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This paper demonstrates conversion of an analog filter into a digital filter using computer aided software. The filter design to be demonstrated is a common third order Butterworth filter. This paper is not an attempt to review all filter designs or applications, but rather the attempt is to give a detailed explanation of the steps required to design almost any digital filter. No knowledge of the Intel Series 210 microcomputer development system is assumed. The appendices contain introduction to the Series 210 system. Chapter I demonstrates the steps needed to design this filter without computer aid. Included are both analog and digital filter response characteristics. Chapter II supplemented with Appendix C demonstrates the computer aided filter design. Again, filter characteristics are included. Chapter III compares the results of Chapter I and II. Even though this paper attempts to be inclusive of most of the computer details, it should not be used in exclusion of the available Series 210 manuals.

On chip Built In Self Test (BIST) is a cost-effective test methodology for highly complex VLSI devices like Systems On Chip (SoC). This work deals with cost-effective BIST methods and Test Pattern Generation (TPG) schemes in BIST for fault detection and diagnosis of analog circuits. Fault-based testing is used in analog domain due to the applicable test methods/ techniques being general and cost-effective. We propose a novel test method causing the Device Under Test (DUT) to saturate or get out of saturation to detect a fault with simple detection hardware. The proposed test method is best suited for use of existing building blocks in Systems-on-Chip (SoC) for implementation of an on-chip test signal generator and test response analyzer. Test generation for a fault in analog circuit is a compute intensive task. A good test generator produces a highly compact test set with less computational effort without trading the fault coverage. In this context, three new test generation methods viz., MultiDetect, ExpoTan, and MultiDiag for testing analog circuits are presented in this thesis. Testing of analog blocks based on circuit transfer function makes the proposed ATPG methods as general-purpose methods for all kinds of LTI circuits. The principle of MultiDetect method, (i.e., selecting a test signal for which the output amplitude difference between good and faulty circuits is minimum when compared to other test signals in an initial test set), helps in the generation of high quality compacted test set with less fault simulations. The experimental results show that the testing of LTI circuits using MultiDetect technique for the benchmark circuits achieves the required fault coverage with much shorter testing time. The generated test set with MultiDetect method can effectively detect both soft and hard faults and does not require any precision analog signal sources or signal measurement circuits when implemented as Built In Self Test (BIST). Test generation for a list of faults and test set compaction are two different phases in an ATPG process. To build an efficient ATPG, these two phases need to be combined with a technique such that the generated test set is highly compact and efficient with less fault simulations. In this context, a novel test set selection technique known as ExpoTan for testing Linear Time Invariant (LTI) circuits is also presented in this thesis. The test generation problem is formulated with tan-1( ) and exponential functions for identification of a test signal with maximum fault coverage. Identification of a sinusoid that detects more faults results in an optimized test signal set. Fault diagnosis and fault location in analog circuits are of fundamental importance for design validation and prototype characterization in order to improve yield through design modification. In this context, we propose a procedure viz., MultiDiag for generation of a test set for analog fault diagnosis. The analog test generation methods, viz., Max, Rand, and MultiDetect etc., which are based on sensitivity analysis, may fail at times to identify a test signal for locating a fault; because the search for a test signal using these test generation methods is restricted to the limited test signals set. But, the MultiDiag method definitely identifies a test signal, if one exists, for locating a fault.

A scheme for Built-in-Self-Test (BIST) of analog signals with minimal area overhead, for measuring on-chip voltages in an all-digital manner is presented in this thesis. With technology scaling, the inverter switching times are becoming shorter thus leading to better resolution of edges in time. This time resolution is observed to be superior to voltage resolution in the face of reducing supply voltage and increasing variations as physical dimensions shrink. In this thesis, a new method of observability of analog signals is proposed, which is digital-friendly and scalable to future deep sub-micron (DSM) processes. The low-bandwidth analog test voltage is captured as the delay between a pair of clock signals. The delay thus setup is measured digitally in accordance with the desired resolution. Such an approach lends itself easily to distributed manner, where the routing of analog signals over long paths is minimized. A small piece of circuitry, called sampling head (SpH) placed near each test voltage, acts as a transducer converting the test voltage to a delay between a pair of low-frequency clocks. A probe clock and a sampling clock is routed serially to the sampling heads placed at the nodes of analog test voltages. This sampling head, present at each test node consists of a pair of delay cells and a pair of flip-flops, giving rise to as many sub-sampled signal pairs as the number of nodes. To measure a certain analog voltage, the corresponding sub-sampled signal pair is fed to a Delay Measurement Unit (DMU) to measure the skew between this pair. The concept is validated by designing a test chip in UMC 130 nm CMOS process. Sub-mV accuracy for static signals is demonstrated for a measurement time of few milliseconds and ENOB of 5.29 is demonstrated for low bandwidth signals in the absence of sample-and-hold circuitry. The sampling clock is derived from the probe clock using a PLL and the design equations are worked out for optimal performance. To validate the concept, the duty-cycle of the probe clock, whose ON-time is modulated by a sine wave, is measured by the same DMU. Measurement results from FPGA implementation confirm 9 bits of resolution.

