the ISFET, but assembled through wire bonding method, and the LTCC that can be applied in the construction of µTAS. As the ISFET bonding pads has its surface finish in aluminum is not possible assembly through flip-chip method using SMT equipments, requiring intermediate processes. Two process that allow the use of SMT equipment were applied: the remetallization, where nickel and gold layers are deposited on the aluminum bonding pads, through the Electroless chemical baths, and stud or ball bumps, which are connected to bonding pads of aluminum by the process known as Stud Ball Bumping (SBB). In the ISFET integration should be made a seal in the bonding pads and a window that allows the contact of the active area (gate region) of ISFET with the solutions to be analyzed. The sealing of the bonding pads has been made with the photoresist SU-8 and the window of active area were made directly on the FR-4 and LTCC substrates. Both processes presented the solderability with the solder paste reflowed at 250°C, indicating that SMT equipments may be applied to the assembly through flip-chip method, the silver conductive epoxy was cured at 100°C for one hour and can also be applied in ISFET integration. Finally the SU-8 used to sealing have showed a good adherence to the FR-4 and LTCC substrates, being cured in the same thermal step of solder paste and/or silver conductive epoxy or after these processes at 150°C for thirty minutes.

Cette thèse concerne de l’étude de composants passifs non-réciproque (circulateurs) fabriqué sur substrat LTCC ferrite. Les aimants externes utilisés dans les circulateurs classiques doivent créer un champ magnétique intense pour compenser le champs de démagnétisant dans le ferrite. Le nouveau circulateur présenté ici utilise une bobine intégrée dans le LTCC ferrite pour magnétiser le matériau de l'intérieur, pour réduire considérablement les effets des champs démagnétisants. Il est possible de contrôler le champ de polarisation rendant le dispositif multifonctionnel: lorsque la bobine est excitée par un courant, le dispositif fonctionne comme un circulateur dynamique dans lequel la direction de circulation peut être basculée en changeant la direction du courant. Si un aimant externe est placé sur le circulateur, sa fréquence de fonctionnement peut être accordée en ajustant le courant de polarisation. Contrairement à d'autres circulateurs LTCC avec aimants externes, le dispositif proposé peut même fonctionner comme un diviseur de puissance sans courant de polarisation. Un prototype de circulateur a été réalisé et caractérisé dans trois états: 1. démagnétisé, 2. Magnétisé par la bobine, 3. magnétisé par la bobine et des aimants externes. En l'absence de courant appliqué, la transmission de chaque port est d'environ -5 dB avec un coefficient de réflexion inférieur à -20 dB à 14,8 GHz. Quand un courant de 300 mA est injecté dans la bobine, les pertes d'insertion et l'isolation mesurées sont d'environ 3 dB et 8 dB, respectivement. Le coefficient de réflexion est inférieur à -20 dB à 14,2 GHz. Lorsque les aimants externes sont ajoutés avec un courant de 200 mA, les pertes d'insertion et l'isolation a été améliorée à 1,6 dB et 23 dB, respectivement à 14,2 GHz. La variation de la fréquence de travail du circulateur est de 0,6 GHz. Elle est due par la variation de l'aimantation M interne lorsque le courant est inférieur à 120 mA, puis par l’augmentation de la température créée par le courant dans la bobine. La taille (L * W * H) totale du circulateur réalisé est de 8mm * 8mm *1.1mm. Ce travail monte qu’il est possible d’intégrer (MMIC) sur un substrat LTCC ferrite des circuits passifs non-réciproques / This thesis investigates passive non-reciprocal components (mainly circulators) based on ferrite Low Temperature Co-fired Ceramic (LTCC) substrate. The external magnets used in conventional circulators must be strong to overcome the ferrite's demagnetization field. The novel circulator presented herein uses an embedded winding within the ferrite substrate to magnetize the material from the inside, thereby significantly reducing the demagnetization effects. Because of the controllability of the bias field, the resulting device is also multifunctional: when the windings are energized by a current, the device operates as a dynamic circulator in which the circulation direction can be changed by switching the direction of the current. Unlike other LTCC circulators with external magnets, the proposed device can even operate as a power splitter by removing the bias current. A circulator prototype has been characterized in three states: unbiased, biased by winding and biased by winding and external magnets. When no current is applied, the transmission of each port is about -5 dB with return loss better than 20 dB at 14.8 GHz. When a current of 300 mA is injected into the winding, the measured insertion loss and isolation of the circulator is approximately 3 dB and 8 dB, respectively, whereas the return loss is better than 20 dB at 14.2 GHz. When external magnets are added in addition to the current of 200 mA, the insertion loss and isolation is improved to 1.6 dB and 23 dB, respectively at 14.2 GHz. The variation of the circulator's working frequency is 0.6 GHz. This is achieved firstly by the change of internal magnetization M when current is less than 120 mA, then the heat in the substrate due to the winding introduces more frequency shifting. The total size (L*W*H) is 8mm*8mm*1.1mm

