Since the discovery of graphene, substantial effort has been put toward the synthesis and production of 2D materials. Developing scalable methods for the production of high-quality exfoliated nanosheets has proved a significant challenge. To date, the most promising scalable method for achieving these materials is through the liquid-based exfoliation (LBE) of nanosheetsin solvents. Thin films of nanosheets in dispersion can be modified with additives to produce 2D inks for printed electronics using inkjet printing. This is the most promising method for the deposition of such materials onto any substrate on an industrial production level. Although well-developed metallic and organic printed electronic inks exist on the market, there is still a need to improve or develop new inks based on semiconductor materials such as transition metal dichalcogenides (TMDs) that are stable, have good jetting conditions and deliver good printing quality.The inertness and mechanical properties of layered materials such as molybdenum disulfide (MoS2) make them ideally suited for printed electronics and solution processing. In addition,the high electron mobility of the layered semiconductors, make them a candidate to become a high-performance semiconductor material in printed electronics. Together, these features make MoS2 a simple and robust material with good semiconducting properties that is also suitable for solution coating and printing. It is also environmentally safe.The method described in this thesis could be easily employed to exfoliate many types of 2D materials in liquids. It consists of two exfoliation steps, one based on mechanical exfoliation of the bulk powder utilizing sand paper, and the other inthe liquid dispersion, using probe sonication to liquid-exfoliate the nanosheets. The dispersions, which were prepared in surfactant solution, were decanted, and the supernatant was collected and used for printing tests performed with a Dimatix inkjetprinter. The printing test shows that it is possible to use the MoS2 dispersion as a printed electronics inkjet ink and that optimization for specific printer and substrate combinations should be performed. There should also be advances in ink development, which would improve the drop formation and break-off at the inkjet printing nozzles, the ink jetting and, consequently, the printing quality. / Sedan upptäckten av grafen har mycket arbete lagts på framställning och produktion av 2D-material. En viktig uppgift har varit att ta fram skalbara metoder för produktion av högkvalitativa  nanosheets via exfoliering. Den mest lovande skalbarametoden hittills har varit vätskebaserad exfoliering av nanosheets i lösningsmedel. Tunna filmer av nanosheets i dispersion kan anpassas med hjälp av tillsatser och användas för tillverkning av halvledare strukturer med inkjet-skrivare, vilket är den mest lovande metoden för på en industriell produktions nivå beläggaden typen av material på substrat. Även om det finns välutvecklade metalliska och organiskabläck för tryckt elektronik, så finns det fortfarande ett behov av att förbättra eller utveckla nya bläck baserade på halvledarmaterial som t.ex. TMD, som är stabila, har goda bestryknings  egenskaper och ger bra tryckkvalitet. Den inerta naturen tillsammans med de mekaniska egenskaperna som finns hosskiktade material, som t.ex. molybdendisulfid (MoS2), gör demlämpliga för flexibel elektronik och bearbetning i lösning. Dessutom gör den höga elektronmobiliteten i dessa 2D-halvledaredem till en stark kandidat som halvledarmaterial inom trycktelektronik. Det betyder att MoS2 är ett enkelt och robust material med goda halvledaregenskaper som är lämpligt för bestrykning från lösning och tryck, och är miljömässigt säker.Den metod som beskrivs här kan med fördel användas föratt exfoliera alla typer av 2D-material i lösning. Exfolieringensker i två steg; först mekanisk exfoliering av torr bulk med sandpapper, därefter används ultraljudsbehandling i lösning för att exfoliera nanosheets. De dispersioner som framställts i lösning med surfaktanter dekanterades och det övre skiktetanvändes i trycktester med en Dimatix inkjet-skrivare.Tryckprovet visar att det är möjligt att använda MoS2 -dispersion som ett inkjet-bläck och att optimering för särskildaskrivar- och substratkombinationer borde göras, såsom förbättringav bläcksammansättningen med avseende på droppbildning och break-off vid skrivarmunstycket, vilket i sin tur skulleförbättra tryckkvaliteten. / KM2 / Paper Solar Cells

