Les limites rencontrées par les dernières générations de mémoires Flash et DRAM (Dynamic Random Access Memory) nécessitent la recherche de nouvelles variables physiques (autres que la charge et la tension), de nouveaux dispositifs ainsi que de nouvelles architectures de circuits. Plusieurs dispositifs à résistance variable sont très prometteurs. Parmi eux, les OxRRAMs (Oxide Resistive Random Access Memory) et les CBRAMs (Conductive Bridge Random Access Memory) sont de sérieux candidats pour la prochaine génération de mémoire dense. Ce travail se concentre donc sur le rôle des mémoires résistives (OxRRAM et CBRAM) dans les mémoires embarquées et plus particulièrement dans les FPGAs. Pour cela, nous avons développé un modèle compact, outil indispensable à la conception de circuits intégrés. Ensuite, nous avons conçus de nouveaux circuits non volatiles tels que des flips-flops (NVFF), des tables de correspondance (NVLUT), des commutateurs 2x2 ainsi que des SRAMs (NVSRAM). Ces structures ont finalement été simulées dans le cas d’un FPGA, afin de vérifier l’impact de celles-ci sur la surface, le délai ainsi que la puissance. Nous avons comparé les résultats pour un FPGA à base de NVLUTs utilisant une structure 1T-2R composée de CBRAMs par rapport à un FPGA plus classique utilisant des SRAMs. Nous réduisons ainsi la taille de 5%, la consommation de 18% et améliorons la vitesse de fonctionnement de 24%. La thèse aborde la modélisation compacte, la conception des circuits, et l’évaluation de systèmes incluant des mémoires résistives. / The grave challenges to future of traditional memories (flash and DRAM) at 1X nm regime has resulted in increased quest for new physical state variables (other than charge or voltage), new devices and architectures offering memory and logic functions beyond traditional transistors. Many thin film devices with resistance change phenomena have been extensively reported as ’promising candidates’. Among them, Ox- ide Resistive Memory (OxRRAM) and Conductive Bridge Resistive Memory (CBRAM) are leading contenders for the next generation high density memories. In this work, we focus on the role of Resistive Memories in embedded memories and their impact on FPGAs in particular. We begin with the discussion on the compact modeling of resistive memory devices for design enabling, we have designed novel circuits of non- volatile flip-flop (NVFF), non-volatile look-up table (NVLUT), non-volatile 2x2 switch and non-volatile SRAM (NVSRAM) using Resistive Memories. We simulated the impact of these design structures on the FPGA system assessing the performance parameters of area, delay and power. By using the novel 1T-2R memory element concept of CBRAMs in FPGAs to implement Look-up Tables (NVLUT), we would scale down the area impact by 5%, enhance speed by 24% and reduce the power by 18% compared to SRAM based FPGAs. The thesis addresses aspects of compact modeling, circuit design and system evaluation using resistive memories.

