This thesis describes an experimental study and modeling of the current-transconductance dependence of the ALD1106, ALD1107, and CD4007 arrays. The study tests the hypothesis that the I-gm dependence of these 7.8 µm to 10 µm MOSFETs conforms to the Advanced Compact Model (ACM). Results from performed measurements, however, do not support this expectation. Despite the relatively large length, both ALD1106 and ALD1107 show sufficiently pronounced ‘short-channel’ effects to render the ACM inadequate. As a byproduct of this effort, we confirmed the modified ACM equation. With an m factor of approximately 0.6, it captures the I-gm dependence with sub-28% maximum error and sub-10% average error. The paper also introduces several formulas and procedures for I-gm model extraction and tuning. These are not specific to the ALD transistor family and can apply to MOSFETs with different physical size and electrical performance.

Impedance measurement as a function of frequency is being increasingly used for the detection of organic molecules. The main building block required for this is a sinusoidal oscillator whose frequency can be varied in the range of a few KHz to tens of MHz. The thesis describes the design of Integrated CMOS Oscillator Circuits. There are 2 designs presented in the thesis, one of which is based on the Wien Bridge and the other, on an LC architecture. They provide both in-phase and quadrature outputs needed for the determination of the real and imaginary parts of complex impedances. The inductor in the LC tank is realized by gyration of a capacitor. This needs two variable transconductance elements. Linear transconductance elements with decoupled transconductance gm and output conductance go is presented. A novel circuit for detecting and controlling the amplitude of oscillation is described. A current mode technique to scale the capacitance is also discussed. Since this oscillator is used in an inexpensive hand-held instrument, both power consumption and chip area must be minimized. A comparison between the Wien Bridge and the LC tank based oscillator is presented. Simulation results pertaining to the design of the different blocks of the circuit are made available. / text

Este trabalho apresenta o estudo do efeito de elevação atípica da transcondutância na região linear de polarização devido ao efeito de corpo flutuante induzido pela porta (Gate Induced Floating Body Effect - GIFBE) de transistores da tecnologia SOI nMOSFET. Este estudo foi realizado com base em resultados experimentais e em simulações numéricas, as quais foram essenciais para o entendimento físico deste fenômeno. Além de contribuir com a explicação física deste fenômeno, este trabalho explora o efeito de corpo flutuante em diferentes estruturas (transistor de porta única, transistor de porta gêmea, transistor de múltiplas portas e transistores de canal tensionado), diferentes tecnologias e em função da temperatura (100K a 450K). A partir do estudo realizado em dispositivos SOI de porta única analisouse a influência das componentes da corrente de porta que tunelam através do óxido de porta do dispositivo, o potencial da região neutra do corpo do transistor, a taxa de recombinação de portadores, o impacto da redução da espessura do óxido de porta e também as dimensões físicas do transistor. Na análise feita da redução do comprimento de canal, verificou-se também que o GIFBE tende a ser menos significativo para dispositivos ultra-submicrométricos. Analisou-se também o efeito da elevação atípica da transcondutância para transistores SOI totalmente depletados, para os quais, este efeito ocorre apenas quando a segunda interface está acumulada, para as duas tecnologias estudadas (65nm e 130nm). A análise dos dispositivos de porta gêmea, que tradicionalmente são usados com a finalidade de minimizar o efeito de elevação abrupta de corrente de dreno, mostrou uma redução do GIFBE para este tipo de estrutura quando comparada à de porta única devido ao aumento da resistência série intrínseca à estrutura. O efeito de corpo flutuante também foi avaliado em função da temperatura de operação dos dispositivos. Para temperaturas variando de 100K a 450K, notou-se que o valor do limiar de GIFBE aumentou tanto para temperaturas acima de 300K quanto abaixo da mesma. Quando estes resultados são apresentados graficamente, observa-se que o comportamento do limiar de GIFBE com a temperatura resulta no formato de uma letra C, onde o valor mínimo está a 300K. Este comportamento se deve à competição entre o processo de recombinação e a degradação efetiva da mobilidade. Uma primeira análise do GIFBE em diferentes estruturas de transistores também foi realizada. Apesar dos transistores de canal tensionado apresentarem o efeito para valores menores de tensão de porta, este efeito se manifesta com menor intensidade nestes transistores, devido a alta degradação da mobilidade efetiva apresentada pelo mesmo. Entretanto, quando o foco são os transistores de múltiplas portas, os resultados obtidos demonstram que apesar destes dispositivos terem sido fabricados com dielétrico de porta de alta constante dielétrica, o GIFBE ainda ocorre. Esta ocorrência do GIFBE em FinFETs é fortemente dependente da largura do Fin, da dopagem da região de canal e conseqüentemente do acoplamento das portas laterais com a superior. / This work presents the study of the Gate Induced Floating Body Effect (GIFBE) that occurs in the SOI MOSFET technology. This study has been performed based on experimental results and on numerical simulations, which were an essential auxiliary tool to obtain a physical insight of this effect. Besides the contribution on the physical explanation of this phenomenon, in this work, the floating body effect was evaluated for different structures (single gate and twin-gate transistors), different technologies (130nm and 65nm SOI CMOS technology) and as a function of the temperature (100K to 450K). From the study of the single gate devices, it was evaluated the gate tunneling current influence on GIFBE, the body potential in the neutral region, the recombination rate, the front gate oxide thickness reduction impact, besides the physical dimensions of the transistor. In the performed analysis, taking into account the channel length reduction, it was verified that the GIFBE tends to be less important for ultra-submicron devices. The GIFBE only occurs for fully depleted devices when the second interface is accumulated. In this situation, the floating body effect influence on fully depleted devices was also studied for both technologies (65nm and 130nm). The twin-gate devices analysis, that traditionally are used in order to minimize the Kink effect, show a GIFBE reduction for this structure when it is compared to the single gate one. This enhance in the electrical characteristics is due to the series resistance increase that is intrinsic of this structures. When the temperature variation from 100K to 450K was analyzed, it was obtained the C shape behavior for the floating body effect due to a competition between the recombination process and the effective mobility degradation factor. A first evaluation of the GIFBE occurrence in new devices was also performed. When the focus is the strained silicon transistor, a occurrence of GIFBE was obtained for a lower gate voltage. Although, the GIFBE occurs earlier for strained transistor. This effect is less pronounced in this device because it presents strong effective mobility degradation. When the focus is FinFETs, the results show that although this device was fabricated with a high-k gate dielectric, the GIFBE still occurs and is strongly dependent on the device channel width.

