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Compared to wafer based solar cells, thin film solar cells greatly reduce material cost and thermal budget due to low temperature process. Monolithically manufacturing allows large area fabrication and continuous processing. In this work, several photovoltaic thin films have been developed by rf-PECVD including a-Si:H and μc-Si, both intrinsic and doped on Corning 4 inch glass substrate at low temperature. The conductivity of n type and p type μc-Si at 180ºC was 17S/cm and 7.1E-2S/cm, respectively. B dopants either in a-Si:H or μc-Si films require higher plasma power to get active doping. The B2H6-to-SiH4 flow ratio for p type μc-Si lies from 0.01 to 0.025. Chamber conditions have critical effect on film quality. Repeatable and superior results require a well-established cleaning passivation procedure. Moreover, μc-Si films have been deposited from pure silane on glass substrate by modified rf-ICP-CVD. The deposition rate has been dramatically increased to 5Å/s due to little H2 dilution with crystalline fraction was around 69%, and 6.2Å/s with crystalline fraction 45%. Microstructure started to form at 150ºC with a thin incubation layer on the glass substrate, and became fully dense conical conglomerates around 300nm where conductivity and crystallinity saturated. Additionally, a-SiGe:H films have been developed by modified rf-ICP-CVD. The optical band gaps have been varied from 1.25 to 1.63eV by changing SiH4-to-GeH4 ratio. Also high temperature resulted in low bandgap. Cross-section TEM showed some microcrystllites appeared near interface region. Heterojunction solar cells on p type c-Si wafer have been fabricated using films developed in this thesis. Interference fringes in EQE disappeared on either textured substrate or cells with lift-off contacts. Maximum EQE was 87% around 700nm. I-V curves have also been studied where the interesting kink suggests a counter-diode has formed between emitter region and contacts.

Low-frequency noise (LFN) is characterized using in-house measurement systems in a variety of SiGe HBT generations. As technology scales to improve the performance and integration level, a large low-frequency noise variation in small geometry SiGe HBTs is first observed in 90 GHz peak fT devices. The fundamental mechanism of this geometry dependent noise variation is thought to be the superposition of individual Lorentzian spectra due to the presence of G/R centers in the device. The observed noise variation is the result of a trap quantization effect, and is thus best described by number fluctuation theory rather than mobility fluctuation theory. This noise variation continues to be observed in 120 GHz and 210 GHz peak fT SiGe HBT BiCMOS technology. Interestingly, the noise variation in the 210 GHz technology generation shows anomalous scaling behavior below about 0.2-0.3um2 emitter geometry, where the noise variation rapidly decreases. Data shows that the collector current noise is no longer masked by the base current noise as it is in other technology generations, and becomes the dominant noise source in these tiny 210 GHz fT SiGe HBTs. The proton response of LFN in SiGe HBTs is also investigated in this thesis. The results show that the relative increase of LFN is minor in transistors with small emitter areas, but significant in transistors with large emitter areas after radiation. A noise degradation model is proposed to explain this observed geometry dependent LFN degradation. A 2-D LFN simulation is applied to SiGe HBTs for the first time in order to shed light on the physical mechanisms responsible for LFN. A spatial distribution of base current noise and collector current noise reveals the relevant importance of the physical locations of noise sources. The impact of LFN in SiGe HBTs on circuits is also examined. The impact of LFN variation on phase noise is demonstrated, showing VCOs with small geometry devices have relatively large phase noise variation across samples.