Les systèmes multicouches à base de LTCC (Low Temperature Co-fired Ceramic) et d’or sont largement utilisés dans l’élaboration de composants multi-matériaux pour applications radiofréquences civiles et militaires. Cette technologie présente un fort potentiel de développement car elle constitue une solution de packaging des puces électroniques. Lors du processus d’élaboration de ces composants multi-matériaux (céramique-métal), la phase de co-frittage est une étape clé et critique, car elle est source d’endommagement du fait des potentiels différentiels de coefficients de dilatation et de cinétiques de retrait. Ainsi, ce travail vise le développement d’un modèle numérique simulant fidèlement le comportement thermomécanique des composants au cours de l’étape de co-frittage. A cet effet, les comportements thermomécanique et au frittage des matériaux céramiques et métalliques sélectionnés ont été finement caractérisés. Les lois de comportement ainsi identifiées ont été implémentées dans le code de calcul par éléments finis Comsol Multiphysics. La robustesse du modèle développé a été analysée par confrontation à des essais expérimentaux conduits grâce à la mise en place d’un dispositif original de suivi in situ de la déformation par ombroscopie. Ainsi, les cambrures générées lors du frittage contraint d’un bicouche à base de LTCC et lors du co-frittage d’un bicouche LTCC-or ont été caractérisées et comparées aux simulations numériques. / LTCC (Low Temperature Co-fired Ceramic) and gold multilayers systems are extensively used in the development of multi-materials components for civil and military radio-frequency applications. This technology presents a high potential of development because it provides a packaging solution for electronic chips. During the process of drafting of these multi-materials components (ceramic metal), the co-sintering step is a key and critical one, indeed it leads to damages because of potential thermal expansion coefficients and shrinkage kinetics differentials. Thus, the aim of this work is to develop a numerical model able to faithfully simulate the components thermomechanical behavior during the co-sintering stage. To achieve this, the sintering and thermomechanical behavior of the selected ceramic and metal materials have been carefully characterized. The behavior laws so identified have been implemented in the software based on the finite elements method Comsol Multiphysics. The developed model robustness has been analyzed by confrontation with experimental tests driven by the establishment of an original shadowscopy apparatus which allows the in situ strain recording. Thus, the generated curvatures during the constrained sintering of a LTCC bilayer and during a gold-LTCC bilayer co-sintering have been characterized and compared with the numerical simulations.

La maîtrise de la communication et de l'information est un atout primordial dans les stratégies de pouvoir, qu'elles soient militaires, politiques ou commerciales. Celui qui est capable de transmettre l'information plus vite prend l'avantage sur les autres. Tel est le moteur de la croissance et du progrès dans le domaine des télécommunications. L'omniprésence grandissante des dispositifs communicants témoigne de l'expansion exponentielle qu'a connu ce domaine depuis les premières communications sans fil. À l'époque du all-in-one, la multiplication des applications au sein d'un même appareil nécessite l'utilisation de composants toujours plus performants et petits . Au cœur de ces systèmes, les filtres ont une importance grandissante. Dans un environnement spatial, les contraintes de fiabilité et d'encombrement sont particulièrement drastiques. Le choix des matériaux est par ailleurs limité, ce qui réduit les possibilités d'innovation. Cependant, l'amélioration de la précision et de la fiabilité dans les technologies de fabrication ouvre de nouvelles perspectives d'innovation et d'amélioration des composants. Ces travaux ont ainsi été motivés par ce souci d'apporter toujours plus de performance et de fiabilité, pour un encombrement moindre en tirant profit du potentiel offert par l'association du concept SIW et de la technologie LTCC. Les résultats mettent à jour de sérieuses dispersions technologiques. Cependant, le potentiel de l'association SIW/LTCC est démontré, et les difficultés rencontrées sont surmontables. Les filtres SIW en technologie LTCC présentent donc des atouts pour s'imposer comme une alternative sérieuse aux solutions existantes. / Control of communication and information is a key asset in the strategies of power, whether military, political or commercial. Whoever is able to transmit information faster takes advantage of others. This is the engine of growth and progress in the field of telecommunications. The growing ubiquity of communicating devices demonstrates the exponential growth experienced by this area since the first wireless communications. At the time of all-in-one, multiple applications within a single device requires the use of ever more powerful and small components. At the heart of these systems, filters are becoming increasingly important. In a space environment, reliability constraints and space are particularly dramatic. The choice of materials is also limited, which reduces the possibilities of innovation. However, the improvement of accuracy and reliability in manufacturing technologies opens new opportunities for innovation and improved components. This work has been motivated by the desire to bring more performances and reliability, a smaller footprint by taking advantage of the potential offered by combining the concept SIW and LTCC. The results update serious technological dispersions. However, the potential association SIW / LTCC is shown, and the difficulties are surmountable. SIW filters in LTCC therefore have advantages for itself as a serious alternative to existing solutions.

