With increased focus on miniaturization and high performance in electronics, thermal management is a very important area of research today. In multiple applications such as portable electronics, consumer electronics, military applications, automobile, power electronics, high performance computing, etc. innovative thermal management strategies are necessary. In this work, two novel approaches to dissipate redundant heat better- first by novel carbonaceous-nanoparticle additives to develop thermal interface materials with superior performance and the second by using advanced metal additive manufacturing techniques to design and analyze metal-lattice based heat sinks are presented. Thermal Interface Materials with multiple carbon-based nanoparticle fillers such as coal-derived Multi Layered Graphene (MLG), standard reduced Graphene Oxide (rGO), Multi-Walled Carbon Nano Tubes (MWCNTs), and Graphene Nano-Platelets (GNPs) in thermal paste were synthesized and seen to have superior heat dissipation properties. Also, graphene was synthesized from coal through an in-house, facile, scalable and cost-effective process. The enhancement in thermal conductance varies from ~70% in the coal-MLG to ~14% in MWCNTs-based TIMs. Noteworthy is ~3.5 times larger enhancement in thermal performance with the in-house coal-derived-MLG as compared to the commercially available g-MLG. At a 3% wt. fraction of coal-MLG, enhancement in thermal conductance was almost 120% higher compared to the base thermal grease. In the second part, metal lattice-based heat sinks are designed for additive manufacturing for use in passive cooling of high-flux thermal management. A parametric optimization based on the lattice geometry, thickness, and height subject to additive manufacturing constraints is conducted. Intricate metal lattices with low mass based on the Simple Cubic, Octet, and Voronoi structures were generated by implicit modelling in nTopology® and their thermal performance was analyzed through numerical analysis using commercial CFD packages. The Voronoi lattice performed best with a significant improvement in thermal performance (~18% reduction in junction temperature difference with respect to ambient) as compared to a standard baseline Longitudinal heat Sink (LHS), while reducing the mass of the heat sink by ~2.1 times. Such optimized metal lattice-based heat sinks can lead to significant downsizing, reduction in overall mass and cost in applications where thermal management is critical with a need for low mass. We believe that such novel scalable materials and processes suited for mass production could be critical in meeting the material, design and product development needs to tackle the thermal management challenges of the future. / Master of Science / With increase in demand of high power and performance in electronics, there is a concurrent increase in redundant heat that needs to be dissipated. With enhanced focus and push towards electric vehicles, defense, consumer electronics, datacenter and supercomputing applications, electronics cooling is a critical area of research today. There are two primary resistances to heat- as it is removed from electronics package to the surrounding atmosphere – due to the thin layer of a material called Thermal Interface Material (TIM) at the interface between the heat sink and the package, and the resistance offered by the heat sink itself. In this work, a two-pronged approach for better cooling in electronics is presented. Firstly, carbon-based nano-sized particles are used to synthesize novel TIMs that provide superior heat transport capabilities as compared to a standard baseline. In the second approach, complex metal-lattice based heat sinks are designed for manufacturing with advanced techniques such as metal 3D printing. Multiple carbon-based nano-particle additives such as Multi Layered Graphene synthesized from coal (MLG), standard commercially available reduced Graphene Oxide (rGO), Multi-Walled Carbon Nano Tubes (MWCNTs), and Graphene Nano-Platelets (GNPs) are dispersed in thermal paste and all of the resulting composites were found to remove heat better from electronics packages. The improvement in this ability varies from ~70% in the coal-MLG to ~14% in MWCNTs-based TIMs. Noteworthy is ~3.5 times larger enhancement in the heat transport ability with the use of in-house coal-derived-MLG as compared to the commercially available g-MLG. At an 3% wt. fraction of coal-MLG, there was a 1.2x increase in thermal performance as compared to the base thermal grease. Also, it is significant to mention that MLG was synthesized from coal through an in-house, facile scalable and cost-effective process. In the second part, metal lattice-based heat sinks designed for metal 3D printing for use in passive cooling of electronics was investigated. Multiple geometric parameters such as the lattice type, thickness, and height subject to additive manufacturing constraints were studied. Intricate metal lattices with low mass based on three structures- Simple Cubic, Octet, and Voronoi were generated by implicit modelling, and their thermal performance was predicted by computer based-simulations using commercial CFD packages. The Voronoi lattice performed best with a significant reduction (~18%) in junction temperature difference with the surrounding atmosphere- as compared to a standard baseline rectangular heat sink design, while simultaneously reducing the mass of the heat sink by ~2.1 times. Such optimized metal lattice-based heat sinks can lead to significant reduction in overall mass, size, and cost in weight sensitive applications. We believe that such novel scalable materials, designs, and processes suited for mass production could be critical in meeting the material, design and product development needs to tackle the thermal management challenges of the near future.

