O Nitreto de Gálio (GaN) é um semicondutor de gap direto, motivo de numerosas pesquisas científicas, principalmente devido a sua importância na fabricação de dispositivos de alta potência e optoeletrônicas. Ligas de GaN como InGaN e AlGaN, por exemplo, possibilitam a fabricação de LEDs e LASERs azuis. Neste nosso estudo selecionamos o Arseneto de Gálio (GaAs) como um substrato viável para síntese de GaN mediante a permuta de Arsênio (As) por Nitrogênio (N) fundamentada em três passos: a) incorporação de N por implantação iônica em GaAs (à 350, 450 ou 550 ºC) em elevadas fluências (1, 2, 3 ou 4 × 1017 N/cm2); b) maior estabilidade das ligações Ga-N frente às de Ga-As; e c) expurgo de As da região contendo N implantado mediante recozimentos (à 550, 650, 750, 850 ou 1000 ºC) sob fluxo de N2. Uma capa de ~ 125 nm de Nitreto de Silício (Si3N4) foi depositada por sputtering sobre o GaAs previamente a implantação à quente: camada de sacrifício que pode ser removida após a síntese. Análises por Microscopia Eletrônica de Transmissão (TEM) e Espectroscopia de Raios- X por Dispersão em Energia (EDS) demonstraram que, no estado como-implantado da fluência de 3 × 1017 N/cm2, formam-se bolhas de N para ambos os lados da interface Si3N4/GaAs e a região implantada do GaAs amorfiza. Após um recozimento à 850 ºC/5 min, observou-se uma elevada degradação da camada de Si3N4, fragilizada pela formação das bolhas de N. Formou-se uma camada contínua de GaN (GaN-layer) de ~ 70 nm na sua fase hexagonal, sustentada por “pilares” no substrato GaAs, entre os quais existem extensos vazios. Medidas TEM em alta resolução (HRTEM) e por Difração de Elétrons de Área Selecionada (SAED) revelaram que a GaN-layer apresenta forte tendência à epitaxia com o substrato GaAs (relações de epitaxia são aqui apresentadas), e regiões estruturalmente espelhadas (i.e., twins). SAED sobre os pilares evidenciaram uma fase transicional cúbica, com um parâmetro de rede substancialmente menor (0,42 ± 0,01) nm que o reportado na literatura (0,45 nm). Estudos por Espectrometria de Retroespalhamento de Rutherford e Canalização (RBS/C) mostraram que a GaN-layer é rica em N (Ga1,00N1,90, para 3 × 1017 N/cm2) e apresenta canalização (para implantações de 2 e 3 × 1017 N/cm2), confirmando o caráter monocristalino identificado por TEM. Medidas de Fotoluminescência (PL) confirmam emissão na região do gap de banda do α-GaN (~ 3,4 eV), bem como bandas associadas a defeitos estruturais do material. Também foi investigado o efeito de campos de tensão provenientes de bolhas de Hélio (He) mediante a realização da síntese a partir de substrato GaAs pré-implantado com He. Neste caso, as bolhas, que se formam no GaAs durante a implantação de N à quente e extinguem-se após recozimentos, limitam a difusão de N para o interior do substrato, conduzindo a formação de uma GaN-layer mais espessa (~ 120 nm) e com bem mais N (Ga1,00N2,80). Como consequência, a GaNlayer apresentou um caráter mais policristalino. / The Gallium Nitride (GaN) is a direct gap semiconductor, is issue of numerous scientific research, mainly due to its importance in the manufacture of high power devices and optoelectronic devices. GaN alloys, as InGaN and AlGaN, for example, enable the production of LEDs and blue LASERs. In this study, we have selected Gallium Arsenide (GaAs) as a suitable substrate for GaN synthesis through Arsenic (As) replacement by Nitrogen (N), based on three steps: a) incorporation of N by ion implantation into GaAs (at 350, 450 or 550 ºC) at high fluences (1, 2, 3 or 4 × 1017 N/cm2); b) higher stability of the Ga-N bonds compared to the Ga-As ones; and c) purge of As from the region containing implanted N by annealing (at 550, 650, 750, 850 or 1000 ºC) under N2 flow. A 125-nm cap-layer of Silicon Nitride (Si3N4) was deposited by sputtering on GaAs prior to the hot implantation: it is a sacrifice layer which can be removed after the synthesis. Transmission Electron Microscopy (TEM) and Energy Dispersive X-ray Spectroscopy (EDS) analyzes demonstrated that, on the as-implanted state of the fluence of 3 × 1017 N/cm2, N bubbles are formed on both sides of the Si3N4/GaAs interface and the implanted region of GaAs amorphizes. After annealing at 850 °C/5min, a high degradation of the Si3N4 layer was observed, weakened by the formation of N bubbles. A continuous layer of GaN (GaN-layer) of ~ 70 nm was formed in its hexagonal phase, supported by “pillars” on the GaAs substrate, with extensive voids in between them. High-Resolution TEM (HRTEM) and Selected Area Electron Diffraction (SAED) measurements revealed that the GaN-layer exhibits a strong tendency to epitaxy with the GaAs substrate (epitaxial relationships are here presented), and structurally mirrored regions (i.e., twins). SAED on the pillars showed a transitional cubic phase, with a lattice parameter substantially smaller (0.42 ± 0.01) nm than the one reported in the literature (0.45 nm). Rutherford Backscattering Spectrometry studies and Channeling (RBS/C) showed that the GaN-layer is rich in N (Ga1.00N1.90, for 3 × 1017 N/cm2) and presents channeling (for implantations of 2 and 3 × 1017 N/cm2), corroborating the monocrystalline nature identified by TEM. Photoluminescence (PL) measurements confirm emission in the band gap region of a- GaN (~ 3.4 eV), as well as bands associated to structural defects in the material. It was also investigated the effect of strain fields from Helium (He) bubbles through synthesis starting up from He pre-implanted GaAs substrate. In this case, the bubbles, which are formed in the GaAs during the hot N-implantation and are annihilated after annealing, limit the N diffusion into the substrate, leading to the formation of a thicker GaN-layer (~ 120 nm) and with much more N (Ga1.00N2.80). As a result, the GaN-layer presented an aspect more polycrystalline.

