Darbe nagrinėjama produkto pakuotės svarba marketingo sprendimuose. Baigiamojo darbo tikslas – išanalizavus įvairių produktų grupių pakuočių įtaką Lietuvos gyventojams ir Lietuvos gamintojų skiriamą dėmesį produktų pakuotėms, pateikti pakuotės kūrimo modelį ir sukurti pakuotės kūrimo taisykles atsižvelgiant į pakuotės kaip marketingo objekto literatūrinę analizę. Produkto pakuotės svarba marketingo sprendimuose analizuojama nagrinėjant produkto pakuotės kaip marketingo objekto teorinius aspektus, atliekant analizę bei pateikiant pasiūlymus pagal gautas teorines ir tyrimo analizės išvadas. Teorinėje darbo dalyje analizuojamos autorių nuomonės apie pakuotės svarbą ir vietą marketingo sprendimuose, kiek pakuotė svarbi vartotojo pirkimo sprendimui. Analitinėje baigiamojo darbo dalyje pateikiami ir analizuojami tyrimo rezultatai, kuris atlikto apklausus (271) respondentų anketavimo būdu ir ištyrus Lietuvos gamintojų atskirų produktų grupių pakuotėms skiriamą dėmesį. Projektinėje darbo dalyje suformuoti tokie sprendimai: produkto pakuotės kūrimo modelis ir taisyklių bei rekomendacijų rinkinys. / In this thesis is analyzing the importance of product packaging in marketing decisions. The purpose of final job – set the model which shows how to package product in the best way and create the rules of good packaging according to the theoretical analysis of package like marketing object. Thos purpose is done after empirical analysis of influence various product package on Lithuanian and analysis of Lithuanian producers’ attitude to product package. The importance of product packaging is being analyzed by studying theoretical aspects and state of packaging state in marketing studies. The big influence of packaging is proved by getting results from research and therefore is formulized suggestions of good product packaging. In theoretical part of thesis is analyzed opinions of various marketing’s authors, how they shows importance of product packaging and its state in marketing decisions. In analytical part is set the result of research, which is done by questioning Lithuanian respondents and Lithuanian manufacturers is explored what attitude they pay to packaging. The project-based part includes the solutions: product packaging model and the rules and recommendations how to represent product trough the package in the best way.

Les travaux de cette thèse ont été menés dans le cadre d’une collaboration entre les laboratoires SATIE et LTN IFSTTAR. Ils portent principalement, sur l’étude de la robustesse des composants JFET SiC de puissance pour des applications de découpage à haute fréquence, forte puissance surfacique et à haute température lorsqu’ils sont soumis à des régimes extrêmes de fonctionnement. Les travaux présentés traitent également de façon plus générale l’étude de la durée de vie de packaging dédiés à ce type de composants et adaptés à la haute température pour des applications aéronautiques. La robustesse de différents lots des VJFETs SiC d’un fabricant particulier (SemiSouth) a été étudiée en régimes d’avalanche et de court circuit afin de déterminer les énergies que peuvent supporter ces composants dans ces modes de fonctionnement particuliers en cherchant notamment à quantifier la température du cristal et à mettre en évidence les mécanismes physiques à l’origine des défaillances. Nous avons ainsi également développé un modèle éléments finis thermique afin d’estimer la température de jonction du JFET SiC lors des régimes extrêmes pour chercher à relier l’apparition de la défaillance à la température. Finalement, nous décrivons des mécanismes physiques à l’origine des dégradations lors de la répétition de tels régimes extrêmes de fonctionnement expliquant à terme la destruction par vieillissement des transistors. Un substrat céramique à base de Si3N4 a été le support des études menées dans le cadre de cette thèse sur le packaging. Nous avons caractérisé les dégradations de ces substrats par des analyses acoustiques après vieillissement par cyclage thermique de forte amplitude. Un modèle thermomécanique a été développé afin d’estimer les contraintes mécaniques dans l’assemblage et valider les résultats expérimentaux obtenus. Enfin, nous avons également initiés des travaux de diagnostic thermique sur des puces JFET SiC, par des mesures d’impédance thermique pouvant être utilisées pour la détection de défauts de délaminage dans un assemblage de puissance. / The work presented in this thesis was conducted between SATIE and LTN IFSTTAR laboratories. It focuses on the study of the robustness of SiC power components subjected to hard working conditions for high switching frequency, high power density and high temperature applications. The work also presents a study on the robustness of a dedicated package adapted to high temperature