Made available in DSpace on 2016-04-28T20:19:18Z (GMT). No. of bitstreams: 1 2007- Jose Aurelio Vilas Boas.pdf: 391843 bytes, checksum: 398e95d547ae787e3a8a39b67fcc2895 (MD5) Previous issue date: 2007-08-28 / The general aim of this dissertation is to investigate customers behavior as regards to choosing packages at the moment of purchase. Customer s behavior is characterized as a process; a set of stages which involves selection, purchase, use or products layout, ideas or experiments to satisfy needs and wishes. This study, by means of a bibliographical research as well as a survey, which was carried through with A, B and C supermarkets customers, located at Volta Redonda (RJ), provides us a view of how the process of choosing packages occurs at the moment of purchase. The study pointed out that customers behave rationally, trying to shop as better as possible, obtaining the best from their money, and maximizing utility, what appears to be an evidence of no emotional involvement when choosing tomatomade products packages. / O objetivo geral desta disserta??o consiste em investigar o comportamento dos consumidores em rela??o ? escolha da embalagem no ato da compra. O comportamento do consumidor se caracteriza como processo: um conjunto de est?gios que envolvem a sele??o, a compra, o uso ou a disposi??o de produtos, id?ias ou experi?ncias para satisfazer necessidades e desejos. O presente estudo, atrav?s de pesquisa bibliogr?fica e uma pesquisa de campo (survey) realizada com consumidores dos supermercados A, B e C situados na cidade de Volta Redonda/RJ, a pesquisa fornece uma vis?o de como ocorre o processo de escolha da embalagem no ato de compra. O estudo apontou que o comportamento dos consumidores ocorre sob uma perspectiva racional, procurando fazer compras da melhor maneira poss?vel, obtendo o melhor pelo dinheiro e maximizando a utilidade, parecendo n?o haver envolvimento emocional na escolha da embalagem da classe de produtos atomatados.

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Four main aspects are studied and explored throughout this dissertation: (1) On-Package Multipolar antenna system design for integration with commercial wireless sensor nodes for machine-to-machine communication applications; (2) Development of a novel MMIC packaging process and subsequent antenna integration for chip-to-chip communication applications, (3) Design and characterization of additively manufactured lumped passive elements for integration with MMIC and hybrid circuits, (4) Design and characterization of antennas for on- and off-metal radio frequency identification (RFID) applications. This work presents the design of different 3-D printed tripolar antenna systems operating at 2.4 GHz. The antennas are designed for integration with commercial wireless nodes with the purpose of mitigating multipath and depolarization channel effects that might be present in many machine-to-machine (M2M) deployments. The antennas are fabricated utilizing an additive manufacturing (AM) approach that combines fused deposition modeling (FDM) of ABS plastic for dielectric parts and micro-dispensing of silver paste Du-Pont CB028 for conductive layers as the majority of the devices presented in this work. Over the air testing demonstrates a 1% channel improvement of up to 14 dB, achieved in a highly-reflective, Rayleigh-like fading environment by implementing selection diversity between three mutually orthogonal monopoles. This improvement leads to better bit error rate (BER) performance (as is also shown). Additionally, RSSI measurements show significant improvement when the prototype antenna system is integrated with commercial wireless sensor hardware. Implications of tripolar antenna integration on M2M systems include reduction in energy use, longer communication link distances, and/or greater link reliability. In order to incorporate the proposed multipolar selection diversity technique into short range wireless chip-to-chip communications, a novel and versatile 3D printed on-chip integration approach using laser machining is subsequently demonstrated for microwave and mm-wave systems in a