Field-Programmable Gate Arrays (FPGAs) são largamente utilizadas em sistemas digitais por características como flexibilidade, baixo custo e alta densidade. Estas características advém do uso de células de SRAM na memória de configuração, o que torna estes dispositivos suscetíveis a erros induzidos por radiação, tais como SEUs. TMR é o método de mitigação mais utilizado, no entanto, possui um elevado custo tanto em área como em energia, restringindo seu uso em aplicações de baixo custo e/ou baixo consumo. Como alternativa a TMR, propõe-se utilizar DMR associado a um mecanismo de reparo da memória de configuração da FPGA chamado scrubbing. O reparo de FPGAs em sistemas em tempo real apresenta desafios específicos. Além da garantia da computação correta dos dados, esta computação deve se dar completamente dentro do tempo disponível (time-slot), devendo ser finalizada antes do tempo limite (deadline). A diferença entre o tempo de computação dos dados e a deadline é chamado de slack e é o tempo disponível para reparo do sistema. Este trabalho faz uso de scrubbing deslocado dinâmico, que busca maximizar a probabilidade de reparo da memória de configuração de FPGAs dentro do slack disponível, baseado em um diagnóstico do erro. O scrubbing deslocado já foi utilizado com técnicas de diagnóstico de grão fino (NAZAR, 2015). Este trabalho propõe o uso de técnicas de diagnóstico de grão grosso para o scrubbing deslocado, evitando as penalidades de desempenho e custos em área associados a técnicas de grão fino. Circuitos do conjunto MCNC foram protegidos com as técnicas propostas e submetidos a seções de injeção de erros (NAZAR; CARRO, 2012a). Os dados obtidos foram analisados e foram calculadas as melhores posição iniciais do scrubbing para cada um dos circuitos. Calculou-se a taxa de Failure-in-Time (FIT) para comparação entre as diferentes técnicas de diagnóstico propostas. Os resultados obtidos confirmaram a hipótese inicial deste trabalho que a redução do número de bits sensíveis e uma baixa degradação do período do ciclo de relógio permitiram reduzir a taxa de FIT quando comparadas com técnicas de grão fino. Por fim, uma comparação entre as três técnicas propostas é feita, analisando o desempenho e custos em área associados a cada uma. / Field-Programmable Gate Arrays (FPGAs) are widely used in digital systems due to characteristics such as flexibility, low cost and high density. These characteristics are due to the use of SRAM memory cells in the configuration memory, which make these devices susceptible to radiation-induced errors, such as SEUs. TMR is the most used mitigation technique, but it has an elevated cost both in area as well as in energy, restricting its use in low cost/low energy applications. As an alternative to TMR, we propose the use of DMR associated with a repair mechanism of the FPGA configuration memory called scrubbing. The repair of FPGA in real-time systems present a specific set of challenges. Besides guaranteeing the correct computation of data, this computation must be completely carried out within the available time (time-slot), being finalized before a time limit (deadline). The difference between the computation time and the deadline is called the slack and is the time available to repair the system. This work uses a dynamic shifted scrubbing that aims to maximize the repair probability of the configuration memory of the FPGA within the available slack based on error diagnostic. The shifted scrubbing was already proposed with fine-grained diagnostic techniques (NAZAR, 2015). This work proposes the use of coarse-grained diagnostic technique as a way to avoid the performance penalties and area costs associated to fine-grained techniques. Circuits of the MCNC suite were protected by the proposed techniques and subject to error-injection campaigns (NAZAR; CARRO, 2012a). The obtained data was analyzed and the best scrubbing starting positions for each circuit were calculated. The Failure-in-Time (FIT) rates were calculated to compare the different proposed diagnostic techniques. The obtained results validated the initial hypothesis of this work that the reduction of the number of sensitive bits and a low degradation of the clock cycle allowed a reduced FIT rate when compared with fine-grained diagnostic techniques. Finally, a comparison is made between the proposed techniques, considering performance and area costs associated to each one.