Diplomova praca sa zameriava na oblast zaostrovania obrazkov tvari. V teoretickej casti prace budu prezentovane moderne metody zaostrovania obrazkov pomocou jedineho obrazku a metody editacie obrazkov. Prakticka cast sa zameria na pristupy rekonstrukcie obrazkov zo sekvencie poskodenych obrazkov. Viacere modely neuronovych sieti so vstupom pre viacero obrazkov budu zhotovene a vyhodnotene. Alternativny pristup v podobe balika nastrojov na editaciu obrazkov bude taktiez predstaveny. Tieto nastroje budu vyuzivat najmodernejsie pristupy k editacii obrazkov s cielom spojit vizualne prvky tvari zo vstupnej sekvencie obrazkov do jedneho finalneho vystupu. V zavere prace budu vsetky metody navzajom porovnane.

This master’s thesis deals with the design and realization of a functional sample power inverter for an electric compressor, which is used in hybrid cars. The electric compressor powered by the inverter is E-compressor by Garrett Advancing Motion. An inverter will be using modern High Electron Mobility Transistors which are based on gallium nitride (GaN). The purpose of this thesis is to find if GaN transistors can be used in E-boosting application.

This thesis deals with deposition of gallium nitride thin films on silicon substrates covered by negative HSQ rezist. Rezist was patterned via electron beam lithography to create masks, where the selective growth of crystals was achieved. Growth of GaN layers was carried out by MBE method. For achievement of desired selective growth, the various deposition conditions were studied.

This master’s thesis deals with the design of the switching power supply on the principle of high frequency converter. The goal of this thesis is construction of converter which is using GaN MOSFET transistors and SiC diodes for switching. The converter uses two switch forward power supply topology. Unusually high switching frequency was chosen for the design with power transformer with open magnetic core. The outcome of this work is functional converter which is primarily intended for educational and demonstrational purposes. Multiple parts of this converter are divided into individual blocks, which can be further used for construction of other types of switching converters.

