Este trabalho apresenta o estudo do comportamento da resistência série de fonte e dreno em transistores SOI FinFET de porta tripla e com canal tensionado. Nos dispositivos SOI FinFETs há um aumento da resistência série de fonte e dreno devido ao estreitamento dessas regiões, sendo esse parâmetro considerado como uma das limitações quanto à introdução desses dispositivos em tecnologias futuras. O uso de tensão mecânica no canal dos dispositivos surge como alternativa para aumentar a condução de corrente através do aumento da mobilidade dos portadores do canal, reduzindo assim, a resistência total dos transistores e, conseqüentemente, a resistência série de fonte e dreno. Inicialmente, foi feito o estudo de alguns métodos de extração da resistência série de fonte e dreno existentes na literatura, com o objetivo de se obter o mais adequado para aplicação e análise posterior. Esse trabalho foi realizado baseado em resultados experimentais e em simulações numéricas que possibilitaram o entendimento físico do fenômeno estudado. A resistência série de fonte e dreno foi explorada em diferentes tecnologias, como transistores SOI FinFETs de porta tripla convencionais e sob influência de tensionamento uniaxial e biaxial. O uso do crescimento seletivo epitaxial (SEG) nas regiões de fonte e dreno altamente dopadas das diferentes tecnologias também foi analisado, pois com essa técnica, a resistência série de fonte e dreno é reduzida substancialmente não comprometendo a condução de corrente e a transcondutância. Os resultados obtidos das diferentes tecnologias com e sem o uso de SEG foram analisados e comparados mostrando que em transistores SOI FinFETs de porta tripla, com crescimento seletivo epitaxial, apresentam o menor valor da resistência série de fonte e dreno mesmo para aqueles sem tensão mecânica na região do canal. / This work presents the study of the source and drain series resistance behavior in standard and strained SOI FinFETs triple gate transistors. In SOI FinFETs transistors there is an increase of the source and drain series resistance due to the narrow of these regions, being this parameter a key limiting factor to the next generations. The use of strained transistors is one of the potential technologies to the next generation high performance because it increase the drive current through an enhance in the carrier mobility, decreasing the transistors total resistance and, therefore, the source and drain series resistance. Initially, a study of some series resistance extraction methods, present in the literature was done, in order to obtain the most appropriate for applications and analysis subsequent. This work was done based on experimental results and numerical simulations, enabling the physical understanding of the phenomenon studied. The series resistance was explored in different technologies, as standard SOI FinFETs triple gates and with uniaxial and biaxial strain. The use of selective epitaxial growth (SEG) in the source and drain regions, with high doping levels, was also studied in the different technologies, because with the use of this technique, the series resistance decreases substantially without compromising the drive current and transconductance. The obtained results from the different technologies with and without the use of SEG were analyzed and compared showing that, SOI FinFETs triple gate transistors with SEG present the lower values of series resistance even for standard devices if compared with strained ones without the use of SEG.

Properties of magnetic thin film devices cannot be understood without detailed knowledge of their structure. For this purpose, a variety of thin film and multilayer systems have been studied. Both reciprocal space (low energy electron diffraction, reflection high energy electron diffraction, X-ray diffraction and reflectometry) and direct space (transmission electron microscopy) as well as Rutherford backscattering spectrometry have been applied. To gain understanding of an oxidation procedure for the growth of magnetite layers, thermal stability of iron layers on molybdenum seed layers has been investigated. Following the mosaicity and the out-of-plane coherence length over different ratios between the constituting layers allowed a deeper understanding of the limits of metallic superlattices. This, together with an approach to use hydrogen in the process gas during magnetron sputter epitaxy, opens routes for the growth of metallic superlattices of superior quality. A non-isostructural multilayer/superlattice system, Fe/MgO, has been investigated. In turn, this gave more understanding how superlattice diffraction patterns are suppressed by strain fields. As an alternative route to single-crystalline superlattices, amorphous multilayers present interesting opportunities. In this context, crystallization effects of iron/zirconium layers on alumiunium oxide were studied. Understanding these effects enables significant improvement in the quality of amorphous multilayers, and allows avoiding these, growing truly amorphous layers. Both the substantial improvement in quality of metallic superlattices, approaching true single-crystallinity, as well as the improvements in the growth of amorphous multilayers give rise to opportunities in the field of magnetic coupling and superconducting spin valves.

