As nanometer Very Large Scale Integration (VLSI) demands more transistor density to fabricate multi-cores and memory blocks in a limited die size, many researches have been performed to keep Moore's Low in two different ways: 2D geometric shrinking and 3D vertical wafer stacking. For the geometric shrinking, nano patterning with 193nm lithography equipment is one of the most fundamental challenges beyond 22nm while the next-generation lithography, such as Extreme Ultra-Violet (EUV) lithography still faces tremendous challenges for volume production in the near future. As a practical solution, Double Patterning Lithography (DPL) has become a leading candidate for sub-20nm lithography process. Another approach for multi-core integration is 3D wafer stacking with Through Silicon Via (TSV). Computer-Aided-Design (CAD) approaches to enable robust DPL and TSV technology are the main focus of this dissertation. DPL poses new challenges for overlay and layout decomposition. Therefore, overlay induced variation modeling and efficient decomposition for better manufacturability are in great demand. Since the variation of metal space caused by overlay results in coupling capacitance variation, we first model metal spacing variation with individual overlay sources. Then, all overlay sources are considered to determine the worst timing with coupling capacitance variation. Non-parallel pattern caused by overlay is converted to parallel one with equivalent spacing having the same delay to be applicable of a traditional RC extraction flow. Our experiments show that the delay variation due to overlay in DPL can be up to 9.1%, and well decomposed layout can reduce the variability. For DPL layout decomposition, we propose a multi-objective and flexible framework for stitch minimization, balanced density, and overlay compensation, simultaneously. We use a graph theoretic algorithm for minimum stitch insertion and balanced density. Additional decomposition constraints for overlay compensation are obtained by Integer Linear Programming (ILP). Robust contact decomposition can be obtained with additional constraints. With these constraints, global decomposition is performed using a modified Fiduccia-Mattheyses (FM) graph partitioning algorithm. Experimental results show that the proposed framework is highly scalable and fast: we can decompose all 15 benchmark circuits in five minutes in a density balanced fashion, while an ILP-based approach can finish only the smallest five circuits. In addition, we can remove more than 95% of the timing variation induced by overlay for tested structures. Three-dimensional integration has new manufacturing and design challenges such as device variation due to TSV induced stress and timing corner mismatch between different stacked dies. Since TSV fill material and silicon have different Coefficients of Thermal Expansion (CTE), TSV causes silicon deformation due to different temperatures at chip manufacturing and operating. Therefore, the systematic variation due to TSV induced stress should be considered for robust 3D IC design. We propose systematic TSV stress aware timing analysis and show how to optimize layout for better performance. First, a stress contour map with an analytical radial stress model is generated. Then, the tensile stress is converted to hole and electron mobility variations depending on geometric relations between TSVs and transistors. Mobility variation aware cell library and netlist are generated and incorporated in an industrial timing engine for 3D-IC timing analysis. TSV stress induced timing variations can be as much as 10% for an individual cell. As an application for layout optimization, we can exploit the stress-induced mobility enhancement to improve timing on critical cells. We show that stress-aware perturbation could reduce cell delay by up to 14.0% and critical path delay by 6.5% in our test case. Three-dimensional Clock Tree Synthesis (3D CTS) is one of the main design difficulties in 3D integration because clock network is spreading over all tiers. In 3D CTS, timing corner mismatch between tiers is caused because each tier is manufactured in independent process. Therefore, inter-die variation should be considered to analyze and optimize for paths spreading over several tiers in 3D CTS. In addition, mobility variation of a clock buffer due to stress from TSV can cause unexpected skew which degrades overall chip performance. Therefore, we propose clock period optimization to consider both timing corner mismatch and TSV induced stress. In our experiments, we show that our clock buffer tier assignment reduces clock period variation up to 34.2%, and the most of stress-induced skew can be removed by our stress-aware CTS. Overall, we show that performance gain can be up to 5.7% with the proposed CTS algorithm. As technology scaling continues toward 14nm and 3D-integration, this dissertation addresses several key issues in the design-manufacturing interface, and proposes unified analysis and optimization techniques for effective design and manufacturing integration. / text