Dans ce travail, nous avons étudié la relaxation de couches d’hétérostructures InGaN/GaN obtenue par épitaxie en phase vapeur aux organométalliques (EPVOM) et épitaxie aux jets moléculaires (EJM) principalement par microscopie électronique en transmission (MET). Pour ce faire, nous avons fait varier la composition de l'indium de 4.1% au nitrure d'indium pur, ce qui correspond lors de la croissance sur GaN à un décalage paramétrique allant de 1% à 11.3%. Le travail a porté sur des couches dont l’épaisseur allait de 7 nm à 500 nm. A partir d’une composition en indium voisine de 10%, nous mettons en évidence la formation d’un réseau de dislocations vis dont la ligne se promène dans l’interface, avec de très longues sections droites le long des directions <11-20>. Ces dislocations coexistent avec un réseau de dislocations coins qui commence à se former vers 13%, il disparait complétement autour d’une composition en indium de 18%. Le réseau de dislocation vis se densifie de plus en plus au-delà. Outre ces dislocations de décalage paramétrique, d'autres mécanismes qui contribuent à la relaxation de la contrainte dans ces hétérostructures InGaN/GaN ont été mis en évidence. Ainsi, au-dessus d'une composition d'indium supérieure à 25%, de nombreux phénomènes se produisent simultanément. (1) Formation des dislocations de décalage paramétrique à l'hétérointerface; (2) une composition de la couche qui s’enrichit en indium vers la surface; (3) des fortes perturbations de la séquence hexagonale conduisant à un empilement aléatoire; (4) croissance à trois dimensions (3D) pouvant même conduire à des couches poreuses lorsque la composition en indium est comprise entre 40% et 85%. Cependant, on met en évidence qu’il est possible de faire croître de l’InN pur de bonne qualité cristalline s'améliore grâce à la formation systématique d'une couche 3D. / In this work, we have investigated the strain relaxation of InGaN layers grown on GaN templates by MOVPE and PAMBE using TEM. To this end we varied the indium composition from 4.1% to pure indium nitride and the corresponding mismatch was changing from less than 1% to 11.3%, the thickness of the InGaN layers was from 7 nm to 500 nm. When the indium composition is around 10%, one would expect mostly elastically strained layers with no misfit dislocations. However, we found that screw dislocations form systematically at the InGaN/GaN interface. Moreover, below 18% indium composition, screw and edge dislocations coexist, whereas starting at 18%, only edge dislocations were observed in these interfaces. Apart from the edge dislocations (misfit dislocations), other mechanisms have been pointed out for the strain relaxation. It is found that above an indium composition beyond 25%, many phenomena take place simultaneously. (1) Formation of the misfit dislocations at the heterointerface; (2) composition pulling with the surface layer being richer in indium in comparison to the interfacial layer; (3) disruption of the growth sequence through the formation of a random stacking sequence; (4) three dimentional (3D) growth which can even lead to porous layers when the indium composition is between 40% and 85%. However, pure InN is grown, the crystalline quality improves through a systematic formation of a 3D layer.

La famille des matériaux semiconducteurs III-N présente des propriétés adéquates pour diversesapplications que ce soit dans le domaine de l’optique ou de l’électronique. Certaines de ces applicationsconsistent à intégrer ces matériaux dans des environnements hostiles et notamment soumis à l’actiond’ions lourds à différentes énergies. Lors de cette thèse, le travail consistait tout d’abord à comprendrel’évolution microstructurale sous irradiation du substrat alpha-Al2O3, puis du film mince GaN, afin d’établirun profil de l’évolution de l’endommagement en fonction de la profondeur. Un comportement assezsimilaire concernant l’évolution des paramètres de maille a été observé pour les deux matériaux. Dansla direction parallèle à la trajectoire du faisceau d’ions, une importante augmentation du paramètre demaille a été mise en évidence tandis que peu de variations ont été relevées perpendiculairement à latrajectoire du faisceau d’ions. Les formations de couche amorphe pour l’alpha-Al2O3 et de couche fortementendommagée pour le GaN ont été observées en surface. Les épaisseurs de ces couches augmentent enfonction de la fluence, associé à l’augmentation des contraintes résiduelles au sein du matériau. Al’aide d’hypothèses et des différents résultats obtenus, deux profils d’endommagement en profondeuront été proposés. D’autre part, la nanoindentation a montré que les paramètres de dureté et de moduled’élasticité évoluent fortement sous irradiation en fonction de la fluence. / Nitride semiconductors are attractive materials for the development of optical and electronic devices.Some of these applications can expose materials to extreme environments and especially radiation ofheavy ions at different energies. In this thesis, the study focused first on behaviour evolution underirradiation of alpha-Al2O3 and then of GaN thin film, in order to establish a profile of damage evolution asfunction of the depth. Concerning lattice parameter, a similar behaviour was observed for both materials.An important increase of lattice parameter parallel to ion beam was highlighted while few variations wasnoted for the lattice parameter perpendicular to ion beam. Formation of amorphous layer for alpha-Al2O3and highly disordered layer for GaN were observed in surface. Layers thicknesses increase as functionof the fluence with an increase of residual stresses in material. Using different results and assumptions,two damage profiles as function of the depth have been proposed. In addition, nanoindentation hasshown hardness and modulus of elasticity parameter evolve highly under irradiation as function of thefluence.