The recent developments in Low Temperature Co-fired Ceramic (LTCC) as a substrate material enable it to be used in the micro and millimetre wave range providing low dissipation factors at high frequencies, good dielectric properties and a high degree of integration for further miniaturised devices. The most common metallisation method used in LTCC technology is screen printing with high cost noble metals such as silver and gold that are compatible with the high sintering temperatures (850°C). However, these techniques require high capital cost and maintenance cost. As the commercial world requires convenient and low cost process technologies for mass production, alternative metallisation methods should be considered. As a result, electroless copper plating of fired LTCC was mainly investigated in this research. The main goals of this project were to carry out electroless plating of fired LTCC with sufficient adhesion and to extend the process to metallise closed LTCC channel structures to manufacture Substrate Integrated Waveguide (SIW) components. The objectives were focused on electroless copper deposition on fired LTCC with improved adhesion. Electroless deposits on the Sn/Pd activated LTCC surface showed poor adhesion without any surface pre-treatments. Hence, chemical etching of fired LTCC was carried out using concentrated NaOH solution. NaOH pre-treatment of LTCC led to the formation of flake like structures on the LTCC surface. A number of surface and chemical analysis techniques and weight measurements were used to investigate the mechanism of the modification of the LTCC surface. The results showed that the flake like structures were dispersed in the LTCC material and a material model for the LTCC structure was proposed. SEM EDX elemental mapping showed that the flake like structure consisted of aluminium, calcium, boron and oxygen. Further experiments showed that both the concentration of NaOH and the immersion time affect the surface morphology and the roughness of fired LTCC. The measured Ra values were 0.6 μm for untreated LTCC and 1.1 μm for the LTCC sample treated with 4M NaOH for 270 minutes. Adhesion tests including peel test and scratch test were carried out to examine the adhesion strength of the deposited copper and both tests indicated that the NaOH pre-treatment led to an improvement, with the best results achieved for samples treated with 4M NaOH. A second aspect of the research focused on the selective metallisation of fired LTCC. Excimer laser machining was used to pattern a resist film laminated on the LTCC surface. This process also roughened the substrate and created channels that were characterised with respect to the laser operating parameters. After patterning the resist layer, samples were activated using Sn/Pd catalyst solution followed by the electroless copper deposition. Electroless copper was selectively deposited only on the patterned LTCC surface. Laser parameters clearly affected the copper plating rate. Even with a similar number of shots per area, the tracks machined with higher repetition rate showed relatively more machining depth as well as good plating conditions with low resistance values. The process was further implemented to realize a complete working circuit on fired LTCC. Passive components including a capacitor and an inductor were also fabricated on LTCC using the mask projection technique of the excimer laser system. This was successful for many designs, but when the separation between conductor lines dropped below 18 μm, electroless copper started to deposit on the areas between them. Finally, a method to deposit copper films on the internal walls of closed channel structures was developed. The method was first demonstrated by flowing electroless copper solutions through silane treated glass capillaries. A thin layer (approx. 60 nm) of electroless copper was deposited only on the internal walls of the glass capillaries. The flow rate of the electroless copper solution had to be maintained at a low level as the copper deposits tended to wash away with higher flow rates. The structures were tested for transmission losses and showed low (<10dB) transmission losses in the terahertz region of the electromagnetic spectrum. The process was further applied to deposit electroless copper on the internal walls of the LTCC closed channel structures to manufacture a LTCC Substrate Integrated Waveguide (SIW).

