Semiconductor die attach materials for high voltage, high reliability analog devices require high thermal conductivity and retention of dielectric strength. A comparative study of effective thermal conductivity and dielectric strength of selected thermoset/ceramic composites was conducted to determine the effect of ceramic particle size and ceramic particle loading on thermoset polymers. The polymer chosen for this study is bismaleimide, a common aerospace material chosen for its strength and thermal stability. The reinforcing material chosen for this study is a ceramic, hexagonal boron nitride. Thermal conductivity and dielectric breakdown strength are measured in low and high concentrations of hexagonal boron nitride. Adhesive fracture toughness of the composite is evaluated on copper to determine the composite’s adhesive qualities. SEM imaging of composite cross-sections is used to visualize particle orientation within the matrix. Micro-indentation is used to measure mechanical properties of the composites which display increased mechanical performance in loading beyond the percolation threshold of the material. Thermal conductivity of the base polymer increases by a factor of 50 in 80%wt loading of 50µm hBN accompanied by a 10% increase in composite dielectric strength. A relationship between particle size and effective thermal conductivity is established through comparison of experimental data with an empirical model of effective thermal conductivity of composite materials.

The objective of this thesis is to investigate the effects of adding natural fiber (kenaf fiber, retted kenaf fiber, and sugarcane fiber) into polymer materials. The effects are obtained by considering three main parts. 1. Performance in thermoplastic composites. The effect of fiber retting on polymer composite crystallization and mechanical performance was investigated. PHBV/PBAT in 80/20 blend ratio was modified using 5% by weight kenaf fiber. Dynamic mechanical analysis of the composites was done to investigate the glass transition and the modulus at sub-ambient and ambient temperatures. ESEM was conducted to analyze fiber topography which revealed smoother surfaces on the pectinase retted fibers. 2. Performance in thermoset composites. The effect of the incorporation of natural fibers of kenaf and of sugarcane combined with the polyester resin matrix is investigated. A comparison of mechanical properties of kenaf polyester composite, sugarcane polyester composite and pure polyester in tensile, bending, dynamic mechanical thermal analysis (DMA) and moisture test on performance is measured.. 3. Performance in sandwich composites. The comparison of the performance characteristics and mechanical properties of natural fiber composites panels with soft and rigid foam cores are evaluated. A thorough test of the mechanical behavior of composites sandwich materials in tensile, bending and DCB is presented here.

No description available.

<p>Semiconductor wafer bonding has been a subject of interestfor many years and a wide variety of wafer bonding techniqueshave been reported in literature. In adhesive wafer bondingorganic and inorganic adhesives are used as intermediatebonding material. The main advantages of adhesive wafer bondingare the relatively low bonding temperatures, the lack of needfor an electric voltage or current, the compatibility withstandard CMOS wafers and the ability to join practically anykind of wafer materials. Adhesive wafer bonding requires nospecial wafer surface treatmentssuch as planarisation.Structures and particles at the wafer surfaces can be toleratedand compensated for some extent by the adhesive material.Adhesive wafer bonding is a comparably simple, robust andlowcost bonding process. In this thesis, adhesive wafer bondingtechniques with different polymer adhesives have beendeveloped. The relevant bonding parameters needed to achievehigh quality and high yield wafer bonds have been investigated.A selective adhesive wafer bonding process has also beendeveloped that allows localised bonding on lithographicallydefined wafer areas.</p><p>Adhesive wafer bonding has been utilised in variousapplication areas. A novel CMOS compatible film, device andmembrane transfer bonding technique has been developed. Thistechnique allows the integration of standard CMOS circuits withthin film transducers that can consist of practically any typeof crystalline or noncrystalline high performance material(e.g. monocrystalline silicon, gallium arsenide,indium-phosphide, etc.). The transferred transducers or filmscan be thinner than 0.3 µm. The feature sizes of thetransferred transducers can be below 1.5 µm and theelectrical via contacts between the transducers and the newsubstrate wafer can be as small as 3x3 µm2. Teststructures for temperature coefficient of resistancemeasurements of semiconductor materials have been fabricatedusing device transfer bonding. Arrays of polycrystallinesilicon bolometers for use in uncooled infrared focal planearrays have been fabricated using membrane transfer bonding.The bolometers consist of free-hanging membrane structures thatare thermally isolated