Cette thèse démontre la faisabilité de l'utilisation de la technologie Nitrure de Gallium (GaN) dans les systèmes RF / micro-ondes reconfigurables. Les principales caractéristiques de ce type de technologie des semi-conducteurs se résident dans ses capacités de supporter des puissances élevées avec un rendement aussi élevé. En outre, la technologie GaN est un candidat très prometteur pour la réalisation des applications haute puissance/haute fréquence. Le travail de cette thèse est divisé en deux parties principales. La première est consacrée au développement, à l’analyse et à la caractérisation en DC et en RF jusqu'à 20 GHz des circuits actifs réalisés à base de la technologie GaN, tels que les diodes varicap et les commutateurs. Les diodes varicap fabriquées ont été modélisées en petit et grand signal par des équations analytiques contenant des coefficients empiriques ainsi un modèle en circuit a été développé, tandis aux commutateurs, un modèle de circuit en petit signal a été proposé. Ces composants actifs ont été réalisés en utilisant les processus GaN HEMTs de fabrication offerts par le Conseil National de Recherches du Canada (CNRC). La deuxième partie aborde les aspects de l'intégration de ces dispositif actifs GaN et de la conception des circuits reconfigurables proposés, tels que déphaseur reconfigurable, -3dB 90° coupleur hybride reconfigurable, oscillateur accordable en fréquence, commutation de faisceau et accordabilité en fréquence d’un réseau d'antennes patch tout en utilisant ces diodes varicap et commutateur GaN développées au fil de cette thèse. A travers cette thèse, l'utilisation de la technologie GaN pour la conception des designs RF reconfigurables en fréquence pour les applications fonctionnant au-dessous de 10 GHz a été démontrée. / This thesis demonstrates the feasibility of using the Gallium Nitride (GaN) technology in reconfigurable RF/microwave systems. The main features of this type of semiconductor technology being its high power with high efficiency. In addition, GaN technology is a very promising candidate for realizing high power/high frequency applications. The thesis work is divided in two main parts. The first one is devoted to active GaN devices, such as varactor diodes and switches, development, analyze and characterization via DC and RF up to 20 GHz. The fabricated varactor were modeled by analytic equations containing empirical coefficients and also a physic circuit model was developed, while for the switches only a small signal physic circuit model was proposed. These GaN devices was manufactured by using the Canadian National Research Council (NRC) GaN HEMTs processes. The second part addresses the integration and design aspects of the reconfigurable proposed circuits, such as tunable phase shifter, reconfigurable 3-dB 90° hybrid coupler, tunable frequency oscillator, beam switching antenna array and matching reconfigurable patch antenna based on these developed GaN varactors and switches devices. The use of GaN on highly efficient reconfigurable designs for broadband RF/microwave applications operating below 10 GHz was demonstrated.

The largest 21st century radio telescope, the Square Kilometre Array (SKA) is now being planned, and the first phase of construction is estimated to commence in the year 2016. Phased array technology, the key feature of the SKA, requires the use of a tremendous number of receivers, estimated at approximately 37 million. Therefore, in the context of this project, the Low Noise Amplifier (LNA) located at the front end of the receiver chain remains the critical block. The demanding specifications in terms of bandwidth, low power consumption, low cost and low noise characteristics make the LNA topologies and their design methodologies one of the most challenging tasks for the realisation of the SKA. The LNA design is a compromise between the topology selection, wideband matching for a low noise figure, low power consumption and linearity. Considering these critical issues, this thesis describes the procedure for designing a monolithic microwave integrated circuit (MMIC) LNA for operation in the mid frequency band (400 MHz to 1.4 GHz) of the SKA. The main focus of this work is to investigate the potential of MMIC LNA designs based on a novel InGaAs/InAlAs/InP pHEMT developed for 1 µm gate length transistors, fabricated at The University of Manchester. An accurate technique for the extraction of empirical linear and nonlinear models for the fabricated active devices has been developed. In addition to the linear and nonlinear model of the transistors, precise models for passive devices have also been obtained and incorporated in the design of the amplifiers. The models show excellent agreement between measured and modelled DC and RF data. These models have been used in designing single, double and differential stage MMIC LNAs. The LNAs were designed for a 50 Ω input and output impedance. The excellent fits between the measured and modelled S-parameters for single and double stage single-ended LNAs reflects the accurate models that have been developed. The single stage LNA achieved a gain ranging from 9 to 13 dB over the band of operation. The gain was increased between 27 dB and 36 dB for the double stage and differential LNA designs. The measured noise figures obtained were higher by ~0.3 to ~0.8 dB when compared to the simulated figures. This is due to several factors which are discussed in this thesis. The single stage design consumes only a third of the power (47 mW) of that required for the double stage design, when driven from a 3 V supply. All designs were unconditionally stable. The chip sizes of the fabricated MMIC LNAs were 1.5 x 1.5 mm2 and 1.6 x 2.5 mm2 for the single and double stage designs respectively. Significantly, a series of differential input to single-ended output LNAs became of interest for use in the Square Kilometre Array (SKA), as it utilises differential output antennas in some of its configurations. The single-ended output is preferable for interfacing to the subsequent stages in the analogue chain. A noise figure of less than 0.9 dB with a power consumption of 180 mW is expected for these designs.