process herein referred to as Laser Enhanced or Laser Assisted Direct Print Additive Manufacturing (LE-DPAM). The integration process extends interconnects laterally from a MMIC to a chip carrier. Picosecond laser machining is applied and characterized to enhance the 3D printing quality. Specifically, the width of micro-dispensed printed traces is accurately controlled within micrometer range (e.g. laser cuts ~12 μm wide), additionally, 150 μm probe pads are cut in order to facilitate RF measurement. The S-parameters of a distributed amplifier integrated into the package are simulated and measured from 2 to 30 GHz. It is seen how the overall performance is significantly better than a traditional wirebonded QFN package and previously reported AM MMIC interconnections. The attenuation of the microstrip line including interconnects is only 0.2 dB/mm at 20 GHz and return loss with the package is less than 10 dB throughout the operating frequency band A 17 GHz package integrated linearly polarized patch antenna, fabricated with a multi-layer and multi-material LE-DPAM process is then introduced for vertical interconnection with a MMIC die. Performance is successfully measured and characterized achieving a return loss greater than 19 dB at the desired design frequency. Good agreement between simulated and measured radiation patterns is also obtained with a peak gain of 4.2 dBi. Another section of this work utilizes LE-DPAM to fabricate lumped capacitors and inductors for coplanar waveguide (CPW) circuits, especially useful for filtering and matching network implementation. Laser machining is used to achieve ~12 µm slots on printed conductors, producing aspect ratios greater than 2:1, as well as to fabricate vertical interconnects or vias that allow for the fabrication of the multilayer inductors. Inductances in the range of 0.4-3 nH are achieved, with a maximum quality factor of 21, self-resonance frequencies up to 88 GHz, and an inductance per unit of area of 5.3 nH/mm2. Interdigital capacitors in the range of 0.05-0.5 pF are fabricated, having a maximum quality factor of 750 and self-resonances up to 120 GHz. All the components are made on the center line of a CPW that is 836 µm wide. The results show that LE-DPAM enables the fabrication of compact passive circuits that can be easily interconnected with MMIC dies, which at the same time, can be manufactured as part of a larger component. This enables the fabrication of structural electronics that are functional into the mm-wave frequency range. A final aspect of this work goes through antenna designs for specific RFID (radio frequency identification) applications. RFID tag design is generally focused specifically on either off-metal or on-metal configurations. In this work passive 2D and 3D RFID tags are presented which perform similarly in both configurations. The presented tags operate in the ISM RFID UHF bands that cover 864-868 MHz and 902-928 MHz. A matching loop consisting of two parallel stubs to ground is used for impedance matching to a passive integrated circuit, which has -18 dBm sensitivity. A planar 2D tag with a footprint of 13126.5 mm2 is first introduced, showing a simulated gain of approximately 3 dBi and a measured read range of 10 m (for 31 dBm transmit power from the reader) in both on-metal and off-metal conditions. The tag is miniaturized into a 3D geometry with a footprint of 2524.25 mm2 (520% reduction) and achieves the same broadside simulated on-metal gain. The antennas are fabricated using a DPAM process, and a meshed ground configuration is explored in order to accomplish a 50% conductive paste reduction without disrupting the performance. The proposed tags are compared with commercially available tags as well as previously published tags in terms of read range and size. The tags in this work present an improvement in terms of read range, gain, and area with respect to previous designs covering the ISM RFID UHF bands. Moreover, the performance of these tags is maintained in on- and off-metal conditions, achieving comparable performance and a reduction in volume of 11482% with respect to the best tag reported.