This thesis presents a study on solutions to high-speed analog-to-digital conversion in CMOS image sensors using time-interpolation methods. Data conversion is one of the few remaining speed bottlenecks in conventional 2D imagers. At the same time, as pixel dark current continues to improve, the resolution requirements on imaging data converters impose very high system-level design challenges. The focus of the presented investigations here is to shed light on methods in Time-to-Digital Converter interpolation of single-slope ADCs. By using high-factor time-interpolation, the resolution of single-slope converters can be increased without sacrificing conversion time or power. This work emphasizes on solutions for improvement of multiphase clock interpolation schemes, following an all-digital design paradigm. Presented is a digital calibration scheme which allows a complete elimination of analog clock generation blocks, such as PLL or DLL in Flash TDC-interpolated single-slope converters. To match the multiphase clocks in time-interpolated single-slope ADCs, the latter are generated by a conventional open-loop delay line. In order to correct the process voltage and temperature drift of the delay line, a digital backend calibration has been developed. It is also executed online, in-column, and at the end of each sample conversion. The introduced concept has been tested in silicon, and has showed promising results for its introduction in practical mass-production scenarios. Methods for reference voltage generation in single-slope ADCs have also been looked at. The origins of error and noise phenomenona, which occur during both the discrete and continuous-time conversion phases in a single-slope ADC have been mathematically formalized. A method for practical measurement of noise on the ramp reference voltage has also been presented. Multiphase clock interpolation schemes are difficult for implementation when high interpolation factors are used, due to their quadratic clock phase growth with resolution. To allow high interpolation factors a time-domain binary search concept with error calibration has been introduced. Although the study being conceptual, it shows promising results for highly efficient implementations, if a solution to stable column-level unit delays can be found. The latter is listed as a matter of future investigations.

Field-programmable analog arrays (FPAAs) provide a method for rapidly prototyping analog systems. Currently available commercial and academic FPAAs are typically based on operational amplifiers (or other similar analog primitives) with only a few computational elements per chip. While their specific architectures vary, their small sizes and often restrictive interconnect designs leave current FPAAs limited in functionality, flexibility, and usefulness. Recent advances in the area of floating-gate transistors have led to an analog technology that is very small, accurately programmable, and extremely low in power consumption. By leveraging the advantages of floating-gate devices, a large-scale FPAA is designed that dramatically advances the current state of the art in terms of size, functionality, and flexibility. A large-scale FPAA is used as part of a mixed-signal prototyping platform to demonstrate the viability and benefits of cooperative analog/digital signal processing. This work serves as a roadmap for future FPAA research. While current FPAAs can be compared with the small, relatively limited, digital, programmable logic devices (PLDs) of the 1970s and 1980s, the floating-gate FPAAs introduced here are the first step in enabling FPAAs to support large-scale, full-system prototyping of analog designs similar to modern FPGAs.

Commercialization of infrared (IR) vision is of vital importance for many applications, such as automobile and health care. The main obstacle in front of the further spread of this technology is the high price. The cost reduction is achieved by placing on-chip electronics and diminishing the camera size, where one of the important components is the analog-to-digital converter (ADC). This thesis reports the design of a successive approximation register (SAR) ADC for low-cost microbolometers and its test electronics. Imaging ADCs are optimized only for the specific application in order to achieve the lowest power, yet the highest performance. The successive approximation architecture is chosen, due to its low-power, small-area nature, high resolution potential, and the achievable speed, as the ADC needs to support a 160x120 imager at a frame rate of 25 frames/sec (fps). The resolution of the ADC is 14 bit at a sampling rate of 700 Ksample/sec (Ksps). The noise level is at the order of 1.3 LSBs. The true resolution of the ADC is set to be higher than the need of the current low-cost microbolometers, so that it is not the limiting factor for the overall noise specifications. The design is made using a 0.18&micro / m CMOS process, for easy porting of design to the next generation low-cost microbolometers. An optional dual buffer approach is used for improved linearity, a modified, resistive digital-to-analog converter (DAC) is used for enhanced digital correction, and a highly configurable digital controller is designed for on-silicon modification of the device. Also, a secondary 16-bit high performance ADC with the same topology is designed in this thesis. The target of the high resolution ADC is low speed sensors, such as temperature sensors or very small array sizes of infrared sensors. Both of the SAR ADCs are designed without switched capacitor circuits, the operation speed can be minimized as low as DC if an extremely low power operation is required. A compact test setup is designed and implemented for the ADC. It consists of a custom designed proximity card, an FPGA card, and a PC. The proximity card is designed for high resolution ADC testing and includes all analog utilities such as voltage references, voltage regulators, digital buffers, high resolution DACs for reference generation, voltage buffers, and a very high resolution &Delta / -&Sigma / DAC for input voltage generation. The proximity card is fabricated and supports automated tests, because many components surrounding the ADC are digitally controllable. The FPGA card is selected as a commercially available card with USB control. The full chip functionalities and performances of both ADCs are simulated. The complete layouts of both versions are finished and submitted to the foundry. The ADC prototypes consist of more than 7500 transistors including the digital circuitry. The power dissipation of the 16-bit ADC is around 10mW, where the 14-bit device consumes 30mW. Each of the dies is 1mm x 5mm, whereas the active circuits occupy around 0.5mm x 1.5mm silicon area. These chips are the first steps in METU for the realization of the digital-in digital-out low cost microbolometers and low cost sensors.