Techn. Universiẗat, Diss., 2002--Berlin.

Universiẗat, Diss., 2003--Stuttgart.

La microélectronique cherche à produire des composants toujours plus performants. Un axe d'amélioration est l'intégration de plus de fonctionnalités dans un volume toujours plus compact. L'approche planaire classiquement utilisée jusqu'à présent atteint ses limites. Une solution à ce défi technologique est l'intégration 3D permettant d'empiler verticalement plusieurs circuits. Les étapes d'assemblage sont cruciales dans ces schémas d'intégration. Parmi les différentes techniques d'assemblage, le collage direct de couches minces métalliques est une alternative très intéressante. En effet, elle offre simultanément un lien mécanique et électrique vertical entre les couches actives de composants.Les propriétés microstructurales, physiques et chimiques des couches minces métalliques déposées ont été largement rapportées dans l'état de l'art antérieur. Cependant, elles n'ont jamais été étudiées dans l'environnement particulier du collage. Le but de notre étude est d'évaluer l'impact de cet environnement sur les couches minces métalliques assemblées pendant et après le procédé d'assemblage.Le collage direct consiste en la mise en contact de surfaces lisses à température ambiante et sous atmosphère ambiant afin de créer une adhérence entre elles. Puisque le collage n'est pas réalisé sous vide, des espèces adsorbées sont piégées à l'interface et une couche d'oxyde natif limite l'obtention du contact métal-métal. L'environnement de collage nous pousse donc à considérer ces différentes espèces qui interfèrent avec le procédé de collage et l'établissement du contact électrique.Dans cette étude, nous avons assemblé différents métaux dans différentes configurations de couches minces. Ainsi, les couches d'oxyde surfaciques ont été désignées comme influentes sur le comportement en adhésion des assemblages. Dans le cas précis du collage direct Cu-Cu, la réaction de l'eau interfaciale est primordiale au renforcement de la tenue mécanique dès la température ambiante. À plus haute température, la dissolution de l'oxyde piégé et la croissance de grain verticale sont des moteurs du scellement dépendant de phénomènes diffusifs. Il est apparu que les joints de grains sont des chemins de diffusion privilégiés dont le rôle dans la microstructure est majeur. Il a également mis en évidence que les couches de métaux réfractaires ne pouvaient pas être assemblées en utilisant les mêmes forces motrices que les métaux de transition dans la gamme de température considérée. La compréhension des différents mécanismes apporte un éclairage nouveau dans l'utilisation du collage direct dans les schémas d'intégration des composants de demain. / The semiconductor industry is driven by an increasing need of computation speed and functionalities. In the development of next generation devices the integration of more functionalities in an ever smaller volume becomes paramount. So far, classical planar integration was privileged but it is currently reaching its limits. One solution to this technological challenge is to consider the 3D dimension as pathway of integration. To ensure the vertical stacking of circuits, the development and control of assembly processes becomes crucial. Among the different techniques under development, direct bonding of metal thin films is a promising solution. It is a straightforward option that offers both a mechanical and an electrical link between the active strata.Microstructural, physical and chemical properties of deposited metal thin films were widely reported in previous state of art. However, they have not yet been studied in the specific bonding environment. The main goal of our study is to pinpoint the impact of this environment during and after the process of assembly.Direct bonding process consists in putting into contact smooth surfaces at room temperature and ambient air which in appropriate conditions leads to the establishment of attractive forces. Since bonding is not operated under vacuum, adsorbed species are trapped at the interface and the metal bonding suffers from the formation of native oxide. The encapsulation of these species as well as the native metal oxide interfere with the bonding process and the establishment of an electrical contact.In this study, various bonded structures have been realized using an extended set of metals in different thin film configurations. Metal oxide layers impact is clearly highlighted via the monitoring of adhesion properties of the assemblies. In the Cu-Cu direct bonding case, the interfacial water reaction is primordial in the strengthening of bonding toughness at room temperature. At higher temperature, oxide dissolution and vertical grain growth are driving forces in the sealing of bonding interface. The microstructure play a role in all these phenomena since grain boundaries are favorite diffusion pathway in thin films. Considering the temperature limitation imposed by the integration, we also highlight that refractory metal thin films needs another bonding approach compared to the transient metals. The understanding of bonding mechanisms throws new light on the use of direct bonding process in the realization of future electrical components.

abstract: Rapid processing and reduced end-of-range diffusion effects demonstrate that susceptor-assisted microwave annealing is an efficient processing alternative for electrically activating dopants and removing ion-implantation damage in ion-implanted semiconductors. Sheet resistance and Hall measurements provide evidence of electrical activation. Raman spectroscopy and ion channeling analysis monitor the extent of ion implantation damage and recrystallization. The presence of damage and defects in ion implanted silicon, and the reduction of the defects as a result of annealing, is observed by Rutherford backscattering spectrometry, moreover, the boron implanted silicon is further investigated by cross-section transmission electron microscopy. When annealing B+ implanted silicon, the dissolution of small extended defects and growth of large extended defects result in reduced crystalline quality that hinders the electrical activation process. Compared to B+ implanted silicon, phosphorus implanted samples experience more effective activation and achieve better crystalline quality. Comparison of end-of-range dopants diffusion resulting from microwave annealing and rapid thermal annealing (RTA) is done using secondary ion mass spectroscopy. Results from microwave annealed P+ implanted samples show that almost no diffusion occurs during time periods required for complete dopant activation and silicon recrystallization. The relative contributions to heating of the sample, by a SiC susceptor, and by Si self-heating in the microwave anneal, were also investigated. At first 20s, the main contributor to the sample's temperature rise is Si self-heating by microwave absorption. / Dissertation/Thesis / M.S. Materials Science and Engineering 2013

The thesis focuses on marketing strategy of Storck when launching a new product to the Czech and Slovak market. At the beginning the parent company and its Czech subsidiary are introduced together with their production capacities and products. In the next part, there is an analysis of Czech confectionary market and wafer and biscuit market as well as comparison of Czech and Slovak wafer market. In the practical part, there is description of marketing strategy of Storck and application of particular elements of the marketing mix. At the end the marketing strategy is evaluated and suggestions for further communication are made.