Silicon carbide (SiC) has higher breakdown field strength than silicon (Si), which enables thinner and more highly doped drift layers compared to Si. Consequently, the power losses can be reduced compared to Si-based power conversion systems. Moreover, SiC allows the power conversion systems to operate at high temperatures up to 250 oC. With such expectations, SiC is considered as the material of choice for modern power semiconductor devices for high efficiencies, high temperatures, and high power densities. Besides the material benefits, the typeof the power device also plays an important role in determining the system performance. Compared to the SiC metal-oxide semiconductor field-effect transistor (MOSFET) and bipolar junction transistor (BJT), the SiC junction field-effect transistor (JFET) is a very promising power switch, being a voltage-controlled device without oxide reliability issues. Its channel iscontrolled by a p-n junction. However, the present JFETs are not optimized yet with regard to on-state resistance, controllability of threshold voltage, and Miller capacitance. In this thesis, the state-of-the-art SiC JFETs are introduced with buried-grid (BG) technology.The buried grid is formed in the channel through epitaxial growth and etching processes. Through simulation studies, the new concepts of normally-on and -off BG JFETs with 1200 V blocking capability are investigated in terms of static and dynamic characteristics. Additionally, two case studies are performed in order to evaluate total losses on the system level. These investigations can be provided to a power circuit designer for fully exploiting the benefit of power devices. Additionally, they can serve as accurate device models and guidelines considering the switching performance. The BG concept utilized for JFETs has been also used for further development of SiC junctionbarrier Schottky (JBS) diodes. Especially, this design concept gives a great impact on high temperature operation due to efficient shielding of the Schottky interface from high electric fields. By means of simulations, the device structures with implanted and epitaxial p-grid formations, respectively, are compared regarding threshold voltage, blocking voltage, and maximum electric field at the Schottky interface. The results show that the device with an epitaxial grid can be more efficient at high temperatures than that with an implanted grid. To realize this concept, the device with implanted grid was optimized using simulations, fabricated and verified through experiments. The BG JBS diode clearly shows that the leakage current is four orders of magnitude lower than that of a pure Schottky diode at an operation temperature of 175 oC and 2 to 3 orders of magnitude lower than that of commercial JBS diodes. Finally, commercialized vertical trench JFETs are evaluated both in simulations andexperiments, while it is important to determine the limits of the existing JFETs and study their performance in parallel operation. Especially, the influence of uncertain parameters of the devices and the circuit configuration on the switching performance are determined through simulations and experiments. / Kiselkarbid (SiC) har en högre genombrottsfältstyrka än kisel, vilket möjliggör tunnare och mer högdopade driftområden jämfört med kisel. Följaktligen kan förlusterna reduceras jämfört med kiselbaserade omvandlarsystem. Dessutom tillåter SiC drift vid temperatures upp till 250 oC. Dessa utsikter gör att SiC anses vara halvledarmaterialet för moderna effekthalvledarkomponenter för hög verkningsgrad, hög temperature och hög kompakthet. Förutom materialegenskaperna är också komponenttypen avgörande för att bestämma systemets prestanda. Jämfört med SiC MOSFETen och bipolärtransistorn i SiC är SiC JFETen en mycket lovande component, eftersom den är spänningsstyrd och saknar tillförlitlighetsproblem med oxidskikt. Dess kanal styrs an en PNövergång. Emellertid är dagens JFETar inte optimerade med hänseende till on-state resistans, styrbarhet av tröskelspänning och Miller-kapacitans. I denna avhandling introduceras state-of-the-art SiC JFETar med buried-grid (BG) teknologi. Denna åstadkommes genom epitaxi och etsningsprocesser. Medelst simulering undersöks nya concept för normally-on och normally-off BG JFETar med blockspänningen 1200 V. Såvä statiska som dynamiska egenskper undersöks. Dessutom görs två fallstudier vad avser totalförluster på systemnivå. Dessa undersökningar kan vara värdefulla för en konstruktör för att till fullo utnyttja fördelarna av komponenterna. Dessutom kan resultaten från undersökningarna användas som komponentmodeller och anvisningar vad gäller switch-egenskaper. BG konceptet som använts för JFETar har också använts för vidareutveckling av så kallade JBS-dioder. Speciellt ger denna konstruktion stora fördelar vid höga temperature genom en effektiv skärmning av Schottkyövergången mot höga elektriska fält. Genom simuleringar har komponentstrukturer med implanterade och epitaxiella grids jämförst med hänseende till tröskelspänning, genombrottspänning