The primary reason for the wireless technology evolution is towards building capacity and obtaining higher data rates. Enclosed locations, densely populated campus, indoor offices, and device-to-device communication will require radios that need to operate at data rates up to 10 Gbps. In the next few years, a new generation of communication systems would emerge to better handle the ever-increasing demand for much wider bandwidth requirements. Simultaneously, key factors such as size, cost, and energy consumption play a distinctive role towards shaping the success of future wireless technologies. In the perspective of 3GPP 5G next generation wireless communication systems, the X band was explicitly targeted with a vast range of applications in point to point radio, point to multi point radio, test equipment, sensors and future wireless communication. An X-band RF front-end circuit for next generation wireless network applications is presented in this work. It details the design of a low noise amplifier and a power amplifier for X band operation. The designed amplifiers were integrated with a wideband single-pole-double-throw switch to achieve an overall front-end structure for 10 GHz. The design was carried out and sent for fabrication using a GaN 0.15µm process provided by NRC, a novel design kit. Due to higher breakdown voltage, high power density, high efficiency, high linearity and better noise performance, GaN HEMTs are a suitable choice for future wireless communication. Thus, the assumption is to further explore capabilities of this process in front-end design for future wireless communications.

No description available.

O presente trabalho descreve o desenvolvimento e implementação de duas configurações distintas de um receptor optoeletrônico integrado. A primeira configuração é similar a um projeto encontrado na literatura mas apresenta diversas modificações que lhe conferiram melhor desempenho em comparação ao projeto original. A segunda configuração é uma nova proposta deste trabalho. O receptor foi desenvolvido e implementado visando sua aplicação em redes de comunicações ópticas passivas (PONs) de alta velocidade comutadas a pacote, para possibilitar a utilização da técnica de multiplexação em comprimento de onda (WDM), aumentando assim a capacidade de transmissão da rede, em particular no ramo de ligação da rede de serviços com o usuário final, denominado rede de acesso. O principal objetivo do receptor aqui desenvolvido foi proporcionar uma sintonia rápida entre os canais disponíveis na rede, possibilitando sua seleção num tempo inferior àquele necessário para a transmissão de um único pacote de informação, diminuindo assim o atraso de sintonia e, por conseguinte, a perda de informação. Para tanto, os circuitos integrados implementados e caracterizados referem-se aos circuitos de chaveamento eletrônico e do amplificador de transimpedância das duas configurações investigadas. Os dados experimentais obtidos para as duas configurações confirmaram a previsão de chaveamento dos canais de entrada num intervalo de tempo da ordem de alguns nanosegundos, o que é totalmente compatível com a velocidade de transmissão das aplicações a que se destina este receptor (aproximadamente 5 Gbits/s). Adicionalmente, são apresentados os dados experimentais relativos à freqüência de corte, ganho direto, isolação, relação on/off e características de ruído dos circuitos implementados. / The present work describes the design and implementation of two configurations of an integrated optoelectronic receiver. The first one is similar to a previously reported design but with some modifications to improve its performance. The second one is a new proposal of this work. The goal of the receiver design and implementation was its application in high bit rate packet-switched passive optical networks (PONs) employing the wavelength division multiplexing (WDM) technique to increase the network capacity, in particular on the connection branch of the network core with the final user, the access network. The main goal of the receiver design was to achieve a fast channel tuning, allowing a tuning time smaller than the required for the transmission of a single information packet, decreasing the tuning latency and, therefore, the rate of information packet loss. In order to accomplish this goal, the implemented and tested integrated circuits include the electronic switching circuit and the transimpedance amplifier for both configurations investigated. The measured data for both configurations confirm the expected input channel switching time results, of about a few nanoseconds, which is certainly useful for the expected bit rate of operation (approximate 5 Gbps). Additionally, experimental results concerning cutoff frequency and bandwidth, direct gain, isolation, on/off ratio, and noise characteristics of both implemented circuits are presented.