La technologie CMOS a contribué au développement de l'industrie des semi-conducteurs. Cependant, au fur et à mesure que le noeud technologique est réduit, la technologie CMOS fait face à des défis importants liés à la dissipation dûe aux courants de fuite et aux effets du canal court. Pour résoudre ce problème, les chercheurs se sont intéressés à la spintronique ces dernières années, compte tenu de la possibilité de fabriquer des dispositifs de taille réduite et d'opérations de faible puissance. La jonction tunnel magnétique (MTJ) est l'un des dispositifs spintroniques les plus importants qui peut stocker des données binaires grâce à la Magnétorésistance à effet tunnel (TMR). En dehors des applications de mémoire non volatile, la MTJ peut également être utilisée pour combiner ou remplacer les circuits CMOS pour implémenter un circuit hybride, de façon à combiner une faible consommation d'énergie et des performances à grande vitesse. Cependant, le problème de la conversion fréquente de charge en spin dans un circuit hybride peut entraîner une importante consommation d'énergie, ce qui obère l'intérêt pour des circuits hybrides. Par conséquent, le concept ASL qui repose sur un pur courant de spin comme support de l'information est proposé pour limiter les conversions entre charge et spin, donc pour réduire la consommation d'énergie. La conception de circuits à base de dispositif ASL entraîne de nombreux défis liés à l'hétérogénéité qu'ils introduisent et à l'espace de conception étendu à explorer. Par conséquent, cette thèse se concentre sur l'écart entre les exigences d'application au niveau du système et la fabrication des nanodispositifs. Au niveau du dispositif, nous avons développé un modèle compact intégrant le STT, la TMR, les effets d'injection/accumulation de spin, le courant de breakdown des canaux et le délai de diffusion de spin. Validé par comparaison avec les résultats expérimentaux, ce modèle permet d'explorer les paramètres du dispositif liés à la fabrication, tels que les longueurs de canaux et les tailles de MTJ, et aide les concepteurs à éviter leur destruction. De plus, ce modèle, décrit avec Verilog-A sur Cadence et divisé en plusieurs blocs : injecteur, détecteur, canal et contact, permet une conception indépendante et une optimisation des circuits ASL qui facilitent la conception de circuits hiérarchiques et complexes. En outre, les expressions permettant le calcul de l'injection/accumulation de spin pour le dispositif ASL utilisé sont dérivées. Elles permettent de discuter des phénomènes expérimentaux observés sur les dispositifs ASL. Au niveau circuit, nous avons développé une méthodologie de conception de circuit/système, en tenant compte de la distribution des canaux, de l'interconnexion des portes et des différents rapports de courant d'injection provoqués par la diffusion de spin. Avec les spécifications et les contraintes du circuit/système, les fonctions booléennes du circuit sont synthétisées en fonction de la méthode de synthèse développée et des paramètres de niveau de fabrication : longueur des canaux, et tailles MTJ sont spécifiées. Basé sur cette méthodologie développée, les circuits combinatoires de base qui forment une bibliothèque de circuits sont conçus et évalués en utilisant le modèle compact développé. Au niveau du système, un circuit DCT, un circuit de convolution et un système Intel i7 sont évalués en explorant les problèmes d'interconnexion : la répartition de l'interconnexion entre les portes et le nombre de tampons inséré. Avec des paramètres théoriques, les résultats montrent que le circuit/système ASL peut surpasser le circuit/système basé sur CMOS. De plus, le pipeline du circuit basé sur ASL est discuté avec MTJ comme tampons insérés entre les étapes. La reconfigurabilité provoquée par les polarités/valeurs du courant d'injection et les états des terminaux de control des circuits ASL sont également discutés avec l'exploration reconfigurable des circuits logiques de base. / The CMOS technology has tremendously affected the development of the semi-conductor industry. However, as the technology node is scaled down, the CMOS technology faces significant challenges set by the leakage power and the short channel effects. To cope with this problem, researchers pay their attention to the spintronics in recent years, considering its possibilities to allow smaller size fabrication and lower power operations. The magnetic tunnel junction (MTJ) is one of the most important spintronic devices which can store binary data based on Tunnel MagnetoResistance (TMR) effect. Except for the non-volatile memory, MTJ can be also used to combine with or replace the CMOS circuits to implement a hybrid circuit, for the potential to achieve low power consumption and high speed performance. However, the problem of frequent spin-charge conversion in a hybrid circuit may cause large power consumption, which diminishes the advantage of the hybrid circuits. Therefore, the ASL