Plusieurs défis subsistent pour la migration de l’électronique imprimée vers l’industrie, malgré des avancées récentes. Dans ces travaux de thèse, l’optimisation du procédé d’impression d’encres à base de nanoparticules d’argent (<Ø>=25 nm) en fonction de sa rhéologie et des interactions fluide/substrat a permis de réaliser des interconnexions électriques d’une épaisseur de 500 nm. Ces lignes imprimées sur des substrats silicium ou flexibles sont ensuite recuites par des méthodes conventionnelles (étuve ou infrarouge) ou sélectives (micro-onde) à des températures comprises entre 100 et 300°C.Une meilleure compréhension de la relation procédé/microstructure des couches minces imprimées, via plusieurs caractérisations cristallographiques (DRX, EBSD et EDX), a permis d’optimiser la croissance des domaines nanocristallins, activée pour des énergies de l’ordre de 3 à 5 kJ•mol-1. Outre les faibles contraintes résiduelles (70 MPa), cette optimisation permet d’atteindre de faibles résistivités électriques (3.4 µOhm•cm) associées à un accroissement de la cohérence des réseaux cristallins aux joints de grains. La probabilité de réflexion des électrons à ces interfaces peut être davantage réduite, grâce à une approche innovante de croissance orientée des cristallites par interdiffusion atomique à partir du substrat.La faible rigidité mécanique (E<50 GPa) de ces lignes initialement poreuses nécessite une étape de renforcement par texturation ou par croissance electroless pour résister aux étapes de micro-assemblage et de soudure filaire. La réalisation d’un démonstrateur fonctionnel a ainsi permis de valider la technologie d’impression pour la fabrication de composants électroniques. / Several challenges are still holding back the technological transfer of printed electronics to industry in spite of recent progresses. In this thesis work, the printing method of inks based on silver nanoparticles (<Ø>=25 nm) was optimized according to its rheology and to the fluid/substrate interactions for the fabrication of electrical interconnections with a thickness of 500 nm. These lines were printed on silicon or flexible substrates and annealed either by conventional (oven or infrared) or selective methods (microwave) at temperatures comprised between 100 and 300 °C.A better understanding of the relationship between process and microstructure of these printed thin films, based on several crystallographic equipments (XRD, EBSD and EDX), led to the optimization of nanocrystallites growth with an activation energy of about 3 to 5 kJ•mol-1. In addition to the low residual stress (70 MPa), this optimization is used to achieve low electrical resistivity (3.4 μOhm•cm) associated with a greater coherence of the crystal lattices at grain boundaries. The probability of electron scattering at such interfaces can be further reduced using an innovative approach of oriented crystallite growth by atomic interdiffusion from the substrate.The low mechanical stiffness (E<50 GPa) of these porous lines requires a reinforcement step either by crystalline texturation or by electroless growth to withstand the assembly and wire-bonding steps. The fabrication of a functional demonstrator thus validated the printing technology for the manufacture of electronic components.

Cette étude prend place dans le cadre du projet ANR Inxilicium visant à la réalisation de cellules solaires en couches minces de silicium par jet d’encre. Les nanoparticules de silicium sont des matériaux à fort potentiel pour la levée de verrous technologiques grâce à leurs propriétés spécifiques. Des encres de nanoparticules de Si issues de diverses méthodes de synthèse ont été imprimées par jet d’encre sur différents substrats : quartz, électrodes métalliques (aluminium, molybdène) et transparente conductrice (ZnO:Al). L’optimisation du procédé d’impression, de l’interaction encre/substrat (via la modulation de l’énergie de surface des substrats) et de l’étape de séchage a permis l’obtention de couches minces homogènes et continues (plusieurs centaines de nm à quelques µm d’épaisseur)A posteriori, une étape de recuit est nécessaire pour recouvrer des propriétés fonctionnelles. L’utilisation de nanoparticules à la physico-chimie de surface contrôlée fait décroître les températures de frittage de 1100 °C à environ 600 °C. En complément, des recuits sélectifs (micro-ondes et photonique) ont été évalués pour leur application sur des substrats flexibles et bas coûts.Les propriétés optiques et les interfaces électrode/silicium ont été examinées afin d’intégrer ces couches dans des dispositifs (cellule solaire…). La formation de transitions métallurgiques Al-Si et Mo-Si a été étudiées par DRX-in situ. L’ensemble de ces travaux a permis la réalisation d’une jonction PN montrant un comportement photovoltaïque à fort champ grâce aussi à la mise au point d’une méthode innovante de collage ouvrant la voie à une réduction du bilan thermique des procédés de fabrication. / This study takes place in the frame of the Inxilicium project from the