Conselho Nacional de Desenvolvimento CientÃfico e TecnolÃgico / Esta pesquisa avaliou o sistema microaerÃbio como estratÃgia simples de remoÃÃo de sulfeto de hidrogÃnio da fraÃÃo gasosa com vistas ao controle de odor e qualidade do biogÃs em estaÃÃes de tratamento de esgotos (ETE). Adicionalmente, foi avaliado o impacto da microaeraÃÃo na estabilidade operacional do sistema anaerÃbio, alÃm de um estudo comparativo entre a tecnologia microaerÃbia e absorÃÃo quÃmica (NaOH) na remoÃÃo de H2S presente no biogÃs. Os experimentos foram conduzidos em fluxo contÃnuo em dois reatores mesofÃlicos (28ÂC) construÃdos em acrÃlico e alimentados com Ãgua residuÃria sintÃtica. O experimento foi dividido em quatro fases de operaÃÃo, para ambos os reatores, de modo que as duas primeiras fases foram para a estabilizaÃÃo dos reatores. Na fase III foi introduzido sulfato de sÃdio, em uma relaÃÃo DQO/SO42- de aproximadamente 7. Por fim, na fase IV foram adicionados aos reatores os sistemas de remoÃÃo de H2S, ou seja, o reator 1 (R1) foi operado em condiÃÃes estritamente anaerÃbias com lavagem cÃustica do biogÃs, enquanto que o reator 2 (R2) foi modificado para operar em condiÃÃes microaerÃbias a partir da injeÃÃo de 0,2 mL.min-1 de ar atmosfÃrico em seu headspace. Foram realizadas anÃlises fÃsico-quÃmicas no afluente e efluente dos reatores, como DQO, pH, alcalinidade, sulfato, sulfeto dissolvido e feita a caracterizaÃÃo do biogÃs em termos de N2, O2, CH4, CO2, H2S, NH3. Foi observado nas fases III e IV que ambos os reatores apresentaram boa estabilidade em termos de remoÃÃo de DQO (>80%) e remoÃÃo de sulfato (>90%). Durante o processo microaerÃbio o oxigÃnio adicionado nÃo modificou a remoÃÃo da matÃria orgÃnica. Em relaÃÃo à qualidade do biogÃs, observou-se que o conteÃdo de metano no sistema provido de microaeraÃÃo foi reduzido de 76% (Fase III) para 52% (Fase IV), devido à diluiÃÃo com o nitrogÃnio presente no ar atmosfÃrico. Entretanto, ao retirar a interferÃncia do N2 foram obtidas concentraÃÃes prÃximas ao da fase totalmente anaerÃbia (Fase III), indicando, portanto, que as arquÃias produtoras de metano nÃo foram afetadas significativamente pelo oxigÃnio introduzido. Em relaÃÃo à remoÃÃo de sulfeto, o processo microaerÃbio foi efetivo na reduÃÃo tanto na fase lÃquida como na gasosa, com remoÃÃo mÃdia de 42% e 94%, respectivamente. O processo de lavagem do biogÃs aplicado no R1 promoveu remoÃÃo de 100% do H2S do biogÃs bem como 100% de CO2 e NH3. Dessa forma, tanto o processo microaerÃbio como a lavagem foram eficientes na remoÃÃo do H2S e podem ser empregados no controle de odor em ETE. O estudo econÃmico preliminar das duas tecnologias (microaerÃbio e lavagem cÃustica) mostra que apesar do investimento inicial necessÃrio para a instalaÃÃo do processo microaerÃbio e os custos de eletricidade para aeraÃÃo contÃnua dos reatores, os custos operacionais com a aquisiÃÃo do reagente quÃmico no processo de lavagem superam os custos totais ao longo do tempo. Por fim, espera-se que o sistema microaerÃbio seja mais vantajoso do que a lavagem quÃmica tanto sob o ponto de vista econÃmico em uma anÃlise mais detalhada quanto na anÃlise de ciclo de vida, mas que novos estudos devam ser conduzidos para comprovar tais hipÃteses. / This research work evaluated the feasibility of the micro-aerobic process to remove sulfide from biogas in order to control biogas quality and odors in wastewater treatment plants (WWTP). Moreover, the impact of micro-aeration over the anaerobic system stability was evaluated, and a comparison of the micro-aerobic biotechnology with a chemical absorption process (NaOH) for sulfide removal from biogas was performed. The experiments were performed in a continuous mode in two acrylic-constructed mesophilic (28 C) bioreactors fed with synthetic wastewater. The experiment consisted into four operation phases for both reactors, being the two first phases used for the stabilization of the systems. During the operation phase III, sodium sulfate was introduced into the reactors at a COD/SO42- ratio of ~7. At the operation phase IV, the hydrogen sulfide removal systems were applied into the reactors, i.e. the reactor 1 (R1) was operated under strictly anaerobic conditions with a biogas caustic scrubbing, and the reactor 2 (R2) was operated at micro-aerobic conditions by using a 0,2 mL.min-1 atmospheric air injection into the headspace of the system. Physical-chemical analyses, such as COD, pH, alkalinity, sulfate, dissolved sulfide was performed, and biogas was