och maximalt elektriskt fält vid Schottky-övergången. Resultaten visar att den epitaxiella varianten kan vara mer effektiv än den implanterade vid höga temperaturer. För att realisera detta concept optimerades en komponent med implanterat grid med hjälp av simuleringar. Denna component tillverkades sedan och verifierades genom experiment. BG JBS-dioden visar tydligt att läckströmmen är fyra storleksordningar lägre än för en ren Schottky-diod vid 175 oC, och två till tre storleksordningar lägre än för kommersiella JBS-dioder. Slutligen utvärderas kommersiella vertical trench-JFETar bade genom simuleringar och experiment, eftersom det är viktigt att bestämma gränserna för existerande JFETar och studera parallelkoppling. Speciellt studeras inverkan av obestämda parametrar och kretsens konfigurering på switchegenskaperna. Arbetet utförs bade genom simuleringar och experiment. / <p>QC 20150915</p>

Oxide ultra-thin film surfaces have properties and structures that are significantly different from the terminations of the corresponding bulk crystals. For example, surface structures of epitaxial ultra-thin oxide films are highly influenced by the crystallinity and electronegativity of the metal substrates they grown on. Some enhanced properties of the novel reconstructions are related to catalysis, sensing and microelectronics, which has resulted in an increasing interest in this field. Ultra-thin TiO_x films were grown on Au(111) substrates in this work. Two well-ordered structures within monolayer coverage - honeycomb (HC) and pinwheel - were generated and investigated. Special attention has been paid to the uniform (2 x 2) Ti₂O₃ HC phase including its regular structure and imperfections such as domain boundaries (DBs) and point defects. Linear DBs with long-range repeating units have been observed; density functional theory (DFT) modelling has been used to simulate their atomic structures and calculate their formation energies. Rotational DBs/defects show up less frequently, however a six-fold symmetrical 'snowflake' DB loop stands out. Two types of point defects have been discovered and assigned to Ti vacancies and oxygen vacancies/hydroxyl groups. Their diffusion manners and pairing habits have been discussed within an experimental context. The results of growing NbO_x ultra-thin films on Au(111) are also presented in this thesis. An identical looking (2 x 2) HC structure to the Ti₂O₃ ultra-thin film has been formed; a stoichiometry of Nb2O3 is suggested. Another interesting reconstruction is a hollow triangle structure. Various sizes have been found, and sides of these equilateral triangles all show a double-line feature aligned along the { 1 ₁⁻ } directions of the Au(111) lattice. Chemical composition characterisations of NbO_x thin films are still required as is DFT modelling. Experimental techniques used in this thesis include scanning tunnelling microscopy (STM), low energy electron diffraction (LEED), and X-ray photoelectron spectroscopy (XPS). Ultra-thin oxide films were created by physical vapour deposition (PVD) in ultra-high vacuum (UHV) systems.

Le but de cette thèse est d'étudier l'effet de l’alignement et le contrôle de la morphologie de films minces de polythiophènes et de les corréler avec les propriétés optiques, de transport de charges et thermoélectriques. Puisque les polymères semiconducteurs sont intrinsèquement anisotropes, il est essentiel de les aligner afin de comprendre leur propriétés. Cette étude a été réalisée en employant deux techniques qui ont permises d’obtenir des films minces orientés. Le brossage à haute température et la cristallisation épitaxiale directionnelle (CED) ont conduit à des films de polythiophène hautement orientés avec des paramètres d'ordre allant jusqu'à 0.87 et des taux de crystallinité jusqu'à 65%. La technique de brossage nous a permis de contrôler avec précision les tailles des domaines cristallins dans des films de P3HT brossés. Par cette méthode, nous avons pu également déterminer les températures de fusion à l'équilibre de différents poly(3-alkyl-thiophène). Nous avons appris que la largeur de bande du couplage excitonique W dépend des dimensions des cristaux dans les films minces brossés. Cette étude à aussi montrer l’importance de la planarité des chaînes pontant les domaines cristallins à travers les zones amorphes sur les propriétés de transport de charges. Nous avons également mis en évidence la morphologie particulière du poly (3-butylthiophène) (P3BT) et le rôle des groupements butyles. La méthode de cristallisation epitaxialle a été utilisée pour orienter des films de poly(3-dioctylphenyl-thiophène) (PDOPT). Nous avons examiné l'effet de la masse moléculaire du PDOPT sur le degré de cristallinité et l'alignement. Ceci nous a permis de proposer un modèle structural montrant l’absence de pi-stacking dans ce polythiophène. Finalement, nous proposons une méthode en deux étapes d’élaboration de films minces conducteurs alignés. Le brossage des films puis le dopage des polymères semiconducteurs de type-P a permis