National Research Agency, which targets the fabrication of silicon thin film solar cells by inkjet-printing. Thanks to their specific properties, silicon nanoparticles are materials with strong potential for technological breakthroughs. Silicon nanoparticle-based inks made by different synthesis routes have been inkjet-printed on different substrates: quartz, metallic electrodes (aluminum, molybdenum) and transparent electrodes (ZnO:Al). Homogeneous and continuous thin films (from several hundreds of nm to some µm thick) have been obtained through optimization of the printing process, the ink/substrate interaction (via substrates surface energy tuning) and the drying step.A posteriori, an annealing step is mandatory for recovering of functional properties. By using nanoparticles with tailored surface physical chemistry, the sintering temperature decreases from 1100 °C to 600 °C. In order to allow the use of this material on flexible and low cost substrates, selective sintering (microwave and photonics) have been also evaluated.Thin film optical properties and electrode/silicon interfaces have been investigated with the purpose to integrate those layers into devices (solar cells…). Metallurgical evolution of Al-Si and Mo-Si physical interfaces has been studied by in situ XRD.This work allowed the fabrication of a PN junction with a photovoltaic behaviour under strong polarization voltage thanks to the development of an innovative thermal pasting process, which opens the way to the reduction of process thermal budget.

A tecnologia dos semicondutores inorgânicos tem dominado a indústria eletrônica por muitos anos. No entanto, com a descoberta dos polímeros condutores um esforço considerável tem sido dedicado ao estudo e às aplicações tecnológicas desses materiais em dispositivos eletrônicos, dando início a um novo ramo da eletrônica: a Eletrônica Orgânica (EO). Uma das grandes vantagens da EO reside nos métodos de processamento. Os materiais orgânicos são facilmente processados em solução, portanto permite o uso de diversas técnicas de deposição, como por exemplo, as técnicas de impressão. Dentre as técnicas de impressão, a jato de tinta é a que mostra ser mais adequada à impressão de circuitos. Ela permite depositar volumes de soluções (ou suspensões) da ordem de picolitros em cada gota mantendo padrões bem definidos. Além disso, elimina o uso de máscaras, ocasionando diminuição nos custos e desperdício de material e, por ser um método de deposição tipo não-contato, minimiza possíveis contaminações. Esta tese dedicou-se, dentro desse contexto, ao domínio da técnica de jato de tinta para a confecção de transistores de efeito de campo orgânico (OFETs) tipo p e tipo n, e com aplicação em um inversor lógico unipolar. Os OFETs impressos usaram a arquitetura top gate/bottom contact (TG/BC. Os filmes semicondutores foram formados por várias linhas impressas sobre a região dos eletrodos fonte e dreno. Para os OFETs tipo p foi utilizado o semicondutor Poli(3-hexiltiofeno) régio-regular (rr-P3HT). Foram fabricados OFETs tipo p com a impressão de linhas utilizando os quatro diferentes padrões de deposição da impressora Autodrop. OFETs tipo p com mobilidade em torno de 3x10-3 cm2/V.s e razões Ion/Ioff da ordem de 103 foram obtidos utilizando um padrão de deposição paralelo e outro perpendicular a fonte e dreno. Para os OFETs tipo n o semicondutor usado foi o Poli{[N,N\'-bis(2-octildodecil)-naftaleno-1,4,5,8-bis(dicarboximida)-2,6-diil]-alt-5,5\'-(2,2\'-bitiofeno)]} (P(NDI2OD-T2)). Dentre os OFETs tipo n impressos os melhores apresentaram mobilidades em torno de 10-2 cm2/V.s e razões Ion/Ioff de aproximadamente 5x102. Ambos os OFETs impressos foram aplicados em inversores lógicos digitais unipolares com ganhos maiores que 1. / The technology of inorganic semiconductors has dominated the industry of electronics for many years. However, since the discovery of conductive polymers considerable effort has been devoted to studies and technological applications of these materials in electronic devices, starting a new branch of electronics: Organic Electronics (OE). One of the great advantages of OE lies in the processing methods. The organic materials are easily handled in solution, thus allows the use of various deposition techniques, as for example the printing techniques. Among the techniques of printing, inkjet is showing to be more suitable for printing circuits. It allows you to deposit solutions (or suspensions) volumes on the order of picoliters in each drop, performing well-defined patterns. Furthermore, it eliminates the use of masks, resulting in reduced costs and material waste. This thesis is dedicated to the field of inkjet technique, specifically for the fabrication of organic field-effect transistors (OFETs), p-type and n-type, and application in a unipolar logic inverter. Printed OFETs used architecture top gate/bottom contact (TG/BC). The semiconductor films were formed by several printed lines on the region of the source and drain electrodes. For p-type OFETs we used poly (3-hexylthiophene ) regio-regular (rr-P3HT) as semiconducting material. The p-type OFETs were fabricated using the four different patterns of deposition of the printer Autodrop. These OFETs showed mobility around 3x10-3 cm2/V.s and Ion/Ioff ratio of the order of 103 for the deposition pattern parallel and perpendicular to source and drain. For the n-type OFETs the semiconductor used was Poly{[N,N\'-bis(2-octyldodecyl)-naphthalene-1,4,5,8-bis(dicarboximide)-2,6-diyl]-alt-5,5\'-(2,2\'-bithiophene)]} (P(NDI2OD-T2)). Among the printed n-type OFETs the best showed mobility around of 10-2 cm2/V.s and Ion/Ioff ratio of the order of 5x102. Both printed OFETs were applied in unipolar digital logic inverters, with gains greater than 1.

O trabalho desta dissertação versou sobre avanços em tecnologias de eletrônica impressa de baixo custo. Em particular, aplicamos as técnicas de impressão por serigrafia e por jato de tinta para confeccionar dispositivos eletrônicos e optoeletrônicos. O primeiro dispositivo construído foi resistências impressas por jato de tinta tendo como matérias primas o poli(3,4-etileno dióxido tiofeno) com sulfonato de poliestireno (PEDOT:PSS) e nanopartículas de prata sobre substratos de vidro. Os valores das resistências foram analisados em se variando parâmetros de impressão. Como segundo dispositivo, imprimimos pela técnica de serigrafia sobre vidro e kapton, antenas de cartões de RFIDs (Radio-Frequency Identifications), também com os dois materiais: tinta de prata e PEDOT:PSS. Os RFIDs foram projetados para operar em frequências entre 860 MHz e 960 MHz. A antena de PEDOT:PSS mostrou alcance de 0,45 m, enquanto que a de tinta prata teve alcance de 1,6 m em 860 MHz e de 4 m em 960 MHz. Fabricamos também células eletroquímicas emissoras de luz (Organic Light Emitting Electrochemical Cells - OLECs), no qual substituímos o eletrodo transparente de óxido de índio (ITO), por um feito de PEDOT:PSS, aplicado por serigrafia sobre vidro. A camada ativa da célula luminescente foi feita por uma mistura de óxido de polietileno complexado com sal de lítio e um polímero luminescente derivado de polifluoreno que emite no verde. As curvas características de corrente e luminância em função da voltagem externa aplicada mostrou o bom desempenho das células fabricadas. Finalmente, produzimos células fotovoltaicas orgânicas, em que o eletrodo transparente, também de PEDOT:PSS, foi depositado por serigrafia sobre vidro. A camada ativa nesse caso foi um sistema bifásico feito de poli(3hexiltiofeno) (P3HT) e um éster, o [6,6]-fenil-C61-ácido metil-butírico (PCBM). Esse dispositivo apresentou um Fator de Preenchimento de 0,47 e uma eficiência externa de aproximadamente 2%. / The work developed along this thesis presents advances in printed electronic technologies of low cost. In particular we applied printable serigraphic and Inkjet technologies to produce electronic and optoelectronic devices. First, we produced resistances having poly(3,4-ethylenedioxythiophene) poly(styrenesulfonate) (PEDOT:PSS) and silver paint as active materials, using an Inkjet printer on glass substrate. We made studies of the resistance performance varying some printed parameters. Then, by serigraphy screen printing was printed, on substrates of kapton and glass, an antenna in an Radio-Frequency Identification card (RFID), also from PEDOT:PSS and from silver paint. This RFID was projected to operate in a frequency range from approximately 860 MHz to 960 MHz. The antenna made of PEDOT:PSS operated in a distance of 0.45 m, while that of silver varied from 1.6 m at 860 MHz to 4 m at 960 MHz. In an Organic Light Emitting Electrochemical Cell (OLEC) we applied one of the electrodes, a PEDOT:PSS layer, as a transparent electrode by serigraphy on glass substrate for made to replace of ITO. The active layer was a mixture of a poly(ethylene oxide) complexed with lithium salt and a derivative of polyfluorene that is a green emitter. The characteristic curves of current and luminance against the applied external voltage assured us the good performance of the device. Similar result was obtained with the performance of an organic photovoltaic (OPV), in which the active layer was a biphasic system made by poly(3-hexylthiophene) (P3HT) and [6,6]-phenyl-C61-butyric acid methyl ester (PCBM), in which the transparent electrode (PEDOT:PSS) was also printed by serigraphy on glass substrate. In this device we obtained a Fill Factor of 0.47 and an external efficiency of almost 2%.

