The three wave mixing process was modeled in GaAs:AlGaAs superlattices using two new modeling tools that were developed in the course of this work: A 2D beam propagation tool for optimizing quasi-phase matching gratings, and a 1D iterative beam propagation tool for determining the output powers and threshold of optical parametric oscillators of arbitrary geometries. The 2D tool predicts close to 80% enhancement of conversion e ciency by phase matching near 800 nm compared to 775 nm, which was the originally designed operation wavelength. The model also predicts resonant behaviour for an abrupt grating pro le. The 1D tool was used to determine the threshold conditions for para- metric oscillation for di erent geometries. The performances of di erent phase matching approaches in AlGaAs were quantitatively compared. The model also indicated the need for pulsed operation to achieve reasonably low threshold powers in AlGaAs waveguides.

<p>Superluminescent diodes have become important for various applications, such as for biomedical imagining, due to their broad spectral width and high power.</p><p>This thesis demonstrates two-section superluminescent diodes fabricated using quantum well intermixing with strained Ga_0.75sln_0.25As quantum wells, grown on a GaAs substrate. A 100 nm capping layer of Ga_0.515In_0.485P grown at low temperature and having an excess of phosphorus, was removed from one section of the device to produce a relative bandgap shift between sections after rapid thermal annealing. The devices emitted at a wavelength of ~1μm with 60 nm of spectral width, and up to 38 mW of power at 20°C, depending on the currents applied to each section.</p><p>The combination of the spectral output from the two quantum well intermixed sections resulted in the broad spectral width. Angled facets at 7 ° were used to prevent the device from lasing. Additional power improvements were seen following the thermal anneal when a SiO2 capping layer was used on both sections. Depending on the applied currents, each section required 1.5 V to 3.0 V; and failed at 5.3 V ± 0.5 V.</p> / Thesis / Master of Applied Science (MASc)

La manipulation des propriétés physiques des nanostructures, telles que leur forme ou leur composition, suscite de plus en plus l’intérêt des recherches à cause des propriétés exceptionnelles des matériaux à cette échelle. L’ingénierie des contraintes a pour objet d’utiliser la déformation pour contrôler les propriétés. Cela est particulièrement intéressant dans les nano-objets car ils peuvent supporter des déformations élastiques élevées. Dans ce travail, nous étudions la déformation et l’influence de la température dans des nanofils uniques de type coeur/coquille. Ceci est possible en utilisant la diffraction cohérente des rayons X (CDI) en condition de Bragg, une technique d’imagerie qui remplace les lentilles optiques par des algorithmes d’inversion capables de reconstruire l’amplitude (densité électronique) et la phase (projection du champ de déplacement atomique) de l’échantillon à partir des clichés de diffraction. Cette méthode a également été appliquée à des particules facettées de platine qui ont des propriétés catalytiques exceptionnelles. Des expériences CDI in situ ont permis d’étudier l’évolution du champ de déformation dans les particules pendant des réactions chimiques et donc de progresser vers le découplage entre leur déformation intrinsèque et leur activité chimique. / Manipulating the physical and chemical properties of nanostructures by changing their characteristics (such as shape, strain or composition) is a vivid field of research spurred by the numerous applications that may take advantage of the unique properties that materials offer at this scale.Strain engineering aims to tune the strain in order to control the properties of materials. This is particularly interesting in nano-objects because they can sustain much higher elastic strains before the occurrence of defects. In this work, we study the strain and the influence of temperature in single core/shell nanowires. This is possible thanks to X-ray coherent diffraction (CDI) in Bragg condition, an imaging technique that replaces the optical lenses by inversion algorithms that are able to reconstruct the amplitude (electronic density) and the phase (projection of the atomic displacement field) of the sample from the experimental diffraction patterns. In addition to nanowires, the method is applied to metallic particles of platinum with exceptional catalyticproperties. In situ CDI experiments allowed to study the strain evolution within particles during chemical reactions, thereby moving forward in the understanding of important relationships such as the intrinsic strain and chemical activity of the nanoparticles.

