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Heat sinks are used mainly to take away the excessive heat which are produced in a component. This transfer of heat enables a smooth operation of the system with the heat generating component. The efficiency of heat sink is often dependent on the amount of heat it can take away within the smallest duration of time. Several designs and manufacturing techniques have been developed to improve this performance of heat sinks. This project aims at building a test rig which can be used to test the efficiency of heat sinks. The test rig should be designed to be modular, i.e. it should be able to test heat sinks of different sizes and also adhering to the design requirements. The project started with a broad information search on heat sinks and different testing methods. A system architecture was formulated for this test rig as a beginning stage and to find the different architectural components. The main principal components were selected fulfilling the design requirements. A chiller with pump, a flow meter with controller, temperature and pressure sensors and piping’s including a flexible pipe were the main components of the system created. When the specific components were chosen, the design was embodied and the components were arranged in a compact manner as a SolidEdge CAD-model. After several design iterations, a final design was selected. The experimental test rig was then built in the flow lab. The built experimental test setup is able to be adjusted to install heat sinks of different sizes making it modular in design. Future work to improve the performance of the test rig is also suggested. / Värmesänkor, som exempelvis kylflänsar, används främst för att transportera bort värme som orsakas av förluster i en komponent. Denna värmeöverföring möjliggör en smidig drift av systemet där den värmegenererande komponenten ingår. Värmesänkans effektivitet beror på hur mycket värmeeffekt den kan transportera bort. Flera olika konstruktioner och tillverkningstekniker har utvecklats för att förbättra värmesänkors kylprestanda. Målet med detta projekt är att bygga en testrigg som kan användas för att testa kylflänsars effektivitet. Testriggen ska utformas så att den är modulär, dvs. den ska kunna användas för att testa kylflänsar av olika storlekar. Projektet startade med en bred informationssökning om kylflänsar och olika testmetoder. En systemarkitektur skapades som ett början och för att hitta systemets olika principkomponenter. De viktigaste huvudkomponenterna som uppfyllde designkraven valdes sedan. En kylare med pump, en flödesmätare med regulator, temperatur- och tryckgivare och rörledningar, inklusive ett flexibelt rör var de viktigaste komponenterna i det system som skapades. De specifika komponenterna valdes sedan och de representerades och arrangerades på ett kompakt sätt som en system-CAD-modell i SolidEdge. Efter flera iterationer valdes en slutlig konstruktion, och den experimentella testriggen byggdes sedan i flödeslaboratoriet. Den experimentella testriggen kan justeras för att installera kylflänsar av olika storlekar, vilket innebär att den, i viss mån, är modulär. Framtida arbeten för att förbättra testriggens prestanda föreslås också.

[ES] En esta tesis se plasma un ejemplo paradigmático de Matemática Industrial: se define un problema real de enorme interés actual, se presenta un modelo matemático del mismo, se resuelve numéricamente mediante métodos de elementos Finitos, se realiza diferentes prototipos y se verifican experimentalmente las predicciones teóricas; además, en este caso particular, los prototipos aquí analizados se llevaron al mercado, cerrando un ciclo que se inicia con el modelado matemático y se termina con la transferencia a la sociedad de una solución competitiva a un problema real. El problema que se aborda en esta tesis se enmarca en el desarrollo de soluciones de iluminación basadas en tecnología de diodos emisores de luz (LED, por su abreviación en inglés) de alta potencia. De hecho, el problema que se afronta es el desarrollo de disipadores pasivos de calor que garanticen la correcta evacuación del calor producido en el dispositivo LED y aseguren su adecuado funcionamiento. Para ello, se modela el problema de transferencia de calor (incluyendo