The change of the spontaneous polarization due to a change of temperature is known as the pyroelectric effect and is restricted to crystalline, non-centrosymmetric and polar matter. Its main application is the utilization in infrared radiation sensors, but usage for waste heat energy harvesting or chemical catalysis is also possible. A precise quantification, i.e. the measurement of the pyroelectric coefficient p, is inevitable to assess the performance of a material. Hence, a comprehensive overview is provided in this work, which summarizes and evaluates the available techniques to characterize p. A setup allowing the fully automated measurement of p by utilizing the Sharp-Garn method and the measurement of ferroelectric hysteresis loops is described. It was used to characterize and discuss the behavior of p with respect to the temperature of the doped bulk III-V compound semiconductors gallium nitride and aluminum nitride and thin films of doped hafnium oxide, as reliable data for these materials is still missing in the literature. Here, the nitride-based semiconductors show a comparable small p and temperature dependency, which is only slightly affected by the incorporated dopant, compared to traditional ferroelectric oxides. In contrast, p of HfO2 thin films is about an order of magnitude larger and seems to be affected by the present dopant and its concentrations, as it is considered to be responsible for the formation of the polar orthorhombic phase.:1. Motivation and Introduction 2. Fundamentals 2.1. Dielectrics and their Classification 2.2. Polarization 2.3. Pyroelectricity 2.4. Ferroelectricty 2.5. Phase Transitions 2.6. Applications and Figures of Merit 3. Measurement Methods for the Pyroelectric Coefficient 3.1. General Considerations 3.1.1. Heating Concepts 3.1.2. Thermal Equilibrium 3.1.3. Electric Contact 3.1.4. Separation of Contributions 3.1.5. Thermally Stimulated Currents 3.2. Static Methods 3.2.1. Charge Compensation Method 3.2.2. Hysteresis Measurement Method 3.2.3. Direct Electrocaloric Measurement 3.2.4. Flatband Voltage Shift 3.2.5. X-ray Photoelectron Spectroscopy Method 3.2.6. X-ray Diffraction and Density Functional Theory 3.3. Dynamic Methods 3.3.1. Temperature Ramping Methods 3.3.2. Optical Methods 3.3.3. Periodic Pulse Technique 3.3.4. Laser Intensity Modulation Methods 3.3.5. Harmonic Waveform Techniques 4. Pyroelectric and Ferroelectric Characterization Setup 4.1. Pyroelectric Measurement Setup 4.1.1. Setup and Instrumentation 4.1.2. Automated Sharp-Garn Evaluation of Pyroelectric Coefficients 4.1.3. Further Examples 4.2. Hysteresis Loop Measurements 4.2.1. Instrumentation 4.2.2. Measurement and Evaluation 4.2.3. Examples 5. Investigated Material Systems 5.1. III-Nitride Bulk Semiconductors GaN and AlN 5.1.1. General Structure and Spontaneous Polarization 5.1.2. Applications 5.1.3. Crystal Growth and Doping 5.1.4. Pyroelectricity 5.2. Hafnium Oxide Thin Films 5.2.1. General Structure and Applications 5.2.2. Polar Properties in Thin Films 5.2.3. Doping Effects 5.2.4. Pyro- and Piezoelectricity 6. Results 6.1. The Pyroelectric Coefficient of Free-standing GaN and AlN 6.1.1. Sample Preparation 6.1.2. Pyroelectric Measurements 6.1.3. Lattice Influence 6.1.4. Slope Differences 6.2. Pyroelectricity of Doped Hafnium Oxide 6.2.1. Sharp-Garn Measurement on Thin Films 6.2.2. Effects of Silicon Doping 6.2.3. Dopant Comparison 7. Summary and Outlook A. Pyroelectric Current and Phase under Periodic Thermal Excitation B. Loss Current Correction for Shunt Method C. Conductivity Correction D. Comparison of Pyroelectric Figures of Merit Bibliography Publication List Acknowledgments / Die Änderung der spontanen Polarisation durch eine Änderung der Temperatur ist bekannt als der pyroelektrische Effekt, welcher auf kristalline, nicht-zentrosymmetrische und polare Materie beschränkt ist. Er findet vor allem Anwendung in Infrarot-Strahlungsdetektoren, bietet aber weitere Anwendungsfelder wie die Niedertemperatur-Abwärmenutzung oder die chemische Katalyse. Eine präzise Quantifizierung, d. h. die Messung des pyroelektrischen Koeffizienten p, ist unabdingbar, um die Leistungsfähigkeit eines Materials zu bewerten. Daher bietet diese Arbeit u.a. einen umfassenden Überblick und