As the integration scale of transistors/devices in a chip/system keeps increasing, effective cooling has become more and more important in microelectronics. To address the thermal dissipation issue, one important solution is to develop thermal interface materials with higher performance. Carbon nanotubes, given their high intrinsic thermal and mechanical properties, and their high thermal and chemical stabilities, have received extensive attention from both academia and industry as a candidate for high-performance thermal interface materials. The thesis is devoted to addressing some challenges related to the potential application of carbon nanotubes as thermal interface materials in microelectronics. These challenges include: 1) controlled synthesis of vertically aligned carbon nanotubes on various bulk substrates via chemical vapor deposition and the fundamental understanding involved; 2) development of a scalable annealing process to improve the intrinsic properties of synthesized carbon nanotubes; 3) development of a state-of-art assembling process to effectively implement high-quality vertically aligned carbon nanotubes into a flip-chip assembly; 4) a reliable thermal measurement of intrinsic thermal transport property of vertically aligned carbon nanotube films; 5) improvement of interfacial thermal transport between carbon nanotubes and other materials. The major achievements are summarized. 1. Based on the fundamental understanding of catalytic chemical vapor deposition processes and the growth mechanism of carbon nanotube, fast synthesis of high-quality vertically aligned carbon nanotubes on various bulk substrates (e.g., copper, quartz, silicon, aluminum oxide, etc.) has been successfully achieved. The synthesis of vertically aligned carbon nanotubes on the bulk copper substrate by the thermal chemical vapor deposition process has set a world record. In order to functionalize the synthesized carbon nanotubes while maintaining their good vertical alignment, an in situ functionalization process has for the first time been demonstrated. The in situ functionalization renders the vertically aligned carbon nanotubes a proper chemical reactivity for forming chemical bonding with other substrate materials such as gold and silicon. 2. An ultrafast microwave annealing process has been developed to reduce the defect density in vertically aligned carbon nanotubes. Raman and thermogravimetric analyses have shown a distinct defect reduction in the CNTs annealed in microwave for 3 min. Fibers spun from the as-annealed CNTs, in comparison with those from the pristine CNTs, show increases of ~35% and ~65%, respectively, in tensile strength (~0.8 GPa) and modulus (~90 GPa) during tensile testing; an ~20% improvement in electrical conductivity (~80000 S m⁻¹) was also reported. The mechanism of the microwave response of CNTs was discussed. Such an microwave annealing process has been extended to the preparation of reduced graphene oxide. 3. Based on the fundamental understanding of interfacial thermal transport and surface chemistry of metals and carbon nanotubes, two major transfer/assembling processes have been developed: molecular bonding and metal bonding. Effective improvement of the interfacial thermal transport has been achieved by the interfacial bonding. 4. The thermal diffusivity of vertically aligned carbon nanotube (VACNT, multi-walled) films was measured by a laser flash technique, and shown to be ~30 mm² s⁻¹ along the tube-alignment direction. The calculated thermal conductivities of the VACNT film and the individual CNTs are ~27 and ~540 W m⁻¹ K⁻¹, respectively. The technique was verified to be reliable although a proper sampling procedure is critical. A systematic parametric study of the effects of defects, buckling, tip-to-tip contacts, packing density, and tube-tube interaction on the thermal diffusivity was carried out. Defects and buckling decreased the thermal diffusivity dramatically. An increased packing density was beneficial in increasing the collective thermal conductivity of the VACNT film; however, the increased tube-tube interaction in dense VACNT films decreased the thermal conductivity of the individual CNTs. The tip-to-tip contact resistance was shown to be ~1×10⁻⁷ m² K W⁻¹. The study will shed light on the potential application of VACNTs as thermal interface materials in microelectronic packaging. 5. A combined process of in situ functionalization and microwave curing has been developed to effective enhance the interface between carbon nanotubes and the epoxy matrix. Effective medium theory has been used to analyze the interfacial thermal resistance between carbon nanotubes and polymer matrix, and that between graphite nanoplatlets and polymer matrix.