characterized in terms of N2, O2, CH4, CO2, H2S, NH3. During the operation phases III and IV, both rectors showed a good stability in terms of COD removal (>80%) and sulfate removal (>90%). During the micro-aerobic process, the introduced oxygen did not affect organic matter removal. Regarding biogas quality, content of methane in the micro-aerobic system decreased to a value of 76% (phase III) and 52% (phase IV), due to the dilution with the nitrogen present in air. Meanwhile, when nitrogen interference was removed, similar concentrations to the anaerobic phase (phase III) were obtained, suggesting that methanogenic archaea was not significantly affected by the introduced oxygen. Regarding to sulfide removal, the micro-aerobic process was effective, both removing sulfide from the liquid and the gaseous phases, showing an average removal of 42% e 94%, respectively. The biogas cleaning process applied to R1 showed a 100% sulfide removal from biogas and 100% removal of CO2 and NH3. In this way, both, the micro-aerobic and the scrubbing processes were efficient for sulfide removal and can be used for odor control in WWTP. The preliminary economical study considering two technologies (micro-aerobic and the scrubbing) showed that even taking into account the initial investment for the aeration and the electricity costs for the continuous aeration, the operational costs with the chemical acquisition for the scrubbing process are much higher. Likely, the micro-aerobic process will be more advantageous than the scrubbing process after a detailed economic analysis or a life cycle assessment, however, it is necessary to perform more research in order to confirm these hypotheses.

Confiabilidade é um parâmetro de projeto importante para aplicações criticas tanto na Terra como também no espaço. Os FPGAs baseados em memoria SRAM são atrativos para implementar aplicações criticas devido a seu alto desempenho e flexibilidade. No entanto, estes FPGAs são susceptíveis aos efeitos da radiação tais como os erros transientes na memoria de configuração. Além disso, outros efeitos como o envelhecimento (aging) ou escalonamento da tensão de alimentação (voltage scaling) incrementam a sensibilidade à radiação dos FPGAs. Nossos resultados experimentais mostram que o envelhecimento e o escalonamento da tensão de alimentação podem aumentar ao menos duas vezes a susceptibilidade de FPGAs baseados em SRAM a erros transientes. Estes resultados são inovadores porque estes combinam três efeitos reais que acontecem em FPGAs baseados em SRAM. Os resultados podem guiar aos projetistas a prever os efeitos dos erros transientes durante o tempo de operação do dispositivo em diferentes níveis de tensão. A correção da memoria usando a técnica de scrubbing é um método efetivo para corrigir erros transientes em memorias SRAM, mas este método impõe custos adicionais em termos de área e consumo de energia. Neste trabalho, nos propomos uma nova técnica de scrubbing usando a redundância interna a nível de quadros chamada FLR- scrubbing. Esta técnica possui mínimo consumo de energia sem comprometer a capacidade de correção. Como estudo de caso, a técnica foi implementada em um FPGA de tamanho médio Xilinx Virtex-5, ocupando 8% dos recursos disponíveis e consumindo seis vezes menos energia que um circuito corretor tradicional chamado blind scrubber. Além, a técnica proposta reduz o tempo de reparação porque evita o uso de uma memoria externa como referencia. E como outra contribuição deste trabalho, nos apresentamos os detalhes de uma plataforma de injeção de falhas múltiplas que permite emular os erros transientes na memoria de configuração do FPGA usando reconfiguração parcial dinâmica. Resultados de campanhas de injeção são apresentados e comparados com experimentos de radiação acelerada. Finalmente, usando a plataforma de injeção de falhas proposta, nos conseguimos analisar a efetividade da técnica FLR-scrubbing. Nos também confirmamos estes resultados com experimentos de radiação acelerada. / Reliability is an important design constraint for critical applications at ground-level and aerospace. SRAM-based FPGAs are attractive for critical applications due to their high performance and flexibility. However, they are susceptible to radiation effects such as soft errors in the configuration memory. Furthermore, the effects of aging and voltage scaling increment the sensitivity of SRAM-based FPGAs to soft errors. Experimental results show that aging and voltage scaling can increase at least two