conducción, radiación y convección) en diferentes prototipos, se resuelve con técnicas de Elementos Finitos y se optimizan los diseños propuestos, garantizando siempre que la temperatura de operación del chip LED sea correcta. Una vez realizado este análisis teórico, se construyen los prototipos y se verifican experimentalmente las predicciones realizadas. Por último, en los anexos se recoge una serie de aportaciones complementarias: una sobre el gas de van der Waals y la Geometría de Contacto y otras dos sobre la convergencia de métodos iterativos. / [CA] En aquesta tesi es plasma un exemple paradigmàtic de Matemàtica Industrial: es defineix un problema real d'enorme interès actual, es presenta un model matemàtic del mateix, es resol numèricament mitjançant mètodes d'Elements Finits, es realitza diferents prototips i es verifiquen experimentalment les prediccions teòriques; a més, en aquest cas particular, els prototips aquí analitzats es van dur a mercat, tancant un cicle que s'inicia amb el modelatge matemàtic i s'acaba amb la transferència a la societat d'una solució competitiva a un problema real. El problema que s'aborda en aquesta tesi s'emmarca en el desenvolupament de solucions d'il·luminació basades en tecnologia LED d'alta potència. De fet, el problema que s'afronta és el desenvolupament de dissipadors passius de calor que garanteixin la correcta evacuació de la calor produïda da en el dispositiu LED i assegurin la seva adequat funcionament. Per a això, es modela el problema de transferència de calor (incloent conducció, radiació i convecció) en diferents prototips, es resol amb tècniques d'Elements Finits i s'optimitzen els dissenys proposats, garantint sempre que la temperatura d'operació de l'xip LED sigui correcta. Un cop realitzat aquest anàlisi teòrica, es construeixen els prototips i es verifiquen experimentalment les prediccions realitzades. Finalment, en els annexos es recull una sèrie d'aportacions complementàries: una sobre el gas de van der Waals i la Geometria de Contacte i dues sobre la convergència de mètodes iteratius. / [EN] In this thesis, a paradigmatic example of Industrial Mathematics is captured: a real problem of enormous current interest is defined, a mathematical model of it is presented, it is solved numerically using Finite Element methods, different prototypes are made and the theoretical predictions are experimentally verified; Furthermore, in this particular case, the prototypes analyzed here were brought to the market, closing a cycle that begins with mathematical modeling and ends with the transfer to society of a competitive solution to a real problem. The problem addressed in this thesis is part of the development of lighting solutions based on high-power LED technology. In fact, the problem being faced is the development of passive heat sinks that guarantee the correct evacuation of the heat produced in the LED device and ensure its proper operation. For this, the heat transfer problem (including conduction, radiation and convection) is modeled in different prototypes, it is solved with Finite Element techniques and the proposed designs are optimized, always guaranteeing that the operating temperature of the LED chip is correct. Once this theoretical analysis has been carried out, the prototypes are built and the predictions made are experimentally verified. Finally, the annexes contain a series of complementary contributions: one on van der Waals gas and Contact Geometry and two others on the convergence of iterative methods. / A la Secretarıa de Educación Superior, Ciencia,Tecnología e Innovación (SENESCYT) por el apoyo económico para poder realizar mis estudios en el extranjero con el fin de fortalecer el talento humano en el Ecuador. / Alarcón Correa, DF. (2020). Modelado matemático y simulación numérica de disipadores de calor para luminarias LED. Aplicaciones a alumbrado público [Tesis doctoral]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/155989

No description available.

This thesis deals with the problem of waste heat, namely, the exhaust gas which are not frequently used. Specifically, it is a design of thermoelectric generators set, power electronics for fan and heat exchanger proposal. The entire system uses the energy of the waste heat to increase the heating efficiency.

