Inductors are extensively used in the design of radio-frequency circuits. In the last decade, the integration of passive components, especially inductors on silicon chips, has led to the widespread development and implementation of Radio Frequency Integrated Circuits (RFICs) in CMOS technologies. However, on-chip passive inductors occupy a large silicon chip area and hardly scale down with technology scaling. Therefore, on-chip passive inductors become formidable obstacles to the realization of highly dense RFICs to be integrated with other highly dense digital circuits on a single chip using a common fabrication process. In recent years, researchers have focused on replacing passive inductors with transistor-only active circuits, namely active inductors. Active inductors can be realized with only a few transistors, which scale down with technology scaling. Therefore, they occupy a fraction of the chip area of their passive counterparts, and can be implemented densely in CMOS processes. Unlike passive inductors, bias dependent operations of active inductors allow for the tuning of their inductance and quality factor Q, and in turn, tuning the performance parameters of RFICs. This thesis focuses on the design and development of passive inductorless CMOS RFICs for ultra-wideband (UWB) receiver front-ends using active inductors. A new Q-enhanced and a new bandwidth-extended tunable active inductors are designed. Using the Q-enhanced active inductor, two tunable UWB low-noise amplifiers (LNAs) (two-stage and three-stage UWB LNAs), a UWB mixer and a wideband local-oscillator (LO) driver are designed. Active inductors are utilized to develop a novel wideband active shunt-peaking technique that decreases high-frequency losses to yield a flat gain over a wide bandwidth. A tunable multiband-UWB front-end integrating a two-stage UWB LNA, and a pair of UWB mixers driven by a pair of wideband LO drivers, is fabricated in a 90nm digital CMOS process. The passive inductorless two-stage UWB LNA, three-stage UWB LNA and UWB front-end occupy chip areas of only 0.0114mm2, 0.0227mm2, and 0.1485mm2, respectively. The active CMOS UWB front-end exhibits a measured flat gain of 22.5dB over 2.5-8.8 GHz bandwidth, and its tunability allows for varying the gain and bandwidth. / Integrated Circuits and Systems

No description available.

<p>QC 20140609</p>

Over the last decade, electronics operating at high temperatures have been increasingly demanded to support in situ sensing applications such as automotive, deep-well drilling and aerospace. However, few of these applications have requirements above 460 °C, as the surface temperature of Venus, which is a specific target for the seismic sensing application in this thesis. Due to its wide bandgap, Silicon Carbide (SiC) is a promising candidate to implement integrated circuits (ICs) operating in such extreme environments. In this thesis, various analog and mixed-signal ICs in 4H-SiC bipolar technology for high-temperature sensing applications are explored, in which the device performance variation over temperatures are considered. For this purpose, device modeling, circuit design, layout design, and device/circuit characterization are involved. In this thesis, the circuits are fabricated in two batches using similar technologies. In Batch 1, the first SiC sigma-delta modulator is demonstrated to operate up to 500 °C with a 30 dB peak SNDR. Its building blocks including a fully-differential amplifier, an integrator and a comparator are characterized individually to investigate the modulator performance variation over temperatures. In the succeeding Batch 2, a SiC electromechanical sigma-delta modulator is designed with a chosen Si capacitive sensor for seismic sensing on Venus. Its building blocks including a charge amplifier, a multiplier and an oscillator are designed. Compared to Batch 1, a smaller transistor and two metal-interconnects are used to implement higher integration ICs in Batch 2. Moreover, the first VBIC-based compact model featured with continuous-temperature scalability from 27 to 500 °C is developed based on the SiC transistor in Batch 1, in order to optimize the design of circuits in Batch 2. The demonstrated performance of ICs in Batch 1 show the feasibility to further develop the SiC readout ICs for seismic sensor system operating on Venus. / <p>QC 20170911</p>