Carbon nanotube (CNT) forests have outstanding thermal, electrical, and mechanical properties, which have generated significant interest as thermal interface materials (TIMs). Some drawbacks to using CNTs as TIMs include poor substrate adhesion, high interface resistances inhibiting thermal transport, and lack of electrical insulation in electronic component applications. It is thus useful to be able to modify CNTs to reduce their electrical conductivity while maintaining high thermal conductivity and interface conductance, and high mechanical compliance. A recent report suggests that nanoscale oxide coatings could be applied to CNTs in forests without changing the mechanical deformation behavior of the forests. Oxide coatings could also provide environmental stability as well as better adhesion to the substrate compared to pristine CNT forests. In this study, we investigated thermal and electrical resistance of CNT forests with an oxide coating. Low-pressure chemical vapor deposition (LPCVD) was used to produce CNTs on high-conductivity Si substrates. Plasma-enhanced atomic layer deposition (PALD) was used to deposit Al2O3 on individual CNTs in forests. This process was facilitated by O2 plasma pretreatment to functionalize the surface of the CNTs and nucleate oxide growth. Several analytical techniques were used to characterize the CNT-oxide composites, including scanning electron microscopy, Raman and X-ray photoelectron spectroscopy. Thermal conductivity and thermal interface resistance were measured using a modified photoacoustic technique. The oxide coating had no significant effect on the effective thermal conductivity of the forests, in contrast to expectations of increased phonon scattering. Electrical resistivity measurements were made and a threefold increase was observed for the oxide-coated forests. This approach could emerge as a promising route to create a viable TIM for thermally conductive and electrically insulating applications.

<p>With the extreme increases in power density of electronic devices, the contact thermal resistance imposed at interfaces between mating solids becomes a major challenge in thermal management. This contact thermal resistance is mainly caused by micro-scale surface asperities (roughness) and wavy profile of surface (nonflatness) which severely reduce the contact area available for heat conduction. High contact pressures (1~100 MPa) can be used to deform the surface asperities to increase contact area. Besides, a variety of conventional thermal interface materials (TIM), such as greases and pastes, are used to improve the contact thermal conductance by filling the remaining air gaps. However, there are still some applications where such TIMs are disallowed for reworkability concerns. For example, heat must be transferred across dry interfaces to a heat sink in pluggable opto-electronic transceivers which needs to repeatedly slide into / out of contact with the heat sink. Dry contact and low contact pressures are required for this sliding application.</p> <p>This dissertation presents a metallized micro-spring array as a surface coating to enhance dry contact thermal conductance under ultra-low interfacial contact pressure. The shape of the micro-springs is designed to be mechanically compliant to achieve conformal contact between nonflat surfaces. The polymer scaffolds of the micro-structured TIMs are fabricated by using a custom projection micro-stereolithography (μSL) system. By applying the projection scheme, this method is more cost-effective and high-throughput than other 3D micro-fabrication methods using a scanning scheme. The thermal conductance of polymer micro-springs is further enhanced by metallization using plating and surface polishing on their top surfaces. The measured mechanical compliance of TIMs indicates that they can deform ~10s μm under ~10s kPa contact pressures over their footprint area, which is large enough to accommodate most of surface nonflatness of electronic packages. The measured thermal resistances of the TIM at different fabrication stages confirms the enhanced thermal conductance by applying metallization and surface polishing. Thermal resistances of the TIMs are compared to direct metal-to-metal contact thermal resistance for flat and nonflat mating surfaces, which confirms that the TIM outperforms direct contact. A thin layer of soft polymer is coated on the top surfaces of the TIMs to accommodate surface roughness that has a smaller spatial period than the micro-springs. For rough surfaces, the polymer-coated TIM has reduced thermal resistance which is comparable to a benchmark case where the top surfaces of the TIM are glued to the mating surface. A polymer base is designed under the micro-spring array which can provide the advantages for handling as a standalone material or integration convenience, at the toll of an increased insertion resistance. Through-holes are designed in the base layer and coated with thermally conductive metal after metallization to enhance thermal conductance of the base layer; a thin layer of epoxy is applied between the base layer and the working surface to reduce contact thermal resistance exposed on the base layer. Cycling tests are conducted on the TIMs; the results show good early-stage reliability of the TIM under normal pressure, sliding contact, and temperature cycles. The TIM is thermally demonstrated on a pluggable application, namely, a CFP4 module, which shows enhanced thermal conductance by applying the TIM. </p> To further enhance the potential mechanical compliance of microstructured surfaces, a stable double curved beam structure with near-zero stiffness composed of intrinsic negative and positive stiffness elastic elements is designed and fabricated by introducing residual stresses. Stiffness measurements shows that the positive-stiffness single curved beam, which is the same as the top beam in the double curved beam, is stiffer than the double curved beam, which confirms the negative stiffness of the bottom beam in the double curved beam. Layered near zero-stiffness materials made of these structures are built to demonstrate the scalability of the zero-stiffness zone.