applications. The robustness of several SiC VJFETs from a particular manufacturer (SemiSouth) was studied in avalanche and short circuit modes in order to estimate the energies that can withstand these components in these operating modes. The experimental protocol also includes thermal models to quantify the crystal temperature and to highlight the ageing physical mechanisms causing failure. Therefore, we had developed a finite element model to estimate the thermal junction temperature of the SiC JFET in extreme working conditions to try to relate the failure to the maximum temperature reached after each cycle. Finally, we described the physical mechanisms behind the degradations that explain ultimately the destruction of ageing transistors under repetitive avalanche mode. A ceramic substrate made of Si3N4 has been the support of studies conducted in this thesis on the packaging reliability. We characterized the degradation of these substrates by acoustic analysis after ageing by thermal cycling of high amplitude. A thermo-mechanical model was developed to estimate the mechanical stresses in the assembly and validate the experimental results. Finally, we have initiated thermal diagnostic studies on SiC JFET chips. We have shown that thermal impedance measurements can be used for the detection of delamination defects in a power assembly.

This work aims to analyze legislation on the management of packaging and packaging waste. The object of the research is European legislation from the Czech -based treatment, which are discussed in detail. The focus of the work is the chapter dealing with the life cycle of the packaging. The rights and obligations of responsible persons related to different stages of the life cycle of the packaging are in Act No. 477/2001 Coll., On packaging and related regulations set out in detail so as to fulfill one of the basic principles of packaging issues "From the cradle to the grave." The work aims at the systematic distribution of these rights and obligations of the different stages. The last chapter focuses attention on beverage containers, specifically comparing the environmental impact of one-way and returnable beverage containers.

Les technologies d'empilement vertical de circuits intégrés, plus connues sous le terme « intégration 3D », ont connu un développement important durant les six dernières années, dans l'optique de proposer une alternative aux approches bidimensionnelles traditionnelles comme les Systems on Chip (SoC). Cette nouvelle architecture a été adaptée au domaine du packaging des circuits intégrés à travers le packaging en 3D réalisé à l'échelle de la plaque ou 3D-WLP pour 3D-Wafer Level Packaging. L'intégration 3D-WLP permet une diminution des tailles des dispositifs finaux, une augmentation de la densité des interconnexions ainsi qu'une réduction des coûts de fabrication. La maîtrise de la réalisation des via traversant, ou TSV pour Through Silicon Via, est une étape clé qui permet d'assurer une connexion électrique entre les différents niveaux empilés. On s'intéresse dans ces travaux de thèse au TSV dans son approche via-last, c'est-à-dire fabriqué en face arrière du dispositif, après les transistors et les niveaux de métallisation de la face avant, et plus particulièrement à l'étape de passivation organique des TSV. En effet, ce via traversant est d'un diamètre trop important pour être complètement rempli avec sa métallisation en cuivre. L'étude concerne donc une solution incluant un remplissage en polymère afin d'améliorer la solution existante en termes de fiabilité et de compatibilité avec des empilements verticaux supplémentaires. / 3D integration technologies for integrated circuits have been widely developed during the six last years in order to propose an alternative to bi-dimensional approaches such as the Systems on Chip (SoC). This new architecture is also used for integrated circuits packaging through 3D-Wafer Level Packaging (3D-WLP). Thus, vertical stacking allows smaller package footprint, higher interconnection density and lower fabrication costs. Through silicon via (TSV) is a key technology that insures vertical electrical interconnection between the stacked levels. This thesis deals with the via-last approach which consists in realizing the TSV at the back-side of the wafer, after the Front End Of the Line (FEOL) and the Back End Of the Line (BEOL), both located at the front-side. During the metallization steps, only a copper liner is electroplated in the TSV since its diameter is too large to achieve a complete metal filling. This study focuses on the TSV polymer insulation step and more specifically, a solution including a TSV polymer filling in order to improve the existing configuration in terms of reliability and compatibility with further 3D stacking.