times the susceptibility of SRAM-based FPGAs to Soft Error Rate (SER). These findings are innovative because they combine three real effects that occur in SRAM-based FPGAs. Results can guide designers to predict soft error effects during the lifetime of devices operating at different power supply voltages. Memory scrubbing is an effective method to correct soft errors in SRAM memories, but it imposes an overhead in terms of silicon area and energy consumption. In this work, it is proposed a novel scrubbing technique using internal frame redundancy called Frame-level Redundancy Scrubbing (FLRscrubbing) with minimum energy consumption overhead without compromising the correction capabilities. As a case study, the FLR-scrubbing controller was implemented on a mid-size Xilinx Virtex-5 FPGA device, occupying 8% of available slices and consumes six times less energy per scrubbed frame than a classic blind scrubber. Also, the technique reduces the repair time by avoiding the use of an external golden memory for reference. As another contribution, this work presents the details of a Multiple Fault Injection Platform that emulates the configuration memory upsets of an FPGA using dynamic partial reconfiguration. Results of fault injection campaigns are presented and compared with accelerated ground-level radiation experiments. Finally, using our proposed fault injection platform it was possible to analyze the effectiveness of the FLR-scrubbing technique. Accelerated radiation tests confirmed these results.

Confiabilidade é um parâmetro de projeto importante para aplicações criticas tanto na Terra como também no espaço. Os FPGAs baseados em memoria SRAM são atrativos para implementar aplicações criticas devido a seu alto desempenho e flexibilidade. No entanto, estes FPGAs são susceptíveis aos efeitos da radiação tais como os erros transientes na memoria de configuração. Além disso, outros efeitos como o envelhecimento (aging) ou escalonamento da tensão de alimentação (voltage scaling) incrementam a sensibilidade à radiação dos FPGAs. Nossos resultados experimentais mostram que o envelhecimento e o escalonamento da tensão de alimentação podem aumentar ao menos duas vezes a susceptibilidade de FPGAs baseados em SRAM a erros transientes. Estes resultados são inovadores porque estes combinam três efeitos reais que acontecem em FPGAs baseados em SRAM. Os resultados podem guiar aos projetistas a prever os efeitos dos erros transientes durante o tempo de operação do dispositivo em diferentes níveis de tensão. A correção da memoria usando a técnica de scrubbing é um método efetivo para corrigir erros transientes em memorias SRAM, mas este método impõe custos adicionais em termos de área e consumo de energia. Neste trabalho, nos propomos uma nova técnica de scrubbing usando a redundância interna a nível de quadros chamada FLR- scrubbing. Esta técnica possui mínimo consumo de energia sem comprometer a capacidade de correção. Como estudo de caso, a técnica foi implementada em um FPGA de tamanho médio Xilinx Virtex-5, ocupando 8% dos recursos disponíveis e consumindo seis vezes menos energia que um circuito corretor tradicional chamado blind scrubber. Além, a técnica proposta reduz o tempo de reparação porque evita o uso de uma memoria externa como referencia. E como outra contribuição deste trabalho, nos apresentamos os detalhes de uma plataforma de injeção de falhas múltiplas que permite emular os erros transientes na memoria de configuração do FPGA usando reconfiguração parcial dinâmica. Resultados de campanhas de injeção são apresentados e comparados com experimentos de radiação acelerada. Finalmente, usando a plataforma de injeção de falhas proposta, nos conseguimos analisar a efetividade da técnica FLR-scrubbing. Nos também confirmamos estes resultados com experimentos de radiação acelerada. / Reliability is an important design constraint for critical applications at ground-level and aerospace. SRAM-based FPGAs are attractive for critical applications due to their high performance and flexibility. However, they are susceptible to radiation effects such as soft errors in the configuration memory. Furthermore, the effects of aging and voltage scaling increment the sensitivity of SRAM-based FPGAs to soft errors. Experimental results show that aging and voltage scaling can increase at least two times the susceptibility of SRAM-based FPGAs to Soft Error Rate (SER). These findings are innovative because they combine three real effects that occur in SRAM-based FPGAs. Results