Multiple laser beam interference allows to produce periodic light patterns in the order of the wavelength of light. A simulation program helps to identify different patterns and to investigate the influence of changing parameters such as e.g. the angle of incidence or the polarization. A positive photoresist (Shipley S1805) is used to create two-dimensional metallic photonic crystals by UV interference lithography.

The InsulPatch is a novel integrated patch-pump device used to deliver drugs, especially macromolecular drugs that are difficult to deliver through an oral pathway and that require transdermal delivery. The patch-pump is a promising replacement for conventional syringes and battery-powered pumps because it is slim, powerless, painless, and relatively inexpensive. The majority of this thesis focuses on the fabrication and testing of microfluidic devices for the delivery of insulin, which is a model drug that is widely used and needs to be delivered transdermally. In this thesis, we demonstrate the fabrication of the patch-pump, which includes an insect-mimetic microfluidic pump fabricated using photolithography and replica molding, and a microneedle array fabricated using 3D printing. The microfluidic pump is used to drive the fluid flow powered by pressurized air or the user’s pulse, and the microneedle array is used to inject the fluid through the skin painlessly. Using pressurized air-driven flow testing, we have tested the flow rate across microfluidic pumps of various flow channel widths over a range of physiologically relevant actuation frequencies and pressures. We have found that for the specific channel design we have been using, the flow rate generally positively correlates with the actuation pressure. For devices with wider flow channels, the flow rate generally negatively correlates with the actuation frequency, whereas the flow rate increases and then decreases with increasing actuation frequency for devices with narrower flow channels. This property of these devices is beneficial in insulin delivery because the demand for insulin is generally reduced in vigorous exercise (with elevated heart rate/actuation frequency) and increased in hypertension patients (with elevated blood/actuation pressure). A major future direction of the study is to test a wide range of device designs in a sample of human subjects by attaching the device onto the wrist and measuring the pulse-driven flow across the device. We can further change the channel design parameters of the device so that it will be ideal for insulin delivery. Using the ex vivo flow testing and human subject data, we can further tailor the device design to specific patients using a genetic algorithm-guided optimization based on the heart rate and blood pressure of the patient and the desired flow rate. We will also perform computational modeling using COMSOL Multiphysics to predict the flow across devices of different designs as well as to understand the physics behind the pulse-driven flow. Finally, a 3D-printed insulin reservoir will be incorporated into our patch-pump system for the storage of U-500 insulin. / M.S. / The InsulPatch is a slim, powerless device (“patch-pump”) that can be used to deliver drugs through the skin, especially designed for drugs that are difficult to deliver orally. The patch technology is a promising replacement for conventional injection using syringes and bulky battery-powered pumps. At this stage, the primary drug that our device aims to deliver is insulin, which generally needs to be delivered through the skin. In this thesis, we demonstrate how our patch-pump is made and how its performance is tested. The patch-pump has two parts: the microfluidic pump and the microneedle array. The microfluidic pump is fabricated using a technique called photolithography, in which a photosensitive polymer is selectively cured by UV light, and replica molding, in which the precursor of another polymer is poured on a mold and cured. The microneedle array is made using 3D printing and designed in such a way so that it can be readily connected to the microfluidic pump. The microfluidic pump is used to drive the fluid flow powered by the user’s pulse, and the microneedle array is used to inject the fluid through the skin painlessly. Through testing the flow across the microfluidic pump prototypes using pressurized air, we characterized the correlation between the flow rate of fluid across the device and parameters including the actuation pressure and frequency of the pressurized air as well as the width of the flow channel. Future directions of the study include testing the devices in human subjects to characterize pulse-driven flow across the devices, computational modeling of the devices, and further changes of the device design to optimize the performance of the device. We will also optimize the device design computationally to tailor the device design to specific diabetic patients. Finally, we will incorporate a 3D-printed insulin reservoir into our system for the storage of insulin solution. / Withhold all access to the ETD for 1 year / patent / I hereby certify that, if appropriate, I have obtained and submitted with my ETD a written permission statement from the ower(s) of each third part copyrighted matter to be included in my thesis or dissertation, allowing distribution as specified above. I certify that the version I submitted is the same as that approved by my advisory committee.