In this work , impurity free vacancy diffusion (IFVD) quantum well intermixing(QWI) technology by high thermal-expansion-induced stress is used to perform bandgap engineering. In this paper, 1530nm InGaAsP multiple QWs sandwiched by p-InP (2£gm thickeneess, top) and n-InP (bottom) material is used as testing material structure also laser fabrication material, where contact materials (InGaAs and InP) on p-InP are used for comparison. By the difference between thermal expansion coefficients of SiO2 on the different material (InGaAs, InP), large different behaviors of QWI are observed, while low different dependence on defects created by ion-implantation is found. Above 70nm photo luminance (PL) wavelength shift of InGaAsP MQW below 2£gm thick InP is realized in this method. Further more, CW in-plane laser structures are also successfully fabricated and demonstrated by such QWI, giving the same shift as PL. It shows that good qualify of material can be obtained in such QWI method. Using local deposition of SiO2 causes different bandgap materials, re-growth free processing for monolithic integration can be expected, offering a powerful scheme of QWI for bandgap engineering.

In this work, a quantum well intermixing(QWI) technology, called impurity free vacancy diffusion(IFVD), is used to do the bandgap engineering in an optoelectronic monolithic integration. The monolithic integration of SOAs and EAMs is taken as an example. By IFVD, the transition energy levels of EAM quantum wells can be shifted to shorter wavelength region, while SOA quantum wells are kept the same. Therefore, the overall SOA-integrated EAM efficiency can be improved. We use dielectric film¡XSiO2 and Si3N4 to control the impurity free vacancy diffusion, both of these two dielectric layer will induce stress on the wafer, but they will come to the totally different result base on the difference atom chemistry with the substrate. Using Ga atom diffusion into SiO2 to relax stress, the IFVD will be operated to enhance quantum well intermixing, leading to energy bang transition change. On the other hand, with Si3N4 film, no significant intermixing is observed, implying atom chemistry dominates the whole process. Also, a super critical fluid technique by H2O2 is also employed to further improving SiO2 quality, a as large as 180nm blue shift is obtained, further improving such mechanism. Through difference properties between SiO2 and Si3N4 dielectric layers, different bandgap transitions in one single chip can be controlled in an area of 30£gm¡Ñ50£gm, leading to a planar bandgap engineering. Use these techniques, an EAM-SOA integration is designed and fabricated, obtaining an wavelength offset of 40nm with good quality of material structure. In the future, we can use this technique on large scale chip, tuning the bandgap to make photonic integration circuit without re-growth.

The main objectives of this thesis are to develop viable process and/or device technologies for bandgap tuning of 1300-nm InGaAs/GaAs quantum-dot (QD) laser structures, and broad linewidth 1300-nm InGaAsP/InP quantum well (QW) superluminescent diode structures. The high performance bandgap-engineered QD laser structures were achieved by employing quantum-dot intermixing (QDI) based on impurity free vacancy diffusion (IFVD) technique for eventual seamless active-passive integration, and bandgap-tuned lasers. QDI using various dielectric-capping materials, such as HfO2, SrTiO3, TiO2, Al2O3 and ZnO, etc, were experimented in which the resultant emission wavelength can be blueshifted to ∼ 1100 nm ─ 1200 nm range depending on process conditions. The significant results extracted from the PL characterization were used to perform an extensive laser characterization. The InAs/GaAs quantum-dot lasers with QDs transition energies were blueshifted by ~185 nm, and lasing around ~1070 – 1190 nm was achieved. Furthermore, from the spectral analysis, a simultaneous five-state lasing in the InAs/InGaAs intermixed QD laser was experimentally demonstrated for the first time in the very important wavelength range from 1030 to 1125 nm. The QDI methodology enabled the facile formation of a plethora of devices with various emission wavelengths suitable for a wide range of applications in the infrared. In addition, the wavelength range achieved is also applicable for coherent light generation in the green – yellow – orange visible wavelength band via frequency doubling, which is a cost-effective way of producing compact devices for pico-projectors, semiconductor laser based solid state lighting, etc. [1, 2] In QW-based superluminescent diode, the problem statement lies on achieving a flat-top and ultra-wide emission bandwidth. The approach was to design an inhomogeneous active region with a comparable simultaneous emission from different transition states in the QW stacks, in conjunction with anti-reflection coating and tilted ridge-waveguide device configuration. In this regard, we achieved 125 nm linewidth from InGaAsP/InP multiple quantum well (MQW) superluminescent diode with a total output power in excess of 70 mW with an average power spectral density of 0.56 mW/nm, and a spectral ripple of ≤1.2 ± 0.5 dB. The high power and broadband SLD with flat-top emission spectrum is a desirable as optical source for noninvasive biomedical imaging techniques employing low coherence interferometry, for instance, optical coherence tomography (OCT).