d’obtenir des propriétés thermoélectriques anisotropes améliorées.Cette thèse démontre l'importance du contrôle de la morphologie et de l'alignement des polymères semiconducteurs et conducteurs pour comprendre leurs propriétés fortement anisotropes. / The aim of this thesis is to study the effect of alignment and morphological control on polythiophene thin films and to correlate this control with the optical, charge transport and thermoelectric properties. Since semiconducting polymers are inherently anisotropic by nature, studying these polymers in the aligned state was essential to understand their properties. This study could be achieved by employing two techniques that are successful in orienting polymers in thin films. High-temperature rubbing (HTR) along with directional epitaxial crystallization (DEC) produced highly oriented polythiophene thin films with order parameters reaching 0.87 and crystallinities up to 65%. HTR was a successful method to control crystal sizes in rubbed poly(3-hexyl-thiophene) P3HT films. By this method, the equilibrium melting temperatures of other poly(3-alkyl-thiophene) P3ATs were calculated. We learned that the free excitonic bandwidth depends on the crystal dimensions in the rubbed thin films. We also learned that the planarity of tie-chains linking consecutive crystalline domains plays a very important role in field-effect mobility. We also discuss the peculiar morphology of poly(3-butyl-thiophene) (P3BT) and the role of the butyl side groups. Then DEC method was proposed to orient poly(3-dioctylphenyl-thiophene) (PDOPT) thin films. We examined the effect of molecular weight of PDOPT on the level of crystallinity and alignment. Consequently, this relation provided fundamental information that helped us refine the crystal structure of PDOPT. Finally, a versatile method to produce highly aligned conducting polymers was proposed. HTR followed by P-type doping proved to be an excellent way to produce highly aligned conducting thin films with enhanced thermoelectric properties. This thesis brings value to the importance of morphology control and the alignment of semiconducting thin films to understand the various properties of these highly anisotropic systems.

Este trabalho apresenta o estudo da influência do tensionamento mecânico (strain) no efeito de abaixamento de barreira induzido pelo dreno (DIBL) em dispositivos SOI FinFETs de porta tripla com e sem crescimento seletivo epitaxial. Também é analisada a influência do uso de crescimento seletivo epitaxial nesses dispositivos em relação ao efeito de canal curto mencionado. O uso de transistores verticais de múltiplas portas tem permitido a continuidade do escalamento dos dispositivos, apresentando melhora nos níveis de corrente bem como a supressão dos efeitos de canal curto. No entanto, ao reduzir a largura do canal, aumenta-se a resistência total do transistor, diminuindo seu desempenho. A fim de melhorar essa característica, as técnicas de tensionamento mecânico e crescimento de fonte e dreno tem sido empregadas. No primeiro caso, ao se deformar mecanicamente a estrutura do canal, altera-se o arranjo das camadas eletrônicas que ocasiona o aumento da mobilidade dos portadores. Conseqüentemente, a corrente aumenta tal como a transcondutância do dispositivo. A técnica de crescimento de fonte e dreno chamada de crescimento seletivo epitaxial (SEG) tem como finalidade reduzir ainda mais a resistência elétrica total da estrutura, uma vez que a área dessas regiões aumenta, possibilitando o aumento das áreas de contato, que são responsáveis pela maior parcela da resistência total. Esse trabalho baseia-se em resultados experimentais e simulações numéricas tridimensionais que analisam o comportamento dos transistores com as tecnologias acima apresentadas em função do efeito de DIBL. / This work presents a study about the influence of strain in the drain induced barrier lowering effect (DIBL) in triple gate SOI FinFETs. Also it is analyzed the selective epitaxial growth used in that structures, comparing their behavior in relation to DIBL effect. Using the vertical multi-gate devices become possible the downscale whereas they present higher current level and suppressed short channel effects. However, reducing the channel width, the transistors total resistance increases and consequently its performance decreases. In order to improve this feature, the strained technology and the Source/Drains growth technique has been employed. In the first case, the mechanical deformation causes a change in the electron shell, which improves the carrier mobility. Consequently, the current level and the transconductance also improve. The selective epitaxial growth technique aims to reduce the devices total resistance since these regions areas increase, allowing large contacts which are responsible for the main parcel of the total resistance. This work is based on experimental results and tridimensional simulations that analyze the transistor behavior using the technologies above presented as a function of DIBL effect.