<p dir="ltr">Non-Newtonian fluid models such as the Bingham and Herschel-Bulkley models are used to characterize the flow behavior of many complex fluids and soft solids. The three parameter Herschel-Bulkley model captures the yield stress behavior and the nonlinear power law behavior. In this thesis, the semi-analytical solution of Herschel-Bulkley fluids provided by Covey and Stanmore is used to experimentally characterize the squeeze flow behavior. A ‘Squeeze Flow and Thermal Resistance Tester’ was custom designed to perform velocity controlled squeeze flow experiments. The tester has an additional capability of performing thermal resistance characterization adhering to the ASTM-D5470 standard. A novel framework is described for characterizing the three Herschel-Bulkley parameters (τy, n and ηHB) using the developed tester. </p><p dir="ltr">Thermal Interface Materials (TIMs) are used to efficiently dissipate heat from a heat generating component to a heat sink in an electronic package. Thermal grease is a type of TIM comprising of a base material (e.g. polymer) loaded with highly conducting filler particles (e.g, boron nitride, alumina or sometimes conducting metals such as aluminum or silver). These greases are expected to exhibit Herschel-Bulkley flow behavior. Hence, thermal greases are used as candidate materials for squeeze flow characterization. In addition to the flow characterization, the thermal resistance across these thermal greases are also characterized using the custom designed tester. Characterization of mechanical and thermal behavior of TIMs is crucial to predicting their long-term reliability. </p><p dir="ltr">The effect of in-situ isothermal baking duration and test temperature on flow behavior is studied. The increase in duration of isothermal baking at test temperature of 55◦C showed that the material tends to stiffen with baking duration. The increase in test temperature from 5◦C to 100◦C resulted in a decrease in the power law index n and viscosity ηHB. </p><p dir="ltr">Finally, a numerical simulation strategy for performing squeeze flow simulations is described. The characterized flow parameters from the squeeze flow experiments were used as input material parameters for a dynamic mesh-based numerical simulation of squeeze flow between parallel surfaces. The results of the experimental force response and numerical simulation results were compared and found to be in close agreement. In order to simulate flow of thermal greases in a package undergoing deformation, a non-flat test setup was fabricated and squeeze experiments were performed. Numerical simulations were subsequently performed for the non-flat surface using material parameters extracted from previous experiments and the results were compared. The results from both experiments and numerical simulations showed that the force response of thermal greases under non-flat surfaces was significantly higher than the planar case.</p>

No description available.

Die fortschreitende Miniaturisierung von elektronischen Systemen begleitet von steigender Leistung und Funktionalität führt zur Erhöhung der Leistungsdichte. Um diesem Trend zu entsprechen, werden neue Entwärmungskonzepte benötigt, die wiederum neuartige Materialien und Materialverbünde fordern. Ein wichtiger Aspekt dieser Arbeit ist deshalb die Konzentration auf die für den Wärmetransport entscheidenden Materialien. Diese Arbeit befasst sich mit der Entwicklung von Methoden für die umfassende thermische Charakterisierung von den verschiedenen Materialien und Materialklassen, die in der Elektronikindustrie verwendet werden. Die Messsysteme wurden so entworfen und entwickelt, dass spezifische Anwendungsbedingungen berücksichtigt werden können, keine aufwändige Probenherstellung notwendig ist und gleichzeitig eine hohe Messgenauigkeit gewährleistet ist. Es wurden vier verschiedene Messsysteme innerhalb dieser Arbeit entwickelt und realisiert, die in ihrer Gesamtheit die Charakterisierung von fast allen Package-Materialien unter gewünschten Randbedingungen ermöglichen. Zahlreiche Materialien und Effekte wurden daraufhin im Rahmen dieser Arbeit mit den entwickelten Messsystemen untersucht und diskutiert. / The continuous miniaturization of electronic systems accompanied by increasing performance and functionality leads to an increase in power density. In order to comply this trend, new heat dissipation concepts are needed which demand new materials and material composites. An important aspect of this work is therefore the concentration on the materials that are decisive for the heat flow. This thesis deals with the development of Methods for comprehensive thermal characterization of the different materials and material classes used in the electronics industry. The measuring systems have been designed and developed in such a way that they enable to take into account specific application conditions, no costly sample preparation is necessary and at the same time high measuring accuracy is ensured. Four different measuring systems were developed and realized within this work, which, in their entirety, enable the characterization of almost all package materials under desired boundary conditions. Based on this, numerous materials and effects were investigated and discussed in the context of this work with the developed measurement systems.

