Fish and wildlife were randomly sampled in Utah from pre-selected x areas and analyzed for levels of total mercury, dieldrin, DDT, and DDE. Levels were well within consumptive tolerance or guildeline limits except for mercury levels of fish in Willard Bay Reservoir. PCB's were also identified in a large proportion of samples. None of the chukars, 6 percent of the pheasants, 4 percent of the waterfowl, and none of the fish sampled, excluding Willard Bay Reservoir, were above the 0.5 ppm guideline level for mercury established by the Food and Drug Administration. Seventy-seven percent of the fish sampled from Willard Bay Reservoir were above the 0.5 ppm guideline level. Only one duck (2 percent) was above the maximum permissible concentration for dieldrin. All of the chukars, pheasants, other waterfowl, and fish were well below human consumptive tolerance limits for dieldrin and DDT + DDE. It is recommended that studies be initiated to more closely define possible sources of mercury and the health hazard involved in consumption of these fish.

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Enclosure design is the process of creating a package that will support and protect enclosed circuitry. Electronic enclosures are used in almost all industries, such as aerospace, automotive, naval, computer, toy, etc. Many designers use computer aided design (CAD) packages to aid them in creating these enclosures. Enclosure creation involves a working knowledge of the physics behind electrical and mechanical systems. Each of these engineering disciplines has separate CAD packages with their own set of rules, programming language, and interfaces. This creates a barrier for communication flow between electrical CAD (ECAD) and mechanical CAD (MCAD). The purpose of this thesis is to overcome the communication barrier by effectively transferring the knowledge contained in the ECAD package to the MCAD package, and use this information to aid in the electronic enclosure design process.

The telecom industry is today categorized by being able to wirelessly transmit large amounts of data between systems in a short time. A precondition for this is that the PCBs (printed circuit board) being developed and manufactured can handle and distribute large amounts of data internally. Often presented as multiple high-speed links up to 10-28 Gbit/s. The PCBs of today contains electric conductors, which all lead from one point to another, with no possibility of branching or flexibility without being rebuilt. A significant problem with all these electric conductors in the PCBs and all the PCBs close contact with each other is the interference building up between them. EMI is a general explanation for this, Electro Magnetic Interference. To avoid this problem and instead meet the constraints of EMC, Electro Magnetic Compatibility, these electric conductors can be replaced with optical conductors. This new concept with optical conductors is not initially going to replace all electric conductors but replace most of the existing high speed links and the traditional point to point communication with optical high speed multidrop. Not just fulfilling the need of EMC, these conductors are also able send one single signal to several different receivers. The optical conduction is happening inside a plate of PC-plastic, allowing the signal to travel throughout the whole PCB if needed. While this is happening, all receivers in need of data can pick up the sent-out signal. / Telekombranschen karaktäriseras av att stora mängder data för över trådlöst mellan system på kort tid. En förutsättning för detta är också att de kretskort som utvecklas och tillverkas måste kunna hantera och distribuera stora mängder data internt på kortet. Detta sker ofta i multipla höghastighetslänkar på upp till 10–28 Gbit/s. Dagens kretskort bygger på elektriska ledare, som har en början och ett slut. Det vill säga ingen möjlighet till förgrening eller förändring utan ombyggnad. Ett problem med alla dessa ledare i kretskorten och kretskortens nära kontakt med varandra är att interferens sker mellan dem. EMI är en känd beteckning för detta, Elektromagnetisk interferens. För att undgå detta problem och istället uppfylla EMC, Elektromagnetisk kompatibilitet, kan dessa elektriska ledare ersättas med optiska. Detta nya koncept med optiska ledare ska till en början inte ersätta alla elektriska ledare utan målet är att ersätta merparten av de på korten befintliga höghastighetslänkar och att ersätta de traditionella höghastighetslänkarnas point to point med en optisk multidroplösning. Utöver att dessa ledare uppfyller EMC så bidrar de även till att en signal kan skickas från samma sändare till flera olika mottagare. Då den optiska ledningen sker genom en skiva i PC-plast har signalen inget förbestämt mål, utan alla mottagare i behov kan plocka upp signalen.

This thesis aims to develop hardware for laboratory in courses such asSwitching Theory at Halmstad University which can help students tounderstand practical applications of the hardware they are studying atuniversity. To achieve this, a printed circuit board (PCB) that simulates trafficintersections has been designed, constructed, and tested.The project consists of four main phases. The first step is to create anequipment list to identify the components needed to meet our goals. Then, theschematic design phase is started using KiCad program for PCB design. Aprinted circuit board is manufactured, and all the components lists in theequipment inventory is carefully soldered. This step completes the secondstage, involving PCB fabrication and component placement. The next step isto program one intersection using an embedded system according to a statemachine and ensure the PCB works properly. For this purpose, a statemachine is developed to describe test conditions and program sequences.

Global energy consumption continues to grow, driving the need for cheap, power-dense power electronics. Replacing the incumbent silicon insulated gate bipolar transistors with silicon carbide (SiC) metal oxide semiconductor field effect transistors (MOSFETs) has been proposed as a solution to increase the power densities of power converters in some applications. One such application is electric vehicles (EVs) where the efficiency and weight of the power electronics are critical; however, modern packaging technologies are still limiting the performance of SiC MOSFETs. One promising trend in power semiconductor packaging technologies is the use of printed circuit boards (PCBs) because the technology is mature—resulting in low costs—and the allowable stackups are ideal for integrating driving circuitry and power loop components—resulting in reduced manufacturing complexity. This thesis presents the design and analysis of two PCB-embedded 1.2 kV SiC MOSFET half-bridge packages and a hybrid PCB/DBC-based 1.2 kV SiC MOSFET full-bridge package for EV on-board charger applications. The first of the two PCB-embedded packages has integrated gate drive circuitry, less than 2.3 nH loop inductances, and dual-sided cooling with a total junction-to-case thermal resistance (RTH,JC) of 0.12 K/W. The second PCB-embedded package has only drain-side cooling to allow for surface mount terminals, has an area of 37.1 mm x 18.5 mm due to the removal of the gate drive circuitry, and has less than 2.4 nH loop inductances. The PCB/DBC-based full-bridge package has an RTH,JC of 0.65 K/W, less than 4.5 nH, and integrated gate drive circuitry. / M.S. / The continued increase in global energy consumption has led to concerns about sustainability, and as renewable energy generation is adopted more broadly, more efficient means of converting electrical energy from one form to another are required. Some applications, such as electric vehicles (EVs), also require a lightweight and a low volume from their converters in addition to high efficiency. The packaging of the semiconductors used in converters is important to the overall electrical efficiency of the converter and can also have an impact on the size of the converter as well. This thesis explores the design and analysis of three package structures for the semiconductors used in the on-board charger of an EV. These package structures are unified under the common theme of using printed circuit boards (PCBs) in the package itself. PCBs are commonly used to route the electrical connections between packaged semiconductors and other components in the converter, but they are not usually integrated into the package itself. The hope is that by integrating the PCB into the semiconductor package, higher-efficiency, lighter-weight, and smaller-volume converters will be possible.

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