<p>The Sigma Delta Modulator (SDM) based analog to digital conversion is cost effective and have the advantages as higher reliability, increased functionality, and reduction in chip cost.</p><p>The thesis work includes the modeling of SDM with the signal flow graph in Matlab, optimization of the coefficients to improve the noise transfer function and signal transfer function. A procedure to find the maximum stable input range for the design. Scaling the inputs of the integrator so that the maximum output signal can be obtained according to the operational transconductance amplifier (OTA) output range. Further we derived error bound for the design. Then step by step realization of the SDM form the signal flow graph (SFG) to a fully differential switched-capacitor (SC) network is shown. The work also includes complete differential transistor level realization for 3-bit flash analog to digital converter (ADC), thermometric to binary encoder, a switch-capacitor digital to analog converter (DAC) circuit and an on-chip circuit realization of the non-overlapping clock generation circuitry.</p>

The Sigma Delta Modulator (SDM) based analog to digital conversion is cost effective and have the advantages as higher reliability, increased functionality, and reduction in chip cost. The thesis work includes the modeling of SDM with the signal flow graph in Matlab, optimization of the coefficients to improve the noise transfer function and signal transfer function. A procedure to find the maximum stable input range for the design. Scaling the inputs of the integrator so that the maximum output signal can be obtained according to the operational transconductance amplifier (OTA) output range. Further we derived error bound for the design. Then step by step realization of the SDM form the signal flow graph (SFG) to a fully differential switched-capacitor (SC) network is shown. The work also includes complete differential transistor level realization for 3-bit flash analog to digital converter (ADC), thermometric to binary encoder, a switch-capacitor digital to analog converter (DAC) circuit and an on-chip circuit realization of the non-overlapping clock generation circuitry.

The geometry of CMOS processes has decreased in a steady pace over the years at the same time as the complexity has increased. Even if there are more requirements on the designer today, the main goal is still the same: to minimize the occupied area and power dissipation. This thesis investigates if a prediction of the costs in future CMOS processes can be made. By implementing several processes on a test circuit we can see a pattern in area and power dissipation when we change to smaller processes. This is done by optimizing a two-stage operational transconductance amplifier on basis of a given specification. A circuit optimization tool evaluates the performance measures and costs. The optimization results from the area and power dissipation is used to present a diagram that shows the decreasing costs with smaller processes and also a prediction of how small the costs will be for future processes. This thesis also presents different optimization tools and a design hexagon that can be used when we struggle with optimization trade-offs.