Aliado ao fato dos biomateriais ainda serem pouco explorados pelas indústrias alimentícias, este trabalho propôs o desenvolvimento de embalagens que sejam, além de biodegradáveis, também ativas através do uso de um agente antimicrobiano natural capaz de inibir a proliferação de fungos correntes em produtos de panificação (Penicillium commune e Eurotium amstelodami). Primeiramente, filmes biodegradáveis a base de fécula de mandioca foram elaborados pela técnica de casting, usando açúcares e glicerol como plastificantes. O aumento do conteúdo de glicerol causou diminuição da resistência máxima à tração e elevação dos valores de propriedades de barreira. Numa segunda etapa do trabalho, a introdução de nanopartículas de argila esmectita influenciou positivamente as propriedades de barreira dos filmes, devido à diminuição observada nos valores de permeabilidade ao vapor de água e coeficiente de permeabilidade ao oxigênio. Nesta fase, a variação do conteúdo de glicerol também afetou significativamente as propriedades mecânicas e de barreira dos filmes biodegradáveis. As concentrações inibitórias mínimas dos óleos essenciais de cravo e de canela contra os fungos estudados foram definidas e o óleo essencial de canela foi selecionado, para ser incorporado aos filmes biodegradáveis, em três conteúdos distintos, pois foi o composto que mostrou uma inibição mais eficiente. A atividade antimicrobiana dos filmes biodegradáveis com incorporação de óleo essencial de canela foi testada sobre os micro-organismos escolhidos através de testes de difusão em halo, cujos resultados foram suficientes para demonstrar o potencial ativo da embalagem desenvolvida. Como método alternativo de incorporação do agente antimicrobiano, gás carbônico (CO2) em estado supercrítico foi utilizado como solvente. Os resultados obtidos foram promissores, uma vez que se observou incorporação de agente antimicrobiano dentro da matriz polimérica em quantidade suficiente para inibir a proliferação dos fungos testados. / This work concerned the development of biodegradable and active packaging based on cassava starch and natural antimicrobial agents that efficiently inhibit growth of fungi commonly found in bread products (Penicillium commune and Eurotium amstelodami). Biodegradable films were prepared by the casting technique, using sugars and glycerol as plasticizers. An increase in glycerol content caused a decrease in tensile strength and an elevation on barrier properties results. In a second phase of the work, incorporation of nanoclays diminished water vapor and oxygen permeability thus improving film packaging properties. Two antimicrobial agents were tested (cinnamon and clove essential oils) and cinnamon essential oil was chosen to be incorporated in biodegradable films based on cassava starch because it was more efficient against Penicillium commune and Eurotium amstelodami. Antimicrobial activity of biodegradable films with cinnamon essential oil was evaluated by means of a halo diffusion test in which an inhibition zone around a sample of the biodegradable and active film was analysed. As alternative method of antimicrobial agent incorporation, carbon dioxide (CO2) in supercritical state was used as solvent. Promising results were obtained since the amount of antimicrobial agent incorporated inside the polymeric matrix was sufficient to inhibit proliferation of fungi.