Des films minces d’oxydes de cuivre (Cu2O, Cu4O3 et CuO) ont été déposés à température ambiante sur des substrats en verre et en silicium par pulvérisation magnétron réactive. Une attention particulière a été portée à l’influence des conditions de synthèse (débit d’oxygène et pression totale) sur la structure et l’orientation préférentielle des dépôts. La pression totale est le paramètre principal influençant la texture des films de Cu2O et de Cu4O3. En revanche l’orientation préférentielle des films de CuO est contrôlée par le débit d’oxygène. Pour des films de Cu2O et de Cu4O3, un phénomène de croissance épitaxique locale (CEL) a été mis en évidence. Il résulte de l’utilisation d’une première couche qui joue le rôle d’une couche de germination lors du processus de croissance. Ainsi, les films peuvent croître avec une texture donnée indépendamment de leurs conditions de synthèse. Cet effet de CEL a été mis à profit pour élaborer des films biphasés (Cu2O + Cu4O3) qui présentent une microstructure originale. L’augmentation de la transmittance optique et du gap optique de films de Cu2O a été rendue possible par des traitements thermiques dans l’air qui permettent de diminuer la densité de défauts dans les films. Finalement, les propriétés optiques et la structure électronique des oxydes de cuivre qui ont été calculées par la méthode GW sont en accord avec des résultats expérimentaux obtenus par absorption optique, photoémission et spectroscopie de perte d’énergie des électrons. / Copper oxide (Cu2O, Cu4O3 and CuO) thin films have been deposited on unmatched substrates by sputtering at room temperature. The influence of oxygen flow rate and total pressure on the film structure and preferred orientation has been studied. The total pressure is a relevant parameter to control the texture of Cu2O and Cu4O3 films, while the oxygen flow rate is effective to tune the preferred orientation of CuO films. Local epitaxial growth, where epitaxial relationship exists in columns of sputtered films, has been observed in Cu2O and Cu4O3 films by using a seed layer. The seed layer will govern the growth orientation of top layer via the local epitaxy, independently of the deposition conditions of top layer. Unusual microstructure that both phases have the vertically aligned columnar growth has been evidenced in biphase Cu2O and Cu4O3, which may relate to the local epitaxial growth of Cu2O. The lower resistivity than that in single phase films has been observed in this biphase film. Annealing in air can increase the transmittance of Cu2O films in visible region by the reduction of the impurity scattering, while the optical band gap is enlarged due to the partial removal of defect band tail. The optical properties and electronic structure of copper oxides calculated by GW approach with an empirical on-site potential for Cu d orbital, are in good accordance with experimental results from optical absorption, photoemission and electron energy loss spectroscopies

Graphene nanoribbons (GNRs) are considered as major building blocks of future carbon-based electronics, in which the termination of the edges essentially defines the electronic properties. Theoretical predictions, such as tunable band gaps in armchair orientated GNRs, and the existence of topologically protected metallic states located at zigzag edges, make them a potential candidate for transistor applications as well as a new class of fully coherent devices. In this context, the fabrication of high-quality GNRs with precise edge geometries is of great interest. Atomistic details and the interaction with its support crucially influence and determine the charge propagation within such graphene nanostructures. Hence, the understanding of transport mechanisms on the nanoscale is indispensable in order to integrate GNRs in future nanoelectronics. This thesis presents a detailed study of the sublimation-assisted growth of different types of self-assembled GNRs on SiC crystals using scanning probe, electron microscopy, and electron diffraction experiments. First, natural SiC steps will be shown to trigger the formation of µm-long epitaxial monolayer GNRs (ML-GNRs), which laterally expand on the flat SiC(0001) surface. These ribbons can be transformed into bilayer GNRs (BL-GNRs) by annealing in air. During this process, oxygen-intercalation