The research conducted in this dissertation studies the issues regarding the improvement of phase noise performance in a BiCMOS Silicon Germanium (SiGe) cross-coupled differential-pair voltage controlled oscillator (VCO) in a narrowband application as a result of a tail-current shaping technique. With this technique, low-frequency noise components are reduced by increasing the signal amplitude without consuming additional power, and its effect on overall phase noise performance is evaluated. The research investigates effects of the tail-current as a main contributor to phase noise, and also other effects that may influence the phase noise performance like inductor geometry and placement, transistor sizing, and the gain of the oscillator. The hypothesis is verified through design in a standard 0.35 μm BiCMOS process supplied by Austriamicrosystems (AMS). Several VCOs are fabricated on-chip to serve for a comparison and verify that the employment of tail-current shaping does improve phase noise performance. The results are then compared with mathematical models and simulated results, to confirm the hypothesis. Simulation results provided a 3.3 dBc/Hz improvement from -105.3 dBc/Hz to -108.6 dBc/Hz at a 1 MHz offset frequency from the 5 GHz carrier when employing tail-current shaping. The relatively small increase in VCO phase noise performance translates in higher modulation accuracy when used in a transceiver, therefore this increase can be regarded as significant. Parametric analysis provided an additional 1.8 dBc/Hz performance enhancement in phase noise that can be investigated in future works. The power consumption of the simulated VCO is around 6 mW and 4.1 mW for the measured prototype. The circuitry occupies 2.1 mm2 of die area. Copyright / Dissertation (MEng)--University of Pretoria, 2010. / Electrical, Electronic and Computer Engineering / unrestricted

Les systèmes multiprocesseurs sur puce électronique (On-Chip Multiprocessor [OCM]) sont considérés comme les meilleures structures pour occuper l'espace disponible sur les circuits intégrés actuels. Dans nos travaux, nous nous intéressons à un modèle architectural, appelé architecture isométrique de systèmes multiprocesseurs sur puce, qui permet d'évaluer, de prédire et d'optimiser les systèmes OCM en misant sur une organisation efficace des nœuds (processeurs et mémoires), et à des méthodologies qui permettent d'utiliser efficacement ces architectures. Dans la première partie de la thèse, nous nous intéressons à la topologie du modèle et nous proposons une architecture qui permet d'utiliser efficacement et massivement les mémoires sur la puce. Les processeurs et les mémoires sont organisés selon une approche isométrique qui consiste à rapprocher les données des processus plutôt que d'optimiser les transferts entre les processeurs et les mémoires disposés de manière conventionnelle. L'architecture est un modèle maillé en trois dimensions. La disposition des unités sur ce modèle est inspirée de la structure cristalline du chlorure de sodium (NaCl), où chaque processeur peut accéder à six mémoires à la fois et où chaque mémoire peut communiquer avec autant de processeurs à la fois. Dans la deuxième partie de notre travail, nous nous intéressons à une méthodologie de décomposition où le nombre de nœuds du modèle est idéal et peut être déterminé à partir d'une spécification matricielle de l'application qui est traitée par le modèle proposé. Sachant que la performance d'un modèle dépend de la quantité de flot de données échangées entre ses unités, en l'occurrence leur nombre, et notre but étant de garantir une bonne performance de calcul en fonction de l'application traitée, nous proposons de trouver le nombre idéal de processeurs et de mémoires du système à construire. Aussi, considérons-nous la décomposition de la spécification du modèle à construire ou de l'application à traiter en fonction de l'équilibre de charge des unités. Nous proposons ainsi une approche de décomposition sur trois points : la transformation de la spécification ou de l'application en une matrice d'incidence dont les éléments sont les flots de données entre les processus et les données, une nouvelle méthodologie basée sur le problème de la formation des cellules (Cell Formation Problem [CFP]), et un équilibre de charge de processus dans les processeurs et de données dans les mémoires. Dans la troisième partie, toujours dans le souci de concevoir un système efficace et performant, nous nous intéressons à l'affectation des processeurs et des mémoires par une méthodologie en deux étapes. Dans un premier temps, nous affectons des unités aux nœuds du système, considéré ici comme un graphe non orienté, et dans un deuxième temps, nous affectons des valeurs aux arcs de ce graphe. Pour l'affectation, nous proposons une modélisation des applications décomposées en utilisant une approche matricielle et l'utilisation du problème d'affectation quadratique (Quadratic Assignment Problem [QAP]). Pour l'affectation de valeurs aux arcs, nous proposons une approche de perturbation graduelle, afin de chercher la meilleure combinaison du coût de l'affectation, ceci en respectant certains paramètres comme la température, la dissipation de chaleur, la consommation d'énergie et la surface occupée par la puce. Le but ultime de ce travail est de proposer aux architectes de systèmes multiprocesseurs sur puce une méthodologie non traditionnelle et un outil systématique et efficace