eine Bewertung der verfügbaren Messmethoden zur Charakterisierung von p. Weiterhin wird ein Messaufbau beschrieben, welcher die voll automatisierte Messung von p mit Hilfe der Sharp-Garn Methode und auch die Charakterisierung der ferroelektrischen Hystereseschleife ermöglicht. Aufgrund fehlerender Literaturdaten wurde dieser Aufbau anschließend genutzt, um den temperaturabhängigen pyroelektrischen Koeffizienten der dotierten III-V-Verbindungshalbleiter Gallium- und Aluminiumnitrid sowie dünner Schichten bestehend aus dotiertem Hafniumoxid zu messen und zu diskutieren. Im Vergleich zu klassichen ferroelektrischen Oxiden zeigen dabei die nitridbasierten Halbleiter einen geringen pyroelektrischen Koeffizienten und eine kleine Temperaturabhängigkeit, welche auch nur leicht durch den vorhandenen Dotanden beeinflusst werden kann. Dagegen zeigen dünne Hafniumoxidschichten einen um eine Größenordnung größeren pyroelektrischen Koeffizienten, welcher durch den anwesenden Dotanden und seine Konzentration beeinflusst wird, da dieser verantwortlich für die Ausbildung der polaren, orthorhombischen Phase gemacht wird.:1. Motivation and Introduction 2. Fundamentals 2.1. Dielectrics and their Classification 2.2. Polarization 2.3. Pyroelectricity 2.4. Ferroelectricty 2.5. Phase Transitions 2.6. Applications and Figures of Merit 3. Measurement Methods for the Pyroelectric Coefficient 3.1. General Considerations 3.1.1. Heating Concepts 3.1.2. Thermal Equilibrium 3.1.3. Electric Contact 3.1.4. Separation of Contributions 3.1.5. Thermally Stimulated Currents 3.2. Static Methods 3.2.1. Charge Compensation Method 3.2.2. Hysteresis Measurement Method 3.2.3. Direct Electrocaloric Measurement 3.2.4. Flatband Voltage Shift 3.2.5. X-ray Photoelectron Spectroscopy Method 3.2.6. X-ray Diffraction and Density Functional Theory 3.3. Dynamic Methods 3.3.1. Temperature Ramping Methods 3.3.2. Optical Methods 3.3.3. Periodic Pulse Technique 3.3.4. Laser Intensity Modulation Methods 3.3.5. Harmonic Waveform Techniques 4. Pyroelectric and Ferroelectric Characterization Setup 4.1. Pyroelectric Measurement Setup 4.1.1. Setup and Instrumentation 4.1.2. Automated Sharp-Garn Evaluation of Pyroelectric Coefficients 4.1.3. Further Examples 4.2. Hysteresis Loop Measurements 4.2.1. Instrumentation 4.2.2. Measurement and Evaluation 4.2.3. Examples 5. Investigated Material Systems 5.1. III-Nitride Bulk Semiconductors GaN and AlN 5.1.1. General Structure and Spontaneous Polarization 5.1.2. Applications 5.1.3. Crystal Growth and Doping 5.1.4. Pyroelectricity 5.2. Hafnium Oxide Thin Films 5.2.1. General Structure and Applications 5.2.2. Polar Properties in Thin Films 5.2.3. Doping Effects 5.2.4. Pyro- and Piezoelectricity 6. Results 6.1. The Pyroelectric Coefficient of Free-standing GaN and AlN 6.1.1. Sample Preparation 6.1.2. Pyroelectric Measurements 6.1.3. Lattice Influence 6.1.4. Slope Differences 6.2. Pyroelectricity of Doped Hafnium Oxide 6.2.1. Sharp-Garn Measurement on Thin Films 6.2.2. Effects of Silicon Doping 6.2.3. Dopant Comparison 7. Summary and Outlook A. Pyroelectric Current and Phase under Periodic Thermal Excitation B. Loss Current Correction for Shunt Method C. Conductivity Correction D. Comparison of Pyroelectric Figures of Merit Bibliography Publication List Acknowledgments

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Verbindungshalbleiter mit einer großen Bandlücke wie Galliumnitrid (GaN) sind aufgrund ihrer hervorragenden elektronischen Eigenschaften für die Halbleiterindustrie von großem Interesse. Die Hochtemperatur-Gasphasenepitaxie, die auf dem physikalischen Gasphasentransport von Gallium basiert, ist eine alternative Methode der Gasphasenepitaxie von GaN. Im Mittelpunkt der vorliegenden Arbeit standen die Weiterentwicklung der Methode hinsichtlich der Verringerung der Kontamination und die Reduzierung der Versetzungsdichte in den GaN-Schichten. Dazu wurde eine neue Verdampfungszelle entwickelt und die komplexen, mehrstufigen Nukleations- und Wachstumsprozesse systematisch untersucht. Insgesamt wurden zu kommerziell verfügbaren GaN-Schichten vergleichbare Defektdichten erreicht. Zusätzlich wurde die Methode zur Abscheidung auf Saphir-Substraten mit einem Durchmesser von bis zu 2 Zoll aufskaliert.