can guide designers to predict soft error effects during the lifetime of devices operating at different power supply voltages. Memory scrubbing is an effective method to correct soft errors in SRAM memories, but it imposes an overhead in terms of silicon area and energy consumption. In this work, it is proposed a novel scrubbing technique using internal frame redundancy called Frame-level Redundancy Scrubbing (FLRscrubbing) with minimum energy consumption overhead without compromising the correction capabilities. As a case study, the FLR-scrubbing controller was implemented on a mid-size Xilinx Virtex-5 FPGA device, occupying 8% of available slices and consumes six times less energy per scrubbed frame than a classic blind scrubber. Also, the technique reduces the repair time by avoiding the use of an external golden memory for reference. As another contribution, this work presents the details of a Multiple Fault Injection Platform that emulates the configuration memory upsets of an FPGA using dynamic partial reconfiguration. Results of fault injection campaigns are presented and compared with accelerated ground-level radiation experiments. Finally, using our proposed fault injection platform it was possible to analyze the effectiveness of the FLR-scrubbing technique. Accelerated radiation tests confirmed these results.

Confiabilidade é um parâmetro de projeto importante para aplicações criticas tanto na Terra como também no espaço. Os FPGAs baseados em memoria SRAM são atrativos para implementar aplicações criticas devido a seu alto desempenho e flexibilidade. No entanto, estes FPGAs são susceptíveis aos efeitos da radiação tais como os erros transientes na memoria de configuração. Além disso, outros efeitos como o envelhecimento (aging) ou escalonamento da tensão de alimentação (voltage scaling) incrementam a sensibilidade à radiação dos FPGAs. Nossos resultados experimentais mostram que o envelhecimento e o escalonamento da tensão de alimentação podem aumentar ao menos duas vezes a susceptibilidade de FPGAs baseados em SRAM a erros transientes. Estes resultados são inovadores porque estes combinam três efeitos reais que acontecem em FPGAs baseados em SRAM. Os resultados podem guiar aos projetistas a prever os efeitos dos erros transientes durante o tempo de operação do dispositivo em diferentes níveis de tensão. A correção da memoria usando a técnica de scrubbing é um método efetivo para corrigir erros transientes em memorias SRAM, mas este método impõe custos adicionais em termos de área e consumo de energia. Neste trabalho, nos propomos uma nova técnica de scrubbing usando a redundância interna a nível de quadros chamada FLR- scrubbing. Esta técnica possui mínimo consumo de energia sem comprometer a capacidade de correção. Como estudo de caso, a técnica foi implementada em um FPGA de tamanho médio Xilinx Virtex-5, ocupando 8% dos recursos disponíveis e consumindo seis vezes menos energia que um circuito corretor tradicional chamado blind scrubber. Além, a técnica proposta reduz o tempo de reparação porque evita o uso de uma memoria externa como referencia. E como outra contribuição deste trabalho, nos apresentamos os detalhes de uma plataforma de injeção de falhas múltiplas que permite emular os erros transientes na memoria de configuração do FPGA usando reconfiguração parcial dinâmica. Resultados de campanhas de injeção são apresentados e comparados com experimentos de radiação acelerada. Finalmente, usando a plataforma de injeção de falhas proposta, nos conseguimos analisar a efetividade da técnica FLR-scrubbing. Nos também confirmamos estes resultados com experimentos de radiação acelerada. / Reliability is an important design constraint for critical applications at ground-level and aerospace. SRAM-based FPGAs are attractive for critical applications due to their high performance and flexibility. However, they are susceptible to radiation effects such as soft errors in the configuration memory. Furthermore, the effects of aging and voltage scaling increment the sensitivity of SRAM-based FPGAs to soft errors. Experimental results show that aging and voltage scaling can increase at least two times the susceptibility of SRAM-based FPGAs to Soft Error Rate (SER). These findings are innovative because they combine three real effects that occur in SRAM-based FPGAs. Results can guide designers to predict soft error effects during the lifetime of devices operating at different power supply voltages. Memory scrubbing is an effective method to