d'aide à la conception dès la phase de la spécification fonctionnelle du système. / On-Chip Multiprocessor (OCM) systems are considered to be the best structures to occupy the abundant space available on today integrated circuits (IC). In our thesis, we are interested on an architectural model, called Isometric on-Chip Multiprocessor Architecture (ICMA), that optimizes the OCM systems by focusing on an effective organization of cores (processors and memories) and on methodologies that optimize the use of these architectures. In the first part of this work, we study the topology of ICMA and propose an architecture that enables efficient and massive use of on-chip memories. ICMA organizes processors and memories in an isometric structure with the objective to get processed data close to the processors that use them rather than to optimize transfers between processors and memories, arranged in a conventional manner. ICMA is a mesh model in three dimensions. The organization of our architecture is inspired by the crystal structure of sodium chloride (NaCl), where each processor can access six different memories and where each memory can communicate with six processors at once. In the second part of our work, we focus on a methodology of decomposition. This methodology is used to find the optimal number of nodes for a given application or specification. The approach we use is to transform an application or a specification into an incidence matrix, where the entries of this matrix are the interactions between processors and memories as entries. In other words, knowing that the performance of a model depends on the intensity of the data flow exchanged between its units, namely their number, we aim to guarantee a good computing performance by finding the optimal number of processors and memories that are suitable for the application computation. We also consider the load balancing of the units of ICMA during the specification phase of the design. Our proposed decomposition is on three points: the transformation of the specification or application into an incidence matrix, a new methodology based on the Cell Formation Problem (CFP), and load balancing processes in the processors and data in memories. In the third part, we focus on the allocation of processor and memory by a two-step methodology. Initially, we allocate units to the nodes of the system structure, considered here as an undirected graph, and subsequently we assign values to the arcs of this graph. For the assignment, we propose modeling of the decomposed application using a matrix approach and the Quadratic Assignment Problem (QAP). For the assignment of the values to the arcs, we propose an approach of gradual changes of these values in order to seek the best combination of cost allocation, this under certain metric constraints such as temperature, heat dissipation, power consumption and surface occupied by the chip. The ultimate goal of this work is to propose a methodology for non-traditional, systematic and effective decision support design tools for multiprocessor system architects, from the phase of functional specification.

Les systèmes multiprocesseurs sur puce électronique (On-Chip Multiprocessor [OCM]) sont considérés comme les meilleures structures pour occuper l'espace disponible sur les circuits intégrés actuels. Dans nos travaux, nous nous intéressons à un modèle architectural, appelé architecture isométrique de systèmes multiprocesseurs sur puce, qui permet d'évaluer, de prédire et d'optimiser les systèmes OCM en misant sur une organisation efficace des nœuds (processeurs et mémoires), et à des méthodologies qui permettent d'utiliser efficacement ces architectures. Dans la première partie de la thèse, nous nous intéressons à la topologie du modèle et nous proposons une architecture qui permet d'utiliser efficacement et massivement les mémoires sur la puce. Les processeurs et les mémoires sont organisés selon une approche isométrique qui consiste à rapprocher les données des processus plutôt que d'optimiser les transferts entre les processeurs et les mémoires disposés de manière conventionnelle. L'architecture est un modèle maillé en trois dimensions. La disposition des unités sur ce modèle est inspirée de la structure cristalline du chlorure de sodium (NaCl), où chaque processeur peut accéder à six mémoires à la fois et où chaque mémoire peut communiquer avec autant de processeurs à la fois. Dans la deuxième partie de notre travail, nous nous intéressons à une méthodologie de décomposition où le nombre de nœuds du modèle est idéal et peut être déterminé à partir d'une spécification matricielle de l'application qui est traitée par le modèle proposé. Sachant que la performance d'un modèle dépend de la quantité de flot de données échangées entre ses unités, en l'occurrence leur nombre, et notre but étant de garantir une bonne performance de calcul en fonction de l'application