O presente trabalho descreve o desenvolvimento e implementação de duas configurações distintas de um receptor optoeletrônico integrado. A primeira configuração é similar a um projeto encontrado na literatura mas apresenta diversas modificações que lhe conferiram melhor desempenho em comparação ao projeto original. A segunda configuração é uma nova proposta deste trabalho. O receptor foi desenvolvido e implementado visando sua aplicação em redes de comunicações ópticas passivas (PONs) de alta velocidade comutadas a pacote, para possibilitar a utilização da técnica de multiplexação em comprimento de onda (WDM), aumentando assim a capacidade de transmissão da rede, em particular no ramo de ligação da rede de serviços com o usuário final, denominado rede de acesso. O principal objetivo do receptor aqui desenvolvido foi proporcionar uma sintonia rápida entre os canais disponíveis na rede, possibilitando sua seleção num tempo inferior àquele necessário para a transmissão de um único pacote de informação, diminuindo assim o atraso de sintonia e, por conseguinte, a perda de informação. Para tanto, os circuitos integrados implementados e caracterizados referem-se aos circuitos de chaveamento eletrônico e do amplificador de transimpedância das duas configurações investigadas. Os dados experimentais obtidos para as duas configurações confirmaram a previsão de chaveamento dos canais de entrada num intervalo de tempo da ordem de alguns nanosegundos, o que é totalmente compatível com a velocidade de transmissão das aplicações a que se destina este receptor (aproximadamente 5 Gbits/s). Adicionalmente, são apresentados os dados experimentais relativos à freqüência de corte, ganho direto, isolação, relação on/off e características de ruído dos circuitos implementados. / The present work describes the design and implementation of two configurations of an integrated optoelectronic receiver. The first one is similar to a previously reported design but with some modifications to improve its performance. The second one is a new proposal of this work. The goal of the receiver design and implementation was its application in high bit rate packet-switched passive optical networks (PONs) employing the wavelength division multiplexing (WDM) technique to increase the network capacity, in particular on the connection branch of the network core with the final user, the access network. The main goal of the receiver design was to achieve a fast channel tuning, allowing a tuning time smaller than the required for the transmission of a single information packet, decreasing the tuning latency and, therefore, the rate of information packet loss. In order to accomplish this goal, the implemented and tested integrated circuits include the electronic switching circuit and the transimpedance amplifier for both configurations investigated. The measured data for both configurations confirm the expected input channel switching time results, of about a few nanoseconds, which is certainly useful for the expected bit rate of operation (approximate 5 Gbps). Additionally, experimental results concerning cutoff frequency and bandwidth, direct gain, isolation, on/off ratio, and noise characteristics of both implemented circuits are presented.

Zweidimensionale (2D) Übergangsmetalldichalcogenide (TMDCs) gehören zu den attraktivsten neuen Materialien für optoelektronische Bauelemente der nächsten Generation. Um die überlegene Funktionalität der mit TMDCs verbundenen Bauelemente zu realisieren, ist ein umfassendes Verständnis ihrer elektronischen Struktur, einschließlich, aber nicht beschränkt auf die Auswirkungen von Defekten auf die elektronischen Eigenschaften und die Ausrichtung der Energieniveaus (ELA) an den TMDCs-Grenzflächen, unerlässlich, aber derzeit nicht ausreichend. Um einen tieferen Einblick in die elektronischen Eigenschaften von TMDCs und den damit verbundenen Grenzflächen in Kombination mit molekularen Halbleitern (MSCs) zu erhalten, untersuchen wir i) die fundamentale Bandstruktur von Monolagen (ML) TMDCs und die durch Schwefelfehlstellen (SVs) induzierte Renormierung der Bandstruktur, um eine solide Grundlage für ein besseres Verständnis der elektronischen Eigenschaften von polykristallinen dünnen Filmen zu schaffen, und ii) die optoelektronischen Eigenschaften ausgewählter MSC/ML-TMDCs-Grenzflächen. Darüber hinaus wird iii) der Einfluss des Substrats auf die elektronischen Eigenschaften einer MSC/ML-TMDC-Grenzfläche untersucht, um das Bauelementedesign zu steuern. Die Charakterisierung erfolgt hauptsächlich durch winkelaufgelöste Photoelektronenspektroskopie (ARPES), ergänzt durch Photolumineszenz (PL), Raman-Spektroskopie, UV-Vis-Absorption, Rastertransmissionselektronenmikroskopie (TEM) und Rasterkraftmikroskopie (AFM). Unsere Ergebnisse tragen zu einem besseren Verständnis der Auswirkungen von Defekten auf ML-TMDC und verwandte Grenzflächen mit MSCs bei, wobei auch die Auswirkungen der Substrate berücksichtigt werden, und sollten dazu beitragen, unser Verständnis des elektronischen Verhaltens in TMDC-verwandten Geräten zu verbessern. / Two-dimensional (2D) transition metal dichalcogenides (TMDCs) are amongst the most attractive emerging materials for next-generation optoelectronic devices. To realize the superior functionality of the TMDCs related devices, a comprehensive understanding of their electronic structure, including but not limited to the impact of defects on the electronic properties and energy level alignment (ELA) at TMDCs interfaces, is essential but presently not sufficient. In an attempt to get a deep insight into the electronic properties of TMDCs and the related interfaces combined with molecular semiconductors (MSCs), we investigate i) the fundamental band structure of monolayer (ML) TMDCs and band structure renormalization induced by sulfur vacancies (SVs), in order to provide a solid foundation for a better understanding the electronic properties of polycrystalline thin films and ii) the optoelectronic properties of selected MSC/ML-TMDC interface. In addition, iii) the impact of the substrate on the electronic properties of the MSC/ML-TMDC interface is investigated for guiding device design. The characterization is mainly performed by using angle-resolved photoelectron spectroscopy (ARPES), with complementary techniques including photoluminescence (PL), Raman spectroscopies, UV-vis absorption, scanning transmission electron microscopy (TEM), and atomic force microscopy (AFM) measurements. Our findings contribute to achieving a better understanding of the impact of defects on ML-TMDC and related interfaces with MSCs considering the substrates’ effect and should help refine our understanding of the electronic behavior in TMDC-related devices.