Thesis submitted in fulfilment of the requirements for the degree Master of Technology: Chemistry in the Faculty of Applied Sciences at the Cape Peninsula University of Technology / Paperboard made from recycled fibres is being used more frequently in direct food packaging applications, in addition to its use as secondary and tertiary packaging. However, recent research has shown that there is a risk that harmful chemicals may migrate from the paperboard into the food. The simplest approach to reducing the migration of these contaminants is the use of barrier films. The barrier efficiencies of these various films can be examined by means of a migration test into a food simulant, followed by extraction in a suitable solvent. The extract can then be analysed by chromatographic techniques such as gas chromatography mass spectrometry (GC-MS) to determine the concentration of the specific contaminants. However on a production level, the availability of this type of highly specialised equipment is limited. A simple, cost effective method is needed to evaluate the barrier properties to specific chemical contaminants. The Heptane Vapour Transmission Rate (HVTR) test is a permeation test method for use at quality control level to determine barrier properties to the migration of organic vapours. The first part of the study focussed on establishing a universal correlation between HVTR and specific migration of diisobutyl phthalate (DiBP), dibutyl phthalate (DBP) and diethylhexyl phthalate (DEHP) that would be applicable to any type of functional barrier. However, experimental data demonstrated this was not possible as the correlation factor linking HVTR to specific migration was largely dependent on the type and morphology of the coating considered. The initial objective of the study was reconsidered in favour of building individual models specific to the nature of the coating and substrate considered. A correlation between HVTR and specific migration of DiBP, DBP and DEHP for a polyvinylidene chloride (PVDC) barrier polymer was constructed by varying the applied coating weight. The vapour transport mechanism for the HVTR test and the specific migration test were found to differ, showing that a direct correlation between HVTR and the specific migration was again not possible. However, an indirect correlation could be made. The HVTR method gives an indication of film integrity, whereas the coating weight could be used as an indicator of the specific migration. The correlation between the coating weight and the specific migration yielded an equation that can be used to calculate the specific migration through the PVDC barrier polymer, provided the quantity of the chemical contaminant originally present in the paperboard was known. This equation was specific to the type of barrier polymer, the specific chemical contaminant as well as the intended shelf-life of the food product to be packaged in the paperboard.

Este projeto tem por objetivo o desenvolvimento de uma embalagem biodegradável tipo espuma, obtida a partir de fécula de mandioca, para o armazenamento de alimentos. As espumas foram obtidas pelo processo de termo-expansão de uma massa de amido, água e aditivos. O estudo das formulações foi dividido em três etapas: na primeira etapa, foi estudada a influência dos sólidos na espuma, foram feitas 5 formulações variando a quantidade de sólidos. Na segunda etapa foi estudada a influência dos plastificantes na espuma e foram testados quatro diferentes plastificantes (PEG 300, PEG 1500, PEG 6000 e PVA). Na terceira etapa foi estudada a influência das cargas minerais nas espumas, foram adicionadas três diferentes