traitée, nous proposons de trouver le nombre idéal de processeurs et de mémoires du système à construire. Aussi, considérons-nous la décomposition de la spécification du modèle à construire ou de l'application à traiter en fonction de l'équilibre de charge des unités. Nous proposons ainsi une approche de décomposition sur trois points : la transformation de la spécification ou de l'application en une matrice d'incidence dont les éléments sont les flots de données entre les processus et les données, une nouvelle méthodologie basée sur le problème de la formation des cellules (Cell Formation Problem [CFP]), et un équilibre de charge de processus dans les processeurs et de données dans les mémoires. Dans la troisième partie, toujours dans le souci de concevoir un système efficace et performant, nous nous intéressons à l'affectation des processeurs et des mémoires par une méthodologie en deux étapes. Dans un premier temps, nous affectons des unités aux nœuds du système, considéré ici comme un graphe non orienté, et dans un deuxième temps, nous affectons des valeurs aux arcs de ce graphe. Pour l'affectation, nous proposons une modélisation des applications décomposées en utilisant une approche matricielle et l'utilisation du problème d'affectation quadratique (Quadratic Assignment Problem [QAP]). Pour l'affectation de valeurs aux arcs, nous proposons une approche de perturbation graduelle, afin de chercher la meilleure combinaison du coût de l'affectation, ceci en respectant certains paramètres comme la température, la dissipation de chaleur, la consommation d'énergie et la surface occupée par la puce. Le but ultime de ce travail est de proposer aux architectes de systèmes multiprocesseurs sur puce une méthodologie non traditionnelle et un outil systématique et efficace d'aide à la conception dès la phase de la spécification fonctionnelle du système. / On-Chip Multiprocessor (OCM) systems are considered to be the best structures to occupy the abundant space available on today integrated circuits (IC). In our thesis, we are interested on an architectural model, called Isometric on-Chip Multiprocessor Architecture (ICMA), that optimizes the OCM systems by focusing on an effective organization of cores (processors and memories) and on methodologies that optimize the use of these architectures. In the first part of this work, we study the topology of ICMA and propose an architecture that enables efficient and massive use of on-chip memories. ICMA organizes processors and memories in an isometric structure with the objective to get processed data close to the processors that use them rather than to optimize transfers between processors and memories, arranged in a conventional manner. ICMA is a mesh model in three dimensions. The organization of our architecture is inspired by the crystal structure of sodium chloride (NaCl), where each processor can access six different memories and where each memory can communicate with six processors at once. In the second part of our work, we focus on a methodology of decomposition. This methodology is used to find the optimal number of nodes for a given application or specification. The approach we use is to transform an application or a specification into an incidence matrix, where the entries of this matrix are the interactions between processors and memories as entries. In other words, knowing that the performance of a model depends on the intensity of the data flow exchanged between its units, namely their number, we aim to guarantee a good computing performance by finding the optimal number of processors and memories that are suitable for the application computation. We also consider the load balancing of the units of ICMA during the specification phase of the design. Our proposed decomposition is on three points: the transformation of the specification or application into an incidence matrix, a new methodology based on the Cell Formation Problem (CFP), and load balancing processes in the processors and data in memories. In the third part, we focus on the allocation of processor and memory by a two-step methodology. Initially, we allocate units to the nodes of the system structure, considered here as an undirected graph, and subsequently we assign values to the arcs of this graph. For the assignment, we propose modeling of the decomposed application using a matrix approach and the Quadratic Assignment Problem (QAP). For the assignment of the values to the arcs, we propose an approach of gradual changes of these values in order to seek the best combination of cost allocation, this under certain metric constraints such as temperature, heat dissipation, power consumption and surface occupied by the chip. The ultimate goal of this work is to propose a methodology for non-traditional, systematic and effective decision support design tools for multiprocessor system architects, from the phase of functional specification.