takes place, forming an oxide layer below the BL-GNRs. Charge transfer into the oxide layer results in strong p-type doping. Based on local multi-probe experiments, ML-GNRs and BL-GNRs revealed 1D diffusive transport characteristics inherent in the comparably high charge carrier densities in both types of ribbon. Moreover, temperature activated interlayer hopping was identified as an effective transport mechanism in BL-GNRs. Graphene nanoribbons grown on pre-processed SiC sidewalls exhibited superior crystalline and electronic quality on wafer-scales. Sidewalls aligned parallel to the [11-20] SiC direction are composed of a periodic array of mini-terraces hosting several approximately (3+-1) nm wide armchair terminated GNRs (ac-GNRs) at their step edges. By using a combined nanoprobe and conductive atomic force microscopy study, ac-GNRs revealed semi-conducting transport characteristics with band gaps of ~300 meV. Such debunching effects can be suppressed in sidewalls along the [1-100] SiC direction. Here, the graphene completely overgrows the sidewall resulting in ~40 nm wide freestanding zigzag GNRs (zz-GNRs). A robust ballistic edge channel was found to be the hallmark of zz-GNRs, which persists on µm-scales at room temperature suggesting the existence of a perfectly conducting channel. However, the roughness of the SiC and the mesa sidewalls limit the charge propagation in this edge mode due to strong short-range interactions. Moreover, ballistic transport was independently proven by utilizing non-invasive and invasive voltage probes. Tuning of the invasiveness was achieved using cleaning procedures of the tips, which lead to a subsequent decrease of contact resistance due to the removal of oxide from the tip surface. The measured resistance of the ballistic conductor was shown to be directly dependent on the invasiveness of the tips, pointing out the importance of the interplay between the probes and the GNR. Finally, spatially-resolved nanoprobe experiments with ultra-small probe spacings revealed several quantized conduction plateaus across zz-GNRs. These plateaus were attributed to edge and bulk transport channels, respectively. Based on tight-binding calculations, the occurrence of spatially-segregated ballistic channels was explained by transversal electric fields originating from asymmetric edge terminations on both sides of the GNR. These findings highlight that edge morphology is an essential parameter in order to understand electronic transport in GNRs. / Nanometerbreite Streifen aus Graphen, sogenannte Graphen-Nanoribbons (GNRs), gelten als wichtiges Bauelement in zukünftigen, kohlenstoffbasierten Elektroniken. Dabei sind die elektronischen Eigenschaften der GNRs wesentlich durch die Geometrie ihrer Kanten bestimmt. Basierend auf theoretischen Modellen, werden skalierbare Bandlücken in armchair-GNRs, sowie lokalisierte, metallische Kantenzustände in zigzag-GNRs vorhergesagt. Diese Eigenschaften könnten für Transistoranwendugen oder sogar für die Realisierung von Bauelementen, die auf kohärentem Ladungstransport basieren, genutzt werden. Dementsprechend ist die Herstellung hochwertiger GNRs mit präzisen Kantengeometrien sowie das Verständnis der zugrundeliegenden Transportmechanismen von großem Interesse. Die vorliegende Arbeit umfasst eine detaillierte Charakterisierung der strukturellen Eigenschaften verschiedener GNR-Typen, die mittels Sublimationsepitaxie auf SiC Kristallen hergestellt wurden. Es wird gezeigt, dass sich μm-lange Monolagen-GNRs (ML-GNRs) an natürlichen SiC Stufenkanten ausbilden, die durch Tempern an Luft zu Bilagen-GNRs (BL-GNRs) transformiert werden können. Während des Temperns findet die Interkalation von Sauerstoff statt, sodass sich unterhalb des BL-GNRs eine Oxidschicht bildet. Der Ladungstransfer in diese Oxidschicht führt zu einer starken p-Dotierung. Lokale Transportmessungen mittels eines 4-Spitzen STM/SEM zeigen, dass sowohl ML-GNRs als auch BL-GNRs 1D diffuse Leiter sind, deren Transporteigenschaften durch die hohen Ladungsträgerdichten dominiert werden. Darüber hinaus wird gezeigt, dass das thermisch aktivierte Tunneln zwischen Graphenlagen ein effektiver Transportmechanismus in BL-GNRs ist. Graphen-Nanoribbons, die durch präferenzielles Wachstum auf SiC-Seitenwänden hergestellt wurden, zeichnen