Laser powder bed fusion (LPBF) is a popular additive manufacturing (AM) technique that has demonstrated the capability to produce sophisticated engineering components. This work reports the crack-free fabrication of an SS316L/IN718 bimetallic structure via LPBF, along with compositional redistribution, phase transformations and microstructural development, and nanohardness variations. Constituent intermixing after LPBF was quantitatively estimated using thermo-kinetic coefficients of mass transport and compared with the diffusivity of Ni in the austenitic Fe-Ni system. The intermixing of primary solvents (Ni and Fe) in SS316L/IN718 bimetallic structures was observed for an intermixing zone of approximately 800 µm, and their intermixing coefficient was estimated to be in the order of 10−5 m2/s based on time of 10 ms. In addition, to understand the high temperature behavior, SS316L/IN718 bimetallic structures were annealed at 850, 950, and 1050 °C, for 120, 48, and 24h respectively, followed by water quenching (WQ). Furthermore, to better understand the intermixing of individual components (Ni and Fe) and to predict the varying (maximum) temperatures in LPBF of SS316L/IN718 bimetallic structures, solid-to-solid SS316L vs IN718 diffusion couples were examined at 850, 950, and 1050 °C, for 120, 48, and 24h respectively, followed by WQ. The investigation of SS316L vs IN718 diffusion couples yielded a maximum temperature of approximately 3400 K in the LPBF of SS316L/IN718 bimetallic structures. Finally, compositional redistribution, phase transformations and microstructural development, and nanohardness variations after LPBF of SS316L/IN625 bimetallic structure were also investigated to provide a better understanding of the LPBF process via bimetallic fabrication.