Heterostructures of the materials system GaN/AlGaN/GaN were grown by molecular beam epitaxy on 6H-SiC substrates and high electron mobility transistors (HEMTs) were fabricated. For devices with large gate periphery an air bridge technology was developed for the drain contacts of the finger structure. The devices showed DC drain currents of more than 1 A/mm and values of the transconductance between 120 and 140 mS/mm. A power added efficiency of 41 % was measured on devices with a gate length of 1 µm at 2 GHz and 45 V drain bias. Power values of 8 W/mm were obtained. Devices with submicron gates exhibited power values of 6.1 W/mm (7 GHz) and 3.16 W/mm (25 GHz) respectively. The rf dispersion of the drain current is very low, although the devices were not passivated. / Heterostrukturen im Materialsystem GaN/AlGaN/GaN wurden mittels Molekularstrahlepitaxie auf 6H-SiC-Substraten gewachsen und High-Electron-Mobility-Transistoren (HEMTs) daraus hergestellt. Für Bauelemente mit großer Gateperipherie wurde eine Air-Bridge-Technik entwickelt, um die Drainkontakte der Fingerstruktur zu verbinden. Die Bauelemente zeigten Drainströme von mehr als 1 A/mm und Steilheiten zwischen 120 und 140 mS/mm. An Transistoren mit Gatelängen von 1 µm konnten Leistungswirkungsgrade (Power Added Efficiency) von 41 % (bei 2 GHz und 45 V Drain-Source-Spannung) sowie eine Leistung von 8 W/mm erzielt werden. Bauelemente mit Gatelängen im Submikrometerbereich zeigten Leistungswerte von 6,1 W/mm (7 GHz) bzw. 3,16 W/mm (25 GHz). Die Drainstromdispersion ist sehr gering, obwohl die Bauelemente nicht passiviert wurden.