O presente trabalho descreve o desenvolvimento e implementação de duas configurações distintas de um receptor optoeletrônico integrado. A primeira configuração é similar a um projeto encontrado na literatura mas apresenta diversas modificações que lhe conferiram melhor desempenho em comparação ao projeto original. A segunda configuração é uma nova proposta deste trabalho. O receptor foi desenvolvido e implementado visando sua aplicação em redes de comunicações ópticas passivas (PONs) de alta velocidade comutadas a pacote, para possibilitar a utilização da técnica de multiplexação em comprimento de onda (WDM), aumentando assim a capacidade de transmissão da rede, em particular no ramo de ligação da rede de serviços com o usuário final, denominado rede de acesso. O principal objetivo do receptor aqui desenvolvido foi proporcionar uma sintonia rápida entre os canais disponíveis na rede, possibilitando sua seleção num tempo inferior àquele necessário para a transmissão de um único pacote de informação, diminuindo assim o atraso de sintonia e, por conseguinte, a perda de informação. Para tanto, os circuitos integrados implementados e caracterizados referem-se aos circuitos de chaveamento eletrônico e do amplificador de transimpedância das duas configurações investigadas. Os dados experimentais obtidos para as duas configurações confirmaram a previsão de chaveamento dos canais de entrada num intervalo de tempo da ordem de alguns nanosegundos, o que é totalmente compatível com a velocidade de transmissão das aplicações a que se destina este receptor (aproximadamente 5 Gbits/s). Adicionalmente, são apresentados os dados experimentais relativos à freqüência de corte, ganho direto, isolação, relação on/off e características de ruído dos circuitos implementados. / The present work describes the design and implementation of two configurations of an integrated optoelectronic receiver. The first one is similar to a previously reported design but with some modifications to improve its performance. The second one is a new proposal of this work. The goal of the receiver design and implementation was its application in high bit rate packet-switched passive optical networks (PONs) employing the wavelength division multiplexing (WDM) technique to increase the network capacity, in particular on the connection branch of the network core with the final user, the access network. The main goal of the receiver design was to achieve a fast channel tuning, allowing a tuning time smaller than the required for the transmission of a single information packet, decreasing the tuning latency and, therefore, the rate of information packet loss. In order to accomplish this goal, the implemented and tested integrated circuits include the electronic switching circuit and the transimpedance amplifier for both configurations investigated. The measured data for both configurations confirm the expected input channel switching time results, of about a few nanoseconds, which is certainly useful for the expected bit rate of operation (approximate 5 Gbps). Additionally, experimental results concerning cutoff frequency and bandwidth, direct gain, isolation, on/off ratio, and noise characteristics of both implemented circuits are presented.