The objective of the proposed work is to study the behavior of SiGe HBTs at cryogenic temperatures and its relation to device scaling and optimization. Not only is cryogenic operation of these devices required by space missions, but characterizing their cryogenic behavior also helps to investigate the performance limits of SiGe HBTs and provides essential information for further device scaling. Technology computer aided design (TCAD) and sophisticated on-wafer DC and RF measurements are essential in this research. Drift-diffusion (DD) theory is used to investigate a novel negative differential resistance (NDR) effect and a collector current kink effect in first-generation SiGe HBTs at deep cryogenic temperatures. A theory of positive feedback due to the enhanced heterojunction barrier effect at deep cryogenic temperatures is proposed to explain such effects. Intricate design of the germanium and base doping profiles can greatly suppress both carrier freezeout and the heterojunction barrier effect, leading to a significant improvement in the DC and RF performance for NASA lunar missions. Furthermore, cooling is used as a tuning knob to better understand the performance limits of SiGe HBTs. The consequences of cooling SiGe HBTs are in many ways similar to those of combined vertical and lateral device scaling. A case study of low-temperature DC and RF performance of prototype fourth-generation SiGe HBTs is presented. This study summarizes the performance of all three prototypes of these fourth-generation SiGe HBTs within the temperature range of 4.5 to 300 K. Temperature dependence of a fourth-generation SiGe CML gate delay is also examined, leading to record performance of Si-based IC. This work helps to analyze the key optimization issues associated with device scaling to terahertz speeds at room temperature. As an alternative method, an fT -doubler technique is presented as an attempt to reach half-terahertz speeds. In addition, a roadmap for terahertz device scaling is given, and the potential relevant physics associated with future device scaling are examined. Subsequently, a novel superjunction collector design is proposed for higher breakdown voltages. Hydrodynamic models are used for the TCAD studies that complete this part of the work. Finally, Monte Carlo simulations are explored in the analysis of aggressively-scaled SiGe HBTs.

This thesis explores the critical advantages of using silicon-germanium (SiGe) HBTs for RF front-end design. The first chapter looks at the SiGe BiCMOS technology platform and its important performance metrics. The second chapter discusses ultra-wide tuneability and the critical role that this functionality can have on real world applications. The third chapter presents simulated and measured results of two wideband ring oscillators (8-18 GHz) designed and fabricated in the Jazz 120 BiCMOS platform. A 7-22 GHz wideband VGA in the 8HP platform is also presented further exemplifying the wideband capabilities of SiGe HBTs.

This thesis describes the architecture, verification, qualification, and packaging of a 16-channel silicon-germanium (SiGe) Remote Electronics Unit (REU) designed for use in extreme environment applications encountered on NASA's exploration roadmap. The SiGe REU was targeted for operation outside the protective electronic "vaults" in a lunar environment that exhibits cyclic temperature swings from -180ºC to 120ºC, a total ionizing dose (TID) radiation level of 100 krad, and heavy ion exposure (single event effects) over the mission lifetime. The REU leverages SiGe BiCMOS technological advantages and design methodologies, enabling exceptional extreme environment robustness. It utilizes a mixed-signal Remote Sensor Interface (RSI) ASIC and an HDL-based Remote Digital Control (RDC) architecture to read data from up to 16 sensors using three different analog channel types with customizable gain, current stimulus, calibration, and sample rate with 12-bit analog-to-digital conversion. The SiGe REU exhibits excellent channel sensitivity throughout the temperature range, hardness to at least 100 krad TID exposure, and single event latchup immunity, representing the cutting edge in cold-capable electronic systems. The SiGe REU is the first example within a potential paradigm shift in space-based electronics.

In this thesis, the circuits which comprise the front-end of a millimeter-wave transmit-receive module are investigated using a state-of-the-art 90 nm SiGe BiCMOS process for use in radar remote sensing applications. In Chapter I, the motivation for a millimeter-wave radar in the context of space-based remote sensing is discussed. In addition, an overview of Silicon-germanium technology is presented, and the chapter concludes with a discussion of design challenges at millimeter-wave frequencies. In Chapter II, a brief history of radar technology is presented - the motivations leading to the development of the transmit-receive module for active electronically scanned arrays are discussed, and the critical components which reside in nearly every high-frequency transmit-receive module are introduced. In Chapter III, the design and results of a W-band single-pole, double-throw switch using SiGe p-i-n diodes are discussed. In particular, the design topology and methods used to achieve low-loss and high power handling over a wide matching bandwidth without sacrificing isolation are described. In Chapter IV, the design and results of a W-band low-noise amplifier using SiGe HBT's are discussed. The design methodologies used to achieve high gain and exceptional noise performance over a wide matching bandwidth are described. Concluding remarks and a discussion of future work are in Chapter V.