correct soft errors in SRAM memories, but it imposes an overhead in terms of silicon area and energy consumption. In this work, it is proposed a novel scrubbing technique using internal frame redundancy called Frame-level Redundancy Scrubbing (FLRscrubbing) with minimum energy consumption overhead without compromising the correction capabilities. As a case study, the FLR-scrubbing controller was implemented on a mid-size Xilinx Virtex-5 FPGA device, occupying 8% of available slices and consumes six times less energy per scrubbed frame than a classic blind scrubber. Also, the technique reduces the repair time by avoiding the use of an external golden memory for reference. As another contribution, this work presents the details of a Multiple Fault Injection Platform that emulates the configuration memory upsets of an FPGA using dynamic partial reconfiguration. Results of fault injection campaigns are presented and compared with accelerated ground-level radiation experiments. Finally, using our proposed fault injection platform it was possible to analyze the effectiveness of the FLR-scrubbing technique. Accelerated radiation tests confirmed these results.

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Processindustrin är den största källan för utsläpp av svaveldioxid (SO2) i Sverige, vilket även inkluderar icke­järnmetallindustrin. Kopparsmältverket Boliden Rönnskär har ett miljötillstånd som tillåter SO2­-utsläpp på maximalt 3500 ton/år, en gräns som Rönnskär har legat nära under de senaste åren. För att minska svaveldioxidutsläppen på Rönnskär så har våtskrubbning (tillsammans med ett bagfilter för stoftrening) föreslagits som en metod för att rena de SO2-­bärande och intermittenta tappgaserna från flashugnen. För att göra ett optimalt val av våtskrubberteknik för ändamålet, undersöktes, utvärderas och jämfördes våtskrubbningstekniker baserade på de följande kemikalierna i denna rapport: lut, soda, peroxid, kalk and zinkoxid. Mätningar gjordes också på sekundärhuvsgaserna från konvertrarna, som också kan användas i skrubbern då flashugnens tappgaser har ett fluktuerande flöde. Vidare gjordes tester på olika processvatten på Rönnskär, som skulle kunna återanvändas i skrubbern. Skrubbrarna utvärderades sedan baserat på indata och olika systemkrav med hjälp av simulerings­ och designprogram samt teoretiska beräkningar. Resultaten visade att det är rimligt att rena sekundärhuvsgaser i skrubbern, då de innehöll ca 280 ton SO2/år. Detta kan jämföras med flashugnens tappgaser som innehöll ca 445 ton SO2/år. Bland skrubbrarna, så utvecklade peroxidskrubbern sig till att vara den mest attraktiva tekniken på grund av dess relativt låga livscykelkostnader och dess lämplighet med både lakverket och flashkyltornsprocessvattnet. De andra teknikerna med packade torn, lut­ och sodaskrubbern, hade högst livscykelkostnader, huvudsakligen på grund av deras höga kemikaliekostnader. Sodaskrubbern, som var den billigare av de två natriumbaserade skrubbarna, skulle kunna vara lämplig ändå på grund av teknikens enkelhet. De öppna tornen hade lägre livscykelkostnader jämfört med de packade tornen. Dock så hade kalkskrubbern flera nackdelar som gör att den inte är ett lämpligt alternativ. Zinkoxidskrubbning har i sin tur inte studerats tillräckligt och är en relativt oprövad teknik, men den bör studeras vidare då den skulle kunna integreras med zinksmältningsprocessen på Rönnskär. Användningen av processvatten i skrubbern skulle leda till en nettominskning av processvatten till reningsverket. Det skulle även leda till minskade reagentkostnader ifall en stripper installeras för att ta bort SO2 från processvattnen innan de går in i skrubbern. / The processing industry is the largest source of sulfur dioxide (SO2) emissions in Sweden, which includes the non­ferrous metals industry. The copper smelter Boliden Rönnskär has an environmental permit to emit a maximum of 3500 tonnes of SO2/year, a limit that the smelter has been close to in recent years. To reduce the SO2 emissions at Rönnskär, wet scrubbing (together with a bag filter for dust cleaning) has been proposed as a method for cleaning the SO2­-bearing, intermittent tapping gases from the flash furnace. To find the optimal wet scrubbing technique for the purpose, wet scrubbing techniques based on the following reagents were investigated, evaluated and compared in this report: caustic soda, soda ash, peroxide, lime and zinc oxide. Measurements were also done on the secondary hood gases from the converters, which could