from the substrate wafer. Thepolycrystalline silicon bolometers are fabricated on asacrificial substrate wafer. Subsequently, they are transferredand integrated on a new substrate wafer using membrane transferbonding. With the same membrane transfer bonding technique,arrays of torsional monocrystalline silicon micromirrors havebeen fabricated. The mirrors have a size of 16x16 µm2 anda thickness of 0.34 µm. The advantages of micromirrorsmade of monocrystalline silicon are their flatness, uniformityand mechanical stability. Selective adhesive wafer bonding hasbeen used to fabricate very shallow cavities that can beutilised in packaging and component protection applications. Anew concept is proposed that allows hermetic sealing ofcavities fabricated using adhesive wafer bonding. Furthermore,microfluidic devices, channels and passive valves for use inmicro total analysis systems are presented.</p><p>Adhesive wafer bonding is a generic CMOS compatible bondingtechnique that can be used for fabrication and integration ofvarious microsystems such as infrared focal plane arrays,spatial light modulators, microoptical systems, laser systems,MEMS, RF-MEMS and stacking of active electronic films forthree-dimensional high-density integration of electroniccircuits. Adhesive wafer bonding can also be used forfabrication of microcavities in packaging applications, forwafer-level stacking of integrated circuit chips (e.g. memorychips) and for fabrication of microfluidic systems.</p>

Semiconductor wafer bonding has been a subject of interestfor many years and a wide variety of wafer bonding techniqueshave been reported in literature. In adhesive wafer bondingorganic and inorganic adhesives are used as intermediatebonding material. The main advantages of adhesive wafer bondingare the relatively low bonding temperatures, the lack of needfor an electric voltage or current, the compatibility withstandard CMOS wafers and the ability to join practically anykind of wafer materials. Adhesive wafer bonding requires nospecial wafer surface treatmentssuch as planarisation.Structures and particles at the wafer surfaces can be toleratedand compensated for some extent by the adhesive material.Adhesive wafer bonding is a comparably simple, robust andlowcost bonding process. In this thesis, adhesive wafer bondingtechniques with different polymer adhesives have beendeveloped. The relevant bonding parameters needed to achievehigh quality and high yield wafer bonds have been investigated.A selective adhesive wafer bonding process has also beendeveloped that allows localised bonding on lithographicallydefined wafer areas. Adhesive wafer bonding has been utilised in variousapplication areas. A novel CMOS compatible film, device andmembrane transfer bonding technique has been developed. Thistechnique allows the integration of standard CMOS circuits withthin film transducers that can consist of practically any typeof crystalline or noncrystalline high performance material(e.g. monocrystalline silicon, gallium arsenide,indium-phosphide, etc.). The transferred transducers or filmscan be thinner than 0.3 µm. The feature sizes of thetransferred transducers can be below 1.5 µm and theelectrical via contacts between the transducers and the newsubstrate wafer can be as small as 3x3 µm2. Teststructures for temperature coefficient of resistancemeasurements of semiconductor materials have been fabricatedusing device transfer bonding. Arrays of polycrystallinesilicon bolometers for use in uncooled infrared focal planearrays have been fabricated using membrane transfer bonding.The bolometers consist of free-hanging membrane structures thatare thermally isolated from the substrate wafer. Thepolycrystalline silicon bolometers are fabricated on asacrificial substrate wafer. Subsequently, they are transferredand integrated on a new substrate wafer using membrane transferbonding. With the same membrane transfer bonding technique,arrays of torsional monocrystalline silicon micromirrors havebeen fabricated. The mirrors have a size of 16x16 µm2 anda thickness of 0.34 µm. The advantages of micromirrorsmade of monocrystalline silicon are their flatness, uniformityand mechanical stability. Selective adhesive wafer bonding hasbeen used to fabricate very shallow cavities that can beutilised in packaging and component protection applications. Anew concept is proposed that allows hermetic sealing ofcavities fabricated using adhesive wafer bonding. Furthermore,microfluidic devices, channels and passive valves for use inmicro total analysis systems are presented. Adhesive wafer bonding is a generic CMOS compatible bondingtechnique that can be used for fabrication and integration ofvarious microsystems such as infrared focal plane arrays,spatial light modulators, microoptical systems, laser systems,MEMS, RF-MEMS and stacking of active electronic films forthree-dimensional high-density integration of electroniccircuits. Adhesive wafer bonding can also be used forfabrication of microcavities in packaging applications, forwafer-level stacking of integrated circuit chips (e.g. memorychips) and for fabrication of microfluidic systems.