During the last decades, the continuing need for faster and smaller sensors has indeed triggered the rapid growth of more sophisticated technologies. This has led to the development of new optical-based sensors, able to detect and measure different phenomena using light. Furthermore, material processing technologies and micro fabrication methods have exponentially advanced, allowing engineers and scientists to develop new and more complex sensors on optical fibers platforms; specifically attractive for life science and biomedical research. All these substantial developments have brought biosensors to a point where multifunctionality is needed, this has led to envision the "Lab-on-Fiber" concept. Which promotes the integration of different sensing components into a single platform, an optical fiber. In this work, an integrated system with non-conventional polymer optical fibers and their further surface modification has been developed. With these different approaches, electrodes, hollow channels and plasmonic nanostructures can be incorporated into a single optical fiber-based sensor, allowing for both electrical and optical sensing with the capabilities of tuning and signal enhancement thanks to the metallic nanostructures. Different fiber substrates can be designed and modified in order to satisfy multiple requirements for a wide variety of applications. / MS / Silica optical fibers have been used since the 1960’s to guide optical signals, such as light, with low losses through long distances; making them an attractive platform to use in large communication systems. However, over the past couple of decades researchers have been trying to implement these low-loss platforms in sensing devices for many different fields, such as environmental and structural monitoring, and chemical and biomedical research. Unfortunately, their high brittleness has prompted researchers to introduce different materials in the same technology, leveraging the development of multimaterial non-conventional fibers. Where different polymers and even metals have replaced silica as the structural material, making these fibers more cost-affordable, flexible, and allow for multi-sensing capabilities of both electrical and optical signals. Although these multimaterial fibers are able to transmit light, they need to be functionalized or modified in order for them to be able to sense different phenomena occurring in their surrounding media. This can be achieved by integrating small particles or structures onto the fibers end-faces, these small structures are known as plasmonic nanostructures. When light (electromagnetic radiation) travels through a fiber and interacts with the free (conduction) electrons of a metallic nanostructure, it leads to a coupling that results in collective oscillations, which produce strong enhancement of the local electromagnetic fields surrounding the nanostructures. The latter can be easily detected with the help of an optical spectrum analyzer that iv stores the transmitted light as a function of the transmitted wavelength. Noble metals like gold and silver produce unprecedented electromagnetic field enhancements and are also biocompatible, making them very attractive in biosensing applications. In this research metallic plasmonic nanostructures were deposited on the end face of multimaterial polymer fibers to enhance the optical properties and potentially the electrical properties as well, creating new sensing devices. The enhancement produced by these structures was studied with both experimental measurements and theoretical simulations. The results demonstrate that the nanostructures investigated in this work can indeed enhance the optical properties of the used polymer fibers, enabling them to work as sensing probes for a many different applications, especially biosensing research.

The aim of this project was to produce an integrate-able free space optical transceiver for Specks. Specks are tiny computing units that together can form a powerful network called a SpeckNet. The SpeckNet platform is developed by the SpeckNet consortium, which consists of five Scottish Universities and combines computer science, electrical engineering and digital signal processing groups. The principal goal of creating an optical transceiver was achieved by integrating in-house fabricated VCSELs (with lasing thresholds below 400 uA) and custom designed detectors on the SpeckNet platform. The transceiver has a very low power consumption (approximately 100 uW), which removes the need for synchronous communication through the SpeckNet thus making the network more efficient. I describe both static and dynamic beam control techniques. For static control, I used micro-lenses. I fabricated the lenses by greyscale electron beam lithography and integrated them directly on VCSEL arrays. I achieved a steering angle of 10 degrees with this design. I also looked at integrated gratings etched straight into a VCSEL and observed beam steering with an efficiency of 60% For dynamic control, I implemented a liquid crystal (LC) design. I built a LC cell with 30 individually controlled pixels, but I only achieved a steering angle of 1 degree. Furthermore, I investigated two different techniques for achieving beam steering by interference, using coupled VCSELs (a phased array approach). Firstly, using photonic crystals etched into the surface of the VCSEL, I built coupled laser cavities. Secondly, I designed and built bow-tie type VCSELs that were optically coupled but electrically isolated. These designs work by differential current injection causing an interference effect in the VCSELs far field. This technique is the first stepping stone towards realising a phased optical array. Finally, I considered signal detection. Using the same VCSEL material, I built a resonant-cavity detector. This detector had a better background rejection ratio than commercially available silicon devices.