tipos de cargas (caulim, talco, CaCO3) em diversas concentrações (0,1; 0,5; 1; 5; 10; 20 e 30%). Em todas as formulações foram analisadas a perda de produção e as características mecânicas das espumas. Os resultados indicaram que a quantidade de fécula influencia a viscosidade da massa, e a mesma está diretamente ligada à perda de produção das espumas. No estudo dos plastificantes, dentre os PEGs, o que apresentou melhor interação com o polímero foi o de menor massa molar (PEG 300), com espumas mais resistentes e flexíveis. As espumas produzidas com PVA apresentaram uma estrutura interna mais homogênea, com alvéolos menores e uniformes em relação às espumas com PEG 300. Isso ocorreu devido o PVA ter propriedades adesivas. A adição de cargas minerais diminuiu a flexibilidade e a resistência à compressão das espumas conforme a quantidade de carga adicionada. Isso indica que não houve uma boa adesão entre as cargas e o polímero (fécula). Verificou-se um acúmulo das cargas inorgânicas na superfície das espumas. As espumas sem adição de carga apresentaram boas características mecânicas, compatíveis com as embalagens comerciais. Foi feita a análise de biodegradabilidade por perda de massa e a espuma se degradou em 20 dias. Tanto a espuma, como os ingredientes utilizados para sua produção (plastificante, amido) não apresentaram toxicidade. Para encerrar o trabalho foi realizada uma análise para verificar a aceitação do produto pelos consumidores. Em todos os parâmetros avaliados (aparência, resistência, confiabilidade e intenção de compra) os consumidores aprovaram o produto. / The objective of this project is the development of biodegradable food packaging, starch foam, made by cassava starch. Starch foam was obtained with a batter of starch, water and additive, through thermo expansion process. Formulation study was divided in three parts: the first step was to verify the starch quantity influence in the starch foam and five formulations with different starch quantities were tested. The second step was to verify the plasticizer influence in the starch foam and four plasticizers were tested (PEG 300, PEG 1500, PEG 6000 and PVA). The third step was to verify the filler influence in the starch foam and three different filler kind were tested (kaolin, talc, CaCO3) in different quantities (0,1; 0,5; 1; 5; 10; 20 and 30%). Mechanical properties and lost of production of starch foam were analyzed in all formulations. Results of first step indicated that the starch quantity in the formulation influenced the batter viscosity and the lost of production of the starch foams. In the second step, the plasticizer PEG 300 (with low molecular weight) presented better performance as compared with PEG 1500 and PEG 6000. Starch foam with PVA presented internal structure more homogeneous than starch foam with PEG 300, due the PVA adhesiveness properties. In the third step, the filler addition did not improve the mechanical properties of starch foam, due there was not interaction between the filler and the polymer (starch). Observing the MEV, there were filler accumulated in the starch foam surface. According biodegradable analysis, starch foam degraded in 20 days. Even starch foam, as all the ingredients (starch, plasticizer), did not present toxicity. Starch foam without filler addition presented mechanical properties similar to the commercials food packaging made by expanded polystyrene and cardboard paper. To finish the work, was realized the acceptance analysis to verity the acceptability of the starch foam. As result, all parameters analyzed (appearance, resistance, trusty and purchase intention) were approved by consumers.

