Recent analyses by polarization resolved second-harmonic (SH) microscopy have demonstrated that ferroelectric (FE) domain walls (DWs) can possess non-Ising wall characteristics and topological nature. These analyses rely on locally analyzing the properties, directionality, and magnitude of the second-order nonlinear tensor. However, when inspecting FE DWs with SH microscopy, a manifold of different effects may contribute to the observed signal difference between domains and DWs, i.e., far-field interference, Čerenkov-type phase-matching (CSHG), and changes in the aforementioned local nonlinear optical properties. They all might be present at the same time and, therefore, require careful interpretation and separation. In this work, we demonstrate how the particularly strong Čerenkov-type contrast can selectively be blocked using dark- and bright-field SH microscopy. Based on this approach, we show that other contrast mechanisms emerge that were previously overlayed by CSHG but can now be readily selected through the appropriate experimental geometry. Using the methods presented, we show that the strength of the CSHG contrast compared to the other mechanisms is approximately 22 times higher. This work lays the foundation for the in-depth analysis of FE DW topologies by SH microscopy.

Ferroelectric field effect transistor (FeFET) memories based on a new type of ferroelectric material (silicon doped hafnium oxide) were studied within the scope of the present work. Utilisation of silicon doped hafnium oxide (Si:HfO2) thin films instead of conventional perovskite ferroelectrics as a functional layer in FeFETs provides compatibility to the CMOS process as well as improved device scalability. The influence of different process parameters on the properties of Si:HfO2 thin films was analysed in order to gain better insight into the occurrence of ferroelectricity in this system. A subsequent examination of the potential of this material as well as its possible limitations with the respect to the application in non-volatile memories followed. The Si:HfO2-based ferroelectric transistors that were fully integrated into the state-of-the-art high-k metal gate CMOS technology were studied in this work for the first time. The memory performance of these devices scaled down to 28 nm gate length was investigated. Special attention was paid to the charge trapping phenomenon shown to significantly affect the device behaviour.

A 2T2C ferroelectric memory cell consisting of a select transistor, a read transistor and two ferroelectric capacitors that can be operated either in FeRAM mode or in memristive ferroelectric tunnel junction mode is proposed. The two memory devices can be programmed individually. By performing a combined readout operation, the two stored bits of the memory cells can be combined to perform in-memory logic operation. Moreover, additional input logic signals that are applied as external readout voltage pulses can be used to perform logic operation together with the stored logic states of the ferroelectric capacitors. Electrical characterization results of the logic-in-memory (LiM) functionality is presented.

Ferroelectric field effect transistor (FeFET) memories based on a new type of ferroelectric material (silicon doped hafnium oxide) were studied within the scope of the present work. Utilisation of silicon doped hafnium oxide (Si:HfO2) thin films instead of conventional perovskite ferroelectrics as a functional layer in FeFETs provides compatibility to the CMOS process as well as improved device scalability. The influence of different process parameters on the properties of Si:HfO2 thin films was analysed in order to gain better insight into the occurrence of ferroelectricity in this system. A subsequent examination of the potential of this material as well as its possible limitations with the respect to the application in non-volatile memories followed. The Si:HfO2-based ferroelectric transistors that were fully integrated into the state-of-the-art high-k metal gate CMOS technology were studied in this work for the first time. The memory performance of these devices scaled down to 28 nm gate length was investigated. Special attention was paid to the charge trapping phenomenon shown to significantly affect the device behaviour.:1 Introduction 2 Fundamentals 2.1 Non-volatile semiconductor memories 2.2 Emerging memory concepts 2.3 Ferroelectric memories 3 Characterisation methods 3.1 Memory characterisation tests 3.2 Ferroelectric memory specific characterisation tests 3.3 Trapping characterisation methods 3.4 Microstructural analyses 4 Sample description 4.1 Metal-insulator-metal capacitors 4.2 Ferroelectric field effect transistors 5 Stabilisation of the ferroelectric properties in Si:HfO2 thin films 5.1 Impact of the silicon doping 5.2 Impact of the post-metallisation anneal 5.3 Impact of the film thickness 5.4 Summary 6 Electrical properties of the ferroelectric Si:HfO2 thin films 6.1 Field cycling effect 6.2 Switching kinetics 6.3 Fatigue behaviour 6.4 Summary 7 Ferroelectric field effect transistors based on Si:HfO2 films 7.1 Effect of the silicon doping 7.2 Program and erase operation 7.3 Retention behaviour 7.4 Endurance properties 7.5 Impact of scaling on the device performance 7.6 Summary 8 Trapping effects in Si:HfO2-based FeFETs 8.1 Trapping kinetics of the bulk Si:HfO2 traps 8.2 Detrapping kinetics of the bulk Si:HfO2 traps 8.3 Impact of trapping on the FeFET performance 8.4 Modified approach for erase operation 8.5 Summary 9 Summary and Outlook