concept which uses a pure spin current to transport the information is proposed for fewer charge-spin conversions, thus for less power consumption. The design of ASL device-based circuits leads to numerous challenges related to the heterogeneity they introduce and the large design space to explore. Hence, this thesis focus on filling the gap between application requirements at the system level and the device fabrication at the device level. In device level, we developed a compact model integrating the STT, the TMR, the spin injection/accumulation effects, the channel breakdown current and the spin diffusion delay. Validated by comparing with experimental results, this model allows exploring fabrication-related device parameters such as channel lengths and MTJ sizes and help designers to prevent from device damages. Moreover, programmed with Verilog-A on Cadence and divided into several blocks: injector, detector, channel and contact devices, this model allows the independent design and cross-layer optimization of ASL-based circuits, that eases the design of hierarchical, complex circuits. Furthermore, the spin injection/accumulation expressions for the used ASL device are derived, enabling to discuss the experimental phenomena of the ASL device. In circuit level, we developed a circuit/system design methodology, taking into account the channel distribution, the gate interconnection and the different injection current ratios caused by the spin diffusion. With circuit/system specifications and constraints, the boolean functions of a circuit are synthesized based on the developed synthesis method and fabrication-level parameters: channel lengths, MTJ sizes are specified. Based on this developed methodology, basic combinational circuits that form a circuit library are designed and evaluated by using the developed compact model. In system level, a DCT circuit, a convolution circuit and an Intel i7 system are evaluated exploring the interconnection issues: interconnection distribution between gates and inserted buffer count. With theoretical parameters, results show that ASL-based circuit/system can outperform CMOS-based circuit/system. Moreover, the pipelining schema of the ASL-based circuit is discussed with MTJ as latches inserted between stages. The reconfigurability caused by the injection current polarities/values and the control terminal states of ASL-based circuits are also discussed with the reconfigurable exploration of basic logic circuits.

Thermal characterization of electronic cabinets is becoming increasingly important, due to growing power dissipation and compact packaging. Usually, multiple length scales of interest and modes of heat transfer are simultaneously present. A steady reduced order thermal modeling framework for electronic cabinets was developed to provide an efficient method to model thermal transport across multiple length scales. This methodology takes advantage of compact modeling at the chip or component level and reduced order modeling at subsystem and cabinet levels. Compact models, which were incorporated into system level simulation, were created for components, and reduced order models (ROMs) were developed using proper orthogonal decomposition (POD) for subsystems and system. An efficient interfacial coupling scheme was developed using the concept of flow network modeling to couple the heat and mass flow rates and pressure at each interface, when interconnecting ROMs together to simulate the entire system. Thermal information was then subsequently extracted from the global modeling and applied to the component model for detailed simulation. A boundary profile-matching scheme for ROM of each subsystem was developed to broaden the applicability of the multi-scale thermal modeling methodology. The output profiles of the subsystem upstream can be transferred to the input profiles of the subsystems downstream by adding necessary flow straightening ducts during the snapshots generation process. A general method to create dynamic multi-layer compact models for components and modules was developed. These dynamic compact models were incorporated into enclosure level simulation. The dynamic reduced order model for the enclosure was developed using POD. The transient multi-scale thermal modeling approach was illustrated through an electronic enclosure with insulated gate bipolar transistor (IGBT) module. The multiscale thermal modeling methodology presented here was validated through experiments conducted on a simulated electronic cabinet and the test vehicle with hybrid cooling technique. The latter incorporated double-sided cooling with hybrid forced air convection, thermoelectric cooling, and micro-channel liquid cooling. The overall multi-scale modeling framework was able to reduced numerical models containing 107 DOF down to around 102, while still retaining an approximation accuracy of around 90% in prediction of chip junction temperature rises, compared to measurements.