This dissertation focuses on the chemistry, detection, and control of metals and metal contaminants during manufacturing of integrated circuits (ICs) on silicon wafers. Chapter 1 begins with an overview of IC manufacturing, including discussion of the common aqueous cleaning solutions, metallization processes, and analytical techniques that will be investigated in subsequent chapters. Chapter 2 covers initial investigations into the chemistry of the SC2 clean - a mixture of HCl, H2O2, and DI water - especially on the behavior of H2O2 in this solution and the impact of HCl concentration on metal removal from particle addition to silicon oxide surfaces. Chapter 3 includes a more generalized investigation of the chemistry of metal ions in solution and how they react with the silicon oxide surfaces they are brought into contact with, concluding with illumination of the fundamental chemical principles that govern their behavior. Chapter 4 shows how metal contaminants behave on silicon wafers when subjected to the high temperature (≥ 800 °C) thermal cycles that are encountered in IC manufacturing. It demonstrates that knowledge of some fundamental thermodynamic properties of the metals allow accurate prediction of what will happen to a metal during these processes. Chapter 5 covers a very different but related aspect of metal contamination control, which is the effectiveness of metal diffusion barriers (e.g. Ru) in holding a metal of interest, (e.g. Cu), where it is wanted while preventing it from migrating to places where it is not wanted on the silicon wafer. Chapter 6 concludes with an overview of the general chemical principles that have been found to govern the behavior of metals during IC manufacturing processes.

京都大学 / 0048 / 新制・課程博士 / 博士(工学) / 甲第22442号 / 工博第4703号 / 新制||工||1734(附属図書館) / 京都大学大学院工学研究科原子核工学専攻 / (主査)教授 斉藤 学, 教授 神野 郁夫, 准教授 松尾 二郎 / 学位規則第4条第1項該当 / Doctor of Philosophy (Engineering) / Kyoto University / DFAM

This thesis is devoted to the behavior of heavy metals in gettering multilayers made of polysilicon and silicon oxide.

Im Rahmen dieser Arbeit wurde der Prozess des chemisch-mechanischen Polierens (CMP) von Siliziumwafern erstmals mittels stochastischer Methoden modelliert und daraus resultierend weiter optimiert. Ziel war es, Erkenntnisse zu ausgewählten, noch nicht vollständig verstandenen Einflussfaktoren zu gewinnen. Der Schwerpunkt lag dabei auf dem Poliertuch. Anhand eines neu entwickelten Modells zur Beschreibung einer konditionierten Tuchoberfläche wurden Zusammenhänge zwischen Konditionier- bzw. Tuchstrukturparametern und resultierender Poliertuchoberfläche herausgearbeitet und somit Möglichkeiten zur exakten Beschreibung und der gezielten Beeinflussung letzterer ermittelt. Weiterhin konnte erstmalig ein lang gesuchter messbarer Parameter benannt werden, mit dem eine ideale Tuchoberfläche charakterisierbar wird. Die Ergebnisse wurden experimentell verifiziert. Abschließend wurde mit einem neuen Abtragsmodell der CMP-Prozess von Siliziumwafern beschrieben, anhand dessen Zusammenhänge zwischen der Tuchrauheit und der Unebenheit der Waferoberfläche mit einer Theorie begründbar wurden.

2D semiconductors are one of the most promising materials for next-generation electronics. Realizing continuous 2D monolayer semiconductors with single-crystalline structure at the wafer scale is still a challenge. We developed an epitaxial phase conversion (EPC) process to meet these requirements. The EPC process is a two-step process, where the sulfurization process was carried out on pre-deposited Mo-containing films. Traditionally, two-step processes for 2D MoS2 and other chalcogenides have suffered low-quality film and non-discontinuity at monolayer thickness. The reason was regarded as the low lattice quality of precursor film. The EPC process solves these problems by carefully preparing the precursor film and carefully controlling the sulfurization process. The precursor film in the EPC process is epitaxial MoO2 grown on 2″ diameter sapphire substrate by pulsed laser deposition. This epitaxial precursor contains significantly fewer defects compared to amorphous precursor films. Thus fewer defects are inherited by the EPC MoS2 film. Therefore, EPC MoS2 film quality is much better. The EPC prepared monolayer MoS2 devices to show field-effect mobility between 10 ~ 30 cm2·V-1s-1, which is the best among the two-step process. We also developed a CLAP method further to reduce the defects in the precursor oxide film; thus, in-plane texture in the thicker MoS2 film was eliminated, and a single-crystalline structure was obtained in the wafer-scale MoS2 films. The potentially feasible technique to further improve the 2D film quality is pointed out for our next research plan. Meanwhile, the epitaxial phase conversion process was proposed to be as a universal growth method. Last but not least, we demonstrate several potential applications of the wafer-scale single-crystalline MoS2 film we developed, such as logic circuits, flexible electronics, and seeding layer of van der Waal or remote epitaxial growth.