This thesis explores the application of two-dimensional (2D) materials such as graphene and single layer hexagonal boron nitride (h-BN) which are produced by liquid phase exfoliation for use in printed electronics and energy composite applications. In Chapter 2 I give a broad overview of the electrical, mechanical and optical properties of 2D materials among other nanomaterials that were used in the thesis such as carbon nanotubes and conductive polymers. Additionally I review the techniques and theory behind the exfoliation and dispersion of functional layered materials. In Chapter 3 I present the coating and printing techniques which were used in this thesis along with the experimental techniques and methods which I use to characterise my inks, films and devices. Chapter 4 is the first experimental chapter of the thesis and demonstrates the printing of 2D material heterostructures to create fully printed dieletrically gated field effect transistors with 2D materials on textile and polymer substrates. In this chapter I also demonstrate reprogrammable volatile memory, p and n type inverters, complementary inverters, and logic gates which pave the way to fully printed integrated circuits, operational at room temperature and pressure with 2D materials processed in liquid. In Chapter 5, I review spray coating (a highly industrial scalable printing technique), in terms of the optimisation of its parameters to achieve thin films of nanomaterials on three-dimensional (3D) surfaces. I then demonstrate that it is possible to create large area (∼750 cm2) transparent conducting films around curved surfaces with spray coating enabling a semi-transparent (around 360°) spherical touch sensor for interactive devices. Chapter 6 explores printed photonics for applications in terahertz (THz) frequencies. Here I demonstrate the feasibility of liquid phase exfoliated graphene to create THz saturable absorbers (SAs) which could enable many applications in THz frequencies such as tomography or time-resolved spectroscopy that require mode-locked (i.e. enabling a train of short pulses to be derived from continuous-wave operation) THz pulses. I also demonstrate that these SAs can be inkjet printed on demand providing unprecedented compactness in a quantum cascade laser system. Finally in Chapter 7, I look at the application of graphene in microbial fuel cells (MFC). I demonstrate that enhanced MFC output arises from the interplay of the improved surface area, enhanced conductivity, and catalytic surface groups of a graphene based electrode. As a final step graphene based anodes and cathodes which were entirely platinum free were combined to create an environmentally sustainable energy source.

Topic of the thesis is the production of unipolar digital circuits by means of mass-printing technologies. For this purpose accumulation-mode and depletion-mode field-effect transistors have been used. To realize depletion-mode field-effect transistors charges are injected and stored in the gate-dielectric. Consequently, the charge transport on the semiconductor-dielectric interface is influenced and the threshold voltage can be controlled. To inject charges into the dielectric different technologies have been used and will be discussed in terms of their process parameters. Finally, fully-printed digital circuits with enhanced performance are introduced. / Gegenstand der vorliegenden Arbeit ist die drucktechnische Herstellung von unipolaren digitalen Schaltungen durch eine Kombination von organischen Feldeekttransistoren vom Anreicherungs- und Verarmungstyp. Zur Realisierung von Transistoren vom Verarmungstyp werden Überschussladung in den Gate- Isolator eingebracht und gespeichert, wodurch der Ladungstransport im Transistorkanal insbesondere die Schwellspannung beeinflusst wird. Es werden verschiedene Aufladungstechnologien und deren Prozessparameter diskutiert. Abschließend werden vollständig mit Massendruckverfahren prozessierte, digitale Schaltungen mit verbesserter Signalübertragungscharakteristik vorgestellt.