Este trabalho visou o desenvolvimento de sensores de oxigênio dissolvido (OD) utilizando tecnologias de filmes espessos, possibilitando baixo custo de produção, mantendo porém a durabilidade e precisão necessárias para o emprego no monitoramento de águas mananciais. Tal desenvolvimento também incluiu o desenvolvimento de circuitos eletrônicos próprios para o funcionamento completo e autônomo dos sensores. Aplicando-se o princípio de funcionamento do sensor eletroquímico de oxigênio dissolvido baseado na célula de Clark(1956), desenvolveu-se inicialmente esta célula confeccionada em PVC com dimensões tradicionais e, posteriormente, utilizou-se a tecnologia LTCC (Low Temperature Cofired Ceramics) como substrato do sensor em uma microconfiguração planar. Essa inovação permitiu estudar as facilidades de construção com este substrato, várias composições para o eletrólito, espessura das membranas em FEP e PDMS, e o uso das técnicas de medidas tais como polarização contínua, polarização pulsada e voltametria cíclica. Os sensores desenvolvidos foram estudados em condições de monitoramento contínuo e chegaram a alcançar 4 meses de durabilidade utilizando membrana de FEP com deriva de 0,14 % hora-1. Verificou-se através dos ensaios que a configuração da célula eletroquímica de 3 eletrodos estende a durabilidade dos microsensores, pois esta configuração atenua a redução da prata sobre o catodo. Devido a recente regulamentação da detecção óptica do OD pela ASTM, inclui-se neste trabalho o princípio da técnica de medição através da detecção da luminescência. Apresenta-se a implementação de um sistema óptico de detecção utilizando LEDs de alto brilho como fonte de excitação e fotodiodo com filtro de cor embutido para a detecção da intensidade luminescente de um complexo de rutênio (Ru(dpp)) imobilizado em filme sol-gel e em silicone PDMS. O sensor óptico imobilizado em filme sol-gel operando em modo contínuo apresentou a menor deriva (0,03 % hora-1) dentre os microssensores ópticos construídos. A adição de uma fina camada de silicone preto sobre a imobilização sol-gel proporcionou maior durabilidade e imunidade do filme à variação de salinidade da amostra sem prejudicar o tempo de resposta do sensor. / This work aims the development of a dissolved oxygen (DO) sensor using thick film technology, which has low cost of production and keeps sensors durability and precision acceptable for their use in the monitoring of water sources. This development also includes the complete electronic circuits for autonomous monitoring. Using the principles of oxygen electrochemical sensors based on Clark´s cell, this cell is initially built in PVC with traditional dimensions and aftwords build in LTCC (Low Temperature Co-fired Ceramics) technology as a substrate for the sensor in a microplanar configuration. This innovation allowed the study of constructive aspects, especially by changing substrate configuration, compositions for the electrolyte, thickness of the FEP or PDMS membrane, and the use of diverse electronic measurement techniques such as continuous polarization, pulsed polarization and cyclic voltammetry. Sensors submitted to continuous monitoring could reach 4 months of duration, using FEP membrane, drifting 0.14 % h-1. A 3 electrodes electrochemical cell configuration can extend the sensor´s life, presenting a low drift for both sensors types, because this new configuration attenuates the reduction of the silver over the cathode. Due to recent regulation of the optical detection of OD by ASTM, this work includes the measurement of DO through the detection of luminescent patterns. Such a system was developed by using high brightness LED´s as excitement sources and special photodiodes embedded with color filters as luminescence intensity detectors . The ruthenium complex (Ru(dpp)) immobilized in a sol-gel film and in PDMS was used as oxygen-sensitive material. The optical sensor immobilized in sol-gel film operating in continuous mode presented the lowest drift (0.03 % h-1) of all built sensors. The addition of a thin layer of black silicone over the sol-gel immobilization provided a greater durability and the immunity of the film and to sample salinity variation, without prejudice to the sensor response time.