Dans le cadre des applications transports, et plus particulièrement de "l’avion plus électrique", avec une demande toujours plus présente de réduction d’encombrement et de poids, la tendance est à l’intégration de plus en plus poussée des convertisseurs statiques. L’augmentation de leur densité de puissance et celle des contraintes thermiques, induites par l’environnement dans lequel ces structures sont localisées, deviennent de plus en plus critiques. La gestion thermique de ces dispositifs est assurée par des systèmes de refroidissement sur lesquels sont montés les composants semi-conducteurs via un matériau d’interface thermique. Une gestion performante sera obtenue par la diminution de la résistance thermique globale entre les éléments dissipatifs et le milieu ambiant grâce en autre à l’amélioration du système de refroidissement et des propriétés thermiques des matériaux constituant le module. Or cette interface est un point délicat du transfert de chaleur car elle peut représenter plusieurs dizaines de pourcents de la résistance thermique globale. Elle nécessite donc une connaissance approfondie de son comportement aux sollicitations thermiques. Après un état de l’art sur les matériaux d’interfaces thermiques et les méthodes de caractérisation des propriétés thermophysiques des matériaux, nous proposons la mise en œuvre d’outils expérimentaux et mathématiques permettant de suivre l’éventuelle évolution de matériaux d’interfaces utilisés en électronique de puissance au cours d’un vieillissement par cyclage en température. Pour cela, deux méthodes sont présentées. La première repose sur la mesure de la résistance thermique des interfaces en régime stationnaire avec un transfert de chaleur monodimensionnel alors que la seconde, basée sur une caractérisation transitoire thermique d’un système, permet d’en identifier les constantes de temps et le réseau Résistance-Capacité du système testé. Des travaux de simulations numériques ont été menés sur les deux types de bancs expérimentaux, d’un côté pour pouvoir évaluer les pertes thermiques latérales du banc statiques, de l’autre côté pour montrer qu’il est bien possible de détecter une variation de la résistance thermique d’un matériau d’interface par l’analyse de l’impédance thermique. / In the context of transportation applications, and especially the "more electric aircraft", with an ever present demand for space and weight reduction, the trend is to integrate more extensive of static converters. The increase in power density and the thermal stresses induced by the environment in which these structures are located, are becoming increasingly critical. Thermal management of these devices is provided by cooling systems on which are mounted the semiconductor components via a thermal interface material. Effective management will be achieved by reducing the overall thermal resistance between the dissipative elements and the environment by improving the cooling system and thermal properties of the materials constituting the module. However, this interface is a delicate point of heat transfer because it can represent several tens of percent of the circuit total thermal resistance. It therefore requires a thorough knowledge of their behavior in thermal stresses. After a state of the art on the thermal interface materials and methods for characterizing thermophysical properties of materials, we propose the implementation of experimental and mathematical tools to monitor any change of interface materials used in power electronics during aging by temperature cycling. For this, two methods are presented. The first is based on the measurement of the thermal resistance of the interfaces with a steady one-dimensional heat transfer, while the second, based on a characterization of a transient thermal system, allows to identify the time constants and the resistor and capacitor network of the tested system. Numerical simulations were carried out on two types of experimental benches, on one side in order to assess the lateral heat losses from static bench, on the other side to show that it is possible to detect a change in the thermal resistance of a TIM with the analysis of the thermal impedance.

