Ion irradiation of tetrahedral amorphous carbon (ta-C) thin films induces a carbon phase transformation from the electrically insulating sp3 hybridization into the conducting sp2 hybridization. In this work, a detailed study on the electrical resistivity and the microstructure of areas, irradiated with several ion species at 30 keV energy is presented. Continuous ion bombardment yields a drastic drop of the resistivity as well as significant structural modifications of the evolving sp2 carbon phase. It is shown that the resistivity lowering can be attributed to the degree of graphitization in the film. Furthermore, the structural ordering processes are correlated with the ion deposited energy density. It is therefore revealed that the ion-induced phase transformation in ta-C films is a combination of sp3-to-sp2 conversion of carbon atoms and ion-induced ordering of the microstructure into a more graphite-like arrangement. All experiments were done with focused ion beam (FIB) systems by applying FIB lithography of electrical van-der-Pauw test structures. FIB lithography on ta-C layers is presented as a fast and easy technique for the preparation of electrically active micro- and nanostructures in an insulating carbon matrix.:Contents List of Figures iii List of Tables v List of Abbreviations vii 1. Introduction 1 2. Fundamentals 5 2.1. Ion-solid interactions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1.1. Scattering and stopping . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1.2. Ion range distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.1.3. Target modifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.1.4. Thermal driven segregation . . . . . . . . . . . . . . . . . . . . . . . . . . 18 2.2. Focused ion beams (FIBs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 2.2.1. Commercial gallium FIB (Ga + -FIB) . . . . . . . . . . . . . . . . . . . . . 24 2.2.2. Mass-separated FIB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 2.3. Tetrahedral amorphous carbon (ta-C) . . . . . . . . . . . . . . . . . . . . . . . . 26 2.3.1. Composition, microstructure and film properties . . . . . . . . . . . . . . 26 2.3.2. Growth mechanisms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 2.3.3. Electronic properties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 3. Experimental 39 3.1. Samples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 3.2. Apparatus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 4. Ion induced surface swelling 43 4.1. Fluence and energy dependence . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 4.2. Calculations of the swelling height . . . . . . . . . . . . . . . . . . . . . . . . . . 48 5. Electrical properties of irradiated ta-C 55 5.1. Electrical resistivity of as-implanted ta-C . . . . . . . . . . . . . . . . . . . . . . 55 5.1.1. Resistance of Ga + implanted micropatterns . . . . . . . . . . . . . . . . . 55 5.1.2. Sheet resistance of Ga + irradiated ta-C . . . . . . . . . . . . . . . . . . . 59 5.1.3. Determination of the sp 3 content . . . . . . . . . . . . . . . . . . . . . . . 62 5.1.4. The effect of different ion species . . . . . . . . . . . . . . . . . . . . . . . 65 5.1.5. Low temperature resistivity – The peculiarity of gallium . . . . . . . . . . 71 5.2. The effect of annealing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 5.3. Irradiation at elevated substrate temperatures . . . . . . . . . . . . . . . . . . . . 79 6. The microstructure of irradiated ta-C 87 6.1. Raman investigations of ion irradiated ta-C . . . . . . . . . . . . . . . . . . . . . 88 6.1.1. Fundamentals of Raman spectroscopy on amorphous carbon . . . . . . . . 88 6.1.2. Raman spectra of as-implanted ta-C . . . . . . . . . . . . . . . . . . . . . 93 6.1.3. Thermally driven graphitization of the microstructure . . . . . . . . . . . 98ii Contents 6.1.4. The correlation between microstructure and resistivity . . . . . . . . . . . 101 6.2. TEM investigations of ion irradiated ta-C . . . . . . . . . . . . . . . . . . . . . . 104 7. FIB lithography on ta-C layers 107 7.1. Graphitic nanowires . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 7.1.1. Nanowire dimensions – The resolution of FIB lithography . . . . . . . . . 108 7.1.2. Nanowire resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110 7.2. Electrical insulation between conducting structures . . . . . . . . . . . . . . . . . 113 8. Conclusions and Outlook 117 A. Gallium nanoparticles on ta-C layers 121 Bibliography 123

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Eine ortsauflösende Spannungs- und Dehnungssensortechnik soll durch die Nutzung magnetostriktiver Materialien auf der Oberfläche von Kohlenstoffeinzelfasern (C-Fasern) und Mikrofeinstrukturierung dieser Schichten erzeugt und zur elektronischen Überwachung des Belastungszustandes von sicherheits- oder servicerelevanten Faserverbundbauteilen eingesetzt werden. Eine auf lokaler Gasphasenabscheidung und Mikrostrukturierung mittels der Focused Ion Beam (FIB)-Technik beruhende Sensorfabrikationsmethode wurde gemeinsam mit dem Institut für Mikrotechnologie Hannover (imt) entwickelt. Mehrschichtig mittels CVD und PVD bedampfte und zusätzlich galvanisch beschichtete C-Fasern weisen neuartige Eigenschaften auf, die im vorgestellten Vorhaben am Lehrstuhl für Verbundwerkstoffe (LVW) charakterisiert wurden. Insbesondere die Untersuchung der verschiedenen Schichten sowie deren Interfaces nehmen eine bedeutende Rolle ein.