Inkjet-printing is a technology which has for the last decade been exploited to fabricate flexible RF components such as antennas and planar circuit elements. However, the limitations of feature size and single layer fabrication prevented the demonstration of compact, and high efficiency RF components operating above 10 GHz into the mm-Wave regime which is critical to silicon integration and fully-printed modules. To overcome these limitations, a novel vertically-integrated fully inkjet-printed process has been developed and characterized up to the mm-Wave regime which incorporates up to five highly conductive metal layers, variable thickness dielectric layers ranging from 200 nm to 200 um, and low resistance through-layer via interconnects. This vertically-integrated inkjet printed electronics process, tagged VIPRE, is a first of its kind, and is utilized to demonstrate fully additive RF capacitors, inductors, antennas, and RF sensors operating up to 40 GHz. In this work, the first-ever fully inkjet printed multi-layer RF devices operating up to 40 GHz with high-performance are demonstrated, along with a demonstration of the processing techniques which have enabled the printing of multi-layer RF structures with multiple metal layers, and dielectric layers which are orders of magnitude thicker than previoulsy demonstrated inkjet-printed structures. The results of this work show the new possibilities in utilizing inkjet printing for the post-processing of high-efficiency RF inductors, capacitors, and antennas and antenna arrays on top of silicon to reduce chip area requirements, and for the production of entirely printed wireless modules.

A new manufacturing paradigm may lower the cost and environmental impact of existing products, as well as enable completely new products. Large scale, roll-to-roll manufacturing of flexible electronics and other functionality has great potential. However, a commercial breakthrough depends on a lower consumption of materials and energy compared with competing alternatives, and that sufficiently high performance and reliability of the products can be maintained. The substrate constitutes a large part of the product, and therefore its cost and environmental sustainability are important. Electrically conducting thin films are required in many functional devices and applications. In demanding applications, metal films offer the highest conductivity.   In this thesis, paper substrates of various type and construction were characterized, and the characteristics were related to the performance of inkjet-printed metal patterns. Fast absorption of the ink carrier was beneficial for well-defined pattern geometry, as well as high conductivity. Surface roughness with topography variations of sufficiently large amplitude and frequency, was detrimental to the pattern definition and conductivity. Porosity was another important factor, where the characteristic pore size was much more important than the total pore volume. Apparent surface energy was important for non-absorbing substrates, but of limited importance for coatings with a high absorption rate. Applying thin polymer–based coatings on flexible non-porous films to provide a mechanism for ink solvent removal, improved the pattern definition significantly. Inkjet-printing of a ZnO-dispersion on uncoated paper provided a thin spot-coating, allowing conductivity of silver nanoparticle films. Conductive nanoparticle films could not form directly on the uncoated paper.   The resulting performance of printed metal patterns was highly dependent on a well adapted sintering methodology. Several sintering methods were examined in this thesis, including conventional oven sintering, electrical sintering, microwave sintering, chemical sintering and intense pulsed light sintering. Specially designed coated papers with modified chemical and physical properties, were utilized for chemical low-temperature sintering of silver nanoparticle inks. For intense pulsed light sintering and material conversion of patterns, custom equipment was designed and built. Using the equipment, inkjet-printed copper oxide patterns were processed into highly conducting copper patterns. Custom-designed papers with mesoporous coatings and porous precoatings improved the reliablility and performance of the reduction and sintering process.         The thesis aims to clarify how ink-substrate interactions and sintering methodology affect the performance and reliability of inkjet-printed nanoparticle patterns on flexible substrates. This improves the selection, adaptation, design and manufacturing of suitable substrates for inkjet-printed high conductivity patterns, such as circuit boards or RFID antennas.