Este trabalho apresenta o estudo do efeito de elevação atípica da transcondutância na região linear de polarização devido ao efeito de corpo flutuante induzido pela porta (Gate Induced Floating Body Effect - GIFBE) de transistores da tecnologia SOI nMOSFET. Este estudo foi realizado com base em resultados experimentais e em simulações numéricas, as quais foram essenciais para o entendimento físico deste fenômeno. Além de contribuir com a explicação física deste fenômeno, este trabalho explora o efeito de corpo flutuante em diferentes estruturas (transistor de porta única, transistor de porta gêmea, transistor de múltiplas portas e transistores de canal tensionado), diferentes tecnologias e em função da temperatura (100K a 450K). A partir do estudo realizado em dispositivos SOI de porta única analisouse a influência das componentes da corrente de porta que tunelam através do óxido de porta do dispositivo, o potencial da região neutra do corpo do transistor, a taxa de recombinação de portadores, o impacto da redução da espessura do óxido de porta e também as dimensões físicas do transistor. Na análise feita da redução do comprimento de canal, verificou-se também que o GIFBE tende a ser menos significativo para dispositivos ultra-submicrométricos. Analisou-se também o efeito da elevação atípica da transcondutância para transistores SOI totalmente depletados, para os quais, este efeito ocorre apenas quando a segunda interface está acumulada, para as duas tecnologias estudadas (65nm e 130nm). A análise dos dispositivos de porta gêmea, que tradicionalmente são usados com a finalidade de minimizar o efeito de elevação abrupta de corrente de dreno, mostrou uma redução do GIFBE para este tipo de estrutura quando comparada à de porta única devido ao aumento da resistência série intrínseca à estrutura. O efeito de corpo flutuante também foi avaliado em função da temperatura de operação dos dispositivos. Para temperaturas variando de 100K a 450K, notou-se que o valor do limiar de GIFBE aumentou tanto para temperaturas acima de 300K quanto abaixo da mesma. Quando estes resultados são apresentados graficamente, observa-se que o comportamento do limiar de GIFBE com a temperatura resulta no formato de uma letra C, onde o valor mínimo está a 300K. Este comportamento se deve à competição entre o processo de recombinação e a degradação efetiva da mobilidade. Uma primeira análise do GIFBE em diferentes estruturas de transistores também foi realizada. Apesar dos transistores de canal tensionado apresentarem o efeito para valores menores de tensão de porta, este efeito se manifesta com menor intensidade nestes transistores, devido a alta degradação da mobilidade efetiva apresentada pelo mesmo. Entretanto, quando o foco são os transistores de múltiplas portas, os resultados obtidos demonstram que apesar destes dispositivos terem sido fabricados com dielétrico de porta de alta constante dielétrica, o GIFBE ainda ocorre. Esta ocorrência do GIFBE em FinFETs é fortemente dependente da largura do Fin, da dopagem da região de canal e conseqüentemente do acoplamento das portas laterais com a superior. / This work presents the study of the Gate Induced Floating Body Effect (GIFBE) that occurs in the SOI MOSFET technology. This study has been performed based on experimental results and on numerical simulations, which were an essential auxiliary tool to obtain a physical insight of this effect. Besides the contribution on the physical explanation of this phenomenon, in this work, the floating body effect was evaluated for different structures (single gate and twin-gate transistors), different technologies (130nm and 65nm SOI CMOS technology) and as a function of the temperature (100K to 450K). From the study of the single gate devices, it was evaluated the gate tunneling current influence on GIFBE, the body potential in the neutral region, the recombination rate, the front gate oxide thickness reduction impact, besides the physical dimensions of the transistor. In the performed analysis, taking into account the channel length reduction, it was verified that the GIFBE tends to be less important for ultra-submicron devices. The GIFBE only occurs for fully depleted devices when the second interface is accumulated. In this situation, the floating body effect influence on fully depleted devices was also studied for both technologies (65nm and 130nm). The twin-gate devices analysis, that traditionally are used in order to minimize the Kink effect, show a GIFBE reduction for this structure when it is compared to the single gate one. This enhance in the electrical characteristics is due to the series resistance increase that is intrinsic of this structures. When the temperature variation from 100K to 450K was analyzed, it was obtained the C shape behavior for the floating body effect due to a competition between the recombination process and the effective mobility degradation factor. A first evaluation of the GIFBE occurrence in new devices was also performed. When the focus is the strained silicon transistor, a occurrence of GIFBE was obtained for a lower gate voltage. Although, the GIFBE occurs earlier for strained transistor. This effect is less pronounced in this device because it presents strong effective mobility degradation. When the focus is FinFETs, the results show that although this device was fabricated with a high-k gate dielectric, the GIFBE still occurs and is strongly dependent on the device channel width.

The aim of the thesis is to get acquainted with the principle and function of functional generators. Furthermore, with their design using active elements that can be electronically controlled. The design and simulation results are presented in Chapter 4, which also shows schematics of simulated and measured circuits.

The aim of the thesis is to get acquainted with the principle and function of functional generators. Furthermore, with their design using active elements that can be electronically controlled. The design and simulation results are presented in Chapter 4, which also shows schematics of simulated and measured circuits.

No description available.