Polarization dependences of optical devices in highly-integrated optical systems become a major problem. To overcome this issue, one can implement polarization diversity scheme to achieve a single polarization on-chip network. One of the essential components in a polarization diversity scheme is the polarization beam splitter (PBS). In this thesis, we will a PBS based on a silicon-on-insulator (SOI) platform with reduced device size and broad operation bandwidth. We use the three-dimensional Finite-Difference Time-Domain (3D-FDTD) method to perform the simulation. First, we use two asymmetric waveguides to design an asymmetric directional coupler with only TE-like mode phase matching condition. We then tape the lower waveguide to keep the TE-polarized light, and split the TE- and TM- polarized light. By utilizing an asymmetrical directional coupler with a tapered waveguide, we have achieved a 7.3

Thesis (M. App. Sc.)--Carleton University, 2004. / Includes bibliographical references (p. 110-113). Also available in electronic format on the Internet.

No description available.

<p>A glass-clad, slow-light photonic-crystal waveguide is proposed as a solution to sub-bandgap light detection in silicon photonic circuits. Such detection in silicon is perceived as a challenge owing to silicon's indirect band gap and transparency to 1550nm wavelengths, yet is essential for achieving low-cost, high-yield integration with today's microelectronics industry. Photonic crystals can be engineered in such a way as to enhance light-matter interaction over a specific bandwidth via the reduction of the group velocity of the propagating wave (i.e. the slowing of light). The interaction enhanced for light detection in the present work is electron-hole pair generation at defect sites. The intrinsic electric field of a p-i-n junction enables light detection by separating the electron-hole pairs as a form of measurable current. The photonic-crystal waveguides are designed to have bandwidths in the proximity of a wavelength of 1550nm. Refractive indices of over 80 near the photonic-crystal waveguide's Brillouin zone boundary are measured using Fourier transform spectral interferometry and are found to correspond to numerical simulations. Defect-induced propagation loss was seen to scale with group index, from 400dB/cm at a group index of 8 to 1200dB/cm at a group index of 88. Scaling was sublinear, which is believed to be due to the spreading of modal volume at large group index values. Photodetectors were measured to have responsivities as high as 34mA/W near the photonic-crystal waveguide's Brillouin zone boundary for a reverse bias of 20V and a remarkably short detector length of 80um. The fabrication of each device is fully CMOS-compatible for the sake of cost-effective integration with silicon microelectronics.</p> / Master of Applied Science (MASc)

À la base de l’évolution de la technologie microélectronique actuelle, la réduction des dimensions critiques des MOSFET standards pour améliorer leurs performances électriques a atteint depuis quelques années ses limites physiques. L’utilisation de nanocomposants innovateurs ayant une configuration planaire, comme solution de remplacement, semble être une voie prometteuse pour certaines applications. Les diodes autocommutantes, Self-Switching Diodes (SSD), en font partie. Les SSD sont des composants unipolaires à deux accès ayant une caractéristique I-V non-linéaire semblable à celle d’une diode bipolaire. Leur configuration planaire rend leur fabrication plus facile et réduit considérablement les capacités parasites intrinsèques. Cette thèse porte sur la fabrication, la simulation et la caractérisation électrique de SSD fabriquées sur des substrats en SOI (Silicon-On-Insulator). Les dispositifs SSD ont été réalisés au départ grâce à des gravures par FIB (Focussed Ion Beam). Cette technique polyvalente nous permet de contrôler en temps réel les conditions de gravure. Par la suite, nous avons procédé à une fabrication massive de SSD en utilisant la technique d’électrolithographie et de gravure sèche. Les simulations effectuées principalement avec TCAD-Medici nous ont permis d’optimiser et d’investiguer en détails l’effet critique des paramètres géométriques (longueur, largeur et épaisseur du canal conducteur ainsi que la largeur des tranchées isolantes) et des paramètres physiques (densité surfacique aux niveaux des interfaces isolant/semiconducteur, densité des dopants et type de diélectrique dans les tranchées isolantes) des SSD sur les caractéristiques électriques, les valeurs de la tension seuil et les phénomènes de transport non linéaire qui ont lieu dans le canal conducteur de ce type de composants. Les mesures expérimentales de caractéristiques I-V de SSD ayant des canaux conducteurs de largeurs et de longueurs variables confirment les prévisions de nos simulations. Bien que le comportement électrique des SSD ressemble à celui d’un MISFET, nous démontrons le fait que l’on ne peut modéliser leurs caractéristiques I-V avec les mêmes expressions en nous basant sur le principe de fonctionnement spécifique à chacun de ces deux dispositifs.