sich durch herausragende strukturelle sowie elektronische Eigenschaften aus. Seitenwände parallel zur [11-20] Richtung wiesen hierbei eine periodische Struktur von Mini-Terrassen auf, an deren Stufen sich mehrere (3 ± 1) nm breite armchair-GNRs (ac-GNRs) ausbilden. Durch die Kombination von 4-Spitzen STM/SEM und Rasterkraftmikroskopie mit leitfähigen Spitzen wurde festgestellt, dass ac-GNRs halbleitende Eigenschaften aufweisen. Die Größe der ermittelten Bandlücken beträgt ∼ 300 meV. Das Zerfallen in Mini-Terrassen kann bei Seitenwänden entlang der [1-100] SiC Richtung unterdrückt werden. Hierbei wird die Seitenwand vollständig vom Graphen überwachsen, sodass sich ∼ 40 nm breite zigzag-GNRs (zz-GNRs) ausbilden. Diese zeichnen sich durch einen robusten, ballistischen (Kanten-) Transportkanal aus, der bei Raumtemperatur auf μm-Skalen nachweißbar ist. Lediglich Rauigkeiten des Substrats sowie der Seitenwände, die als starke Streuzentren dienen, limitieren die Ausbreitung der Ladungsträger in diesem Kantenzustand. Der ballistische Transport von Ladungsträgern in zz-GNRs wurde unabhängig, mit Hilfe von nicht-invasiven und invasiven Spannungskontakten (STM-Spitzen) nachgewiesen. Die Invasivität der Kontakte wurde durch spezielle Reinigungsverfahren der Spitzen verändert, die zu geringeren Kontaktwiderständen führten. Hierbei wird gezeigt, dass der gemessene Widerstand des ballistischen Leiters direkt von der Invasivität der Spitzen abhängt. Dies deutet darauf hin, dass die Interaktion zwischen Messspitze und GNR bezüglich der Transporteigenschaften von großer Bedeutung ist. Abschließend werden mittels ortsaufgelöster Transportmessungen mit ultrakleinen Spitzenabständen mehrere, quantisierte Leitungskanäle detektiert, die sich räumlich über die Breite der zz-GNRs verteilen. Diese Kanäle können jeweils Kanten- und Volumen-Zuständen zugeordnet werden. Gestützt durch tight-binding-Berechnungen werden die quantisierten Transportkanäle durch transversale elektrische Felder erklärt, die durch asymmetrische Bindungsverhältnisse der Kanten erzeugt werden. Diese Ergebnisse unterstreichen, dass die Kantenmorphologie ein wesentlicher Parameter ist, um den elektronischen Transport in GNRs zu verstehen.

No description available.

In this thesis, the effect of surfactants (Bi /Sb) on GaAs(111) is explored, particularly in regards to modifying the surface morphology and growth kinetics. Both molecular beam epitaxy (MBE) and metal-organic chemical vapour deposition (MOCVD) techniques are discussed in this context. InAs/GaAs(111) quantum dots (QDs) have been promoted as leading candidates for efficient entangled photon sources, owing to their high degree of symmetry (c_3v). Unfortunately, GaAs(111) suffers from a defect-ridden homoepitaxial buffer layer, and the InAs/GaAs(111) material system does not natively support Stranski{Krastanov InAs QD growth. Surfactants have been identified as effective tools to alter grown surface morphologies and growth modes, potentially overcoming these obstacles, but have yet to be studied in detail in this context. For MBE, it is shown that Bi acts as a surfactant when employed in GaAs(111) homoepitaxy, and eliminates defects/hillocks, yielding atomically-smooth surfaces with step-flow growth, and RMS roughness values of 0.13 nm. The effect is more pronounced as the Bi flux increases, and Bi is suggested to be increasing adatom diffusion. A novel reflection high energy electron diffraction (RHEED)-based experiment was also designed and performed to measure the desorption activation energy (U_Des) of Bi on GaAs(111), yielding U_Des = 1.74 ± 0.38 eV. GaAs(111) homoepitaxy was also investigated using MOCVD, with GaAs(111)B exhibiting RMS roughness values of 0.09 nm. Sb is shown to provoke a morphological transition from plastically-relaxed 2D to 3D growth for InAs/GaAs(111)B, showing promise in its ability to induce QDs. Finally, simulations for GaAs-based quantum well (QW) photoluminescence were conducted, and such QWs are shown to potentially produce very sharp linewidths of 3.9 meV. These results enhance understanding of Bi surfactant behaviour on GaAs(111) and can open up its use in many technological applications, paving the way for the realization of high efficiency/viable QD entangled photon sources. / Thesis / Master of Applied Science (MASc)