by Ng Chi-Keung. / Thesis (M.Phil.)--Chinese University of Hong Kong, 1998. / Includes bibliographical references (leaves 127-134). / Abstract also in Chinese. / Abstract --- p.2 / 摘要 --- p.3 / Acknowledgements --- p.4 / Chapter Chapter 1 --- Introduction --- p.7 / Chapter Chapter 2 --- Packaging Effects of Integrated Circuits --- p.9 / Chapter 2.1 --- The Structure of the IC Package --- p.9 / Chapter 2.2 --- Microstrip Discontinuities --- p.11 / Chapter Chapter 3 --- The Finite-Difference Time-Domain Method --- p.19 / Chapter 3.1 --- Basic Theory --- p.19 / Chapter 3.2 --- Stability Criterion --- p.25 / Chapter 3.3 --- Formulation of Source --- p.30 / Chapter A. --- Source Function --- p.30 / Chapter (i) --- Sinusoidal --- p.30 / Chapter (ii) --- Gaussian Pulse --- p.31 / Chapter B. --- Source Realization --- p.36 / Chapter (i) --- Electric Field Source --- p.36 / Chapter (ii) --- Lumped Source --- p.38 / Chapter (iii) --- Current Source --- p.40 / Chapter C. --- Source Placement --- p.41 / Chapter 3.4 --- Parameter Extraction --- p.42 / Chapter A. --- Voltage and Current --- p.42 / Chapter B. --- Characteristic Impedance --- p.44 / Chapter C. --- Effective Dielectric Constant --- p.45 / Chapter D. --- Scattering Parameters --- p.46 / Chapter 3.5 --- Termination and Boundary Treatment --- p.48 / Chapter A. --- Perfect Electric Conductor (PEC) --- p.48 / Chapter B. --- Perfect Magnetic Conductor (PMC) --- p.49 / Chapter C. --- Interface between Two Materials --- p.50 / Chapter 3.6 --- Perfectly Matched Layer (PML) --- p.54 / Chapter A. --- Theory of PML in Three Dimensions --- p.56 / Chapter B. --- Incorporation of PML as Absorbing Boundary Condition (ABC) --- p.65 / Chapter C. --- Discretization of Maxwell's Equations in PML --- p.73 / Chapter 3.7 --- Flowcharts --- p.75 / Chapter A. --- Free Space Radiation by a Dipole Antenna --- p.77 / Chapter B. --- Parameters of a Microstrip Line --- p.79 / Chapter C. --- Scattering Parameters of Planar Network --- p.85 / Chapter 3.8 --- Summary --- p.87 / Chapter Chapter 4 --- Effects of Ground Via Allocation --- p.88 / Chapter 4.1 --- Introduction --- p.88 / Chapter 4.2 --- Simulation and Experimental Results --- p.91 / Chapter 4.3 --- Equivalent Circuit Modelling --- p.108 / Chapter 4.4 --- Summary --- p.124 / Chapter Chapter 5 --- Conclusions --- p.125 / Chapter Chapter 6 --- Recommendation for Future Work --- p.126 / References --- p.127 / Publication --- p.134

Recent advances in microelectronics and packaging industry are characterized by a progressive miniaturization in response to a general trend toward higher integration and package density. Corresponding to this are the challenges to traditional manufacturing processes. Some of these challenges can be satisfied by laser micromachining, because of its inherent advantages. In laser micromachining, there is no tool wear, the heat affected zone can be localized into a very small area, and the laser micromachining systems can be operated at a very wide range of speeds. Some applications of laser micromachining include pulsed Nd:YAG laser spot welding for the photonic devices and laser microdrilling in the computer printed circuit board market. Although laser micromachining has become widely used in microelectronics and packaging industry, it still produces results having a variability in properties and quality due to very complex phenomena involved in the process, including, but not limited to, heat transfer, fluid flow, plasma effects, and metallurgical problems. Therefore, in order to utilize the advantages of laser micromachining and to achieve anticipated results, it is necessary to develop a thorough understanding of the involved physical processes, especially those relating to microelectronics and packaging applications. The objective of this Dissertation was to study laser micromachining processes, especially laser drilling and welding of metals or their alloys, for the microscale applications. The investigations performed in this Dissertation were based on analytical, computational, and experimental solutions (ACES) methodology. More specifically, the studies were focused on development of a consistent set of equations representing interaction of the laser beam with materials of interest in this Dissertation, solution of these equations by finite difference method (FDM) and finite element method (FEM), experimental demonstration of laser micromachining, and correlation of the results. The contributions of this Dissertation include: 1)development of a finite difference method (FDM) program with color graphic interface, which has the capability of adjusting the laser power distributions, coefficient of energy absorption, and nonlinear material properties of the workpiece as functions of temperature, and can be extended to calculate the fluid dynamic phenomena and the profiles of laser micromachined workpieces, 2)detailed investigations of the effect of laser operating parameters on the results of the profiles and dimensions of the laser microdrilled or microwelded workpiece, which provide the guideline and advance currently existing laser micromachining processes, 3)use, for the first time, of a novel optoelectronic holography (OEH) system, which provides non-contact full-field deformation measurements with sub-micrometer accuracy, for quantitative characterization of thermal deformations of the laser micromachined parts, 4)experimental evaluations of strength of laser microwelds as the function of laser power levels and number of microwelds, which showed the lower values than the strength of the base material due to the increase of hardness at the heat affected zone (HAZ) of the microwelds, 5)measurements of temperature profiles during laser microwelding, which showed good correlations with computational results, 6)detailed considerations of absorption of laser beam energy, effect of thermal and aerodynamic conditions due to shielding gas, and the formation of plasma and its effect on laser micromachining processes. The investigations presented in this Dissertation show viability of the laser micromachining processes, account for the considerations required for a better understanding of laser micromachining processes, and provide guideline which can help explaining and advancing the currently existing laser micromachining processes. Results of this Dissertation will facilitate improvements and optimizations of the state-of-the-art laser micromachining techniques and enable the emerging technologies related to the multi-disciplinary field of microelectronics and packaging for the future.