Résumé : Les circuits photoniques intégrés qui combinent des dispositifs photoniques pour la génération, la détection, la modulation, l'amplification, la commutation et le transport de la lumière dans une puce, ont été rapportés comme étant une innovation technologique importante qui simplifie la conception du système optique et qui réduit l'espace et la consommation de l'énergie en améliorant ainsi la fiabilité. La capacité de modifier la bande interdite des zones sélectives des différents dispositifs photoniques à travers la puce est la clé majeure pour le développement de circuits photoniques intégrés. Comparé à d'autres méthodes d’épitaxie, l’interdiffusion de puits quantiques a attiré beaucoup d'intérêt en raison de sa simplicité et son efficacité en accordant la bande interdite durant le processus de post-épitaxie. Cependant, l’interdiffusion de puits quantiques a subi des problèmes reliés au manque de précision pour modifier convenablement la bande interdite ciblée et à l’incontrôlabilité de l’absorption des impuretés au cours du processus qui peut dégrader la qualité du matériel interdiffusé. Dans cette thèse, nous avons utilisé les lasers excimer pour créer des défauts à proximité de la surface (~ 10 nm) des microstructures à base de puits quantiques III-V (par exemple InP et GaAs) et pour induire l’interdiffusion après le recuit thermique. L'irradiation par les lasers excimer (ArF et KrF) des microstructures à puits quantiques a été réalisée dans différents environnements, y compris l'air, l'eau déionisée, les couches diélectriques (SiO2 et Si3N4) et les couches d’InOx. Pour proposer un bon contrôle de la technique d’interdiffusion de puits quantiques par laser excimer, nous avons étudié la génération et la diffusion de défauts de surface en utilisant différentes méthodes de caractérisation de surface/interface, comme l'AFM, SEM, XPS et SIMS qui ont été utilisées pour analyser la modification de la morphologie de surface/interface et la modification chimique de la microstructure de ces puits quantiques. La qualité des microstructures à puits quantiques étudiées a été représentée par des mesures de photoluminescence et de luminescence des diodes lasers ainsi fabriqués. Les résultats montrent que le laser excimer induit des quantités d'oxydes de surface dans les surfaces des microstructure à puits quantiques InP/InGaAs/InGaAsP dans l'air et des impuretés d'oxygène des couches d'oxydes diffusées dans la région active de la microstructure lors du recuit, ce qui améliore l’interdiffusion, mais réduit l'intensité de la photoluminescence. Par contre, l’irradiation dans un environnement d'eau déionisée n’a pas démontré de diffusion des impuretés évidentes d'un excès d'oxygène vers les régions actives, mais la stœchiométrie de surface a été restaurée après l’interdiffusion. L’InOx a été trouvé avec un grand coefficient de dilatation thermique dans la microstructure interdiffusée qui était supposée d’augmenter la contrainte de compression dans la région active et ainsi d’augmenter l'intensité de photoluminescence de 10 fois dans l’échantillon irradié dans l'eau déionisée. Concernant les microstructures avec une couche diélectrique, la modification de la bande interdite a été toujours réalisée sur des échantillons dont les couches diélectriques ont été irradiées et la surface de InP a été modifiée par le laser excimer. Pour l'échantillon avec une couche de 243 nm de SiO2, les variations de la photoluminescence ont été mesurées sans l’ablation de cette couche de SiO2 lors de l'irradiation par le laser KrF. Cependant, la morphologie de l'interface d’InP a été modifiée, les oxydes d'interface ont été générés et les impuretés d'oxygène se sont diffusées à l'intérieur des surfaces irradiées. Les améliorations de l’interdiffusion dans les deux surfaces non irradiées et irradiés de l'échantillon couvert de couche d’InOx ont démontré l'importance des oxydes dans l’interdiffusion des puits quantiques. Les diodes laser fabriquées à partir d’un matériau interdiffusé par un laser KrF ont montré un seuil de courant comparable à celui des matériaux non interdiffusés avec un décalage de photoluminescence de 100 nm. En combinant un masque d'aluminium, nous avons créé un déplacement uniforme de photoluminescence de 70 nm sur une matrice rectangulaire de 40 μm x 200 μm ce qui présente un potentiel d’application de l’interdiffusion des puits quantiques par les lasers excimer dans les circuits photoniques intégrés. En outre, les lasers excimer ont été utilisés pour créer des structures de nano-cônes auto-organisées sur des surfaces de microstructure de InP/InGaAs/InGaAsP en augmentant l'intensité de PL par ~ 1.4 fois. Les lasers excimer ont été aussi utilisés pour modifier la mouillabilité sélective des zones d’une surface de silicium par une modification chimique de surface induite par laser dans différents milieux liquides. Ainsi, la fluorescence des nanosphères a été réussie pour des fonctions de configuration spécifique avec une surface de silicium. // Abstract : Photonic integrated circuits (PICs) which combine photonic devices for generation, detection, modulation, amplification, switching and transport of light on a chip have been reported as a significant technology innovation that simplifies optical system design, reduces space and power consumption, improves reliability. The ability of selective area modifying the bandgap for different photonic devices across the chip is the important key for PICs development. Compared with other growth methods, quantum well intermixing (QWI) has attracted amounts of interest due to its simplicity and effectiveness in tuning the bandgap in post-growth process. However, QWI has suffered problems of lack of precision in achieving targeted bandgap modification and uncontrollable up-taking of impurities during process which possibly degrade the quality of intermixed material. In this thesis, we have employed excimer laser to create surface defects in the near surface region (~ 10 nm) of III-V e.g. InP and GaAs, based QW microstructure and then annealing to induce intermixing. The irradiation by ArF and KrF excimer lasers on the QW microstructure was carried out surrounded by different environments, including air, DI water, dielectric layers (SiO2 and Si3N4) and InOx coatings. To propose a more controllable UV laser QWI technique, we have studied surface defects generation and diffusion with various surface/interface characterization methods, like AFM, SEM, XPS and SIMS, which were used to analyse the QW surface/interface morphology and chemical modification during QWI. The quality of processed QW microstructure was represented by photoluminescence measurements and luminescence measurements of fabricated laser diodes. The results shows that excimer laser induced amounts of surface oxides on the InP/InGaAs/InGaAsP microstructure surface in air and the oxygen impurities from oxides layer diffused to the active region of the QW microstructure during annealing, which enhance intermixing but also reduce the PL intensity. When irradiated in DI water environment, no obvious excessive oxygen impurities were found to diffuse to the active regions and the surface stoichiometry has been restored after intermixing. InOx with large coefficient of thermal expansion was found inside the intermixed QW microstructure, which was supposed to increase the compressive strain in active region and enhance the PL intensity to maximum 10 times on sample irradiated in DI water. On microstructure coated with dielectric layers, bandgap modifications were always found on samples whose dielectric layers were ablated and InP surface was modified by excimer laser. On sample coated with 243 nm SiO2 layer, the PL shifts were found on sample without ablation of the SiO2 layer when irradiated by KrF laser. However, the InP interface morphology was modified, interface oxides were generated and oxygen impurities have diffused inside on the irradiated sites. The enhancements of interdiffusion on both non irradiated and irradiated sites of sample coated with InOx layer have verified the importance of oxides in QWI. The laser diodes fabricated from KrF laser intermixed material have shown comparable threshold current density with as grown material with PL shifted by 133 nm. Combined aluminum mask, we have created uniform 70 nm PL shifts on 40 μm x 200 μm rectangle arrays which presents UV laser QWI potential application in PICs. In addition, excimer lasers have been used to create self organized nano-cone structures on the surface of InP/InGaAs/InGaAsP microstructure and enhance the PL intensity by ~1.4x. Excimer lasers have selective area modified wettability of silicon surface based on laser induced surface chemical modification in different liquid environments. Then the fluorescence nanospheres succeeded to specific pattern functions with silicon surface.