A near-field technique known as evanescent interferometric lithography allows for high resolution imaging. However its primary limitation is that the image exponentially decays within the photoresist due to physical limits. This thesis aims to overcome this limitation and presents a method to considerably enhance the depth of focus of images created using evanescent interferometric lithography by using a material underlay beneath the photoresist. A key enabler of this is the understanding that evanescent fields couple to surface states and operating within proximity of a resonance, the strength of the coupling allows for considerable energy extraction from the incident beam and redistribution of this energy in a photoresist cavity. This led to the analysis of the Fresnel equations, which suggested that such coupling was in fact the result of an enhanced reflectance that takes place at boundaries of carefully chosen materials. While it is known that metals and lossy dielectrics result in surface plasmon polaritons (SPP) and surface exciton polaritons (SEP) as conventional solutions to the Fresnel reflection equations for the TM polarization of light, there is no such naturally occurring surface state that allows evanescent wave enhancement with the TE polarization of light. Further investigation of the Fresnel reflection equations revealed both for TM and TE that in fact another solution exists that is but unconventional to enhance the reflectivity. This solution requires that one of the media have a negative loss. This is a new type of surface resonance that requires that one of the media be a gain medium; not one in the optical pumped sense but one that would naturally supply energy to a wave to make it grow. This new surface resonance is also a key result of this thesis. Clearly, however this is only a hypothetical solution as a real gain medium would violate the conservation of energy. However, as it is only the reflectance of this gain medium that is useful for evanescent wave enhancement, in fact a multilayered stack consisting of naturally occurring materials is one way to achieve the desired reflectivity. This would of course be only an emulation of the reflectivity aspect of the gain medium. This multilayered stack is then an effective gain medium for the reflectivity purposes when imaging is carried out at a particular NA at a particular wavelength. This proposal is also a key idea of this thesis. At λ = 193 nm, this method was used to propose a feasible design to image high resolution structures, NA = 1.85 at an aspect ratio of ~3.2. To experimentally demonstrate the enhancements, a new type of solid immersion test bed, the solid immersion Lloyd's mirror interference lithography test-bed was constructed. High quality line and space patterns with a half-pitch of 55.5 nm were created using λ = 405 nm, corresponding to a NA of 1.824, that is well in the evanescent regime of light. Image depths of 33-40 nm were seen. Next, the evanescent image was coupled to an effective gain medium made up of a thin layer of hafnium oxide (HfO) upon silicon dioxide (SiO2). This resulted in a considerable depth enhancement, and 105 nm tall structures were imaged. The work in this thesis details the construction of the solid immersion lithography test-bed, describes the implementation of the modeling tools, details the theory and analysis required to achieve the relevant solutions and understanding of the physical mechanism and finally experimentally demonstrates an enhancement that allows evanescent interferometric lithography beyond conventional limits.

O presente trabalho tem como objetivo desenvolver um processo de fabricação de elementos micro-ópticos utilizando-se litografia por feixe de elétrons, empregando o resiste SU-8, negativo e amplificado quimicamente, sobre substrato de Si. Para tanto, é realizado o estudo dos parâmetros do efeito de proximidade a, b e h para se modelar e controlar os efeitos do espalhamento dos elétrons no resiste e no substrato, e se altera o processamento convencional do SU-8 para se obter um processo com baixo contraste. A determinação dos parâmetros do efeito de proximidade para o sistema de escrita direta e amostra SU-8 / Si é feita experimentalmente e por simulação de Monte Carlo. Particularmente, verifica-se a dependência dos mesmos com a profundidade do resiste. Primeiramente utilizando o software PROXY, obtêm-se a, b e h da observação de padrões de teste revelados. Chega-se a 4m para o parâmetro () que mede o retroespalhamento dos elétrons pelo substrato e 0,7 para a relação (h) entre a intensidade destes