Ce travail de thèse est consacré à l’étude expérimentale des mécanismes de démouillage de films solides d’épaisseur nanométrique conduisant à la transformation d’un film mince en une assemblée d’îlots tridimensionnels. L’utilisation de la microscopie à électrons lents (LEEM) nous a permis d’étudier la morphologie et la cinétique in situ et en temps réel du démouillage de films de Si/SiO2 (SOI) et de Ge/SiO2 (GOI) obtenus par collage moléculaire (procédé Smart Cut™). Ces mesures expérimentales ont été complétées par des analyses par diffusion centrale des rayons X en incidence rasante (GISAXS) et des observations ex situ par microscopie à force atomique (AFM). Les mécanismes de démouillage de SOI et GOI sont thermodynamiquement pilotés par la capillarité et cinétiquement contrôlés par la diffusion de surface. L’étude complémentaire du démouillage à partir de fronts cristallographiquement orientés obtenus par lithographie nous a permis d’analyser le rôle central du facettage, de l’anisotropie cristalline et des processus de formation du bourrelet de démouillage. En particulier, le rôle de la nucléation 2D sur la cinétique d’épaississement (couche par couche) du bourrelet a pu être mis en évidence. Les résultats expérimentaux ont pu être confrontés à des modèles analytiques et des simulations de type Monte Carlo cinétique. Nous en avons déduit les valeurs des paramètres physiques pertinents et avons attribué les différences de morphologies entre SOI et GOI à la présence de facettes spécifiques. / This work is devoted to the experimental study of the dewetting mechanisms of ultrathin solid films by which a metastable film transforms into an assembly of tridimensional crystallites. Using low energy Electron Microscopy (LEEM) we analyse, in situ and in real time, the morphology and the kinetics of the dewetting of Si/SiO2 (SOI) and Ge/SiO2 (GOI) systems obtained by molecular bonding (Smart Cut™ process). Further information has been obtained by Grazing Incidence Small Angle X–ray Scattering (GISAXS) and Atomic Force Microscopy (AFM) measurements. We show that the dewetting is driven by surface free energy minimization and mediated by surface diffusion. A complementary study of artificial well-oriented dewetting fronts obtained by lithography enables us to analyze the important role played by facets, the crystal anisotropy and the rim thickening mechanism. We show that the rim thickening proceeds in a layer-by-layer mode and is limited by 2D nucleation. Thanks to analytical models and Kinetics Monte Carlo simulations, numerical values of the pertinent physical parameters involved in the dewetting process are obtained and the morphological differences between SOI and GOI are attributed to the presence of specific facets.