No description available.

Made available in DSpace on 2014-12-17T14:07:00Z (GMT). No. of bitstreams: 1 GuilhermeFM.pdf: 1361832 bytes, checksum: 90befe7961c07f2510ca8f988b71da6b (MD5) Previous issue date: 2009-03-23 / Conselho Nacional de Desenvolvimento Cient?fico e Tecnol?gico / This work addresses the production of lightweight concrete building elements, such as plates, prefabricated slabs for pre-molded and panels of fencing, presenting a singular concrete: the Lightweight Concrete, with special properties such low density and good strength, by means of the joint use of industrial waste of thermosetting unsaturated polyesters and biodegradable foaming agent, named Polymeric Lightweight Concrete. This study covered various features of the materials used in the composition of the Polymeric Lightweight Concrete, using a planning of factorial design 23, aiming at studying of the strength, production, dosage processes, characterization of mechanical properties and microstructural analysis of the transition zone between the light artificial aggregate and the matrix of cement. The results of the mechanical strength tests were analyzed using a computational statistics tool (Statistica software) to understand the behavior and obtain the ideal quantity of each material used in the formula of the Polymeric Lightweight Concrete. The definition of the ideal formula has the purpose of obtaining a material with the lowest possible dry density and resistance to compression in accordance with NBR 12.646/92 (&#8805; 2.5 MPa after 28 days). In the microstructural characterization by scanning electron microscopy it was observed an influence of the materials in the process of cement hydration, showing good interaction between the wrinkled face of the residue of unsaturated polyesters thermosetting and putty and, consequently, the final strength. The attaining of an ideal formula, given the Brazilian standards, the experimental results obtained in the characterization and comparison of these results with conventional materials, confirmed that the developed Polymeric Lightweight Concrete is suitable for the production of building elements that are advantageous for construction / Neste trabalho ? abordada a aplica??o da tecnologia dos concretos leves ? produ??o de elementos construtivos, tais como placas pr?-fabricadas para lajes pr?-moldadas, pain?is de veda??o e pe?as pr?-moldadas, e ao desenvolvimento de um concreto celular com propriedades especiais de baixa densidade e boa resist?ncia mec?nica, em fun??o da utiliza??o conjunta de res?duo industrial de poli?ster insaturado termofixo (PIT) e espuma biodegrad?vel incorporadora de ar, denominado de Concreto Celular Polim?rico (CCP) . O estudo abrangeu diferentes tra?os dos materiais empregados na composi??o do CCP, sendo utilizado um planejamento fatorial 23, para an?lises dos processos de dosagem e produ??o, caracteriza??o das propriedades mec?nicas, bem como an?lises microestruturais da zona de transi??o entre o agregado artificial leve (PIT) e a matriz de cimento. Os resultados dos testes de resist?ncia mec?nica foram analisados utilizando-se uma ferramenta computacional de estat?stica (Statistica Software) para compreens?o do comportamento e obten??o da concentra??o ideal de cada material utilizado na formula??o do CCP. A defini??o da f?rmula ideal teve como finalidade a obten??o de um material com a menor densidade a seco poss?vel e resist?ncia ? compress?o que atendesse ? norma NBR 12.646/92 (&#8805; 2,5 MPa aos 28 dias). Na caracteriza??o microestrutural por microscopia eletr?nica de varredura, observou-se a influ?ncia dos materiais no processo de hidrata??o do cimento, onde constatou-se boa intera??o entre o res?duo de PIT, cuja face ? enrugada, e a pasta de cimento. A obten??o da formula??o de um novo material que atende ? norma brasileira, os resultados experimentais obtidos nas caracteriza??es e compara??o desses resultados com materiais convencionais, comprovaram que o Concreto Celular Polim?rico desenvolvido ? adequado ? produ??o de elementos construtivos que apresentam vantagens quando aplicados ? constru??o civil