[pt] Diante dos constantes avanços da tecnologia os dispositivos eletrônicos vêm passando por um processo de miniaturização, ao mesmo tempo em que sustentam um aumento de potência. Essa tendência se mostra um desafio para seu gerenciamento térmico, uma vez que os sistemas de resfriamento típicos para eletrônicos utilizam ar como fluido de trabalho, e o seu baixo coeficiente de transferência de calor limita sua capacidade de atender às necessidades térmicas da indústria atual. Nesse sentido, o resfriamento bifásico tem sido considerado uma solução promissora para fornecer resfriamento adequado para dispositivos eletrônicos. Circuitos de termossifão bifásico combinam a tecnologia de resfriamento bifásico com sua inerente natureza passiva, já que o sistema não requer uma bomba para fornecer circulação para seu fluido de trabalho, graças às forças da gravidade e de empuxo. Um dissipador de calor de microcanais, localizado bem em cima do dispositivo eletrônico, dissipa o calor gerado. Isto o torna uma solução de baixo custo e energia. Além disso, ter um circuito de termossifão operando com um refrigerante de baixo GWP, como o R-1234yf, resulta em baixo impacto para o meio ambiente, uma vez que é um refrigerante ecologicamente correto e o sistema tem baixo ou nenhum consumo de energia. Este trabalho fornece um modelo numérico detalhado para a simulação de um circuito de termossifão bifásico, operando em condições de regime permanente. O circuito compreende um evaporador (chip e dissipador de calor de micro-aletas), um riser, um condensador refrigerado a água de tubo duplo e um downcomer. Equações fundamentais e constitutivas foram estabelecidas para cada componente. Um método numérico de diferenças finitas, 1-D para o escoamento do fluido por todos os componentes do sistema, e 2-D para a condução de calor no chip e evaporador foi empregado. O modelo foi validado com dados experimentais para o refrigerante R134a, mostrando uma discrepância em relação ao fluxo de massa em torno de 6 por cento, para quando o sistema operava sob regime dominado pela gravidade. A pressão de entrada do evaporador prevista apresentou um erro relativo máximo de 4,8 por cento quando comparada aos resultados experimentais. Além disso, a maior discrepância da temperatura do chip foi inferior a 1 grau C. Simulações foram realizadas para apresentar uma comparação de desempenho entre o R134a e seu substituto ecologicamente correto, R1234yf. Os resultados mostraram que quando o sistema operava com R134a, ele trabalhava com uma pressão de entrada no evaporador mais alta, assim como, com um fluxo de massa mais alto. Por causa disso, o R134a foi capaz de manter a temperatura do chip mais baixa do que o R1234yf. No entanto, essa diferença na temperatura do chip foi levemente inferior a 1 grau C, mostrando o R1234yf como comparável em desempenho ao R134a. Além disso, o fator de segurança da operação do sistema foi avaliado para ambos os refrigerantes, e para um fluxo de calor máximo do chip de 33,1 W/cm2, R1234yf mostrou um fator de segurança acima de 3. Isso significa que o circuito de termossifão pode operar com segurança abaixo do ponto crítico de fluxo de calor. Dada a investigação sobre a comparação de desempenho dos refrigerantes R134a e R1234yf, os resultados apontaram o R1234yf como um excelente substituto ecologicamente correto para o R134a, para operação em um circuito de termossifão bifásico. / [en] Given the constant advances in technology, electronic devices have been going through a process of miniaturization while sustaining an increase in power. This trend proves to be a challenge for thermal management since commonly electronic cooling systems are air-based, so that the low heat transfer coefficient of air limits its capacity to keep up with the thermal needs of today s industry. In this respect, two-phase cooling has been regarded as a promising solution to provide adequate cooling for electronic devices. Two-phase thermosyphon loops combine the technology of two-phase cooling with its inherent passive nature, as the system does not require a pump to provide circulation for its working fluid, thanks to gravity and buoyancy forces. A micro-channel heat sink located right on top of the electronic device dissipates the heat generated. This makes for an energy and cost-efficient solution. Moreover, having a thermosyphon loop operating with a low GWP refrigerant such as R-1234yf results in low impact for the environment since it is an environmentally friendly refrigerant, and the system has low to none energy consumption. This work provides a detailed numerical model for the simulation of a two-phase thermosyphon loop operating under steady-state conditions. The loop comprises an evaporator (chip and micro-fin heat sink), a riser, a tube-in-tube water-cooled condenser and a downcomer. Fundamental and constitutive equations were established for each component. A finite-difference method, 1-D for the flow throughout the thermoysphon s components and 2-D for the heat conduction in the evaporator and chip, was employed. The model was validated against experimental data for refrigerant R134a, showing a mass flux discrepancy of around 6 percent for when the system operated under gravity dominant regime. The predicted evaporator inlet pressure showed a maximum relative error of 4.8 percent when compared to the experimental results. Also, the chip temperature s largest discrepancy was lower than 1 C degree. Simulations were performed to present a performance comparison between R134a and its environmentally friendly substitute, R1234yf. Results showed that when the system operated with R134a, it yielded a higher evaporator inlet pressure as well as a higher mass flux. Because of that, R134a was able to keep the chip temperature lower than R1234yf. Yet, that difference in chip temperature was slightly lower than 1 C degree, showing R1234yf as comparable in performance to R134a. In addition, the safety factor of the system s operation was evaluated for both refrigerants, and for a maximum chip heat flux of 33.1 W/cm2, R1234yf showed a safety factor above 3. This means the thermosyphon loop can operate safely under the critical heat flux. Given the investigation on the performance comparison of refrigerants R134a and R1234yf, results pointed to R1234yf being a great environmentally friendly substitute for R134a for the two-phase thermosyphon loop.