Ces travaux examinent le potentiel d’un papier à fort lissé pour la production de masse de tags RFID-HF imprimés. Les caractérisations menées sur le papier Powercoat HD mettent en évidence une haute tolérance à la température et une faible rugosité. De fait, il se présente ainsi comme une sérieuse alternative à l’utilisation des films polymères (PET, PEN, PI, etc.), permettant de développer pleinement les performances électriques d’encres conductrices métalliques.Deux procédés d’impression industriels ont été considérés, la flexographie et la sérigraphie ayant tout deux fait leurs preuves depuis plusieurs décennies pour l’impression graphique à hautes cadences. Le potentiel de leur utilisation pour l’impression à grande échelle de dispositifs électroniques à bas-coût est discuté dans ces travaux. De plus, les performances électriques d’encres commerciales à base d’argent sont étudiées en fonction de la taille des particules qui les composent. En effet, l’utilisation de particules métalliques à l’échelle nanométrique pourra faciliter l’activation des mécanismes de diffusion atomique, améliorant ainsi le contact physique entre les particules et favorisant la conduction électrique. En parallèle, les encres à microparticules sont moins coûteuses et leurs conditions d’utilisation moins contraignantes. Toutefois, la coalescence des particules métalliques après l’impression ne pourra être initiée sans un traitement thermique de recuit.Le recuit est usuellement réalisé dans une étuve ou un tunnel à air chaud, la température doit alors rester inférieure à la tolérance du substrat. Cela permet d’atteindre des performances électriques qui restent limitées pour des durées de procédé de l’ordre de plusieurs minutes. Afin de tenir compte des contraintes industrielles d’une production à grande échelle et de permettre d’obtenir les meilleures performances électriques en un temps réduit, l’un des principaux axes de recherche exploré consiste au déploiement des technologies émergentes de recuit photonique proche infrarouge (NIR) et lumière intense pulsée (IPL). Ces dernières sont basées sur l’absorption de l’énergie lumineuse par le film d’encre provoquant ainsi sont échauffement rapide. L’important différentiel d’absorption entre les encres et le substrat contribue, en outre, à une sélectivité de ces procédés permettant de limiter la dégradation du support tout en atteignant au niveau de l’encre, des températures pouvant être supérieures à 300°C. Pour chaque procédé de recuit, l’influence des différents paramètres sur les performances électriques finales a pu être étudiée par la mise en place d’un suivi in-situ de la résistance, permettant un échantillonnage allant jusqu’à 250 kHz.Finalement, des boucles RFID-HF ont été imprimées, recuites dans les conditions précédemment optimisées puis caractérisées. Une estimation des coûts de production a été menée afin de distinguer les contributions liées à l’encre, au support et à la puce électronique en silicium. Les résultats obtenus mettent en évidence le potentiel du papier Powercoat HD, couplé à une impression en flexographie et à un recuit proche infrarouge, permettant alors la production à grande échelle de tags RFID-HF pour un coût matière de l’ordre de 5 centimes d’euros. / This work examines the potential of a very smooth paper for the mass production of printed RFID-RF tags. Characterizations on Powercoat HD paper demonstrate high temperature tolerance and very low roughness. It thus represents a serious alternative to the use of polymeric films (PET, PEN, PI, etc.), enabling the electrical performance of metallic conductive inks to be fully developed.Two industrial printing processes have been considered, flexography and screen printing, and their use were discussed for the printing of low-cost electronic devices. Moreover, the electrical performances of commercial silver based inks are studied according to the size of their particles. Indeed, the use of metal particles at the nanometric scale can facilitate the activation of the atomic diffusion mechanisms, thus improving the physical contact between the particles and promoting electrical conduction. In parallel, microparticles inks are cheaper and their conditions of use less restrictive. In any case, the coalescence of the metal particles after printing cannot be initiated without a thermal sintering treatment.Sintering is usually carried out in an oven or hot air tunnel, the temperature must therefore remain below the tolerance of the substrate. This leads to limited electrical performances for long process duration of several minutes. In order to take into account the industrial constraints of large-scale production and to achieve the best electrical performance in a short time, one of the main explored research areas is the deployment of emerging near-infrared (NIR) and intense pulsed light (IPL) photonic technologies. These latter are based on the absorption of light energy by the ink film thus causing rapid heating. The important absorption differential between the inks and the substrate allows high heating selectivity which makes it possible to limit the degradation of the substrate while the ink temperatures may be greater than 300 ° C. For each sintering process, the influence of the various parameters on the final electrical performance has been studied by setting up an in-situ resistance monitoring, allowing sampling frequency up to 250 kHz.Finally, RFID-HF loops were printed, sintered under previously optimized conditions and then characterized. An estimate of the production costs was carried out in order to distinguish the contributions related to the ink, the substrate and the silicon chip. The obtained results demonstrate the potential of Powercoat HD paper, coupled with flexographic roll-to-roll printing and near-infrared technology, enabling the large-scale production of RFID-HF tags at a material cost of the order of 5 euros cents.