The ability to fabricate semiconductor wafers with spatially selected regions of different bandgap material is required for the fabrication of monolithic photonic integrated circuits (PIC's). Although this subject has been studied for three decades and many semiconductor engineering approaches have been proposed, the problem of achieving reproducible results has constantly challenged scientists and engineers. This concerns not only the techniques relaying on multiple sequential epitaxial growth and selective area epitaxy, but also the conventional quantum well intermixing (QWI) technique that has been investigated as a post-growth approach for bandgap engineering. Among different QWI techniques, those based on the use of different lasers appear to be attractive in the context of high-precision and the potential for cost-effective bandgap engineering. For instance, a tightly focused beam of the infrared (IR) laser could be used for the annealing of small regions of a semiconductor wafer comprising different quantum well (QW) or quantum dot (QD) microstructures. The precision of such an approach in delivering wafers with well defined regions of different bandgap material will depend on the ability to control the laser-induced temperature, dynamics of the heating-cooling process and the ability to take advantage of the bandgap engineering diagnostics. In the frame of this thesis, I have investigated IR laser-induced QWI processes in QW wafers comprising GaAs/A1GaAs and InP/InGaAsP microstructures and in InAs QD microstructures grown on InP substrates. For that purpose, I have designed and set up a 2-laser system for selective area rapid thermal annealing (Laser-RTA) of semiconductor wafers. The advantage of such an approach is that it allows carrying out annealing with heating-cooling rates unattainable with conventional RTA techniques, while a tightly focused beam of one of the IR lasers is used for `spot annealing'. These features have enabled me to introduce a new method for iterative bandgap engineering at selected areas (IBESA) of semiconductor wafers. The method proves the ability to deliver both GaAs and InP based QW/QD wafers with regions of different bandgap energy controlled to better than « 1nm of the spectral emission wavelength. The IBESA technique could be used for tuning the optical characteristics of particular regions of a QW wafer prepared for the fabrication of a PIC. Also, this approach has the potential for tuning the emission wavelength of individual QDs in wafers designed, e.g., for the fabrication of single photon emitters. In the 1st Chapter of the thesis, I provide a short review of the literature on QWI techniques and I introduce the Laser - RTA method. The 2nd Chapter is devoted to the description of the fundamental processes related to the absorption of laser light in semiconductors. I also discuss the results of the finite element method applied for modeling and semi-quantitative description of the Laser - RTA process. Details of the experimental setup and developed procedures are provided in the 3rd Chapter. The results concerning direct bandgap engineering and iterative bandgap engineering are discussed in the 4th and 5th Chapters, respectively.

<p>Thermistor material can be used to fabricate un-cooled IR detectors their figure of merit is the Temperature Coefficient of Resistance (TCR). Ge dots in Si can act as a thermistor material and they have a theoretical TCR higher than for SiGe layers but they suffer from intermixing of Si into the Ge dots. Ge dots were grown on unstrained or strained Si layers and relaxed or strained SiGe layers at temperatures of 550 and 600°C by reduced pressure chemical vapor deposition (RPCVD). Both single and multilayer structures where grown and characterized. To achieve a strong signal in a thermal detector a uniform shape and size distribution of the dots is desired. In this thesis work, an endeavor has been to grow uniform Ge dots with small standard deviation of their size. Scanning electron microscopy (SEM) and Atomic force microscopy (AFM) have been used to characterize the size and shape distribution of Ge dots. Ge contents measured with Raman spectroscopy are higher at lower growth temperatures. Simulation of TCR for the most uniform sample grown at 600°C give 4.43%/K compared to 3.85%/K for samples grown at 650°C in a previous thesis work.</p><p>Strained surfaces increases dot sizes and make dots align in crosshatched pattern resulting in smaller density, this effect increases with increasing strain.</p><p>Strain from buried layers of Ge dots in a multilayer structure make dots align vertically. This alignment of Ge dots was very sensitive to the thickness of the Si barrier layer. The diameter of dots increase for each period in a multilayer structure. When dots are capped by a Si layer at the temperature of 600°C intermixing of Si into the Ge dot occurs and the dot height decrease.</p>