Device fabrication on multi walled carbon nanotubes (MWCNTs) using electrical beam lithography (EBL), electron beam induced deposition (EBID), ion beam induced deposition (IBID) methods was carried out, followed by device electrical characterization using a conventional probe station. A four-probe configuration was utilized to measure accurately the electrical resistivity of MWCNTs with similar results obtained from devices fabricated by different methods. In order to reduce the contact resistance of the beam deposited platinum electrodes, single step vacuum thermal annealing was performed. Microscopy and spectroscopy were carried out on the beam deposited electrodes to follow the structural and chemical changes occurring during the vacuum thermal annealing. For the first time, a core-shell type structure was identified on EBID Pt and IBID Pt annealed electrodes and analogous free standing nanorods previously exposed to high temperature. We believe this observation has important implications for transport properties studies of carbon materials. Apart from that, contamination of carbon nanostructure, originating from the device fabrication methods, was also studied. Finally, based on the observations of faster processing time together with higher yield and flexibility for device preparation, we investigated EBID to fabricate devices for other discrete carbon nanostructures.

This dissertation describes the development of a new method for increasing the resolution of the current protein microarray technology, down to the single molecule detection level. By using a technique called size-dependent self-assembly, different proteins can be bound to different sized fluorescent nanostructures, and then located on a patterned silicon substrate based on the sized pattern which is closest to the size of the bead diameter.The protein nanoarray was used to detect antibody-antigen binding, specifically anti-mouse IgG binding to mouse IgG. The protein nanoarray is designed with the goal of analyzing rare proteins. However, common proteins, such as IgG, are used in the initial testing of the array functionality. Mouse IgG, representing rare proteins, is conjugated to fluorescent beads and the beads are immobilized on a patterned silicon surface. Then anti-mouse IgG binds to the mouse IgG on the immobilized beads. The binding of the antibody, anti-mouse IgG, to the antigen, mouse IgG is determined by fluorescent signal attenuation.The first objective was to bind charged nanoparticles, conjugated with proteins, to an oppositely charged silicon substrate. Binding of negatively charged gold nanoparticles (AuNP), conjugated with mouse IgG, to a positively charged silicon surface was successful.The second objective was to demonstrate the method of size-dependent self-assembly at the nanometer scale (<100 >nm). Different-sized, carboxylated, fluorescent beads and AuNP, which were conjugated with proteins, were serially added to a patterned polymethyl methacrylate (PMMA) coated silicon surface. Size-dependent self-assembly was successfully demonstrated, down to the nanometer scale.The final objective was to obtain a signal from antibody-antigen binding within the protein array. Conjugated fluorescent beads were bound to e-beam patterns and signal attenuation was measured when the antibodies bound to the conjugated beads. The size-dependent self-assembly is a valuable new method that can be used for the detection and quantification of proteins.

This thesis addresses nanostructure fabrication techniques based on electron beam lithography, which is the most widely employed nanofabrication techniques for R&D and for the prototyping or production of photo-mask or imprint mold. The focus is on the study of novel resist and development process, as well as pattern transfer procedure after lithography. Specifically, this thesis investigates the following topics that are related to either electron beam resists, their development, or pattern transfer process after electron beam lithography: (1) The dry thermal development (contrary to conventional solvent development) of negative electron beam resists polystyrene (PS) to achieve reasonably high contrast and resolution. (2) The solvent development for polycarbonate electron beam resist, which is more desirable than the usual hot aqueous solution of NaOH developer, to achieve a low contrast that is ideal for grayscale lithography. (3) The fabrication of metal nanostructure by electron beam lithography and dry liftoff (contrary to the conventional liftoff using a strong solvent or aqueous solution), to achieved down to ~50 nm resolution. (4) The study a novel electron beam resist poly(sodium 4-styrenesulfonate) (sodium PSS) that is water soluble and water developable, to fabricate the feature size down to ~ 40 nm. And finally, (5) The fabrication of gold nanostructure on a thin membrane, which will be used as an object for novel x-ray imaging, where we developed the fabrication process for silicon nitride membrane, electroplating of gold, and pattern transfer after electron beam lithography using single layer resist and tri-layer resist stack.

No description available.

No description available.