In this report the influence of the growth conditions on the surface morphology of AlGaN/GaN heterostructures grown on sapphire-based and bulk GaN substrates is nondestructively investigated with focus on the decoration of defects and the surface roughness. Under Ga-rich conditions specific types of dislocations are unintentionally decorated with shallow hillocks. In contrast, under Ga-lean conditions deep pits are inherently formed at these defect sites. The structural data show that the dislocation density of the substrate sets the limit for the density of dislocation-mediated surface structures after MBE overgrowth and no noticeable amount of surface defects is introduced during the MBE procedure. Moreover, the transfer of crystallographic information, e.g. the miscut of the substrate to the overgrown structure, is confirmed. The combination of our MBE overgrowth with the employed surface morphology analysis by atomic force microscopy (AFM) provides a unique possibility for a nondestructive, retrospective analysis of the original substrate defect density prior to device processing.

We report and discuss the performance of an enhancement mode n-channel pseudo-vertical GaN metal oxide semiconductor field effect transistor (MOSFET). The trench gate structure of the MOSFET is uniformly covered with an Al₂O₃ dielectric and TiN electrode material, both deposited by atomic layer deposition (ALD). Normally-off device operation is demonstrated in the transfer characteristics. Special attention is given to the estimation of the active acceptor concentration in the Mg doped body layer of the device, which is crucial for the prediction of the threshold voltage in terms of device design. A method to estimate the electrically active dopant concentration by applying a body bias is presented. The method can be used for both pseudo-vertical and truly vertical devices. Since it does not depend on fixed charges near the channel region, this method is advantageous compared to the estimation of the active doping concentration from the absolute value of the threshold voltage.

The incorporation of Gallium Nitride (GaN) Power Amplifiers (PAs) into future high power aperture radar systems is certain; however, the introduction of this technology into multifunction radar systems will present new challenges to radar engineers. This dissertation describes a broad investigation into amplitude and phase transients produced by GaN PAs when they are excited with multifunction radar waveforms. These transients are the result of self-heating electrothermal memory effects and are manifested as interpulse instabilities that can negatively impact the coherent processing of multiple pulses. A behavioral model based on a Foster network topology has been developed to replicate the measured amplitude and phase transients accurately. This model has been used to develop a digital predistortion technique that successfully mitigates the impact of the transients. The Moving Target Indicator (MTI) Improvement Factor and the Root Mean Square (RMS) Pulse-to-Pulse Stability are used as metrics to assess the impact of the transients on radar system performance and to test the effectiveness of a novel digital predistortion concept. / Ph. D. / The incorporation of Gallium Nitride (GaN) Power Amplifiers (PAs) into future radar systems is certain, and will present new challenges to radar engineers. This dissertation describes a broad investigation into signal transients produced by GaN PAs when they are excited with a wide variety of RF pulsed waveforms. These waveforms are representative of those used by a radar system to conduct multiple functions or missions. The transients are primarily the result of changes in the GaN PA gain due to self-heating, and are manifested as differences in consecutive pulses. These pulse-to-pulse differences negatively affect the ability of a radar system to extract information from a received echo. A behavioral model based on a Foster network topology has been developed to replicate the measured signal transients accurately. This model has been used to develop a digital predistortion technique that successfully counteracts the transients mitigating the impact of the transients. The Moving Target Indicator (MTI) Improvement Factor and the Root Mean Square (RMS) Pulse-to-Pulse Stability are used as performance metrics to quantify the effect of the transients on radar system performance and to test the effectiveness of a novel digital predistortion concept.