com aquela dos elétrons diretamente espalhados pelo resiste (alcance dado por a). Ainda, com esses dados, estima-se o diâmetro do feixe do microscópio eletrônico de varredura a partir da equação de aproximação de espalhamento direto para pequenos ângulos (a = 128nm na superfície do resiste) e se determina a resolução lateral do processo (a = 800nm na interface resiste/ substrato, para um filme de 2,4m). Em seguida, usa-se o software CASINO para se calcular os parâmetros de proximidade a partir da curva de densidade de energia dissipada no resiste obtida pela simulação da trajetória de espalhamento dos elétrons. Confrontam-se, finalmente, os valores obtidos pelos dois métodos. Em relação ao processamento do resiste SU-8, são determinadas as condições experimentais para a fabricação de estruturas tridimensionais por litografia de feixe de elétrons. Especificamente, busca-se desenvolver um processo com características (espessura, contraste, sensibilidade e rugosidade) adequadas para a fabricação de micro-dispositivos ópticos. Inicia-se com o levantamento das curvas de contraste e da sensibilidade do SU-8 para determinadas temperaturas de aquecimento pós-exposição. Obtém-se contraste abaixo de 1 para aquecimento pós-exposição abaixo da temperatura de transição vítrea do resiste, mantendo-se sensibilidade elevada (2C/cm2). Em seguida, mede-se a rugosidade da superfície do filme revelado para diferentes doses de exposição. Para finalizar, submete-se a amostra a um processo de cura e escoamento térmico, para melhorar a dureza e a rugosidade do resiste a ser utilizado como dispositivo final Consegue-se um valor de rugosidade (40nm) inferior a 20 vezes o comprimento de onda de diodo laser de eletrônica de consumo. Por fim, é produzido um dispositivo com perfil discretizado em 16 níveis como prova de conceito. / This work aims at developing an electron-beam lithography process for the fabrication of microoptical elements using the negative tone chemically amplified resist SU-8 on Si substrate. A study of the proximity effect parameters a, b and h is carried out to model and control the electron scattering both in the resist and in the substrate, and the SU-8 standard processing conditions are changed to achieve a low contrast process. The determination of the SU-8 / Si proximity effect parameters and its dependence with resist depth is done employing an experimental method and through Monte Carlo simulations. First, a, b and h are obtained comparing exposed patterns calculated by the software PROXY. b, the parameter which measures the backscattering of the electrons by the substrate, is equal to 4m and the value of h, the ratio of the dose contribution of backscattered electrons to that of the forward scattered (related to a), is 0.7. The extrapolation of exposed patterns data is used to estimate the scanning electron microscope beam diameter through the equation for low angle scattering (a = 128nm at the resist surface) and the lateral resolution of the process is determined (a = 800nm at the resist/ substrate interface, for a 2.4m film). With aid of the software CASINO, Monte Carlo simulations of the scattering trajectories of electrons in substrate and resist materials are calculated, recording the energy that they dissipate through collisions along their path. The results obtained representing the profile of the energy dissipated in the resist are used to determine the proximity effect parameters. The experimental method results are compared to that obtained by simulation. Regarding the SU-8 processing, the process parameters for the fabrication of three-dimensional structures by electron-beam lithography are determined. The process is designed to have specifications (thickness, contrast, sensitivity and surface roughness) suitable for microoptical elements fabrication. It begins with the determination of the SU-8 contrast curve and its sensitivity for specific post-exposure bake temperatures. A below the unit contrast process with high sensitivity (2C/cm2) is achieved postannealing the sample below the resist glass transition temperature. The film surface roughness is measured after resist development for different exposure doses, and a controlled hardbake (cure) and reflow is carried to enhance both the mechanical properties and the surface roughness of the structures that will remain as part of the final device. A RMS roughness of 40nm, lower than 20 times the wavelength of consumer electronics laser diode, is obtained. The electron-beam process designed is applied to the fabrication of a microelement with a 16-level profile discretization.