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The development of micro and nano-electromechanical systems (MEMS and NEMS) with entirely new or improved functionalities is typically based on novel or improved designs, materials and fabrication methods. However, today’s micro- and nano-fabrication is restrained by manufacturing paradigms that have been established by the integrated circuit (IC) industry over the past few decades. The exclusive use of IC manufacturing technologies leads to limited material choices, limited design flexibility and consequently to sub-optimal MEMS and NEMS devices. The work presented in this thesis breaks new ground with a multitude of novel approaches for the integration of non-standard materials that enable the fabrication of 3D micro and nanoelectromechanical systems. The objective of this thesis is to highlight methods that make use of non-standard materials with superior characteristics or methods that use standard materials and fabrication techniques in a novel context. The overall goal is to propose suitable and cost-efficient fabrication and integration methods, which can easily be made available to the industry. The first part of the thesis deals with the integration of bulk wire materials. A novel approach for the integration of at least partly ferromagnetic bulk wire materials has been implemented for the fabrication of high aspect ratio through silicon vias. Standard wire bonding technology, a very mature back-end technology, has been adapted for yet another through silicon via fabrication method and applications including liquid and vacuum packaging as well as microactuators based on shape memory alloy wires. As this thesis reveals, wire bonding, as a versatile and highly efficient technology, can be utilized for applications far beyond traditional interconnections in electronics packaging. The second part presents two approaches for the 3D heterogeneous integration based on layer transfer. Highly efficient monocrystalline silicon/ germanium is integrated on wafer-level for the fabrication of uncooled thermal image sensors and monolayer-graphene is integrated on chip-level for the use in diaphragm-based pressure sensors. The last part introduces a novel additive fabrication method for layer-bylayer printing of 3D silicon micro- and nano-structures. This method combines existing technologies, including focused ion beam implantation and chemical vapor deposition of silicon, in order to establish a high-resolution fabrication process that is related to popular 3D printing techniques. / <p>QC 20121207</p>

Ce travail a porté sur la caractérisation et la quantification en 3D de la répartition de charges de différents types (nanoparticules, nanotubes, etc.) dans des matrices polymères. Nous nous focalisons sur les techniques de tomographie en microscopie électronique. Une approche multiple en tomographie électronique a été réalisée : la tomographie en FIB/MEB (faisceau d’ions focalisé/microscope électronique à balayage), la tomographie en MEB et la tomographie en MET (microscope électronique en transmission). Les nanocomposites polymère sont généralement élaborés aux fins d’améliorer les propriétés physiques (mécanique, électrique, etc.) du matériau polymère constituant la matrice, grâce à une addition contrôlée de charges nanométriques. La caractérisation de tels matériaux, et l’établissement de corrélations précises entre la microstructure et les propriétés d’usage, requièrent une approche tri-dimensionnelle. En raison de la taille nanométrique des charges, la microscopie électronique est incontournable. Deux systèmes de nanocomposite polymère ont été étudiés par une approche multiple de tomographie électronique : P(BuA-stat-S)/MWNTs (copolymère statistique poly (styrène-co-acrylate de butyl) renforcé par des nanotubes de carbone multi-parois), et P(BuA-stat-MMA)/SiO2 (copolymère statistique poly(butyl acrylate-co-methyl methacrylate) renforcé par des nanoparticules de silice). Par combinaison de divers techniques, la caractérisation et la quantification des nanocharges ont été possibles. En particulier, la taille, la fraction volumique et la distribution des charges ont été mesurées. Cette étude a ainsi fourni des informations en 3D qui contribuent à mieux comprendre les propriétés des nanocomposites. Une attention particulière a été portée aux artefacts et causes d’erreur possibles durant l’étape de traitement 3D. Nous avons également essayé de comparer les différentes techniques utilisées du point de vue de leurs avantages et inconvénients respectifs, en dégageant des possibilités d’amélioration future. / This work is focused on the characterization and quantification of the 3D distribution of different types of fillers (nanoparticles, nanotubes, etc.) in polymer matrices. We have essentially used tomography techniques in electron microscopy. Multiple approaches to electron tomography were performed: FIB-SEM (focused ion beam/scanning electron microscope) tomography, SEM tomography and TEM (transmission electron microscope) tomography. Polymer nanocomposites are basically synthesized in order to improve the physical properties (mechanical, electric, etc.) of the pure polymer constituting the matrix, by a controlled addition of fillers at the nanoscale. The characterization of such materials and the establishment of accurate correlations between the microstructure and the modified properties require a three-dimensional approach. According to the nanometric size of the fillers, electron microscopy techniques are needed. Two systems of polymer nanocomposites have been studied by multiple electron tomography approaches: P(BuA-stat-S)/MWNTs (statistical copolymer poly(styrene-co-butyl acrylate) reinforced by multi-walled carbon nanotubes) and P(BuA-stat-MMA)/SiO2 (statistical copolymer poly(butyl acrylate-co-methyl methacrylate) reinforced by silica nanoparticles). By combining various techniques, the characterization and the quantification of nanofillers were possible. In particular, statistics about size, distribution and volume fraction of the fillers were measured. This study has then provided 3D information, which contributes to a better understanding of properties of the nanocomposites. Attention has been paid to analyze carefully original data, and artifacts and causes of errors or inaccuracy were considered in the 3D treatments. We also attempted to compare benefits and drawbacks of all techniques employed in this study, and perspectives for future improvements have been proposed.