Orientador: João Sinezio de Carvalho Campos / Dissertação (mestrado) - Universidade Estadual de Campinas, Faculdade de Engenharia Quimica / Made available in DSpace on 2018-08-04T01:48:34Z (GMT). No. of bitstreams: 1 Liba_AdemirDonizeti_M.pdf: 4797015 bytes, checksum: 1351ff08893b1a29731246cf2e4cd3c8 (MD5) Previous issue date: 2004 / Resumo: A resina de poliéster insaturada (RPI) é um polímero termofixo de baixo peso molecular obtido por condensação, o processo inicia-se através da esterificação entre diálcoois e diácidos saturados e insaturados, com o aumento do peso molecular do polímero, a retirada da água, que é gerada como subproduto da reação, torna-se difícil e lança-se mão do uso do vácuo ou de um maior fluxo de gás inerte para finalização da reação. Quanto à produção em escala industrial, apesar de conhecerem-se métodos de produção contínua, esta na maioria das indústrias é conduzida em bateladas com tempo de duração em média de 20 horas, podendo variar de acordo com a escolha das matérias primas utilizadas. Para a obtenção do polímero dentro dos parâmetros especificados, se faz necessário o controle dos radicais carboxilas, medidos através do índice de acidez (IA) e do peso molecular médio numérico (Mn), sendo este último parâmetro obtido de maneira indireta através da viscosidade(n). Para a viscosidade pode-se utilizar a escala Gardner, ou o viscosímetro cone e placa. A marcha de execução destas técnicas envolve várias etapas, desde a retirada da amostra até a obtenção do resultado da medida, sendo que para a amostragem, dependendo do equipamento disponível, esta pode implicar na interrupção do processo produtivo. Neste trabalho apresenta-se uma alternativa para o controle da reação, através do infravermelho próximo (NIR), em substituição às técnicas convencionais, com a vantagem do acompanhamento e do controle ser passível de execução em tempo real e sem a necessidade da retirada de amostras. Utilizou-se como base para o trabalho, a utilização anterior do NIR em processos envolvendo outros polímeros, tais como o policloreto de vinila (PVC), o policarbonato, o poliuretano e outros. Para verificar-se a viabilidade da utilização do NIR em substituição as técnicas convencionais, os valores obtidos para o IA e a viscosidade através destas técnicas foram comparados estatisticamente aos valores obtidos pelo NIR, obtendo-se forte correlação, com confiabilidade estatística de 95%. Com os resultados obtidos concluiu-se que o NIR pode ser utilizado com vantagens para o controle do processo de obtenção da resina de poliéster insaturada / Abstract: The unsaturated polyester resin (UPR) is a thermosetting polymer of low molecular weight obtained by condensation, the process begins through a esterification, between glycols and a mix of saturated and unsaturated acids, when the molecular weight of the polymer increase, the retreat of the water, generated as by-product of the reaction, if it turns more difficult and are necessary to use a vacuum or a larger flow of inert gas for finalization of the reaction. The production in industrial scale, in spite of they know each other methods of continuous production, are made in a batch with 20 hours long, could vary in agreement with the choice of the raw materials. For the obtaining of the polymer in the specified parameters, are necessary the control of the acid number (AN) and of the molecular weight (Mn), being this last obtained parameter in an indirect way through the viscosity. For measures those properties, are used as tools for the measure of the acidity number by titrimetric methods, and for the viscosity are use the Gardner scale, or the cone and plate viscometer. These techniques involves several stages, from the take of the sample to the obtaining of the result of the measure, and for obtain the sampling, depending on the available equipment, this can implicate in the interruption of the productive process. In this work we propose an alternative for the control of the reaction, by near infrared spectrometer (NIR), in substitution to the conventional techniques, with the advantage of the attendance and of the control to be susceptible to execution in real time and without the need of take samples. It was used as base for the