Afin de permettre de développer un modèle de mémoire non-volatile basée sur le transistor à nanotube de carbone à commande optique qui est utilisée dans des circuits électroniques neuromorphiques, il est nécessaire de comprendre les physiques électroniques et optoélectroniques des nanotubes de carbone, en particulier l’origine de l'effet mémoire que présente ces transistors. C’est dans ce contexte général que cette thèse s'intègre. Le travail est mené sur trois plans :• Caractériser électriquement et optoélectroniquement des structures de test des CNTFETs et des OG-CNTFETs.• Développer un modèle compact pour les contacts Schottky dans les transistors à nanotube de carbone de la façon auto-cohérente basé sur le diamètre et la nature du métal d’électrode en utilisant la méthode de la barrière effective avec les paramètres nécessaires calibrés.• Modéliser l'OG-CNTFET selon les régimes de fonctionnement, lecture, écriture, effacement ou programmation pour application à une mémoire non-volatile en intégrant le mécanisme de piégeage et dépiégeage à l’interface polymère/oxyde. / This PhD thesis presents a computationally efficient physics-based compact model for optically-gated carbon nanotube field effect transistors (OG-CNTFETs), especially in the non-volatile memory application. This model includes memory operations such as “read”, “write”, “erase” or “program”, and “reset” which are modeled using trapping and detrapping mechanisms at the polymer/oxide interface. The relaxation of the memory state is taken into account. Furthermore, the self-consistent modeling of Schottky barriers at contacts between the carbon nanotube channel and metal electrodes is integrated in this model applying the effective Schottky barrier method. The Schottky contact model can be included in CNTFET based devices for a typical biasing range of carbon nanotube transistors. This compact model is validated by the good agreement between simulation results and experimental data (I-V characteristics). In the non-volatile memory application, this model can fully reproduce device behaviors in transient simulations. A prediction study of the key technological parameter, the CNT diameter variety is established to expect its impact on the transistor performance, and more importantly, on the memory operation. In the other hand, this thesis presents a preliminary electric characterization (I-V) of CNTFETs and OG-CNTFETs for the device modeling database. A preliminary optoelectronic characterization method is proposed.

Electrostatic Discharge (ESD), an event of a sudden transfer of electrons between two bodies at different potentials, happens commonly throughout nature. When such even occurs on integrated circuits (ICs), ICs will be damaged and failures result. As the evolution of semiconductor technologies, increasing usage of automated equipments and the emerging of more and more complex circuit applications, ICs are more sensitive to ESD strikes. Main ESD events occurring in semiconductor industry have been standardized as human body model (HBM), machine model (MM), charged device model (CDM) and international electrotechnical commission model (IEC) for control, monitor and test. In additional to the environmental control of ESD events during manufacturing, shipping and assembly, incorporating on-chip ESD protection circuits inside ICs is another effective solution to reduce the ESD-induced damage. This dissertation presents design, characterization, integration and compact modeling of novel silicon controlled rectifier (SCR)-based devices for on-chip ESD protection. The SCR-based device with a snapback characteristic has long been used to form a VSS-based protection scheme for on-chip ESD protection over a broad rang of technologies because of its low on-resistance, high failure current and the best area efficiency. The ESD design window of the snapback device is defined by the maximum power supply voltage as the low edge and the minimum internal circuitry breakdown voltage as the high edge. The downscaling of semiconductor technology keeps on squeezing the design window of on-chip ESD protection. For the submicron process and below, the turn-on voltage and sustain voltage of ESD protection cell should be lower than 10 V and higher than 5 V, respectively, to avoid core circuit damages and latch-up issue. This presents a big challenge to device/circuit engineers. Meanwhile, the high voltage technologies push the design window to another tough range whose sustain voltage, 45 V for instance, is hard for most snapback ESD devices to reach. Based on the in-depth elaborating on the principle of SCR-based devices, this dissertation first presents a novel unassisted, low trigger- and high holding-voltage SCR (uSCR) which can fit into the aforesaid ESD design window without involving any extra assistant circuitry to realize an area-efficient on-chip ESD protection for low voltage applications. The on-chip integration case is studied to verify the protection effectiveness of the design. Subsequently, this dissertation illustrate the development of a new high holding current SCR (HHC-SCR) device for high voltage ESD protection with increasing the sustain current, not the sustain voltage, of the SCR device to the latchup-immune level to avoid sacrificing the ESD protection robustness of the device. The ESD protection cells have been designed either by using technology computer aided design (TCAD) tools or through trial-and-error iterations, which is cost- or time-consuming or both. Also, the interaction of ESD protection cells and core circuits need to be identified and minimized at pre-silicon stage. It is highly desired to design and evaluate the ESD protection cell using simulation program with integrated circuit emphasis (SPICE)-like circuit simulation by employing compact models in circuit simulators. And the compact model also need to predict the response of ESD protection cells to very fast transient ESD events such as CDM event since it is a major ESD failure mode. The compact model for SCR-based device is not widely available. This dissertation develops a macromodeling approach to build a comprehensive SCR compact model for CDM ESD simulation of complete I/O circuit. This modeling approach offers simplicity, wide availability and compatibility with most commercial simulators by taking advantage of using the advanced BJT model, Vertical Bipolar Inter-Company (VBIC) model. SPICE Gummel-Poon (SGP) model has served the ICs industry well for over 20 years while it is not sufficiently accurate when using SGP model to build a compact model for ESD protection SCR. This dissertation seeks to compare the difference of SCR compact model built by using VBIC and conventional SGP in order to point out the important features of VBIC model for building an accurate and easy-CAD implement SCR model and explain why from device physics and model theory perspectives.