make use of the remaining capacity in the scrubber. Further, tests were conducted on various process waters from other processes at Rönnskär, waters that could be reused in the scrubber. The scrubber techniques were then evaluated based on the input data and system requirements using simulation and design software as well as theoretical calculations. The results suggested that it is reasonable to clean secondary hood gases in the scrubber, as they contained approximately 280 tonnes of SO2/year. This could be compared to the flash tapping gases that contained approximately 445 tonnes of SO2/year. Among the scrubbers, the peroxide scrubber evolved as the most attractive technique due to its relatively low life cycle cost and due to its suitability with the leaching plant and the flash cooling tower process water. The other packed tower techniques, caustic soda and soda ash had the highest life cycle costs, mainly due to their high reagent costs. The soda ash scrubber, which was the cheaper of the two sodium­-based scrubbers, could still be a suitable alternative due to its simplicity. The open spray towers had lower life cycle costs than the packed towers. However, the lime scrubber had several disadvantages that makes it an unsuitable alternative. In turn, the zinc oxide scrubber is a relatively under­researched and unproven technique, but should still be studied further as it could be integrated with the zinc smelting process at Rönnskär. The use of process waters in the scrubber would lead to a net reduction of process water to the process water treatment plant and would lead to reduced reagent costs if a stripper is installed to remove the SO2 from the process waters before entering the scrubber.

This thesis discusses findings gained through work with the NOx abatement system at Radford Facility and Army Ammunition Plant (RFAAP). Removal of harmful substances from flue-gas emissions has garnered increased priority in the chemical industry in preceding decades, as governmental restrictions on these substances become more stringent and as national awareness concerning environmental quality and resource utilization continues to grow. These reasons make the study of NOx abatement an important and challenging endeavor. This work concerns itself specifically with reduction of NOx in flue-gas emissions from stationary sources. First we present an overview of current technology and approaches to controlling NOx for stationary sources. Next, we focus in on one particular approach to control of NOx within the context of a case study of the technology used at the Radford Facility and Army Ammunition Plant. RFAAP employs a scrubber/absorber tower followed in series by a selective catalytic reduction (SCR) reaction vessel in their NOx abatement system. We use as the method of study computer simulations within ASPEN Plus, a process simulation software package for chemical plants. We develop three different models with which to characterize NOx abatement at RFAAP, a conversion model, an equilibrium model and a kinetic model. The conversion-reaction model approximates the absorption and SCR reactions with constant percentage extent-of-reaction values. Though useful for initial investigation and mass balance information, we find the conversion model's insensitivity to process changes to be unacceptable for in-depth study of the case of NOx absorption and SCR. The equilibrium-reaction model works on the assumption that all the reactions reach chemical equilibrium. For the conditions studied here, we find the equilibrium model accurately simulates NOx absorption but fails in the case of SCR. Therefore, we introduce a kinetic-reaction model to handle the SCR. The SCR reactions prove to be highly rate-dependant and the kinetic approach performs well. The final evolution of the ASPEN Plus simulation uses an equilibrium model for the absorption operation and a kinetic model for the SCR. We explore retrofit options using this combined model and propose process improvements. We end this work with observations of the entire project in the form of conclusions and recommendations for improving the operation of the NOx abatement system through process-parameter optimization and equipment-retrofit schemes. By leading the reader through the process by which we arrived at a successful and highly informative computer model for NOx absorption and SCR, we hope to educate the reader on the subtleties of NOx abatement by absorption and SCR. We attempt to break down the numerous