Im Rahmen dieser Arbeit wurde der pseudo-halogenide Gasphasenepitaxie (PHVPE)-Prozess für die GaN-Kristallzüchtung entwickelt. Dieser Prozess basiert auf dem Zyanid als Transportmittel für Ga. Das HCN wurde aus der Reaktion von heißem NH3 entweder mit Graphit oder einem gasförmigen Kohlenstoffträger gewonnen. Als Quelle für reaktiven Stickstoff diente NH3. Im ersten Ansatz wurde ein Reaktor aus Graphit genutzt. In diesem Fall wurden Wachstumsraten von 60 um=h erreicht. Außerdem zeigte der Kristall eine geringe Perfektion mit hoher V-Grubendichte. Im zweiten Ansatz bestand der Reaktor aus mit pyrolytischem Graphit beschichteten Teilen. Diese Änderung des Konzeptes half die Kristallqualität zu verbessern, reduzierte aber gleichzeitig die Wachstumsrate drastisch, weil das Ga-transportmittel nicht mehr ausreichend zur Verfügung stand. Der neu konstruierte, graphitfreie Aufbau stellt den dritten Zugang zur PHVPE dar. In diesem Fall entsteht HCN während eines Degussa-Prozesses am Pt-Katalysator im Züchtungsreaktor. Zur Untersuchung der Reaktionswege wurde ein FTIR-basiertes insitu Abgasmesssystem entwickelt. GaN-Kristalle wurden auf Saphir und Ga2O3 Substraten, AlN/Al2O3 und GaN/Al2O3 Templates gezüchtet. Eine Selbstseparation wurde für dicke GaN-Schichten auf Ga2O3 erreicht. Die Proben wurden mit verschiedenen Methoden charakterisiert, z.B. mit der Röntgenbeugungs-Spektroskopie (XRD) und Elektronenrückstreubeugung (EBSD) für die Kristallperfektion und kristallographische Orientierung, der Transmissionselektronenmikroskopie (TEM) zur Untersuchung von Versetzungen und der Grenzfläche zwischen GaN und dem Ga2O3, der Rasterelektronenmikroskopie (REM) für die Oberflächenmorphologie und Schichtdicke, der energiedispersiven Röntgenspektroskopie (EDX) für die Kristallzusammensetzung, sowie der ex-situ und in-situ Abgasanalyse mit der Fourier-Transform-Infrarotspektroskopie (FTIR) zum Studium der Reaktionswege. / Within the frame of this work the pseudo halide vapor phase epitaxy process (PHVPE) was developed for GaN crystals growth. The process is based on cyanide as a transport agent for Ga. The source of HCN was the reaction of hot NH3 with either graphite or gaseous carbon precursor. Source of reactive nitrogen was NH3. In the first approach the reactor made of graphite was used. In this case growth rate of 60 um/h was achieved. Additionally, the crystals exhibit poor quality with high V-pit density. The second approach was to provide the reactor with pyrolytical boron nitride covered parts. Changing the concept helped to improve the crystals'' quality but simultaneously reduced drastically the growth rate, due to the lack of sufficient supply of Ga transport agent. Newly designed graphite free setup is used in the third approach for PHVPE. In this case, HCN forms during Degussa process on Pt catalyst, inside the growth reactor. For investigation of the reaction paths, an in-situ exhaust gas measurement system based on FTIR was developed. GaN crystals were grown on sapphire and Ga2O3 substrates, AlN/Al2O3 and GaN/Al2O3 templates. Self separation was achieved for thick GaN crystals grown on Ga2O3. The samples were characterized by various methods i.e. x-ray diffraction spectroscopy (XRD) and electron back scattering diffraction EBSD for crystal quality and crystallographic orientation, transmission electron microscopy (TEM) for investigating dislocations and interface between GaN and Ga2O3, scanning electron microscopy (SEM) for surface morphology and layer thickness, energy dispersive x-ray spectroscopy (EDX) for crystals compositions, ex-situ and in-situ exhaust gas analysis by Fourier transform infrared spectroscopy (FTIR) for investigation of the reaction paths.