We propose a preliminary model for perception analyses of professional identity based on quantitative criteria as applied to a specific academic area. The identity is a largely discussed by social sciences and there is a consensus about the difficulties in describing its social construction and even its perception by the subjects themselves. Professional identity is not different. Here, we studied how public policies aimed at academic and professional consolidation and training for the microelectronics sector may have had influence on its trainees and professionals over the last decade. We used social network analysis tools on Lattes curricula to determine semantic similarities between bibliographic productions of researchers who applied projects to the CNPq CA-ME and of trainees under CI-Brazil Program. We then used the colected data to characterize, from the distribution of keywords colleted throughou time, the identity evolution of the subjects. This paper concerns itself also with a brief presentation and evaluation of the CI-Brasil program as such (i.e., a program). Initiated in 2002, it has helped the alteration of the microelectronic ecosystem in the country, especially regarding training and fixation of human resources for the integrated circuit design sector. Embedded electronics have been partially responsible for deficits in the Brazilian trade balance. Therefore, public policy must be formulated cautiously and responsibly so as to increase sector infrastructure and form adequate human resources regarding market demand, be it at technician, undergraduate or graduate levels, and training these professionals. This paper focuses on undergraduate degrees and other training initiatives. Finally, this paper aims to indicate indispensable requirements for the assimilation of these professionals by the market, with public support and financing in partnership with universities and private enterprises (triple helix.) / Buscamos um modelo de análise de percepção da identidade profissional com bases mais quantitativas. Identidade é um tema muito discutido nas ciências sociais, onde há um consenso da dificuldade na forma de identificar sua construção social e, mesmo, sua percepção pelos próprios indivíduos. A identidade profissional não é diferente. Assim, nosso propósito foi mostrar como uma política pública de formação e fixação de indivíduos para o setor de microeletrônica afetou nos últimos 10 anos os profissionais da área. Para tanto usamos ferramentas de análise de redes sociais, para identificar semelhanças semânticas na produção acadêmica e técnica de pesquisadores vinculados ao CA-ME e de bolsistas do programa CI-Brasil. A seguir usamos os dados coletados para caracterizar, a partir da distribuição de palavras-chave recolhidas ao longo do tempo, a evolução da identidade dos sujeitos. Esta Tese trata também de uma discussão e avaliação do Programa CIBrasil iniciado em 2002, mostrando como este tem colaborado na alteração do ecossistema da microeletrônica no país, marcadamente no que toca à formação, capacitação e fixação de recursos humanos para o setor de design de circuitos integrados. O setor de eletrônica embarcada de modo geral tem causado déficits na balança comercial brasileira, assim, as Políticas Públicas para o setor devem ser formuladas com extrema cautela e responsabilidade de forma a aumentar a infraestrutura do setor e formar recursos humanos adequados às demandas de mercado, quer sejam formação em nível técnico quer na graduação quer na pósgraduação e ainda capacitar estes técnicos em nível de aperfeiçoamento. O enfoque deste trabalho estará na graduação e aperfeiçoamento. Por fim, busca-se apontar condições para que estes profissionais sejam assimilados pelo mercado com apoio e financiamentos públicos em parceria com as Universidades e Empresas (tripla hélice).

A 5 GHz continuous unlicensed bandwidth is available at millimeter-wave (mm-wave) frequencies around 60 GHz and offers the prospect for multi gigabit wireless applications. The inherent atmospheric attenuation at 60 GHz due to oxygen absorption makes the frequency range ideal for short distance communication networks. For these mm-wave wireless networks, the low noise amplifier (LNA) is a critical subsystem determining the receiver performance i.e., the noise figure (NF) and receiver sensitivity. It however proves challenging to realise high performance mm-wave LNAs in a silicon (Si) complementary metal-oxide semiconductor (CMOS) technology. The mm-wave passive devices, specifically on-chip inductors, experience high propagation loss due to the conductivity of the Si substrate at mm-wave frequencies, degrading the performance of the LNA and subsequently the performance of the receiver architecture. The research is aimed at realising a high performance mm-wave LNA in a Si BiCMOS technology. The focal points are firstly, the fundamental understanding of the various forms of losses passive inductors experience and the techniques to address these issues, and secondly, whether the performance of mm-wave passive inductors can be improved by means of geometry optimising. An associated hypothesis is formulated, where the research outcome results in a preferred passive inductor and formulates an optimised passive inductor for mm-wave applications. The performance of the mm-wave inductor is evaluated using the quality factor (Q-factor) as a figure of merit. An increased inductor Q-factor translates to improved LNA input and output matching performance and contributes to the lowering of the LNA NF. The passive inductors are designed and simulated in a 2.5D electromagnetic (EM) simulator. The electrical characteristics of the passive structures are exported to a SPICE netlist which is included in a circuit simulator to evaluate and