Ce travail de thèse vise à utiliser l’ingénierie des contraintes mécaniques pour améliorer la fiabilité des composants microélectroniques en environnement de chaleur humide afin de développer des technologies non-hermétiques robustes. L’application se fait sur des composants micro-ondes à base d’arséniure de gallium (GaAs) avec des fonctions d’amplification faible bruit (LLA et LNA). Les travaux ont commencé par l’analyse des modes d’endommagement-matériau des MMIC (Monolithic Microwave Integrated Circuit) en milieu sévère et par l’évaluation des contraintes thermomécaniques induites dans les couches minces empilées par l’environnement de test. Ce projet propose deux formes de méthodes pour mettre en évidence l’effet d’une contrainte sur la fiabilité des MMIC dans une configuration de qualification spatiale : une première méthode dite « indirecte » par mise en flexion (250MPa en absolue) et une seconde méthode « directe » par traitement de la couche de passivation en nitrure de silicium (SiNx) via l’implantation d’ions azote (~ -1,2GPa). Un système de mise en contrainte mécanique et un circuit imprimé spécialement conçus pour ces travaux, soumettent par flambement du circuit imprimé le MMIC à des contraintes mécaniques uni-axiales de traction ou de compression. Des bancs de caractérisation par connecteurs ou sous pointes sont utilisés pour mesurer les paramètres statiques des transistors et calibrer les variations de contraintes internes des couches du MMIC flambé grâce aux effets piezorésistifs des semi-conducteurs. Des simulations numériques par Abaqus ® ont permis d’évaluer les contraintes thermomécaniques subies par les MMIC pendant leur préparation au test de vieillissement et ainsi qu’après enrobage de résine « Dam&Fill ». Pour chacune des deux méthodes proposées, directe et indirecte, une campagne de test a été menée dans les conditions de vieillissement les plus sévères (85°C / 85%HR / polarisation inverse de grille). Les résultats obtenus pour le cas indirect par mise en flexion sur 1850h (A) / 2450h (B) ont montré une nette amélioration du temps moyen avant défaillance des composants que ce soit sous contraintes de traction ou de compression. En effet pour les technologies étudiées la présence de contrainte a retardé de façon considérable l’endommagement plus de 80% des MMIC. L’analyse de la défaillance des composants défectueux a été complétée par des simulations éléments finis purement mécaniques sous Abaqus ®. Elle a montré des fissures et des cloques au voisinage des doigts de grille du transistor et des capacités, que nous avons tenté de relier aux pertes de performances statiques et dynamiques. Les résultats avec la méthode directe sur 1000h (A et B) par implantation ionique ont aussi montré une amélioration de la fiabilité pour 100% des composants vieillis. La comparaison de ces résultats avec le cas indirect permet d’identifier la nature et les niveaux de contraintes optimales qu’il faut pour garantir une meilleure fiabilité des MMIC en environnement sévère avec leurs limitations. Une étude du comportement physico-chimique de l’endommagement de l’extrême surface des puces a aussi été effectuée afin de relier les différentes échelles de dégradations entre elles : de la perte de performance jusqu’à la rupture des liaisons chimiques en passant par la microstructure des couches. / This thesis aims at using mechanical stress engineering to improve the reliability of microelectronic components under Temperature-Humidity-Bias testing in order to develop robust packaging technologies for space. The application is done on microware devices based on gallium arsenic (GaAs) with low noise amplifier function (LLA and LNA). We started work by analyzing failure mechanisms of MMIC devices (Monolithic Microwave Integrated Circuit) in severe environment and with the evaluation of thermomechanical induced stresses in stack layers by test temperature. We propose two methods to study the impact of mechanical applied stress on the reliability of microware devices in space qualification: the first method called “indirect” is a bending by buckling way which applies uniaxial stress (250MPa in absolute value) and the second method called “direct” with biaxial stress by treating silicon nitride passivation (SiNx) layer with nitrogen ion implantation (~ -1,2GPa). A system which applies mechanical stress and a printed circuit especially designed for this thesis. Characterization benches with connectors of probes are used to make electrical measurements of transistors and to calibrate the changes of internal stress by piezoresistive effects in semi semiconductors. Numerical simulations have been performed in Abaqus ® to evaluate thermomechanical stresses induced in layers through devices preparation and after plastic encapsulation (Dam&Fill). For each proposed method, aging test was carried out in the most severe conditions (85°C / 85%RH / inverse polarization of the gate). The results of indirect case by buckling on 1850h (A) / 2450h (B) of testing showed a significant improvement of their reliability either in tensile or compressive applied stress. Indeed, for the studied devices the presence of stress delayed considerably damage of more than 80% of aged devices. The failure analysis of failed devices was completed by finite element method simulations in Abaqus ®. We observed and blisters near the gate fingers and capacitors which are linked to the loss of static and dynamic performances. The results in the direct case by surface treatment on 1000h (A and B) of testing also showed the improvement of the reliability for all aged components. The comparison of these results with the indirect case helps to identify the nature and level of optimal applied stress to ensure a better reliability of GaAs devices under THB testing. A study of the physico-chemical behavior of the failures at the surface was also performed in order to make a link between different scales of failure: from the loss of performance until the breaking of chemical bonds through changes of internal stress of the layers.