Les systèmes optomécaniques, dans lesquels les vibrations d'un résonateur mécanique sont couplées à un rayonnement électromagnétique, ont permis l'examen de multiples nouveaux effets physiques. Afin d'exploiter pleinement ces phénomènes dans des circuits réalistes et d'obtenir différentes fonctionnalités sur une seule puce, l'intégration des résonateurs optomécaniques est obligatoire. Ici nous proposons une nouvelle approche pour la réalisation de systèmes intégrés et hétérogènes comportant des cavités à cristaux photoniques bidimensionnels au-dessus de guides d'ondes en silicium-sur-isolant. La réponse optomécanique de ces dispositifs est étudiée et atteste d'un couplage optomécanique impliquant à la fois les mécanismes dispersifs et dissipatifs. En contrôlant le couplage optique entre le guide d'onde intégré et le cristal photonique, nous avons pu varier et comprendre la contribution relative de ces couplages. Cette plateforme évolutive permet un contrôle sans précédent sur les mécanismes de couplage optomécanique, avec un avantage potentiel dans des expériences de refroidissement et pour le développement de circuits optomécaniques multi-éléments pour des applications tels que le traitement du signal par effets optomécaniques. / Optomechanical systems, in which the vibrations of a mechanical resonator are coupled to an electromagnetic radiation, have permitted the investigation of a wealth of novel physical effects. To fully exploit these phenomena in realistic circuits and to achieve different functionalities on a single chip, the integration of optomechanical resonators is mandatory. Here, we propose a novel approach to heterogeneously integrated arrays of two-dimensional photonic crystal defect cavities on top of silicon-on-insulator waveguides. The optomechanical response of these devices is investigated and evidences an optomechanical coupling involving both dispersive and dissipative mechanisms. By controlling optical coupling between the waveguide and the photonic crystal, we were able to vary and understand the relative strength of these couplings. This scalable platform allows for unprecedented control on the optomechanical coupling mechanisms, with a potential benefit in cooling experiments, and for the development of multi-element optomechanical circuits in the frame of optomechanically-driven signal-processing applications.

Este trabalho mostra a comparação dos efeitos das falhas provocadas pelos Single-Event Effects em dispositivos 28nm FDSOI, 28nm FDSOI High-K e 32nm Bulk CMOS e células de memória 6T SRAM feitas com estes dispositivos. Para conseguir isso, foram usadas ferramentas TCAD para simular falhas transientes devido a impacto de íons pesados a nível dispositivo e nível circuito. As simulações neste ambiente tem como vantagem a simulação dos fatos e mecanismos que produz as falhas transientes e seus efeitos nos dispositivos, além de também servir para projetar virtualmente estes dispositivos e caraterizar eles para estas simulações. Neste caso, foram projetados três dispositivos para simulação: um transistor NMOS de 32nm Bulk, um transistor NMOS de 28nm FDSOI e um transistor NMOS de 28nm FDSOI High-K para fazer comparações entre eles. Estes dispositivos foram projetados, caraterizados e testados contra o impacto de íons pesados a níveis dispositivo e circuito. Como resultado obtido, transistor Bulk de 32nm teve, no pior caso, uma carga coletada de 7.57 e 7.19 vezes maior que a carga coletada pelo dispositivo FDSOI de 28nm e FDSOI High-K de 28nm respectivamente atingido pelo mesmo íon pesado de 100MeV-cm2/mg. Com estes dados foi possível modelar o comportamento da carga coletada de ambos dispositivos usando este íon pesado, atingindo os terminais de Fonte e Dreno em distintos lugares e ângulos. Usando a mesma ferramenta e os dados obtidos de carga coletada pelos testes anteriores, foram projetadas células de memória SRAM de 6 transistores. Isso foi para testar elas contra os efeitos do impacto de íons pesados nos transistores NMOS de armazenagem da dados. Neste caso, a Transferência Linear de Energia (LET) do íon necessária para fazer que o dado armazenado na SRAM Bulk mude é 12.8 vezes maior que no caso da SRAM FDSOI e 10 maior no caso da SRAM FDSOI High-K, embora a quantidade de carga coletada necessária para que o dado mude em ambas células seja quase a mesma. Com estes dados foi possível modelar os efeitos dos íons pesados em ambos circuitos, descobrir a Carga Crítica destes e qual é o mínimo LET necessário para que o dado armazenado nestas SRAMs mude. / This work shows a comparison of faults due to Single-Event Effects in 28nm Fully Depleted SOI (FDSOI), 28nm FDSOI High-K and 32nm Bulk CMOS devices, and in 6T SRAM memory cells made with these devices. To provide this, was used TCAD tools to simulate transient faults due to heavy ion impacts on device and circuit levels. The simulations in that environment have the advantage to simulate the facts and mechanisms which produce the transient faults and this effects on the electronic devices, it also allow to simulate the virtual device fabrication and to characterize them. In this case, two devices were created for the simulations: a 32nm Bulk NMOS transistor and a 28nm FDSOI NMOS transistor for compare them. These devices were created, characterized and tested against heavy ion impacts at device and circuit levels. The results show that 32nm Bulk transistor has, in the worst case, a collected charge 7.57 and 7.19 times greater than the 28nm FDSOI and 28nm FDSOI High-K respectively collected charge with the same 100MeV-cm2/mg heavy ion. With these data it was possible to model the behavior of the collected charge in both devices with the same heavy-ion, reach the Source and Drain Terminal in different places and angles. Using the same tools and the obtained collected charge data of previous simulations, it was designed 6 transistors SRAM Memory Cells. That is done to test these circuits against the heavy ion effects on the data-storage NMOS transistor. In this case, the necessary Ion Linear Energy Transfer (LET) to flip the Bulk SRAM is 12.8 greater than the FDSOI SRAM and 10 times greater than the FDSOI High- K SRAM case, although the amount of charge to flip the cells is almost the same in both cases. With these data it was possible to model the heavy-ion effects in both circuits, discover the Critical Charge of them and the minimum LET to flips these SRAMs.

