The solid-state interaction of palladium (Pd) with single crystal silicon carbide (6H- SiC) before and after annealing has been investigated using Rutherford backscattering spectrometry (RBS) in conjunction with RUMP simulation package, time-of-flight elastic recoil detector analysis (ToF-ERDA), glancing incident X-ray diffraction (GIXRD) and scanning electron microscopy (SEM). A thin layer of Pd (500 A) was deposited onto a clean 6H-SiC substrate at room temper- ature. The prepared difusion couples were then annealed in vacuum at different annealing temperatures for a maximum period of 1 h. The annealing temperature ranged from 2000C to 8000C. The composition of the as-deposited and the annealed samples was measured by using a He+ beam with an energy of 1.6 MeV. The ToF-ERDA measurements were per- formed on the as-deposited sample by using a high energy copper beam (about 30 MeV) for elemental depth distribution. The GIXRD measurements performed on the samples were able to identify the phases that form before and after annealing. The SEM micrograph obtained during this study gave some insight on the surface morphology of the samples before and after annealing. Our results obtained during this study showed that Pd reacts with SiC after annealing at 4000C resulting in the formation of metal-rich silicides and some unreacted Pd. Annealing at higher temperatures (5000C and 6000C) produced metal-rich silicides, which continued to grow until all the Pd has been consumed. Annealing at even higher temperatures (7000C and 8000C), the metal-rich silicides disappear and the silicon rich silicides start appearing. These appear by simply consuming the metal-rich silicides, resulting in the formation of two or more phases. The behaviour of the interaction between Pd with 6H-SiC is different than the Pd-Si system. The reaction temperature of the Pd/SiC are much more higher than those of the Pd/Si system. That is, Pd reacts with Si at temperatures as low as 2500C, while it starts to react with SiC at an annealing temperature of 4000C. In addition to this silicides such as Pd9Si2, Pd4Si form at the initial reaction temperature followed by the formation of the Pd2Si phase at the temperatures above 6000C for the Pd/SiC system. Meanwhile in the Pd/Si system the Pd2Si phase remains stable even after annealing at 8000C. No carbon compounds were observed in the temperature range used in this study and the formation of silicides were found to be accompanied by the formation of free carbon which remained immobile in the system. / Dissertation (MSc)--University of Pretoria, 2012. / Physics / unrestricted

Silicon carbide (SiC), is a wide band gap (2.4 eV < Eg < 3.3 eV) semiconducting material well known for its potential applications in high-temperature, high-power, high-frequency or hard radiation resistant devices. In this thesis, we are broadening elementary knowledge about this material. We identify energy levels in the material, using Photo-Hall effect spectroscopy supported by the temperature dependency of classic Hall effect measurement and temperature dependent photoluminescence. This knowledge is essential to allow SiC application as a radiation detector.

Advances in power electronic systems, especially those in hybrid and electric automobiles and renewable power generation systems, demand high blocking voltage, fast switching performance and low thermal budget from power semiconductor devices. State-of-the--art, silicon based power semiconductor devices are limited by material properties in meeting these demands. Due to the relatively low critical electric field, the on-resistance of the devices is high, and increases significantly with blocking voltage. As a result, current silicon (Si) power MOSFETs rated at above 600 V suffer from unacceptably high conduction losses. Innovative designs, such as the insulated gate bipolar transistor (IGBT), have been developed which use conductivity modulation through the injection of minority carriers to reduce on-resistance. But the involvement of minority carriers gives rise to stored charge and a turn-off delay, dramatically increasing switching losses compared to unipolar devices. Silicon carbide (SiC), a wide band gap semiconductor provides an alternative to Si, and offers a 7x higher electric field strength, 2x higher saturation velocity, and 3x higher thermal conductivity. A thinner, more heavily doped drift region is required for a SiC power device for a particular voltage, which reduces on-resistance and power consumption. However, the channel resistance of SiC metal oxide semiconductor field effect transistors (MOSFETs) is high due to the poor quality of the dielectric-semiconductor interface. Thus the SiC MOSFET fails to live up to the full promise of the material. Minimization of the channel resistance is essential, especially for applications requiring blocking voltages under 1 kV, where this component dominates others. In this work, a novel tri-gate SiC MOSFET is proposed to address this issue. This new structure utilizes both the conventional horizontal surface as well as the sidewalls of a trench to increase the effective width of the channel without increasing the device area. With proper optimization, it should be possible to achieve 3x lower specific on-resistance compared to current SiC unipolar power devices.