This thesis presents work on a holistic approach for improving the overall design of solar cooling systems driven by solar thermal collectors. Newly developed methods for thermodynamic optimization of hydraulics and control were used to redesign an existing pilot plant. Measurements taken from the newly developed system show an 81% increase of the Solar Cooling Efficiency (SCEth) factor compared to the original pilot system. In addition to the improvements in system design, new efficiency factors for benchmarking solar cooling systems are presented. The Solar Supply Efficiency (SSEth) factor provides a means of quantifying the quality of solar thermal charging systems relative to the usable heat to drive the sorption process. The product of the SSEth with the already established COPth of the chiller, leads to the SCEth factor which, for the first time, provides a clear and concise benchmarking method for the overall design of solar cooling systems. Furthermore, the definition of a coefficient of performance, including irreversibilities from energy conversion (COPcon), enables a direct comparison of compression and sorption chiller technology. This new performance metric is applicable to all low-temperature heat-supply machines for direct comparison of different types or technologies. The achieved findings of this work led to an optimized generic design for solar cooling systems, which was successfully transferred to the market.

<p dir="ltr">The short lifespan of capacitors in power electronics converters is a significant challenge. These capacitors, often electrolytic, are vital for voltage smoothing and frequency filtering. However, their susceptibility to heat, ripple current, and aging can lead to premature faults. This can cause issues like output voltage instability and short circuits, ultimately resulting in catastrophic failure and system shutdown. Capacitors are responsible for 30% of power electronics failures.</p><p dir="ltr">To tackle this challenge, scientists, researchers, and engineers are exploring various approaches detailed in technical literature. These include exploring alternative capacitor technologies, implementing active and passive cooling solutions, and developing advanced monitoring techniques to predict and prevent failures. However, these solutions often come with drawbacks such as increased complexity, reduced efficiency, or higher upfront costs. Additionally, research in material science is ongoing to develop corrosion-resistant capacitors, but such devices are not readily available.</p><p dir="ltr">This dissertation presents a capacitorless solution for dc-dc and dc-ac converters. The proposed solution involves harnessing parasitic elements and integrating them as intrinsic components in power converter technology. This approach holds the promise of enhancing power electronics reliability ratings, thereby facilitating breakthroughs in electric vehicles, compact power processing units, and renewable energy systems. The central scientific premise of this proposal is that the capacitance requirement in a power converter can be met by deliberately augmenting parasitic components.</p><p dir="ltr">Our research hypothesis that incorporating high dielectric material-based thin-films, fabricated using nanotechnology, into planar magnetics will enable the development of a family of capacitorless electronic converters that do not rely on discrete capacitors. This innovative approach represents a departure from the traditional power converter schemes employed in industry.</p><p dir="ltr">The first family of converters introduces a novel capacitorless solid-state power filter (SSPF) for single-phase dc-ac converters. The proposed configuration, comprising a planar transformer and an H-bridge converter operating at high frequency, generates sinusoidal ac voltage without relying on capacitors. Another innovative dc-ac inverter design is the twelve step six-level inverter, which does not incorporate capacitors in its structure.</p><p dir="ltr">The second family of capacitorless topologies consists of non-isolated dc-dc converters, namely the buck converter and the buck-boost converter. These converters utilize alternative materials with high dielectric constants, such as calcium copper titanate (CCTO), to intentionally enhance specific parasitic components, notably inter capacitance. This innovative approach reduces reliance on external discrete capacitors and facilitates the development of highly reliable converters.</p><p dir="ltr">The study also includes detailed discussions on the necessary design specifications for these parasitic capacitors. Furthermore, comprehensive finite element analysis solutions and detailed circuit models are provided. A design example is presented to demonstrate the practical application of the proposed concept in electric vehicle (EV) low voltage side dc-dc power converters used to supply EVs low voltage loads.</p>