investigate the LNA performance. Two LNAs are designed and prototyped using the 13μ-m SiGe BiCMOS process from IBM as part of the experimental process to validate the hypothesis. One LNA implements the preferred inductor structures as a benchmark, while the second LNA, identical to the first, replaces one inductor with the optimised inductor. Experimental verification allows complete characterization of the passive inductors and the performance of the LNAs to prove the hypothesis. According to the author's knowledge, the slow-wave coplanar waveguide (S-CPW) achieves a higher Q-factor than microstrip and coplanar waveguide (CPW) transmission lines at mm-wave frequencies implemented for the 130 nm SiGe BiCMOS technology node. In literature, specific S-CPW transmission line geometry parameters have previously been investigated, but this work optimises the signal-to-ground spacing of the S-CPW transmission lines without changing the characteristic impedance of the lines. Optimising the S-CPW transmission line for 60 GHz increases the Q-factor from 38 to 50 in simulation, a 32 % improvement, and from 8 to 10 in measurements. Furthermore, replacing only one inductor in the output matching network of the LNA with the higher Q-factor inductor, improves the input and output matching performance of the LNA, resulting in a 5 dB input and output reflection coefficient improvement. Although a 5 dB improvement in matching performance is obtained, the resultant noise and gain performance show no significant improvement. The single stage LNAs achieve a simulated gain and NF of 13 dB and 5.3 dB respectively, and dissipate 6 mW from the 1.5 V supply. The LNA focused to attain high gain and a low NF, trading off linearity and as a result obtained poor 1 dB compression of -21.7 dBm. The LNA results are not state of the art but are comparable to SiGe BiCMOS LNAs presented in literature, achieving similar gain, NF and power dissipation figures. / Dissertation (MEng)--University of Pretoria, 2012. / Electrical, Electronic and Computer Engineering / unrestricted

We focused on a non-cooling room temperature microbolometer infrared imaging array device which includes a sensing layer of p-type a-Si:H component layers doped with boron. Boron incorporation and bonding configuration were investigated for a-Si:H films grown by plasma enhanced chemical deposition (PECVD) at varying substrate temperatures, hydrogen dilution of the silane precursor, and dopant to silane ratio using multiple internal reflection infrared spectroscopy (MIR-IR). This study was then confirmed from collaborators via Raman spectroscopy. MIR-IR analyses reveal an interesting counter-balance relationship between boron-doping and hydrogen-dilution growth parameters in PECVD-grown a-Si:H. Specifically, an increase in the hydrogen dilution ratio (H2/SiH4) or substrate temperature was found to increase organization of the silicon lattice in the amorphous films. It resulted in the decrease of the most stable SiH bonding configuration and thus decrease the organization of the film. The new chemical bonding information of a-Si:H thin film was correlated with the various boron doping mechanisms proposed by theoretical calculations. The study revealed the corrosion morphology progression on aluminum alloy (Al, 0.5% Cu) under acidic chloride solution. This is due to defects and a higher copper content at the grain boundary. Direct galvanic current measurement, linear sweep voltammetry (LSV), and Tafel plots are used to measure corrosion current and potential. Hydrogen gas evolution was also observed (for the first time) in Cu/Al bimetallic interface in areas of active corrosion. Mechanistic insight that leads to effective prevention of aluminum bond pad corrosion is explored and discussed. (Chapter 4) Aluminum bond pad corrosion activity and mechanistic insight at a Cu/Al bimetallic interface typically used in microelectronic packages for automotive applications were investigated by means of optical and scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDX) and electrochemistry. Screening of corrosion variables (temperature, moisture, chloride ion concentration, pH) have been investigated to find their effect on corrosion rate and to better understand the Al/Cu bimetallic corrosion mechanism. The study revealed the corrosion morphology progression on aluminum alloy (Al, 0.5% Cu) under acidic chloride solution. The corrosion starts as surface roughening which evolves into a dendrite structure and later continues to grow into a mud-crack type corrosion. SEM showed the early stage of corrosion with dendritic formation usually occurs at the grain boundary. This is due to defects and a higher copper content at the grain boundary. The impact of copper bimetallic contact on aluminum corrosion was explored by sputtering copper microdots on aluminum substrate. Copper micropattern screening revealed that the corrosion is activated on the Al/Cu interface area and driven by the large potential difference; it was also seen to proceed at much higher rates than those observed with bare aluminum. Direct galvanic current measurement, linear sweep voltammetry (LSV), and Tafel plots are used to measure corrosion current and potential. Hydrogen gas evolution was also observed (for the first time) in Cu/Al bimetallic interface in areas of active corrosion. Mechanistic insight that leads to effective prevention of aluminum bond pad corrosion is explored and discussed. Micropattern corrosion screening identified hydrogen evolution and bimetallic interface as the root cause of Al pad corrosion that leads to Cu ball lift-off, a fatal defect, in Cu wire bonded device. Complete corrosion inhibition can be achieved by strategically disabling the mutually coupled cathodic and anodic reaction cycles.