Cette thèse s’intéresse à une technique de caractérisation particulièrement bien adaptée à l’étude de couches diélectriques ultra-minces sur semiconducteurs. La génération de seconde harmonique (SHG) est une méthode très prometteuse, basée sur l’optique non-linéaire. Un laser est focalisé sur l'échantillon à caractériser et le signal à deux fois la fréquence fondamentale est mesuré. Pour les matériaux centrosymétriques comme c-Si, SiO2 et Al2O3, le signal SHG est dû aux défauts et au champ électrique Edc d’interface (induit par les charges préexistantes Qox et/ou piégées au niveau des pièges d’interface Dit). La SHG donne ainsi accès à la qualité des interfaces entre diélectriques/semiconducteurs. Néanmoins, le signal SHG dépend aussi des phénomènes de propagation optique dans les structures multicouches. Pour cette raison, nous avons développé un programme de simulation qui prend en compte les phénomènes optiques et les champs électriques statiques aux interfaces. Nous avons utilisé la SHG pour analyser la qualité de passivation de structures Al2O3/Si préparées avec des procédés différents et nous avons montré une corrélation entre SHG et mesure de durée de vie des porteurs de charges. Les valeurs de Qox et Dit ont été extraites par des mesures de capacité-tension et elles ont permis de calculer le champ Edc. La simulation optique, avec les valeurs extraites de Edc a permis de reproduire les données expérimentales de SHG dans ces structures. La SHG a été utilisée également pour la caractérisation des substrats Silicium-sur-Isolant (SOI). Pour les structures SOI épaisses, la simulation et les résultats expérimentaux ont montré que la réponse SHG est dominée par les interférences optiques (faible impact de Edc). Pour les structures SOI ultraminces, les interfaces sont couplées électriquement et des valeurs de Edc sont nécessaires pour reproduire les données expérimentales par simulation. Cela implique que pour les SOI ultraminces, la SHG pourrait donner accès aux champs électriques au niveau des interfaces d’une manière non-destructive. / This PhD work was developed in the context of research for novel characterization methods for ultra-thin dielectric films on semiconductors and their interfacial quality. Second harmonic generation (SHG) is a very promising non-invasive technique based on nonlinear optics. A laser emitting at the fundamental frequency is incident upon the sample which responds through its 2nd order polarization, generating a signal at twice the fundamental frequency. For centrosymmetric materials such as c-Si, amorphous SiO2 or Al2O3, the SHG signal is mainly due to the defects and to the static electric field Edc present at the interface (due to pre-existing charges Qox and/or photo-injected charge trapping/detrapping at interface traps Dit). Thus, SHG measurement gives access to the quality of dielectric/semiconductor interfaces. Nevertheless, the SHG signal is also dependent on multilayer optical propagation phenomena. For this reason, we have developed a simulation program which accounts for the optical phenomena and the static electric fields at the interfaces. We have used SHG to monitor the passivation quality of Al2O3/Si structures prepared with different processes and showed a correlation between SHG and minority carrier lifetime measurements. Qox and Dit were extracted from capacitance-voltage measurements and helped calculating the Edc values. The optical simulation, fed with known Edc values reproduced the experimental SHG data in these structures. The SHG was also used for Silicon-on-Insulator (SOI) substrates characterization. In thick SOI structures, both simulations and experimental results show that the SHG response is mainly given by optical interferences (Edc has no impact). In ultrathin SOI, the interfaces are electrically coupled and Edc is needed as input in the simulation in order to reproduce the experimental SHG data. This implies that in ultrathin SOI, SHG can access the interface electric fields in a non-destructive way.