A 2TnC ferroelectric memory gain cell consisting of two transistors and two or more ferroelectric capacitors (FeCAP) is proposed. While a pre-charge transistor allows to access the single cell in an array, the read transistor amplifies the small read signals from small-scaled FeCAPs that can be operated either in FeRAM mode by sensing the polarization reversal current, or in ferroelectric tunnel junction (FTJ) mode by sensing the polarization dependent leakage current. The simultaneous read or write operation of multiple FeCAPs is used to realize compute-in-memory (CiM) algorithms that enable processing of data being represented by both, non-volatilely internally stored data and externally applied data. The internal gain of the cell mitigates the need for 3D integration of the FeCAPs, thus making the concept very attractive especially for embedded memories. Here we discuss design constraints of the 2TnC cell and present the proof-of-concept for realizing versatile (CiM) approaches by means of electrical characterization results.

Edge computing requires highly energy efficient microprocessor units with embedded non-volatile memories to process data at IoT sensor nodes. Ferroelectric non-volatile memory devices are fast, low power and high endurance, and could greatly enhance energy-efficiency and allow flexibility for finer grain logic and memory. This paper will describe the basics of ferroelectric devices for both hysteretic (non-volatile memory) and negative capacitance (steep slope switch) devices, and then project how these can be used in low-power logic cell architectures and fine-grain logic-in-memory (LiM) circuits.

Ferroelectricity is a material property were a remanent polarization exists under zero electrical field that can be reversed by applying an electrical field [1]. As consequence, two nonvolatile states exist that can be switched by an electrical field. This feature makes ferroelectrics ideally suited for nonvolatile memories with low write energy. Therefore, already in the 1950s first attempts have been made to realize ferroelectric nonvolatile memories based on ferroelectric barium titanate (BTO) crystals having evaporated electrodes on both sides [2]. The success of this approach was hindered by disturb issues that could be solved in the early 1990s by adding a transistor device as a selector [3]. Such a memory is referred to as a ferroelectric random access memory (FeRAM). Since reading of the ferroelectric polarization from a capacitor requires switching of the ferroelectric [1], the information will be destroyed and a write back is necessary. This can be avoided if the ferroelectric is placed inside of the gate stack of a MOS transistor resulting in a ferroelectric field effect transistor (FeFET) [1]. Conventional ferroelectric materials like BTO or lead- zirconium titanate (PZT) cannot be placed directly on silicon since unwanted interface reactions will occur. The necessary interface layer together with the space charge region of the transistor device leads to a rather low capacitance in series with the ferroelectric dielectric and consequently results in a strong depolarization field that has destroyed the nonvolatility of the FeFET device for many years and hinters scaling as well [4]. Today FeRAM devices are established on the market [3,5], but are limited to niche application since scaling is hindered by many integration problems associated to materials like PZT.