World-wide, there has been a large increase in tertiary student numbers, not entirely matched by funding increases. Consequently, instructors are faced with large, diverse classes, and find themselves struggling to provide adequate assessment and prompt feedback, two quantities critical in an effective learning environment. Personal computers and the Internet can help solve this problem. The aim of this study was to develop, implement and validate a Web-based software package that, through providing practice and assessment opportunities, improved student learning and reduced marking and related mundane aspects of instructor workload. At the start of the study, such a package already existed in prototype form: OASIS (Online Assessment System with Integrated Study). As the study progressed, this software package was first fully rewritten and then repeatedly modified. OASIS delivers individualised tasks, marks student responses, supplies prompt feedback, and logs student activity. Staff can deliver sets of practice questions and assessments to students: assessments may involve different questions for different students, not just numerically different versions of the same questions. Given my role as teacher, the traditional research ideal of observing without affecting the research environment was both impossible and unconscionable. In particular, since preliminary evidence suggested that OASIS did enhance student learning, I could not adopt a ‘two groups’ approach to the research, with one group using OASIS while the other did not. Instead, an action research methodology was seen as most appropriate for my double role of teacher and researcher. / This methodology enabled me, in the light of my findings, to continuously modify the learning environment and enhance student learning. The action research proceeded through a spiral of one-semester cycles of planning, acting, observing and reflecting. To maximize rigour, the research ran through eight cycles over four years and involved considerable triangulation. OASIS itself collected much quantitative data. Further data were collected via interview, survey, email and informal discussion from three groups: current students, postgraduates and academics. My colleagues provided alternative perceptions and interpretations, as did Physics Department academics who were using OASIS, and an external academic who interviewed academics and investigated the implementation of OASIS. Perhaps surprisingly, academics had generally adopted OASIS to promote student learning rather than to decrease their own workloads. In some cases workloads were reduced; however, where OASIS assessments augmented rather than replaced existing traditional assessments, workloads actually went up slightly. All instructors who used OASIS reported enhanced student learning and wished to continue using it. Student surveys, interviews, focus-group discussions and informal feedback showed that students found the software easy to use and considered that it helped them improve their skills and understanding. OASIS questions were preferred over textbook questions. Students commonly requested OASIS to be available in more of their areas of study. In general students wanted hints or model answers though some argued against their provision. / The majority of students were enthusiastic about the use of OASIS for practice, and activity logs revealed that they did use OASIS extensively. These logs also revealed the motivating power of assessments: typically half the online practice activity took place in the last 36 hours prior to assessments. Interviews provided further interesting insights into the ways different students approached their studies and assessments. However, students did voice concerns about the validity of OASIS assignments, noting their peers could rely on the efforts of others to score highly in these. A number of steps were carried out in an attempt to defuse these concerns, including: disabling OASIS practice during assignments, basing assignments on previously unseen questions, and providing different assignment questions to different students. While this study has achieved the goal of developing, implementing and validating OASIS, many future opportunities exist. OASIS may be used in schools as well as universities. Non-numerical questions, where answers may be somewhere between right and wrong, are possible. OASIS can also be used to deliver concept inventories to students to support research into concept acquisition and retention.

La production de lavande concoure au rayonnement de la région Rhône-Alpes. Les applications de l'huile essentielle (HE) de lavande reposent sur la culture de 3 espèces (L. aangustifolia, L. latifolia et L. stoechas et d'un hybride L. x intermedia) aux chémotypes marqués. Le genre Lavandula est un modèle idéal pour comprendre la structuration et l'origine de la diversité des composés organiques volatils (COV) en particulier des terpènes. Les lavandes ont l'avantage d'avoir une aire de distribution large avec des régions bioclimatiques différentes, un nombre d'espèces limité (39) ayant des caractéristiques morphologiques et écologiques variées. Pour caractériser la diversité des COV accumulés dans les espèces du genre et envisager leur évolution, nous avons analysé (GC-MS) les COV de 29 espèces (certaines pour la première fois). Comme souvent chez les plantes, la production de COV dans les inflorescences de lavande est soumise à une régulation spatio-temporelle. L'émission différentielle de COV au cours du temps chez L. angustifolia a été relevée par les agriculteurs qui ont observé une qualité d'HE différente suivant la maturité des inflorescences au moment de la récolte. Pour modéliser ces variations et les corréler avec des étapes du développement de la plante, nous avons analysé, au niveau chimique (GC-FID) et moléculaire (qPCR), les variations temporelles des principaux COV dans les feuilles et les inflorescences (plusieurs années et cultivars). En amont de ces recherches sur les COV du genre Lavandula, différent outils de bioinformatique ont été développés. En particulier, le module " MSeasy " qui permet d'automatiser le rapatriement de données de GC-MS. Ceci constitue un pré-requis pour utiliser la lavande comme modèle d'étude des COV chez les Lamiacées