Thermal management is a major bottleneck for the next-but-one generation of semiconductor devices, especially the performance of SiC and GaN devices is limited by heat dissipation. This thesis evaluates four new packaging concepts with regards to thermal management: Diamond based substrates, phase change materials, Cu-Graphene composite films and anisotropic heat dissipation. Anisotropic heat dissipation is shown to be the most auspicious concept. A metal-matrix composite baseplate for a high performance power module using annealed pyrolytic graphite is created and evaluated. The baseplate shows a locally increased heat dissipation compared to a plain metal baseplate by 30 %. Furthermore, the thermal contact between device (baseplate) and cooler is of high importance. A study of different characterization methods for thermal interface materials is performed and a new method for the quantification of the thermal contact conductance is presented. The study shows that a combination of several methods is necessary so that the complete picture of heat dissipation performance of thermal interface materials becomes apparent. The new developed method allows to select the perfect thermal grease for a given combination of device and cooler. / Wärmemanagement ist eine große Herausforderung sowohl für aktuelle als auch für zukünftige Halbleiterprodukte. Speziell die nächste Produktgeneration mit SiC oder GaN Chips benötigen neue Entwärmungskonzepte, um ihr volles Potential bezüglich höherer Stromstärken zu entfalten. In dieser Arbeit wurden vier neuartige Konzepte erforscht: Diamant basierte Substrate, Phasen-Wechsel-Materialien, Cu-Graphene Kompositschichten und anisotrope Entwärmung. Es zeigte sich, dass anisotrope Entwärmung das vielversprechendste Konzept ist. Als Demonstrator wurde eine Bodenplatte mit thermisch pyrolytischen Graphiteinleger für ein Leistungsmodul gefertigt. Sie zeigt eine lokale Erhöhung der Entwärmung von 30 %. Weiter ist der thermische Kontakt zwischen Bauteil und Kühler sehr wichtig. Verschiedene Charakterisierungsmethoden für thermische Schnittstellen-Materialien wurden verglichen. Dieser Vergleich zeigt, dass eine Kombination verschiedener Methoden notwendig ist, um ein vollständiges Bild über die Leistungsfähigkeit solcher Materialien zu gewinnen. Eine neue Messmethode wurde entwickelt, um die thermische Kontakt-Leitfähigkeit zu messen. Diese neue Methode ermöglicht es, die beste Wärmeleitpaste für eine vorgegebene Kombination aus Produkt und Kühleroberfläche zu identifizieren.

The electronic market is continually moving towards higher power densities. As a result, the demand on the cooling is increasing. Focus has to be put on the whole thermal management chain, from the component to be cooled to the ambient. Thermal interface materials are used to efficiently transfer heat between two mating surfaces or in some cases across larger gaps. There are several different thermal interface materials with various application areas, advantages and disadvantages. This study aimed to evaluate thermal and mechanical properties of graphite sheets and graphite gap pads. The work was done in cooperation with Ericsson AB. A test rig based on the ASTM D5470 standard was used to measure the thermal resistance and thermal conductivity of the materials at different pressures. It was found that several graphite sheets and gap pads performed better than the materials used in Ericsson’s products today. According to the tests, the thermal resistance could be reduced by about 50 % for the graphite sheets and 90 % for the graphite gap pads. That was also verified by placing the materials in a radio unit and comparing the results with a reference test. Both thermal values and mechanical values were better than for the reference materials. However, the long term reliability of graphite gap pads could be an issue and needs to be examined further. / Elektronikbranschen rör sig mot högre elektriska effektertätheter, det vill säga högre effekt per volymenhet. Som en följd av detta ökar också efterfrågan på god kylning. Kylningen måste hanteras på alla nivåer, från komponenten som ska kylas, ända ut till omgivningen. Termiska interface material (TIM) används för att förbättra värmeöverföringen mellan två ytor i kontakt med varandra eller för att leda värmen över större gap. Det finns flera olika TIM med olika tillämpningsområden, fördelar och nackdelar. Denna studie gick ut på att utvärdera termiska och mekaniska egenskaper hos grafitfilmer och så kallade ”graphite gap pads” då de används som TIM. Projektet gjordes i sammarbete med Ericsson AB. En testuppställning baserat på ASTM D5470-standarden användes för att utvärdera värmeledningsförmågan och den termiska resistansen hos de olika materialen vid olika trycknivåer. Resultaten visade att flera grafitfilmer och ”gap pads” presterade bättre än materialen som används Ericssons produkter idag. Enligt testerna skulle den termiska resistansen kunna minskas med 50 % för grafitfilmerna och 90 % för ”gap padsen”. Materialens fördelaktiga egenskaper verifierades i en radioenhet där temperaturerna kunde sänkas i jämförelse med ett referenstest med standard-TIM. De nya materialen var mjukare än referensmaterialen och skulle därför inte orsaka några mekaniska problem vid användning.  Den långsiktiga tillförlitligheten för grafitbaserade ”gap pads” måste dock undersökas vidare eftersom de elektriskt ledande materialen skulle kunna skapa kortslutningar på kretskorten.