complex processes to present a less daunting prospect to the engineer challenged with the application of current NOx removal technology. In addition, we introduce the reader to the power and usefulness of computer modeling in instances of such complexity. The model teaches us about the details of the process and helps us develop concrete information for its optimization. Ideally, the reader could use a similar approach in tackling related operations and not confine the usefulness of this thesis to NOx absorption and SCR. The audiences that we think would benefit from exposure to this thesis are the following: • Environmental engineers with a NOx problem; • Process engineers interested in optimization tools; • Design engineers exploring flue-gas treatment options; • Combustion engineer desiring to learn about SCR; • Chemists and mathematicians intrigued by the complexities of NOx absorption chemistry. / Master of Science

SRAM-based FPGAs provide valuable computation resources and reconfigurability; however, ionizing radiation can cause designs operating on these devices to fail. The sensitivity of an FPGA design to configuration upsets, or its SEU sensitivity, is an indication of a design's failure rate. SEU mitigation techniques can reduce the SEU sensitivity of FPGA designs in harsh radiation environments. The reliability benefits of these techniques must be determined before they can be used in mission-critical applications and can be determined by comparing the SEU sensitivity of an FPGA design with and without these techniques applied to it. Many approaches can be taken to evaluate the SEU sensitivity of an FPGA design. This work describes a low-cost easier-to-implement approach for evaluating the SEU sensitivity of an FPGA design. This approach uses additional logic resources on the same FPGA as the design under test to determine when the design has failed, or deviated from its specified behavior. Three SEU mitigation techniques were evaluated using this approach: triple modular redundancy (TMR), configuration scrubbing, and user-memory scrubbing. Significant reduction in SEU sensitivity is demonstrated through fault injection and radiation testing. Two LEON3 processors operating in lockstep are compared against each other using on-chip error detection logic on the same FPGA. The design SEU sensitivity is reduced by 27x when TMR and configuration scrubbing are applied, and by approximately 50x when TMR, configuration scrubbing, and user-memory scrubbing are applied together. Using this approach, an SEU sensitivity comparison is made of designs implemented on both an Altera Stratix V FPGA and a Xilinx Kintex 7 FPGA. Several instances of a finite state machine are compared against each other and a set of golden output vectors, all on the same FPGA. Instances of an AES cryptography core are chained together and the output of two chains are compared using on-chip error detection. Fault injection and neutron radiation testing reveal several similarities between the two FPGA architectures. SEU mitigation techniques reduce the SEU sensitivity of the two designs between 4x and 728x. Protecting on-chip functional error detection logic with TMR and duplication with compare (DWC) is compared. Fault injection results suggest that it is more favorable to protect on-chip functional error detection logic with DWC than it is to protect it with TMR for error detection.

Strahlwäscher sind durch Ihre Fluiddynamik gekennzeichnet, was eine detaillierte Simulation erschwert. Es konnte gezeigt werden, dass die in der Literatur üblichen empirischen Ansätze aufgrund Ihrer Vereinfachungen den Prozess nur ungenau beschreiben und daher nur für eingeschränkte Bedingungen gelten. Die für die Auslegung von Strahlwäschern relevanten Größen, die erreichbare Pressung und die Stoffaustauschfläche, für beliebige Betriebspunkte wurden in dieser Arbeit durch eine dreidimensionale CFD Simulation berechnet. Es wurden entsprechende Unterprogramme implementiert, um den Stoffübergang im Strahlwäscher zu berechnen. Die chemische Absorption wurde sowohl für die Tropfen als auch für den sich ausbildenden Wandfilm berechnet und als Senke an die Gasphase zurückgegeben. Die Tropfengröße und der Sprühwinkel haben einen essentiellen Einfluss auf die Strömungsverhältnisse im Strahlwäscher. Diese, im wesentlichen von der Düse abhängigen Größen, wurden experimentell mit der Phasen-Doppler-Anemometrie bestimmt. Die Simulationsergebnisse wurden durch Versuche in einer Technikumsanlage verifiziert.