<p>High speed analog-to-digital converters (ADCs) used in, e.g., read channel and ultra wideband (UWB) applications are often based on a flash topology. The read channel applications is the intended application of this work, where a part of the work covers the design of two different types of 6-bit flash ADCs. Another field of application is UWB receivers.</p><p>To optimize the performance of the whole system and derive the specifications for the sub-blocks of the system it is often desired to use a topdown design methodology. To facilitate the top-down design methodology the ADCs are modeled on behavioral level. The models are simulated in MATLAB®. The results are used to verify the functionality of the proposed circuit topologies and serve as a base to the circuit design phase.</p><p>The first flash ADC has a conventional topology. It has a resistor net connected to a number of latched comparators, but its thermometer-tobinary encoder is based on 2-to-1 multiplexers buffered with inverters. This gives a compact encoder with a regular structure and short critical path. The main disadvantage is the code dependent timing difference between the encoder outputs introduced by this topology. The ADC was simulated on schematic level in Cadence® using the foundry provided transistor models. The design obtained a maximum sampling frequency of 1 GHz, an effective resolution bandwidth of 390 MHz, and a power consumption of 170 mW.</p><p>The purpose of the second ADC is to demonstrate the concept of introducing dynamic element matching (DEM) into the reference net of a flash ADC. This design yields information about the performance improvements the DEM gives, and what the trade-offs are when introducing DEM. Behavioral level simulations indicate that the SFDR is improved by 11 dB when introducing DEM, but the settling time of the reference net with DEM will now limit the conversion speed of the converter. Further, the maximum input frequency is limited by the total resistance in the reference net, which gets increased in this topology. The total resistance is the total switch on-resistance plus the total resistance of the resistors. To increase the conversion speed and the maximum input frequency a new DEM topology is proposed in this work, which reduces the number of switches introduced into the reference net compared with earlier proposed DEM topologies. The transistor level simulations in Cadence® of the flash ADC with DEM indicates that the SFDR improves by 6 dB compared with when not using DEM, and is expected to improve more if more samples are used in the simulation. This was not possible in the current simulations due to the long simulation time. The improved SFDR is however traded for an increased chip area and a reduction of the maximum sampling frequency to 550 MHzfor this converter. The average power consumption is 92 mW.</p><p>A goal of this work is to evaluate a 130 nm partially depleted silicon-oninsulator (SOI) complementary metal oxide semiconductor (CMOS) technology with respect to analog circuit implementation. The converters are therefore implemented in this technology. When writing this the ADCs are still being manufactured. Since the technology evaluation will be based on the measurement results the final results of the evaluation are not included in this thesis. The conclusions regarding the SOI CMOS technology are therefore based on a literature study of published scientific papers in the SOI area, information extracted during the design phase of the ADCs, and from the transistor level circuit simulations. These inputs indicate that to fully utilize the potential performance advantages of the SOI CMOS technology the partially depleted SOI CMOS technology should be exchanged for a fully depleted SOI CMOS technology. The manufacturing difficulties regarding the control of the thin-film thickness must however first be solved before the exchange can be done.</p> / Report code: LiU-Tek-Lic-2005:68.