The objective of the research in this dissertation is to demonstrate the viability of using silicon-germanium (SiGe) bipolar/complementary metal-oxide semiconductor (BiCMOS) technologies in novel high-speed, high-performance wireless and wireline applications. These applications include self-healing integrated systems, W-Band phased array radar systems, and multi-gigabit wireline transceiver systems. The contributions from this research are summarized below: 1. Design of a wideband 8-18 GHz signal source with the best reported tuning range and die area combination for self-healing applications [95]. 2. Design of a robust, multi-band 8-10/ 16-20 GHz signal source with amplitude-locking for self-healing applications. A figure-of-merit (FoM) is proposed that combines tuning range and die area, and this work achieves the best FoM compared with state-of-the art [51]. 3. First ever reported on-die healing of image-rejection ratio of an 8-18 GHz mixer integrated with the multi-band test signal source [52], [96]. 4. Design of a 94 GHz differential Colpitts oscillator with 14% tuning range that spans 86-99 GHz for phased-array radar systems. 5. Identification of technology platform related bottlenecks in multi-gigabit wireline systems. A novel study of linearity of switching transistors in a current-mode logic (CML) gate. 6. A novel FoM that can be used to predict large-signal CML delay using small-signal Y-parameter techniques [97].

Elemental semiconductors like silicon and germanium have been used since the beginning of the electronics industry. Silicon has dominated research and production and thus silicon based devices can be produced at the lowest cost using the most mature technology. While dopants can be used to tailor the electric properties of the semiconductor within certain limits, more flexibility is gained using compound semiconductors such as silicon-germanium. The electric properties of a compound semiconductor are highly dependant on the composition, which in turn is influenced by the dissolution reaction and flow characteristics during the growth process. Liquid phase diffusion (LPD) is a solution growth technique that has been proposed to grow silicon-germanium seed crystals for other growth techniques. The dissolution of silicon is a limiting factor for the growth rate in LPD and also Bridgman growth techniques. Investigation of the dissolution process is aimed at increasing the growth rate while still maintaining maximum uniformity of the crystal composition. To accomplish this, a static magnetic field was utilized in experiments done by Armour. The experimental results showed that a top seeded configuration without magnetic fields leads to a diffusion driven process and homogeneous dissolution, while the addition of a strong 0.8 Tesla magnetic field resulted in non-uniform and slightly increased dissolution. This work is complementary to the experimental investigation and aims to help understand the influence of magnetic fields on silicon dissolution. For this work, an OpenFOAM magnetohydrodynamics application including heat and species transport and three different magnetic force models has been developed and validated. The simulations done show that an isothermal state is reached within 90 seconds if no temperature gradient is imposed. Additional simulations with a temperature gradient helped to rule out a possible thermal leak in the experimental system, confirming that it must have been close to isothermal. Since the solutal expansion coefficient of has not been measured properly to the Author's knowledge, two possible values for the expansion coefficient have been considered. It has been found that the exact value of the solutal expansion coefficient does not have a great influence on the results of this work.

Compared to wafer based solar cells, thin film solar cells greatly reduce material cost and thermal budget due to low temperature process. Monolithically manufacturing allows large area fabrication and continuous processing. In this work, several photovoltaic thin films have been developed by rf-PECVD including a-Si:H and μc-Si, both intrinsic and doped on Corning 4 inch glass substrate at low temperature. The conductivity of n type and p type μc-Si at 180ºC was 17S/cm and 7.1E-2S/cm, respectively. B dopants either in a-Si:H or μc-Si films require higher plasma power to get active doping. The B2H6-to-SiH4 flow ratio for p type μc-Si lies from 0.01 to 0.025. Chamber conditions have critical effect on film quality. Repeatable and superior results require a well-established cleaning passivation procedure. Moreover, μc-Si films have been deposited from pure silane on glass substrate by modified rf-ICP-CVD. The deposition rate has been dramatically increased to 5Å/s due to little H2 dilution with crystalline fraction was around 69%, and 6.2Å/s with crystalline fraction 45%. Microstructure started to form at 150ºC with a thin incubation layer on the glass substrate, and became fully dense conical conglomerates around 300nm where conductivity and crystallinity saturated. Additionally, a-SiGe:H films have been developed by modified rf-ICP-CVD. The optical band gaps have been varied from 1.25 to 1.63eV by changing SiH4-to-GeH4 ratio. Also high temperature resulted in low bandgap. Cross-section TEM showed some microcrystllites appeared near interface region. Heterojunction solar cells on p type c-Si wafer have been fabricated using films developed in this thesis. Interference fringes in EQE disappeared on either textured substrate or cells with lift-off contacts. Maximum EQE was 87% around 700nm. I-V curves have also been studied where the interesting kink suggests a counter-diode has formed between emitter region and contacts.