Graphene is a promising material for many technological applications. To realize these applications, new fabrication techniques that allow precise control of the physical properties, as well as large scale integration between single devices are needed. In this work, a series of studies are performed in order to develop graphene based devices. First, using MD simulations we study the effects of irradiating graphene with a carbon ion atom at several positions and energies from 0.1 eV to 100 keV. The simulations show four types of processes adsorption, reflection, transmission, and vacancy formation. At energies below 10 eV the dominant process is reflection, between 10 and 100 eV is adsorption, and between 100 eV and 100 keV the dominant process is transmission. Vacancy formation is a low rate process that takes place at energies above 30 eV. Three types of defects were found: adatom, single vacancy, and 5-8-5 defect formed from a double vacancy defect. Also a bottom-up fabrication method is studied, in this method, the controlled folding of graphene structures, driven by molecular interactions with water nanodroplets, is analyzed considering the interactions with substrates such as SiO2, HMDS and IPA on SiO2. When the graphene is supported on SiO2, the attraction between graphene and the substrate prevents graphene from folding but if the substrate has HMDS or IPA, the interaction between graphene and the substrate is weak, and depending on the geometry of the graphene structure, folding is possible. Finally, to evaluate the characteristics of graphene based devices, we model the vibrational bending modes of graphene ribbons with different dimensions. The resonant frequencies of the ribbons and relations between the size of the ribbon and their resonant frequencies are calculated. The interaction of a graphene vibronic device with water and IPA molecules are simulated and demonstrate that this device can be used as a sensitive vibronic molecular sensor that is able to distinguish the chemical nature of the detected molecule. Also, the electrical properties of the graphene vibronic with armchair and zigzag border are calculated; the latter has the potential to generate THz electrical signals as demonstrated in this work.

In past studies, several techniques have been employed to create microscopic features on relatively simple surfaces. Of these, lithography-based techniques have proven effective at manufacturing large fields of deterministic microasperities and microcavities on planar and cylindrical substrates. The present study focuses on adapting UV-lithography to a more complex substrate. Machined from stainless steel, a conical mold insert introduces an interesting geometry designed for the injection molding of radial lip seal elastomer. The distinct shape of this mold insert poises unique challenges to a conventional lithography procedure. Spray application is investigated as a feasible means to deposit layers of photoresist on the surface. An appropriate masking element is designed and created to facilitate transfer of a particular pattern via UV exposure. A clamping technique is implemented to align and secure the photomask. These techniques are incorporated into a three-day process, and results are obtained through optical microscopy and light interferometry. By applying Design of Experiments (DOE) and Analysis of Variance (ANOVA), significant process variables are indentified. Based on these findings, refinements to the process are enabled and future considerations are made evident.

Thin films of Teflon AF have been directly patterned by electron-beam lithography without the need for post exposure chemical development. The relationship between pattern depth and exposure dose was found to be linear over a wide range of doses. Pattern depth was also observed to be dependent on initial film thickness. Teflon AF can be directly patterned at doses similar to typical e-beam resists. High resolution features as small as ~200 nm have been resolved. FTIR measurements revealed that CF3 and fluorinated dioxole groups play a significant role in the patterning mechanism. Teflon AF films also exhibited an increase in refractive index upon exposure to the electron-beam. This property has been exploited in waveguiding applications. Waveguides in Teflon AF were patterned using direct electron beam lithography technique. Waveguides were clearly visible to the naked eye. Characterization in the visible region showed evidences of light guiding through the waveguides. However light could not cross the entire chip. Characterization in the infrared region revealed the slab mode even though individual waveguides were not detected.

<p>A variety of intriguing surface patterns have been observed on developing natural systems, ranging from corrugated surface of white blood cells at nanometer scales to wrinkled dog skins at millimeter scales. To mimetically harness functionalities of natural morphologies, artificial transformative skin systems by using soft active materials have been rationally designed to generate versatile patterns for a variety of engineering applications. The study of the mechanics and design of these dynamic surface patterns on soft active materials are both physically interesting and technologically important. </p><p>This dissertation starts with studying abundant surface patterns in Nature by constructing a unified phase diagram of surface instabilities on soft materials with minimum numbers of physical parameters. Guided by this integrated phase diagram, an electroactive system is designed to investigate a variety of electrically-induced surface instabilities of elastomers, including electro-creasing, electro-cratering, electro-wrinkling and electro-cavitation. Combing experimental, theoretical and computational methods, the initiation, evolution and transition of these instabilities are analyzed. To apply these dynamic surface instabilities to serving engineering and biology, new techniques of Dynamic Electrostatic Lithography and electroactive anti-biofouling are demonstrated.</p> / Dissertation