In this thesis, growth of ZrB2 thin films by direct current magnetron sputtering is investigatedusing a high vacuum industrial scale deposition system and an ultra-high vacuum laboratory scalesystem. The films were grown from ZrB2 compound targets at temperatures ranging from ambient (without external heating) to 900 °C and with substrate biases from -20 to -120 V. Short deposition times of typically 100 or 300 s and high growth rates of 80-180 nm/min were emphasized to yield films with thicknesses of 300-400 nm. The films were characterized by thinfilm X-ray diffraction with the techniques θ/2θ and ω scans, pole figure measurements andreciprocal space mapping, scanning and transmission electron microscopy, elastic recoil detection analysis and four point probe measurements. The substrates applied were Si(100), Si(111),4H-SiC(0001) and GaN(0001) epilayers grown on 4H-SiC. The Si(111), 4H-SiC(0001) substrates and GaN(0001) epilayers were chosen given their small lattice mismatches to ZrB2 making them suitable for epitaxial growth.The films deposited in the industrial system were found to be close to stoichiometric with a low degree of contaminants, with O being the most abundant at a level of &lt; 1 at.%. Furthermore, the structure of the films is temperature dependent as films deposited in this system without external heating are fiber textured with a 0001-orientation while the films deposited at 550 °C exhibitrandom orientation. In contrast, epitaxial growth was demonstrated in the laboratory scale system on etched 4H-SiC(0001) and Si(111) deposited at 900 °C following outgassing of the substrates at 300 °C and in-situ heat treatment at the applied growth temperature to remove the native oxides. However, films grown on GaN(0001) were found to be 0001 textured at the applied deposition conditions, which make further studies necessary to enable epitaxial growth on this substrate material. Four point probe measurements on the films deposited in the industrial system show typical resistivity values ranging from ˜95 to 200 μΩcm with a trend to lower values for the films deposited at higher temperatures and at higher substrate bias voltages.

京都大学 / 0048 / 新制・課程博士 / 博士(工学) / 甲第20379号 / 工博第4316号 / 新制||工||1669(附属図書館) / 京都大学大学院工学研究科電子工学専攻 / (主査)教授 木本 恒暢, 教授 山田 啓文, 准教授 浅野 卓 / 学位規則第4条第1項該当 / Doctor of Philosophy (Engineering) / Kyoto University / DGAM

京都大学 / 0048 / 新制・課程博士 / 博士(工学) / 甲第21371号 / 工博第4530号 / 新制||工||1705(附属図書館) / 京都大学大学院工学研究科電子工学専攻 / (主査)教授 木本 恒暢, 教授 山田 啓文, 准教授 掛谷 一弘 / 学位規則第4条第1項該当 / Doctor of Philosophy (Engineering) / Kyoto University / DGAM

京都大学 / 0048 / 新制・課程博士 / 博士(工学) / 甲第21772号 / 工博第4589号 / 新制||工||1715(附属図書館) / 京都大学大学院工学研究科電子工学専攻 / (主査)教授 木本 恒暢, 教授 藤田 静雄, 准教授 杉山 和彦 / 学位規則第4条第1項該当 / Doctor of Philosophy (Engineering) / Kyoto University / DFAM