In dieser Arbeit werden ferroelektrische Phasenübergänge in verspannten (K,Na)NbO3-Schichten erstmals mit Hilfe temperaturabhängiger dreidimensionaler Röntgenbeugung untersucht. Der Fokus liegt auf stark anisotrop verspannten Dünnschichten, die bei Raumtemperatur ein geordnetes Fischgräten-Domänenmuster mit einer periodischen Anordnung von monoklinen a1a2/MC-Phasen aufweisen. Bei Erhöhung der Temperatur durchlaufen die (K,Na)NbO3-Dünnschichten einen ferroelektrischen Phasenübergang in die orthorhombische Hochtemperaturphase, die sich durch regelmäßige, alternierenden a1/a2-Streifendomänen mit ausschließlich lateraler Polarisation auszeichnet. In-plane Röntgenmessungen zeigen, dass die Filmeinheitszellen eine kleine Verzerrung in der Ebene erfahren, was zur Bildung von vier verschiedenen Einheitszellvarianten und damit vier verschiedenen (Super-)Domänenvarianten führt. Durch den Vergleich von Röntgenbeugungsmessungen verschiedener Bragg-Reflexe an Filmen mit unterschiedlicher Schichtdicke ist es möglich, die spezifischen Beugungsmerkmale zu unterscheiden und sie den einzelnen Phasen zuzuordnen. Mit Hilfe von in situ temperaturabhängiger Röntgenbeugung ist es daher möglich, die Details des Phasenübergangs vom Fischgräten in das Streifen-Domänenmuster aufzudecken. Es zeigt sich, dass dieser sich über einen großen Temperaturbereich erstreckt und in mehreren Schritten vollzieht. Die Beobachtung von Phasenkoexistenz innerhalb des Übergangs und einer thermischen Hysterese in der Phasenübergangstemperatur lassen auf einen Phasenübergang erster Art schließen. Zudem hängt die Phasenübergangstemperatur stark von der Kaliumkonzentration x in der KxNa1-xNbO3-Dünnschicht ab und kann durch eine Änderung von x=0,95 (stärker kompressiv verspannt) auf x=0,8 (stärker tensil verspannt) um etwa 60 K erhöht werden. Darüber hinaus ist dies die erste Studie, die experimentell beobachtete dreidimensionale Domänenanordnungen direkt mit Berechnungen aus Phasenfeldsimulationen vergleicht. / In this work, ferroelectric phase transitions in strained (K,Na)NbO3 films are studied for the first time using in situ temperature-dependent three-dimensional X-ray diffraction. The focus lies on strongly anisotropically strained thin films, which exhibit a well-ordered herringbone domain pattern with a periodic arrangement of monoclinic a1a2/MC phases at room temperature. Upon increasing temperatures, the (K,Na)NbO3 thin films undergo a ferroelectric phase transition to the orthorhombic high-temperature phase, which is characterized by a regular pattern of alternating a1/a2 stripe domains with pure lateral polarization. In-plane X-ray measurements show that the film unit cells undergo a small in-plane distortion, leading to the formation of four different unit cell variants and thus four different (super)domain variants. By comparing X-ray diffraction measurements of different Bragg reflections of films with different film thicknesses, it is possible to distinguish the specific diffraction features and assign them to the individual phases observed at the different temperatures. Using in situ temperature-dependent X-ray diffraction, it is therefore possible to reveal the details of the phase transition from the a1a2/MC herringbone to the a1/a2 stripe domain pattern. It is shown to extend over a wide temperature range and to occur in several steps. The observation of phase coexistence within the transition and a thermal hysteresis in the phase transition temperature suggests a first-order type phase transition. Moreover, the phase transition temperature strongly depends on the molar concentration of potassium x in the KxNa1-xNbO3 thin film and can be increased by about 60 K by changing x=0.95 (more compressively strained) to x=0.8 (more tensile strained). Furthermore, this is the first study to directly compare experimentally observed three-dimensional domain arrangements with calculations from phase field simulations.

So far, only CMOS compatible and scalable hafnia-zirconia (HZO) based ferroelectric (FE) n-FeFETs have been reported. To enable the full ferroelectric hierarchy [1] both p- and n-type devices should be available. Here we report a p-FeFET with a large memory window (MW) for the first time. Moreover, we propose different integration schemes comprising structures with and without internal gate resulting in metal-FE-insulator-Si (MFIS) and metal-FE-metal-insulator-Si (MFMIS) devices which could be used to tackle the problem of interface (IF) degradation and possibly decrease the power consumption of the devices.

Inspired by neurobiological systems, Spiking Neural Networks (SNNs) are gaining an increasing interest in the field of bio-inspired machine learning. Neurons, as central processing and short-term memory units of biological neural systems, are thus at the forefront of cutting-edge research approaches. The realization of CMOS circuits replicating neuronal features, namely the integration of action potentials and firing according to the all-or-nothing law, imposes various challenges like large area and power consumption. The non-volatile storage of polarization states and accumulative switching behavior of nanoscale HfO₂ - based Ferroelectric Field-Effect Transistors (FeFETs), promise to circumvent these issues. In this paper, we propose two FeFET-based neuronal circuits emulating the Integrate-and-Fire (I&F) behavior of biological neurons on the basis of SPICE simulations. Additionally, modulating the depolarization of the FeFETs enables the replication of a biology-based concept known as membrane leakage. The presented capacitor-free implementation is crucial for the development of neuromorphic systems that allow more complex features at a given area and power constraint.