Ce travail répond à un besoin industriel accru en termes d’amplification des signaux sur porteuses à enveloppes variables utilisés par les systèmes de télécommunications actuels. Ces signaux disposent d’un fort PAPR et d’une distribution statistique d’enveloppe centrée en-deçà de la valeur crête d’enveloppe. La raison pour laquelle les industriels télécoms requièrent alors des amplificateurs de très fortes puissances de sortie, robustes, fiables et ayant une dépense énergétique optimale le long de la dynamique d’enveloppe associée à un niveau de linéarité acceptable. Ce document expose les résultats d’étude et de réalisation de deux Amplificateurs de Puissance Doherty (APD) à haut rendement encapsulés en boîtiers plastiques QFN. Le premier est un amplificateur Doherty symétrique classique (APD-SE) et le second est un amplificateur à deux entrées RF (APD-DE). Ces démonstrateurs fonctionnant en bande C sont fondés sur l’utilisation de la technologie Quasi-MMIC associant des barrettes de puissance à base des transistors HEMTs AlGaN/GaN sur SiC à des circuits d’adaptation en technologie ULRC. L’approche Quasi-MMIC associée à la solution d’encapsulation plastique QFN permettant une meilleure gestion des comportements thermiques offre des performances électriques similaires à celles de la technologie MMIC avec des coûts et des cycles de fabrication très attractifs. Durant ces travaux, une nouvelle méthode d’évaluation des transistors dédiés à la conception d’amplificateurs Doherty a été développée et mise en oeuvre. L’utilisation intensive des simulations électromagnétiques 2.5D et 3D a permis de bien prendre en compte les effets de couplages entre les différents circuits dans l’environnement du boîtier QFN. Les résultats des tests des amplificateurs réalisés fonctionnant sur une bande de 1GHz ont permis de valider la méthode de conception et ont montré que les concepts avancés associés à l’approche Quasi-MMIC ainsi qu’à des technologies d’encapsulation plastique, peuvent générer des fonctions micro-ondes innovantes. Les caractérisations de l’APD-DE ont relevé l’intérêt inhérent à la préformation des signaux d’excitation et des points de polarisation de chaque étage de l’amplificateur. / This work responds to an increased industrial need for on carrier signals with variable envelope amplification used by current telecommunications systems. These signals have a strong PAPR and an envelope statistical distribution centred below the envelope peak value, the reason why the telecom industrialists then require a robust and reliable high power amplifiers having an energy expenditure along of the envelope dynamics associated with an acceptable level of linearity. This document presents the results of the study and realization of two, high efficiency, Doherty Power Amplifiers (DPA) encapsulated in QFN plastic packages. The first is a conventional Doherty power Amplifier (DPA-SE) and the second is a dual-input Doherty power amplifier (DPA-DE). These C-band demonstrators are based on the use of Quasi-MMIC technology combining power bars based on the AlGaN/GaN transistors on SiC to matching circuits in ULRC technology. The Quasi-MMIC approach combined with Quasi-MMIC approach combined with QFN plastic package solution for better thermal behaviour management offers electrical performances similar to those of MMIC technology with very attractive coasts and manufacturing cycles. During this work, a new evaluation method for the transistors dedicated to the design of DPA was developed and implemented. The intensive use of 2.5D and 3D electromagnetic simulations made it possible to take into account the coupling effects existing between the different circuits in the QFN package environment. The results of the tests of the amplifiers realised and operating on 1GHz bandwidth validated the design method and showed that the advanced concepts associated with the Quasi-MMIC approach as well as plastic encapsulation technologies can generate innovative microwave functions. The characterizations of the DPA-DE have noted the interest inherent in the preformation of the excitation signals and the bias points of each stage of the amplifier.

The Asymmetric Spacer layer Tunnel (ASPAT) diode is a new diode invented in the early 90s as an alternative to the Schottky barrier diode (SBD) technology for microwave detector applications due to its highly stable temperature characteristics. The ASPAT features a strong non-linear I-V characteristic as a result of tunnelling through a thin barrier, which enables RF detection at zero bias from microwaves up to submillimetre wave frequencies. In this work, two heavily doped GaAs contact layer on top and bottom layers adjacent to lightly doped GaAs intermediate layers, enclose undoped GaAs spacers with different lengths sandwiching an undoped AlAs layer that acts as a tunnel barrier. The ultimate ambition of this work was to develop a MMIC detector as well as a frequency source based on optimized ASPAT diodes for millimetre wave (100GHz) applications. The effect of material parameter and dimensions on the ASPAT source performances was described using an empirical model for the first time. Since this is a new device, keys challenges in this work were to improve DC and RF characteristic as well as to develop a repeatable, reproducible, and ultimately manufacturable fabrication process flow. This was investigated using two approaches namely air-bridge and dielectric-bridge fabrication process flows. Through this work, it was found that the GaAs/AlAs heterostructures ASPAT diode are more amenable to the dielectric-bridge technique as large-scale fabrication of mesa area up to 4×4Âμm2 with device yields exceeding 80% routinely produced. The fabrication of the ASPAT using i-line optical lithography which has the capability to reduce emitter area to 4×4Âμm2 to lower down the device capacitance for millimetre wave application has been made feasible in this work. The former challenge was extensively studied through materials and structural characterisations by a SILVACO physical modelling and confirmed by comparison with experimental data. The I-V characteristic of the fabricated ASPAT demonstrated outstanding scalability, demonstrating robust processing. A fair comparison has been made between ASPAT and SBD fabricated in-house; indicating ASPAT is extremely stable to the temperature. The RF characterisations were carried out with the aid of Keysight ADS software. The DC characteristic from fabricated GaAs/AlAs ASPAT diodes were absorbed into an ADS simulation tool and utilized to demonstrate the performance of MMIC 100GHz detector as well as 20GHz/40GHz signal generators. Zero bias ASPAT with mesa area of 4×4Âμm2 with video resistance of 90KΩ, junction capacitance of 23fF and curvature coefficient of 23V-1 has demonstrated detector voltage sensitivity above 2000V/W, while the signal source conversion loss and conversion efficiency are 28dB and 0.3% respectively. An estimate noise equivalent power (NEP) for this particular device is 18.8pW/Hz1/2.