In this thesis, a custom quadrupole mass filter setup was established to independently investigate the impact of the most prominent ion species that are present during ion-assisted deposition. The setup was applied to the low temperature epitaxial growth of GaN thin films on 6H-SiC substrates. Atomic nitrogen ions at higher ion kinetic energies were for the first time independently identified to be the predominant cause of deteriorating crystalline qualities during growth. Precise control of the ion beam parameters yielded the capability to vary the average GaN phase content from almost purely wurtzite to the meta-stable zinc blende GaN phase. Even in case of comparably high crystalline quality, the atomic and molecular nitrogen ions were independently determined to yield distinct thin film topographies throughout the entire observed evolution of the thin film formation.:Bibliographical Description 1 Introduction 1.1 Epitaxial Thin Film Growth 1.2 Ion-Beam Assisted Deposition 1.2.1 Influence of Energetic Particles 1.2.2 Ion-atom Arrival Ratio 1.3 Gallium Nitride 2 Methods 2.1 Setup of the Deposition System 2.1.1 Knudsen Effusion Cell 2.1.2 Reflection High-Energy Electron Diffraction 2.1.3 Auger Electron Spectroscopy 2.1.4 Ion Sources 2.2 Quadrupole Mass Filter System 2.2.1 Components 2.2.2 Working Principle of a Quadrupole Mass Filter 2.2.3 Alternative Mass Filters 2.3 X-ray Diffraction and Reflectivity 2.4 Atomic Force Microscopy 2.5 Transmission Electron Microscopy 3 Results and Discussions 3.1 Characterization of the Quadrupole Mass Filter System 3.1.1 Mass Filter Performance and Resolution 3.1.2 Ion Beam Characteristics 3.1.3 Space Charge Considerations 3.1.4 Conclusions 3.2 Influence of the I/A Ratio and Ion Kinetic Energy 3.2.1 Determination of the GaN Phase Composition 3.2.2 Film Topography and Growth Mode 3.2.3 Crystal Structure and Orientation 3.2.4 Microstructure at the Interface 3.2.5 Conclusions 3.3 Impact of the Ion Species on Growth Instabilities 3.3.1 Growth Rates and Thin Film Topography 3.3.2 Crystal Structure 3.3.3 Growth Mode and RHEED pattern evolution 3.3.4 Conclusions 4 Summary and Conclusions Bibliography Complete Publication List of the Author Acknowledgments Declaration of Authorship / In dieser Arbeit wurde ein maßgefertigter Quadrupol-Massenfilteraufbau etabliert, um die Auswirkungen der prominentesten Ionenspezies, die während der ionengestützten Abscheidung vorhanden sind, unabhängig voneinander zu untersuchen. Der Aufbau wurde für das epitaktische Niedertemperatur-Wachstum von GaN-Dünnschichten auf 6H-SiC-Substraten angewendet. Atomare Stickstoffionen bei höheren kinetischen Ionenenergien wurden zum ersten Mal in der Abwesenheit anderer Spezies als die dominierende Ursache für die Verschlechterung der kristallinen Qualität während des Wachstums identifiziert. Eine präzise Kontrolle der Ionenstrahlparameter ergab die Fähigkeit, den durchschnittlichen GaN-Phasengehalt von der fast reinen Wurtzit- bis zur metastabilen Zinkblende-GaN-Phase zu variieren. Selbst bei vergleichbar hoher kristalliner Qualität weisen die mit atomaren und molekularen Stickstoffionen hergestellten Schichten unabhängig voneinander verschiedene Topographien auf, die sich während der gesamten beobachteten Entwicklung der Dünnschichtbildung deutlich abzeichneten.:Bibliographical Description 1 Introduction 1.1 Epitaxial Thin Film Growth 1.2 Ion-Beam Assisted Deposition 1.2.1 Influence of Energetic Particles 1.2.2 Ion-atom Arrival Ratio 1.3 Gallium Nitride 2 Methods 2.1 Setup of the Deposition System 2.1.1 Knudsen Effusion Cell 2.1.2 Reflection High-Energy Electron Diffraction 2.1.3 Auger Electron Spectroscopy 2.1.4 Ion Sources 2.2 Quadrupole Mass Filter System 2.2.1 Components 2.2.2 Working Principle of a Quadrupole Mass Filter 2.2.3 Alternative Mass Filters 2.3 X-ray Diffraction and Reflectivity 2.4 Atomic Force Microscopy 2.5 Transmission Electron Microscopy 3 Results and Discussions 3.1 Characterization of the Quadrupole Mass Filter System 3.1.1 Mass Filter Performance and Resolution 3.1.2 Ion Beam Characteristics 3.1.3 Space Charge Considerations 3.1.4 Conclusions 3.2 Influence of the I/A Ratio and Ion Kinetic Energy 3.2.1 Determination of the GaN Phase Composition 3.2.2 Film Topography and Growth Mode 3.2.3 Crystal Structure and Orientation 3.2.4 Microstructure at the Interface 3.2.5 Conclusions 3.3 Impact of the Ion Species on Growth Instabilities 3.3.1 Growth Rates and Thin Film Topography 3.3.2 Crystal Structure 3.3.3 Growth Mode and RHEED pattern evolution 3.3.4 Conclusions 4 Summary and Conclusions Bibliography Complete Publication List of the Author Acknowledgments Declaration of Authorship

Light Detection And Ranging (LiDAR) is a hot topic today primarily because of its vast importance within autonomous vehicles. LiDAR sensors are capable of capturing and identifying objects in the 3D environment. However, a drawback of LiDAR is that they perform poorly under adverse weather conditions. Noise present in LiDAR scans can be divided into random and pseudo-random noise. Random noise can be modeled and mitigated by statistical means. The same approach works on pseudo-random noise, but it is less effective. For this, Deep Neural Nets (DNN) are better suited. The main goal of this thesis is to investigate how snow can be detected in LiDAR point clouds and filtered out. The dataset used is Winter Adverse DrivingdataSet (WADS). Supervised filtering contains a comparison between statistical filtering and segmentation-based neural networks and is evaluated on recall, precision, and F1. The supervised approach is expanded by investigating an ensemble approach. The supervised result indicates that neural networks have an advantage over statistical filters, and the best result was obtained from the 3D convolution network with an F1 score of 94.58%. Our ensemble approaches improved the F1 score but did not lead to more snow being removed. We determine that an ensemble approach is a sub-optimal way of increasing the prediction performance and holds the drawback of being more complex. We also investigate an unsupervised approach. The unsupervised networks are evaluated on their ability to find noisy data and correct it. Correcting the LiDAR data means predicting new values for detected noise instead of just removing it. Correctness of such predictions is evaluated manually but with the assistance of metrics like PSNR and SSIM. None of the unsupervised networks produced an acceptable result. The reason behind this negative result is investigated and presented in our conclusion, along with a model that suffers none of the flaws pointed out.