Le sujet de cette thèse est l’analyse de la fiabilité des transistors bipolaires à hétérojonction SiGe:C et descircuits intégrés associés. Dans ce but, un modèle compact prenant en compte l’évolution des caractéristiquesdes transistors SiGe:C a été développé. Ce modèle intègre les lois de vieillissement des mécanismes dedéfaillance des transistors identifiés lors des tests de vieillissement. Grâce aux simulations physiques TCADcomplétées par une analyse du bruit basses fréquences, deux mécanismes de dégradations ont été localisés. Eneffet, selon les conditions de polarisation, des porteurs chauds se retrouvent injectés aux interfaces dutransistor. Ces porteurs chauds ont suffisamment d’énergie pour dégrader l’interface en augmentantprogressivement leurs densités de pièges. L’une des deux interfaces dégradées se situe au niveau del’’’espaceur’’ émetteur-base dont l’augmentation de la densité de piège dépend des porteurs chauds créés parionisation par impact. L’autre interface dégradée se situe entre le silicium et le STI dont l’augmentation dedensité de pièges dépend des porteurs chauds générés par ionisation par impact et/ou par génération Auger.En se basant sur ces résultats, une loi de vieillissement a été incorporée dans le modèle compact HICUM. Enutilisant ce modèle, l’étude de l’impact des mécanismes de défaillance sur un circuit amplificateur faible bruit aété menée. Cette étude a montré que le modèle compact intégrant les lois de vieillissement offre la possibilitéd’étudier la fiabilité d’un circuit complexe en utilisant les outils de conception standard permettant ainsi dediminuer le temps de conception global. / The SiGe:C HBT reliability is an important issue in present and future practical applications. To reduce the designtime and increase the robustness of circuit applications, a compact model taking into account aging mechanismactivation has been developed in this thesis. After an aging test campaign and physical TCAD simulations, onemain damage mechanism has been identified. Depending on the bias conditions, hot carriers can be generatedby impact ionization in the base-collector junction and injected into the interfaces of the device where trapdensity can be created, leading to device degradation. This degradation mechanism impacting the EB/spacerinterface has been implemented in the HICUM compact model. This compact model has been used to performreliability studies of a LNA circuit. The CPU simulation time is not impacted by the activation of the degradationcompact model with an increase in computation time lower than 1%. This compact model allows performing areliability analysis with conventional circuit simulators and can be used to assist the design of more robustcircuits, which could help in reducing the design time cycle. / L’affidabilità dei transistori a eterogiunzione SiGe:C è un aspetto molto importante nella progettazione circuitale,sia per le tecnologie attuali che per quelle in fase di sviluppo. In questo lavoro di tesi è stato sviluppato un modellocompatto in grado di descrivere i principali meccanismi di degrado, in modo da contribuire alla progettazione dicircuiti relativamente più robusti rispetto a tali fenomeni, ciò che potrebbe favorire una riduzione dei tempi diprogetto. A seguito di una campagna sperimentale e di un’analisi con tecniche TCAD, è stato identificato unmeccanismo principale di degrado. In particolari condizioni di polarizzazione, i portatori ad elevata energiagenerati per ionizzazione a impatto nella regione di carica spaziale, possono raggiungere alcune interfacce deldispositivo e ivi provocare la formazione di trappole. Solo la generazione di trappole relativa allo spaceremettitore-base è stata considerata nella formulazione del modello, essendo il fenomeno più rilevante. Ilmodello è stato utilizzato per effettuare alcuni studi di affidabilità di un amplificatore a basso rumore. Il tempocomputazionale non è significativamente influenzato dall’attivazione del modello di degrado, aumentando solodell’1%. Il modello sviluppato è compatibile con i comuni programmi di simulazione circuitale, e può essereimpiegato nella progettazione di circuiti con una migliore immunità rispetto ai fenomeni di degrado,contribuendo così a un riduzione dei tempi di progetto.