While investigations of semiconductor nanowires (NWs) has a long history, a significant progress is yet to be made in silicon carbide (SiC) NW technologies before they are ready to be utilized in electronic applications. In this dissertation work, SiC NW polytype control, NW axis orientation with respect to the growth substrate and other issues of potential technological importance are investigated. A new method for growing SiC NWs by vapor-liquid-solid mechanism was developed. The method is based on an in-situ vapor phase delivery of a metal catalyst to the growth surface during chemical vapor deposition. This approach is an alternative to the existing seeded catalyst method based on ex-situ catalyst deposition on the target substrate. The new SiC NW growth method provided an improved control of the NW density. It was established that the NW density is influenced by the distance from the catalyst source to the substrate and is affected by both the gas flow rate and the catalyst diffusion in the gas phase. An important convenience of the new method is that it yields NW growth on the horizontal substrate surfaces as well as on titled and vertical sidewalls of 4H-SiC mesas. This feature facilitates investigation of the NW growth trends on SiC substrate surfaces having different crystallographic orientations simultaneously, which is very promising for future NW device applications. It was established that only certain orientations of the NW axes were allowed when growing on a SiC substrate. The allowed orientations of NWs of a particular polytype were determined by the crystallographic orientation of the substrate. This substrate-dependent (i.e., epitaxial) growth resulted in growth of 3C-SiC NWs in total six allowed crystallographic orientations with respect to the 4H-SiC substrate. This NW axis alignment offers an opportunity to achieve a limited number of NW axis directions depending on the surface orientation of the substrate. The ease of controlling the NW density enabled by the vapor-phase catalyst delivery approach developed in this work, combined with the newly obtained knowledge about how to grow unidirectional (wellaligned) NW arrays, offer new opportunities for developing novel SiC NW electronic and photonic devices.

In the COVID-19 stock market industries reacted and were affected in different ways. This paper will use Standard Industrial Classification (SIC) codes to look at how sectors and selected industries fared after a whole year in a pandemic. This will be accomplished by comparing 2019 stock returns to 2020 stock returns with a t-test and estimating the effect of COVID-19 positive case and death increases using a pooled OLS regression. All SIC sectors A-J were analyzed as well as 18 selected industries such as food stores, real estate, oil and gas extraction, health services, and communications. Results show a significant variation in the monthly returns of 2019 and 2020. Regression results show that there is a small but positive correlation of sector and industry returns to COVID-19 positive case and death increases. This contrary result can confirm the short influential window of COVID-19 outcomes on the stock market as shown in related research. This also confirms that regardless of the continued escalation of the pandemic, the stock market follows sentiment, not substance. This paper will contribute to the existing literature by conducting a yearlong event study of the United States' sectors and industries during the COVID-19 pandemic.

Silicon carbide rectifiers are commercially available since 2001, and MESFET switches are expected to enter the market within a year. Moreover, three inch SiC wafers can be purchased nowadays without critical defects for the device performance and four inch substrate wafers are announced for the year 2005. Despite this tremendous development in SiC technology, the reliability issues like device degradation or high channel mobility still remain to be solved. This thesis focuses on SiC surface passivation and termination, a topic which is very important for the utilisation of the full potential of this semiconductor. Three dielectrics with high dielectric constants, Al2O3, AlN and TiO2, were deposited on SiC with different techniques. The structural and electrical properties of the dielectrics were measured and the best insulating layers were then deposited on fully processed and well characterised 1.2 kV 4H SiC PiN diodes. For the best Al2O3 layers, the leakage current was reduced to half its value and the breakdown voltage was extended by 0.5 kV, reaching 1.6 kV, compared to non passivated devices. As important as the proper choice of dielectric material is a proper surface preparation prior to deposition of the insulator. In the thesis two surface treatments were tested, a standard HF termination used in silicon technology and an exposure to UV light from a mercury lamp. The second technique is highly interesting since a substantial improvement was observed when UV light was used prior to the dielectric deposition. Moreover, UV light stabilized the surface and reduced the leakage current by a factor of 100 for SiC devices after 10 Mrad γ ray exposition. The experiments indicate also that the measured leakage currents of the order of pA are dominated by surface leakage. / QC 20110114