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Fabrication process assessment and negative bias illumination stress study of IGZO and ZTO TFTsHoshino, Ken 11 June 2012 (has links)
Indium-gallium-zinc oxide (IGZO) and zinc-tin oxide (ZTO) are investigated for thin-film transistor (TFT) applications. Negative bias illumination stress (NBIS) is employed for electrical stability assessment. Unpassivated IGZO and ZTO TFTs
suffer from severe NBIS instabilities. Zinc-tin-silicon oxide is found to be an effective passivation layer for IGZO and ZTO TFTs, significantly improving the NBIS stability. NBIS instabilities in unpassivated TFTs are attributed to an NBIS-induced
desorption of chemisorbed oxygen from the channel layer top surface, exposing surface oxygen vacancies. A ZTSO layer protects the channel layer top surface from adsorbed gas interactions and also appears to reduce the density of oxygen vacancies. The best device architectures investigated with respect to TFT electrical performance are found to be staggered with aluminum electrodes for unpassivated TFTs and coplanar with ITO electrodes for ZTSO-passivated TFTs. Annealing in wet-O₂ is not found to be effective for improving the performance of IGZO or ZTO TFTs or for reducing the post-deposition annealing temperature. / Graduation date: 2012
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Density functional simulations of defect behavior in oxides for applications in MOSFET and resistive memoryLi, Hongfei January 2018 (has links)
Defects in the functional oxides play an important role in electronic devices like metal oxide semiconductor field effect transistors (MOSFETs) and resistive random-access memories (ReRAMs). The continuous scaling of CMOS has brought the Si MOSFET to its physical technology limit and the replacement of Si channel with Ge channel is required. However, the performance of Ge MOSFETs suffers from Ge/oxide interface quality and reliability problems, which originates from the charge traps and defect states in the oxide or at the Ge/oxide interface. The sub-oxide layers composed of GeII states at the Ge/GeO2 interface seems unavoidable with normal passivation methods like hydrogen treatment, which has poor electrical properties and is related to the reliability problem. On the other hand, ReRAM works by formation and rupture of O vacancy conducting filaments, while how this process happens in atomic scale remains unclear. In this thesis, density functional theory is applied to investigate the defect behaviours in oxides to address existing issues in these electronic devices. In chapter 3, the amorphous atomic structure of doped GeO2 and Ge/GeO2 interface networks are investigated to explain the improved MOSFET reliability observed in experiments. The reliability improvement has been attributed to the passivation of valence alternation pair (VAP) type O deficiency defects by doped rare earth metals. In chapter 4, the oxidation mechanism of GeO2 is investigated by transition state simulation of the intrinsic defect diffusion in the network. It is proposed that GeO2 is oxidized from the Ge substrate through lattice O interstitial diffusion, which is different from SiO2 which is oxidized by O2 molecule diffusion. This new mechanism fully explains the strange isotope tracer experimental results in the literature. In chapter 5, the Fermi level pinning effect is explored for metal semiconductor electrical contacts in Ge MOSFETs. It is found that germanides show much weaker Fermi level pinning than normal metal on top of Ge, which is well explained by the interfacial dangling bond states. These results are important to tune Schottky barrier heights (SBHs) for n-type contacts on Ge for use on Ge high mobility substrates in future CMOS devices. In chapter 6, we investigate the surface and subsurface O vacancy defects in three kinds of stable TiO2 surfaces. The low formation energy under O poor conditions and the +2 charge state being the most stable O vacancy are beneficial to the formation and rupture of conducting filament in ReRAM, which makes TiO2 a good candidate for ReRAM materials. In chapter 7, we investigate hydrogen behaviour in amorphous ZnO. It is found that hydrogen exists as hydrogen pairs trapped at oxygen vacancies and forms Zn-H bonds. This is different from that in c-ZnO, where H acts as shallow donors. The O vacancy/2H complex defect has got defect states in the lower gap region, which is proposed to be the origin of the negative bias light induced stress instability.
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Shapeable microelectronicsKarnaushenko, Daniil 04 July 2016 (has links) (PDF)
This thesis addresses the development of materials, technologies and circuits applied for the fabrication of a new class of microelectronic devices that are relying on a three-dimensional shape variation namely shapeable microelectronics. Shapeable microelectronics has a far-reachable future in foreseeable applications that are dealing with arbitrarily shaped geometries, revolutionizing the field of neuronal implants and interfaces, mechanical prosthetics and regenerative medicine in general. Shapeable microelectronics can deterministically interface and stimulate delicate biological tissue mechanically or electrically. Applied in flexible and printable devices shapeable microelectronics can provide novel functionalities with unmatched mechanical and electrical performance. For the purpose of shapeable microelectronics, novel materials based on metallic multilayers, photopatternable organic and metal-organic polymers were synthesized.
Achieved polymeric platform, being mechanically adaptable, provides possibility of a gentle automatic attachment and subsequent release of active micro-scale devices. Equipped with integrated electronic the platform provides an interface to the neural tissue, confining neural fibers and, if necessary, guiding the regeneration of the tissue with a minimal impact. The self-assembly capability of the platform enables the high yield manufacture of three-dimensionally shaped devices that are relying on geometry/stress dependent physical effects that are evolving in magnetic materials including magentostriction and shape anisotropy. Developed arrays of giant magnetoimpedance sensors and cuff implants provide a possibility to address physiological processes locally or distantly via magnetic and electric fields that are generated deep inside the organism, providing unique real time health monitoring capabilities. Fabricated on a large scale shapeable magnetosensory systems and nanostructured materials demonstrate outstanding mechanical and electrical performance. The novel, shapeable form of electronics can revolutionize the field of mechanical prosthetics, wearable devices, medical aids and commercial devices by adding novel sensory functionalities, increasing their capabilities, reducing size and power consumption.
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Shapeable microelectronicsKarnaushenko, Daniil 08 June 2016 (has links)
This thesis addresses the development of materials, technologies and circuits applied for the fabrication of a new class of microelectronic devices that are relying on a three-dimensional shape variation namely shapeable microelectronics. Shapeable microelectronics has a far-reachable future in foreseeable applications that are dealing with arbitrarily shaped geometries, revolutionizing the field of neuronal implants and interfaces, mechanical prosthetics and regenerative medicine in general. Shapeable microelectronics can deterministically interface and stimulate delicate biological tissue mechanically or electrically. Applied in flexible and printable devices shapeable microelectronics can provide novel functionalities with unmatched mechanical and electrical performance. For the purpose of shapeable microelectronics, novel materials based on metallic multilayers, photopatternable organic and metal-organic polymers were synthesized.
Achieved polymeric platform, being mechanically adaptable, provides possibility of a gentle automatic attachment and subsequent release of active micro-scale devices. Equipped with integrated electronic the platform provides an interface to the neural tissue, confining neural fibers and, if necessary, guiding the regeneration of the tissue with a minimal impact. The self-assembly capability of the platform enables the high yield manufacture of three-dimensionally shaped devices that are relying on geometry/stress dependent physical effects that are evolving in magnetic materials including magentostriction and shape anisotropy. Developed arrays of giant magnetoimpedance sensors and cuff implants provide a possibility to address physiological processes locally or distantly via magnetic and electric fields that are generated deep inside the organism, providing unique real time health monitoring capabilities. Fabricated on a large scale shapeable magnetosensory systems and nanostructured materials demonstrate outstanding mechanical and electrical performance. The novel, shapeable form of electronics can revolutionize the field of mechanical prosthetics, wearable devices, medical aids and commercial devices by adding novel sensory functionalities, increasing their capabilities, reducing size and power consumption.
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