Although scalingof CMOS technology has been predicted to continue for another decade, novel technological solutions are required to overcome the fundamental limitations of the decananometer MOS transistors. Single Electron Transistor (SET) has attracted attention mainly because of its unique Coulomb blockade oscillations characteristics, ultra low power dissipation and nanoscale feature size. Despite the high potential, due to some intrinsic limitations (e.g., very low current drive) it will be very difficult for SET to compete head-to-head with CMOS’s large-scale infrastructure, proven design methodologies, and economic predictability. Nevertheless, the characteristics of SET and MOS transistors are quite complementary. SET advocates low-power consumption and new functionality (related to the Coulomb blockade oscillations), while CMOS has advantages like high-speed driving and voltage gain that can compensate the intrinsic drawbacks of SET. Therefore, although a complete replacement of CMOS by single-electronics is unlikely in the near future, it is also true that combining SET and CMOS one can bring out new functionalities, which are unmirrored in pure CMOS technology. As the hybridization of CMOSand SET is gaining popularity, silicon SETs are appearing to be more promising than metallic SETs for their possible integration with CMOS. SETs are normally studied on the basis of the classical Orthodox Theory, where quantization of energy states in the island is completely ignored. Though this assumption greatly simplifies the physics involved, it is valid only when the SET is made of metallic island. As one cannot neglect the quantization of energy states in a semi conductive island, it is extremely important to study the effects of energy quantization on hybrid CMOSSET integrated circuits. The main objectives of this thesis are: (1) understand energy quantization effects on SET by numerical simulations; (2) develop simple analytical models that can capture the energy quantization effects; (3)analyze the effects of energy quantization on SET logic inverter, and finally; (4)developa CAD framework for CMOS-SETco-simulation and to study the effects of energy quantization on hybrid circuits using that framework. In this work the widely accepted SIMON Monte Carlo (MC) simulator for single electron devices and circuits is used to study the effects of energy quantization. So far SIMON has been used to study SETs having metallic island. In this work, for the first time, we have shown how one can use SIMON to analyze SET island properties having discrete energy states.It is shown that energy quantization mainly changes the Coulomb Blockade region and drain current of SET devices and thus affects the noise margin, power dissipation, and the propagation delay of SET logic inverter. Anew model for the noise margin of SET inverter is proposed, which includes the energy quantization term. Using the noise margin as a metric, the robustness of SET inverter is studied against the effects of energy quantization. An analytical expression is developed, which explicitly defines the maximum energy quantization (termedas “Quantization Threshold”)that an SET inverter logic circuit can withstand before its noise margin upper bound crosses the acceptable tolerance limit. It is found that SET inverter designed with CT : CG =0.366 (where CT and CG are tunnel junction and gate capacitances respectively) offers maximum robustness against energy quantization. Then the effects of energy quantization are studied for Current biased SET (CBS), which is an integral part of almost all hybrid CMOS-SET circuits. It is demonstrated that energy quantization has no impact on the gain of the CBS characteristics though it changes the output voltage levels and oscillation periodicity. The effects of energy quantization are further studied for two circuits: Negative Differential Resistance (NDR) and Neurone Cell, which use CBS. A new model for the conductance of NDR characteristics is also formulated that includes the energy quantization term. A novel CAD framework is then developed for CMOS-SET co-simulation, whichuses MCsimulator for SET devices alongwithconventional SPICE. Using this framework, the effects of energy quantization are studied for some hybrid circuits, namely, SETMOS, multiband voltage filter, and multiple valued logic circuits. It is found that energy quantization degrades the performance of hybrid circuit, which could be compensated by properly tuning the bias current of SET devices. Though this study is primarily done by exhaustive MC simulation, effort has also been put to develop first order compact model for SET that includes energy quantization effects. Finally it has been demonstrated that the SET behavior under energy quantization can be predicted byslightlymodifyingthe existing SETcompact models that are valid for metallic devices having continuous energy states.