work, the previous work of NIR in processes involving other polymeric materials, such as polyvinyl chloride (PVC), polycarbonate, the polyurethane and others. To verify the viability of the use of NIR in substitution of the conventional techniques, the values obtained for acid number and viscosity through these techniques were compared to the values obtained by NIR, being obtained strong correlation, with statistical reliability of 95%. With the obtained results it was ended that NIR can be used with advantages for the process control of unsaturated polyester resin / Mestrado / Ciencia e Tecnologia de Materiais / Mestre em Engenharia Química

Orientador: Edson Cocchieri Botelho / Resumo: Esta pesquisa visa o processamento de compósitos termorrígidos laminados multifuncionais, via moldagem por compressão a quente, constituídos por fibras de carbono, resina epóxi e mantas de poli(butadieno) (BR) produzidas via processo de eletrofiação. Estas mantas têm como função proporcionar maior tenacidade ao compósito obtido, aumentando sua tolerância ao dano e consequentemente, elevando sua aplicabilidade no setor aeroespacial. Para o desenvolvimento deste trabalho de pesquisa, primeiramente, foram produzidas mantas de poli(butadieno) por eletrofiação. Todas as condições de processamento foram avaliadas nesta etapa do projeto. Posteriormente, estas mantas foram utilizadas para a obtenção de diferentes compósitos com resina epóxi e fibra de carbono, utilizando-se oito distintas configurações, processados via moldagem por compressão a quente. A qualidade dos compósitos fabricados foi avaliada a partir de ensaios de digestão ácida, microscopia, análise dinâmico mecânica (DMA) e inspeção acústica por ultrassom. Com o intuito de se avaliar eventuais ganhos na tenacidade à fratura dos laminados, foram realizados ensaios de excitação por impulso e resistência ao impacto, o qual foi seguido pela técnica de ultrassom. Também foram realizados ensaios de End-Notched Flexure (ENF) pelo modo II de fratura (modo de deslizamento) e ensaios de cisalhamento interlaminar (ILSS) e após os respectivos ensaios, os compósitos também foram avaliados por microscopia. A partir da técnica de eletr... (Resumo completo, clicar acesso eletrônico abaixo) / Abstract: This research aims the processing of multifunctional laminated thermosetting composites by hot compression molding, consisting of carbon fibers, epoxy resin and polybutadiene (BR) mats produced by electrospinning. These mats can provide greater toughness to the composite obtained, increasing its damage tolerance and consequently increasing its applicability in the aerospace field. For the development of this research, polybutadiene mats were produced by the electrospinning process. All processing conditions were evaluated at this stage of the project. Subsequently, these mats were used to obtain different epoxy resin/ carbon fiber composites with 8 distinct configurations, processed by hot compression molding process. The quality of the manufactured composites was evaluated using acid digestion tests, microscopy, dynamic mechanical analysis (DMA) and acustic inspection by ultrasound. After processing, in order to evaluate possible gains in fracture toughness, these laminates were submitted impulse excitation tests, impact resistance, and after tests the specimens were analyzed by ultrasound. Also, End-Notched Flexure (ENF) testes were performed using mode II fracture (sliding mode) and interlaminar shear tests (ILSS) and after the respective tests, the composites were also evaluated by microscopy. Using the electrospinning technique, it was possible to manufacture polybutadiene microfibers successfully, and use them to process laminated composites consisting of carbon fibers ... (Complete abstract click electronic access below) / Doutor