Motivé par des applications dans le domaine de l'analyse de données génomiques, ce travail de thèse porte sur l'étude de l'impact de la dépendance sur les propriétés des procédures de tests multiples en grande dimension. Notre proposition consiste à considérer un modèle d'Analyse en Facteurs pour la structure de dépendance entre les variables. Un algorithme de type EM est présenté pour estimer les paramètres du modèle ainsi qu'une méthode ad hoc pour déterminer le nombre optimal de facteurs à inclure dans le modèle. De plus, ce modèle définit un cadre général pour la prise en compte de la dépendance dans les procédures de tests multiples. L'estimation du taux de faux-positifs (FDR) et de la proportion d'hypothèses nulles, paramètre important qui intervient dans le contrôle des taux d'erreurs, sont étudiés plus particulièrement. Ainsi, on montre que la dépendance entre tests entraîne une instabilité des procédures d'inférence simultanée. Une nouvelle approche est présentée : l'objectif est de réduire cette dépendance, procurant à la fois une augmentation de la puissance des tests et une diminution de la variabilité des taux d'erreurs. Enfin, ces résultats méthodologiques sont illustrés à partir de données génomiques et la procédure est implémentée dans le logiciel libre R au sein du package FAMT.

<p>The world of systems engineering methods is changing as rigorous ‘off-the-shelf’ systems engineering methods become more popular. One example of such a systems engineering method is Rational Unified Process. In order to cover all phases in a software development process, and a wide range of project-types, such methods need to be of an impressive size. Thus, the need for configuring such methods in a structured way is increasing accordingly. In this thesis, method configuration is considered as a particular kind of method engineering that focuses on tailoring a standard systems engineering method. We propose a meta-method for method configuration based on two fundamental values: standard systems engineering method’s rationality and reuse. A conceptual framework is designed, introducing the concepts Configuration Package and Configuration Template. A Configuration Package is a pre-made ideal method configuration suitable for a delimited characteristic of a (type of) software artifact, or a (type of) software development project, or a combination thereof. Configuration Templates with different characteristics are built combining a selection of Configuration Packages and used as a base for a situational method. The aim of the proposed meta-method is to ease the burden of configuring the standard systems engineering method in order to reach an appropriate situational method.</p>

The competition amongst companies is getting tougher and the economic markets are getting even bigger with new products and businesses. One way for companies to differentiate themselves from the competitors is through packaging design. If the merchandise is to send a reliable and solid message to consumers, the attributes of the packaging must be consistent and uniform. If the different attributes are not coherent, the message loses credibility towards the consumer. Through the sent messages, the pack signals the products’ expected quality and price. This paper includes two studies, in which the main objective is to discover and build understanding about Swedish consumers’ perception of a product’s price depending on the pack’s design. The focus of this paper is based upon household products. The first study is solely focused on consumers’ opinions on package design, while the second study is based on existing product packs on the market. The results obtained in the consumer study will discover eventual general opinions concerning cheap and expensive packages. These results will then be compared to a selection of products from the markets’ existing offers. The purpose of this study is to clarify how well companies shape their packs based on consumers’ general perception. It is finally discussed how the different attributes can be used to legitimize a higher or lower price. / Konkurrensen mellan företag ökar och blir allt hårdare med ett ständigt växande antal aktörer på marknaden. Ett sätt att differentiera sig från konkurrenter är genom förpackningsdesign. För att varan i sin helhet ska ge ett pålitligt intryck måste förpackningens attribut vara enhetliga och genomgående. Spretar attributen inger detta förvirring och skapar brist i trovärdighet hos konsumenten. Förpackningen signalerar varans förväntade kvalitet och pris. Denna uppsats omfattar två studier med syfte att kartlägga svenska konsumenters uppfattning av en produkts pris utifrån förpackningens utformning. Fokus i denna uppsats ligger på hushållsprodukter. Den första studien vänder sig direkt till konsumenten medan den andra undersöker befintliga förpackningar på marknaden. Resultatet av konsumenternas generella uppfattning, gällande billiga respektive dyrare förpackningar, jämförs med ett urval från marknadens befintliga utbud. Detta görs med syfte att klargöra för hur väl företagen arbetar efter konsumenternas generella uppfattning. Slutligen diskuteras hur de olika attributen kan användas i förpackningsdesign för att legitimera ett dyrare respektive billigare pris.