La biologie synthétique est une science issue du rapprochement entre les biotechnologies et les sciences pour l’ingénieur. Elle consiste à créer de nouveaux systèmes biologiques par une combinaison rationnelle d’éléments biologiques standardisés, découplés de leur contexte naturel. L’environnement, l’agroalimentaire et la santé figurent parmi ses principaux domaines d’application. Cette thèse s’est focalisée sur les aspects liés à la conception ex-vivo de ces biosystèmes artificiels. A partir des analogies réalisées entre les processus biologiques et certaines fonctions électroniques, l’accent a été mis sur la réutilisation et l’adaptation des outils de conception numériques, supportant l’approche de conception « top-down ». Ainsi, une adaptation complète des méthodes de CAO de la microélectronique a été mise en place pour la biologie synthétique. Dans cette optique, les mécanismes biologiques élémentaires ont été modélisés sous plusieurs niveaux d’abstraction, allant de l’abstraction numérique à des modèles flux de signal et des modèles conservatifs. Des modèles en logique floue ont aussi été développés pour faire le lien entre ces niveaux d’abstraction. Ces différents modèles ont été implémentés avec deux langages de description matérielle et ont été validés sur la base de résultats expérimentaux de biosystèmes artificiels parmi les plus avancés. Parallèlement au travail de formalisation des modèles destinés au flot de conception, leur amélioration a aussi été étudiée : la modélisation des interactions entre plusieurs molécules a été rendue plus réaliste et le développement de modèles de bruits biologiques a également été intégré au processus. Cette thèse constitue donc une contribution importante dans la structuration et l’automatisation d’étapes de conception pour les biosystèmes synthétiques. Elle a permis de tracer les contours d’un flot de conception complet, adapté de la microélectronique, et d’en mettre en évidence les intérêts. / Synthetic biology is a science derived from the rapprochement between biotechnology and engineering science. It aims to create new biological systems through a rational combination between standardized biological elements which are disconnected from their natural context. Its main areas of application are the environment, the food-processing industry and the health sector. This thesis focuses on the ex vivo design aspects of these artificial biosystems. Thanks to analogies between biological processes and some electronic functions, the emphasis was put on reusing and adapting digital design tools that are fitting the top-down design approach. Thus, microelectronics CAD methods have been completely adapted to synthetic biology. In this regard, basic biological mechanisms have been modelled with various levels of abstraction, from digital abstraction to signal flow and conservative models. Fuzzy logic models have also been developed as a link between these levels of abstraction. These models have been implemented with two hardware description languages. They have been proven correct thanks to experimental results from state-of-the-art artificial biosystems. Concurrently to their formalization, improvements of design flow models have been studied: the modelling of interactions between several molecules have been made more realistic and the development of models for biological noise have been integrated to the process. This thesis is an important contribution to the structuring and the automation of some design steps for synthetic biosystems. It has made possible to highlight and to trace the outlines of a complete design flow, adapted from microelectronics.