Pour adresser les nœuds technologiques avancés dans le cadre de la lithographie électronique, une nouvelle stratégie de correction des effets de proximité a été imaginée pour prendre le relai de la technique standard de modulation de dose. Dans ces travaux de thèse, les effets de proximité ont été analysés sur les outils e-beam de dernière génération au sein du LETI. Les limites de la modulation de dose ont aussi été évaluées. Parallèlement, une approche plus fondamentale, basée sur la simulation, a permis de mieux comprendre l'impact des différentes étapes du procédé de lithographie sur les motifs réalisés. Une nouvelle stratégie de correction avancée, appelée exposition multiple, a ensuite été mise au point. Celle-ci fait intervenir des motifs spécifiques appelés eRIF (electron Resolution lmprovement Features) dont l'exposition, couplée à celle des motifs initiaux permet de mieux contrôler la répartition de la dose injectée dans la résine. On parle alors d'expositions multiples. Au cours de ces travaux le positionnement des eRIF, ainsi que leurs dimensions ont fait l'objet d'une étude approfondie. L'élaboration d'algorithmes d'optimisation et la réalisation d'expérimentations en salle blanche ont permis d'optimiser ces paramètres et de mettre en évidence les gains apportés par les eRIF. Par rapport à la modulation de dose, des améliorations significatives ont pu être démontrées sur de véritables circuits intégrés. Grâce à l'exposition multiple, la résolution ultime des outils de lithographie e-beam a été repoussée de 2 nœuds technologiques pour les niveaux les plus critiques d'un circuit. Les règles de dessin retenues pour réaliser les eRIF ont ensuite été intégrées dans des modèles de corrections. via le logiciel de préparation de données INSCALE d'ASELTA NANOGRAPHICS pour assurer une correction automatisée des circuits. / In electron beam lithography, a new proximity affects correction strategy has been imagined to push the resolution capabilities beyond the limitations of the standard dose modulation. In this work, the proximity affects inherent to e-beam lithography have been studied on the newest e-beam tools available at LETI. First, the limits of the standard dose modulation correction have been evaluated. The influences of each step of the lithographic process have also been analyzed from a theoretical point a view. A simulation approach was built and used to determine the impact of each of these steps on the patterned features. Then, a new writing strategy has been fully developed. It involves sub resolution features known as eRIF (electron Resolution Improvement features) which provide a finer control of the dose profile into the resist. Since the eRIF are exposed a top the nominal features, this new writing strategy is called multiple pass exposure. In this work, the position, the dose and the design of the eRIF have been studied and optimized to get the best of this new strategy. To do so, experiments were led in a clean room environment, and minimization algorithms have been developed. It has been demonstrated that the eRIF provide a significant gain compared to the standard dose modulation. Improvements have been observed even on the most critical levels of the Integrated circuits. By using the multiple pass exposure with optimized eRIF, the resolution capabilities of the e-beam tool have been reduced by 2 technological nodes. The design rules that have been determined to use the eRIF the most efficient way were finally implemented in INSCALE, the new data preparation software developed by ASELTA NANOGRAPHICS. This way, multiple pass exposure can be used in an automated mode to correct full layouts.

O presente trabalho tem como objetivo desenvolver um processo de fabricação de elementos micro-ópticos utilizando-se litografia por feixe de elétrons, empregando o resiste SU-8, negativo e amplificado quimicamente, sobre substrato de Si. Para tanto, é realizado o estudo dos parâmetros do efeito de proximidade a, b e h para se modelar e controlar os efeitos do espalhamento dos elétrons no resiste e no substrato, e se altera o processamento convencional do SU-8 para se obter um processo com baixo contraste. A determinação dos parâmetros do efeito de proximidade para o sistema de escrita direta e amostra SU-8 / Si é feita experimentalmente e por simulação de Monte Carlo. Particularmente, verifica-se a dependência dos mesmos com a profundidade do resiste. Primeiramente utilizando o software PROXY, obtêm-se a, b e h da observação de padrões de teste revelados. Chega-se a 4m para o parâmetro () que mede o retroespalhamento dos elétrons pelo substrato e 0,7 para a relação (h) entre a intensidade destes com aquela dos elétrons diretamente espalhados pelo resiste (alcance dado por a). Ainda, com esses dados, estima-se o diâmetro do feixe do microscópio eletrônico de varredura a partir da equação de aproximação de espalhamento direto para pequenos ângulos (a = 128nm na superfície do resiste) e se determina a resolução lateral do processo (a = 800nm na interface resiste/ substrato, para um filme de 2,4m). Em seguida, usa-se o software CASINO para se calcular os parâmetros de proximidade a partir da curva de densidade de energia dissipada no resiste obtida pela simulação da trajetória de espalhamento dos elétrons. Confrontam-se, finalmente, os valores obtidos pelos dois métodos. Em relação ao processamento do resiste SU-8, são