L’émergence d’interrupteurs de puissance en SiC permet d’envisager des convertisseurs de puissance capables de fonctionner au sein des environnements sévères tels que la haute tension (> 10 kV ) et la haute température (> 300 °C). Aucune solution de commande spécifique à ces environnements n’existe pour le moment. Le développement de fonctions élémentaires en SiC (comparateur, oscillateur) est une étape préliminaire à la réalisation d’un premier démonstrateur. Plusieurs laboratoires ont développé des fonctions basées sur des transistors bipolaires, MOSFETs ou JFETs. Cependant les recherches ont principalement portées sur la conception de fonctions logiques et non sur l’intégration de drivers de puissance. Le laboratoire AMPERE (INSA de Lyon) et le Centre National de Microélectronique de Barcelone (Espagne) ont conçu un MESFET latéral double grille en SiC. Ce composant élémentaire sera à la base des différentes fonctions intégrées envisagées. L’objectif de ces recherches est la réalisation d’un convertisseur élévateur de tension "boost" monolithique et de sa commande en SiC. La démarche scientifique a consisté à définir dans un premier temps un modèle de simulation SPICE du MESFET SiC à partir de caractérisations électriques statique et dynamique. En se basant sur ce modèle, des circuits analogiques tels que des amplificateurs, oscillateurs, paires différentielles, trigger de Schmitt ont été conçus pour élaborer le circuit de commande (driver). La conception de ces fonctions s’avère complexe puisqu’il n’existe pas de MESFETs de type P et une polarisation négative de -15 V est nécessaire au blocage des MESFETs SiC. Une structure constituée d’un pont redresseur, d’un boost régulé avec sa commande basée sur ces différentes fonctions a été réalisée et simulée sous SPICE. L’ensemble de cette structure a été fabriqué au CNM de Barcelone sur un même substrat SiC semi-isolant. L’intégration des éléments passifs n’a pas été envisagée de façon monolithique (mais pourrait être considérée pour les inductances et capacités dans la mesure où les valeurs des composants intégrés sont compatibles avec les processus de réalisation). Le convertisseur a été dimensionné pour délivrer une de puissance de 2.2 W pour une surface de 0.27 cm2, soit 8.14 W/cm2. Les caractérisations électriques des différents composants latéraux (résistances, diodes, transistors) valident la conception, le dimensionnement et le procédé de fabrication de ces structures élémentaires, mais aussi de la majorité des fonctions analogiques. Les résultats obtenus permettent d’envisager la réalisation d’un driver monolithique de composants Grand Gap. La perspective des travaux porte désormais sur la réalisation complète du démonstrateur et sur l’étude de son comportement en environnement sévère notamment en haute température (> 300 °C). Des analyses des mécanismes de dégradation et de fiabilité des convertisseurs intégrés devront alors être envisagées. / The new SiC power switches is able to consider power converters, which could operate in harsh environments as in High Voltage (> 10kV) and High Temperature (> 300 °C). Currently, they are no specific solutions for controlling these devices in harsh environments. The development of elementary functions in SiC is a preliminary step toward the realization of a first demonstrator for these fields of applications. AMPERE laboratory (France) and the National Center of Microelectronic of Barcelona (Spain) have elaborated an elementary electrical compound, which is a lateral dual gate MESFET in Silicon Carbide (SiC). The purpose of this research is to conceive a monolithic power converter and its driver in SiC. The scientific approach has consisted of defining in a first time a SPICE model of the elementary MESFET from electric characterizations (fitting). Analog functions as : comparator, ring oscillator, Schmitt’s trigger . . . have been designed thanks to this SPICE’s model. A device based on a bridge rectifier, a regulated "boost" and its driver has been established and simulated with the SPICE Simulator. The converter has been sized for supplying 2.2 W for an area of 0.27 cm2. This device has been fabricated at CNM of Barcelona on semi-insulating SiC substrate. The electrical characterizations of the lateral compounds (resistors, diodes, MESFETs) checked the design, the "sizing" and the manufacturing process of these elementary devices and analog functions. The experimental results is able to considerer a monolithic driver in Wide Band Gap. The prospects of this research is now to realize a fully integrated power converter in SiC and study its behavior in harsh environments (especially in high temperature > 300 °C). Analysis of degradation mechanisms and reliability of the power converters would be so considerer in the future.

<p>This dissertation describes how the surface chemistries of 2D nanomaterials can be modified to alter overall material properties. Specifically, through a focus of the ligand-surface atom bonding in addition to the overall ligand structure we highlight the ability to direct morphological outcomes in lead free halide perovskites, maximize optoelectronic responses in substoichiometric tungsten oxide, and alter physicochemical properties titanium carbide MXenes.   </p>