The integration of mixed-signal systems has long been a problem in the semiconductor industry. CMOS System-on-Chip (SOC), the traditional means for integration, fails mixed-signal systems on two fronts; the lack of on-chip passives with high quality (Q) factors inhibits the design of completely integrated wireless circuits, and the noise coupling from digital to analog circuitry through the conductive silicon substrate degrades the performance of the analog circuits. Advancements in semiconductor packaging have resulted in a second option for integration, the System-On-Package (SOP) approach. Unlike SOC where the package exists just for the thermal and mechanical protection of the ICs, SOP provides for an increase in the functionality of the IC package by supporting multiple chips and embedded passives. However, integration at the package level also comes with its set of hurdles, with significant research required in areas like design of circuits using embedded passives and isolation of noise between analog and digital sub-systems. A novel multiband balun topology has been developed, providing concurrent operation at multiple frequency bands. The design of compact wideband baluns has been proposed as an extension of this theory. As proof-of-concept devices, both singleband and wideband baluns have been fabricated on Liquid Crystalline Polymer (LCP) based organic substrates. A novel passive-Q based optimization methodology has been developed for chip-package co-design of CMOS Low Noise Amplifiers (LNA). To implement these LNAs in a mixed-signal environment, a novel Electromagnetic Band Gap (EBG) based isolation scheme has also been employed. The key contributions of this work are thus the development of novel RF circuit topologies utilizing embedded passives, and an advancement in the understanding and suppression of signal coupling mechanisms in mixed-signal SOP-based systems. The former will result in compact and highly integrated solutions for RF front-ends, while the latter is expected to have a significant impact in the integration of these communication devices with high performance computing.

The investigation of liquid crystal polymer (LCP) technology to function as a low-cost next-generation organic platform for designs up to millimeter-wave frequencies has been performed. Prior to this research, the electrical performance of LCP had been characterized only with the implementation of standard transmission lines and resonators. In this research, a wide variety of passive functions have been developed on LCP technology and characterized for the first time. Specifically, we present the development of patch antenna arrays for remote sensing applications, the performance of compact low-pass and band-pass filters up to millimeter-wave frequencies, and the integration of passive elements for X-band and V-band transceiver systems. First, dual-frequency/dual-polarization antenna arrays have been developed on multilayer LCP technology and have been integrated with micro-electro-mechanical-system (MEMS) switches to achieve real-time polarization reconfigurability. These arrays are conformal, efficient and have all the features desirable for applications that require space deployment. Second, a wide variety of filters with different physical and functional characteristics have been implemented on both single and multilayer LCP technology. These filters can be classified based on the filter type (low-pass/band-pass), the resonators used (single-mode/dual-mode), the response characteristics (symmetric/asymmetric), and the structure of the filter (modular/non-modular). Last, examples of integrated modules for use in transceiver systems are presented. This part of the research involves the development of duplexers, radiating elements, as well as their integration. The duplexers themselves are realized by integrating a set of band-pass filters and matching networks. The characterization of the individual components, and of the integrated system are included. This research has resulted in a thorough understanding of LCP's electrical performance and its multilayer lamination capabilities pertaining to its functioning as a material platform for integrated microwave systems. Novel passive prototypes that can take advantage of such multilayer capabilities have been developed.