determinadas as condições experimentais para a fabricação de estruturas tridimensionais por litografia de feixe de elétrons. Especificamente, busca-se desenvolver um processo com características (espessura, contraste, sensibilidade e rugosidade) adequadas para a fabricação de micro-dispositivos ópticos. Inicia-se com o levantamento das curvas de contraste e da sensibilidade do SU-8 para determinadas temperaturas de aquecimento pós-exposição. Obtém-se contraste abaixo de 1 para aquecimento pós-exposição abaixo da temperatura de transição vítrea do resiste, mantendo-se sensibilidade elevada (2C/cm2). Em seguida, mede-se a rugosidade da superfície do filme revelado para diferentes doses de exposição. Para finalizar, submete-se a amostra a um processo de cura e escoamento térmico, para melhorar a dureza e a rugosidade do resiste a ser utilizado como dispositivo final Consegue-se um valor de rugosidade (40nm) inferior a 20 vezes o comprimento de onda de diodo laser de eletrônica de consumo. Por fim, é produzido um dispositivo com perfil discretizado em 16 níveis como prova de conceito. / This work aims at developing an electron-beam lithography process for the fabrication of microoptical elements using the negative tone chemically amplified resist SU-8 on Si substrate. A study of the proximity effect parameters a, b and h is carried out to model and control the electron scattering both in the resist and in the substrate, and the SU-8 standard processing conditions are changed to achieve a low contrast process. The determination of the SU-8 / Si proximity effect parameters and its dependence with resist depth is done employing an experimental method and through Monte Carlo simulations. First, a, b and h are obtained comparing exposed patterns calculated by the software PROXY. b, the parameter which measures the backscattering of the electrons by the substrate, is equal to 4m and the value of h, the ratio of the dose contribution of backscattered electrons to that of the forward scattered (related to a), is 0.7. The extrapolation of exposed patterns data is used to estimate the scanning electron microscope beam diameter through the equation for low angle scattering (a = 128nm at the resist surface) and the lateral resolution of the process is determined (a = 800nm at the resist/ substrate interface, for a 2.4m film). With aid of the software CASINO, Monte Carlo simulations of the scattering trajectories of electrons in substrate and resist materials are calculated, recording the energy that they dissipate through collisions along their path. The results obtained representing the profile of the energy dissipated in the resist are used to determine the proximity effect parameters. The experimental method results are compared to that obtained by simulation. Regarding the SU-8 processing, the process parameters for the fabrication of three-dimensional structures by electron-beam lithography are determined. The process is designed to have specifications (thickness, contrast, sensitivity and surface roughness) suitable for microoptical elements fabrication. It begins with the determination of the SU-8 contrast curve and its sensitivity for specific post-exposure bake temperatures. A below the unit contrast process with high sensitivity (2C/cm2) is achieved postannealing the sample below the resist glass transition temperature. The film surface roughness is measured after resist development for different exposure doses, and a controlled hardbake (cure) and reflow is carried to enhance both the mechanical properties and the surface roughness of the structures that will remain as part of the final device. A RMS roughness of 40nm, lower than 20 times the wavelength of consumer electronics laser diode, is obtained. The electron-beam process designed is applied to the fabrication of a microelement with a 16-level profile discretization.

Kyoto University (京都大学) / 0048 / 新制・課程博士 / 博士(工学) / 甲第16851号 / 工博第3572号 / 新制||工||1540(附属図書館) / 29526 / 京都大学大学院工学研究科材料工学専攻 / (主査)教授 杉村 博之, 教授 酒井 明, 准教授 鈴木 基史 / 学位規則第4条第1項該当

This thesis deals with grayscale e-beam lithography and diffractive optical elements fabrication. Three topics are addressed. The first topic is combined grayscale e-beam lithography. The goal of this task is combining exposures performed by two systems with various beam energies. This combined technique leads to a better usage of both systems because various structures can be more easily prepared by one electron beam energy than by the other. The next topic is the optimization of shape borders of exposing structures that are defined by image input. The influence of such optimization on exposure data preparation is evaluated, as well as the exposure time and the change of optical properties of testing structures. The possibility of deep multilevel diffractive optical element fabrication in plexiglass blocks is researched as the third topic. Plexiglass can replace the system of a resist and a substrate. A new approach to writing down the structures by electron beam is presented, minimizing thermal stress on the plexiglass block during the exposure. The writing method also improves the homogeneity of exposed motifs. A method for computing the exposure dose for specific multilevel structures was designed. This method is based on the existing model of proximity effect computation and it minimizes the computing time necessary to obtain the exposure doses.