This thesis discusses the investigation and utilization of a new promising thin-film material, liquid crystal polymer (LCP), for microwave and millimeter-wave (mm-wave [>30 GHz]) components and packages. The contribution of this research is in the determination of LCP's electrical and mechanical properties as they pertain to use in radio frequency (RF) systems up to mm-wave frequencies, and in evaluating LCP as a low-cost substrate and packaging material alternative to the hermetic materials traditionally desired for microwave circuits at frequencies above a few gigahertz (GHz). A study of LCP's mm-wave material properties was performed. Resonant circuit structures were designed to find the dielectric constant and loss tangent from 2-110 GHz under both ambient and elevated temperature conditions. Several unique processes were developed for the realization of novel multilayer LCP-based RF circuits. These processes include thermocompression bonding with tight temperature control (within a few degrees Celsius), precise multilayer alignment and patterning, and LCP laser processing with three different types of lasers. A proof-of-concept design that resulted from this research was a dual-frequency dual-polarization antenna array operating at 14 and 35 GHz. Device characterization such as mechanical flexibility testing of antennas and seal testing of packages were also performed. A low-loss interconnect was developed for laser-machined system-level thin-film LCP packages. These packages were designed for and measured with both RF micro-electromechanical (MEM) switches and monolithic microwave integrated circuits (MMICs). These research findings have shown LCP to be a material with uniquely attractive properties/capabilities for vertically integrated, compact multilayer LCP circuits and modules.

Les composants hyperfréquences embarqués dans des satellites utilisent actuellement l'encapsulation hermétique dans des boîtiers métalliques ou céramiques. La très forte amélioration des matériaux organiques en termes de dégazage et d'impureté ionique notamment rend possible l'utilisation de solutions quasi-hermétiques pour l'environnement spatial. Les encapsulations plastiques ouvrent des perspectives avérées de gain de dimension et de coût. La validation d'une technologie d'encapsulation repose sur la réalisation d'essais de fiabilité normatifs (1000 heures à 85°C et 85% d'humidité relative). Ces essais sont applicables quels que soient le profil de stockage de la mission, le type d'encapsulation et la technologie des composants utilisés. Les conditions de réalisation de ces essais ne sont pas clairement définies, par exemple l'application ou pas d'un fort champ électrique au niveau du composant. Or ce seul paramètre devient prépondérant lorsque les conditions sont réunies pour permettre la mise en place de phénomènes de corrosion. Ces travaux de thèse se sont axés sur la compréhension des mécanismes de défaillance mis en jeu dans des tests de vieillissement accéléré en chaleur humide. Pour cela, une méthodologie a été mise en œuvre pour établir les signatures électriques en statique de composants défaillants de deux filières technologiques de MMICs GaAs. Ces tests ont été reproduits sur des composants avec et sans encapsulation par une résine époxyde chargée silice, déposée selon le procédé dam-and-fill. Ainsi, il a été possible de distinguer les défaillances liées à la dégradation intrinsèque des composants, de l'effet protecteur ou non de l'encapsulation plastique. En parallèle, le comportement d'échantillons de résines sous différentes ambiances de chaleur humide a été testé et une modélisation a été proposée pour prédire leur prise d'humidité. Concernant l'effet de l'encapsulation par dam-and-fill, les résultats obtenus ont été contradictoires et dépendant des lots de composants. Ces résultats sont à pondérer par la taille restreinte de l'échantillonnage des files de test. En effet, pour la technologie représentative de cette étude, la présence d'une encapsulation plastique, pour un premier lot de composants, a eu tendance d'une part, à ne pas éviter ni même retarder l'apparition de fuites électriques, et d'autre part à aggraver ces dégradations, au point de mener à des défaillances dans la majorité des cas. De plus, des doutes subsistent sur la qualité de ce lot, notamment celle de la passivation. Pour un second lot de composants testés de technologie identique, il a été observé une amélioration de la résistance à l'humidité des composants encapsulés, vis-à-vis des puces nues. L'analyse de défaillance des composants encapsulés est extrêmement difficile car il faut pouvoir accéder aux défauts à la surface, voire sous la surface, du composant protégé. Une solution alternative a donc été cherchée afin de contourner les problèmes posés par la présence du matériau d'encapsulation. La nouvelle approche proposée combine la thermographie infrarouge avec la méthode du point chaud, l'imagerie en optique et l'analyse aux rayons X. Le défaut est tout d'abord localisé par la face avant, malgré la présence de la résine d'encapsulation. Ensuite, la transparence du substrat GaAs aux infrarouges permet des observations par la face arrière du composant. Une méthodologie de préparation relativement simple et rapide a pu être proposée et sa faisabilité démontrée.