En France, les volumes de sédiments de dragage générés chaque année pour la maintenance des ports et des voies navigables sont estimés à environ 50 millions de mètres cubes. La gestion de ces sédiments représente un enjeu économique, social et environnemental pour les gestionnaires. Aujourd’hui, l’une des solutions privilégiées est le développement de la gestion à terre de ces matériaux, qui consiste à les réutiliser comme matières premières secondaires en substitution partielle ou totale de matières nobles. De nombreux travaux de recherche ont été effectués sur la problématique de la valorisation des sédiments de dragage et de curage et de nouvelles filières sont actuellement toujours à l’étude (ciments, enrochements pour travaux maritimes et fluviaux, bétons cellulaires, granulats artificiels, etc.). Ce travail de thèse s’inscrit dans un contexte d’économie circulaire et vise à permettre le développement d’une gestion durable et responsable des ressources naturelles non renouvelables. Ceci à travers la réutilisation des sédiments de dragage dans la formulation de matériaux composites traités par des liants thermodurcissables ou thermoplastiques. Ainsi, après un travail de synthèse bibliographique sur les principales propriétés des sédiments de dragage, les méthodes de formulation des mortiers polymères et les modalités d’intégration des matériaux alternatifs dans ces matrices sont été décrites. Les expérimentations portent plus particulièrement sur la formulation de matériaux à partir de polymères thermodurcissables (résines de type Epoxy ou Polyester) et thermoplastiques (plastiques recyclés issus du tri des déchets). La validation des performances techniques des formulations optimisées pour chacun des traitements a été effectuée pour des usages en revêtements de sols ou en granulats légers dans des bétons hydrauliques. Enfin, la dernière partie de la thèse a été consacrée à l’étude de l’acceptabilité environnementale des nouveaux matériaux à travers la réalisation des essais de lixiviation dynamique sur monolithes. Les travaux menés ont permis de démontrer la faisabilité technique et environnementale de la valorisation des sédiments en tant que charge minérale dans des matrices polymères, avec des taux d’incorporation de sédiments significatifs pouvant atteindre jusqu’à 80 %. Ce qui confirme l’intérêt de cette typologie de traitement pour la valorisation des sédiments de dragage. / In France, the volume of dredged sediments generated each year through maintenance of ports and waterways, is estimated at around 50M cubic meters. The management of these sediments represents an economic, social and environmental stake for the managers of the waterways. Today, one of the solution is the onshore management of these sediments, which consists on their reuse as secondary raw materials in partial or total substitution of natural materials for civil engineering applications such as sub-base road materials, embankments, concrete, bricks/tiles, and cement production. In this context this study was initiated in order to define a long-term value chain for dredging sediments for a sustainable and responsible management of natural resources. This through the valorization of dredged sediments in polymer matrix mortar formulations. Indeed, this research presents an innovative solution that preserves natural resources by promoting the use of local resources, such as dredged sediments. In order to achieve this objective, the study included several phases : the first part is devoted to the state of the art concerning dredged sediments, polymer mortars and the recovery of waste in polymer mortars. In the second part, we studied recovery of sediment in thermosetting matrix polymers (Epoxy-Polyester). In the third part we studied the possibilities of incorporating sediments in recycled thermoplastic matrix. The materials from this combination have been used as lightweight aggregates for mortar formulation. Finally, in the last part was devoted to environmental monitoring of new formulated materials. This is done through leaching tests carried out on crushed samples and monoliths, to ensure the environmental safety of these materials. The result obtained with the different formulations tested, show the technical and environmental feasibility of valorization of sediments as mineral filler in polymer mortars, with sediments incorporation rates range between 50 and 80%. Indeed, the use of a polymer matrix makes it possible to have better physico-mechanical and chemical results with cementitious matrix mortars.