La progressivité du claquage des oxydes de grille d'épaisseurs inférieures à 20 nm permet d'envisager une prolongation de la durée de vie des circuits. Cet enjeu majeur de la fiabilité contemporaine requiert des modèles adaptés afin de contrôler la variabilité des paramètres induites par le claquage. Après avoir étudié l'impact d'une fuite de courant sur une couche chargée, nous avons mis au point un modèle bas niveau de simulation par éléments finis, capable de reproduire la dérive des paramètres mesurée sur des dispositifs du nœud 45 nm. Des lois empiriques de ces dérives ont été injectées dans un modèle compact du transistor dégradé, simplifié par nos observations originales de la dépolarisation du canal et de la répartition des courants. Finalement nous avons simulé l'impact du claquage sur le fonctionnement de circuits simples et estimés la dérive de leurs paramètres tels que l'augmentation de la consommation due au claquage. / Breakdown (BD) progressivity for oxides thicker than 20nm may allow circuit lifetime extension; for design purpose and reliability questions, it is now very important to include soft BD failure in compact models in order to predict circuit's parameters variability. After studying the impact of current leakage on a charged layer, we set up a low level simulation model, able to reproduce parameters deviation measured on MOSFET from the 45nm node. Empirical laws of parameter's variability due to this degradation have been used to build up a compact model of damaged device. Our observations have allowed several improvements of BD understanding and led to major simplifications in BD compact modelling. Our simulations of small circuits show a good agreement with published measures and allow an estimation of BD impact on circuits, such as circuit's parameters deviation and power consumption increase estimation.

La thèse de Giovanni BETTI BENEVENTI portes sur la caractérisation électrique et la modélisationphysique de dispositifs de mémoire non-volatile à changement de phase. Cette thèse a été effectuée dans le cadre d’une cotutelle avec l’Università degli Studi di Modena e Reggio Emilia (Italie).Le manuscrit en anglais comporte quatre chapitres précédés d’une introduction et terminés par uneconclusion générale.Le premier chapitre présent un résumé concernant l’état de l’art des mémoires a changement de phase. Le deuxième chapitre est consacré aux résultats de caractérisation matériau et électrique obtenus sur déposition blanket et dispositifs de mémoire à changement de phase (PCM) basées sur le nouveau matériau GeTe dopé carbone (GeTeC).Le chapitre trois s’intéresse à l’implémentation et à la caractérisation expérimentale d’un setup demesure de bruit a basse fréquence sur dispositifs électroniques a deux terminaux développé auxlaboratoires de l’Università degli Studi di Modena e Reggio Emilia en Italie.Enfin, dans le dernier chapitre est présentée une analyse rigoureuse de l’effet d’auto-chauffage Joulesur la caractéristique I-V des mémoires a changement de phase intégrant le matériau dans la phase polycristalline. / Within this Ph.D. thesis work new topics in the field of Non-Volatile Memories technologies have been investigated, with special emphasis on the study of novel materials to be integrated in Phase-Change Memory (PCM) devices, namely:(a) Investigation of new phase-change materialsWe have fabricated PCM devices integrating a novel chalcogenide material: Carbon-doped GeTe (or simply, GeTeC). We have shown that C doping leads to very good data retention performances: PCM cells integrating GeTeC10% can guarantee a 10 years fail temperature of about 127°C, compared to the 85°C of GST. Furthermore, C doping reduces also fail time dispersion. Then our analysis has pointed out the reduction of both RESET current and power for increasing carbon content. In particular, GeTeC10% PCM devices yield about a 30% of RESET current reduction in comparison to GST and GeTe ones, corresponding to about 50% of RESET energy decrease.Then, resistance window and programming time of GeTeC devices are comparable to those of GST.(b) Advanced electrical characterization techniquesWe have implemented, characterized and modeled a measurement setup for low-frequency noise characterization on two-terminal semiconductor devices.(c) Modeling for comprehension of physical phenomenaWe have studied the impact of Self-induced Joule-Heating (SJH) effect on the I-V characteristics of fcc polycrystalline-GST-based PCM cells in the memory readout region. The investigation has been carried out by means of electrical characterization and electro-thermal simulations.