The master thesis analyses electrical conductivity of lead-free solder joints. The test method design for monitoring the electrical conductivity of the soldered joint is described in the practical part. Simulated BGA package with four pin (BGA4) is used for experiments. Tested PCBs are subjected to isothermal aging and current load. During isothermal aging is measured electrical conductivity and optical microscope is used for intermetallic layer (IMC) growth observation. Two types of surface finish (OSP and ENIG) are used for tests and three diameters of solder terminal balls (solder alloy SAC405). The influence of the ratio area connection / solder volume (ratio S / V) on lead-free solder joints conductivity was evaluated.

No description available.

Despote the indisputable advantages of fine-pitch components, is need to calculate with a few trouble during production, especially increased requirements for accuracy of mounting and solder printing. In this work I’m concerned with problems of solder printing for these components and evaluation using SPC. For the evaluation I used 3D paste inspection based on laser scanning of the surface. The output of this work is to describe the principles of solder printing and elaborating of GR&R, SPC analysis and histograms of solder printing for some outputs. I focused in my master thesis on motive design change of problematic components and economic evaluation of the adjustments.

With continued feature size reduction in microelectronics and with more than a billion transistors on a single integrated circuit (IC), on-chip interconnection has become a challenge in terms of processing-, electrical-, thermal-, and mechanical perspective. Today’s high-performance ICs have on-chip back-end-of-line (BEOL) layers that consist of copper traces and vias interspersed with low-k dielectric materials. These layers have thicknesses in the range of 100 nm near the transistors and 1000 nm away from the transistors close to the solder bumps. In such BEOL layered stacks, cracking and/or delamination is a common failure mode due to the low mechanical and adhesive strength of the dielectric materials as well as due to high thermally-induced stresses. However, there are no available cohesive zone models and parameters to study such interfacial cracks in sub-micron thick microelectronic layers. This work focuses on developing framework based on cohesive zone modeling approach to study interfacial delamination in sub-micron thick layers. Such a framework is then successfully applied to predict microelectronic device reliability. As intentionally creating pre-fabricated cracks in such interfaces is difficult, this work examines a combination of four-point bend and double-cantilever beam tests to create initial cracks and to develop cohesive zone parameters over a range of mode-mixity. Similarly, a combination of four-point bend and end-notch flexure tests is used to cover additional range of mode-mixity. In these tests, silicon wafers obtained from wafer foundry are used for experimental characterization. The developed parameters are then used in actual microelectronic device to predict the onset and propagation of crack, and the results from such predictions are successfully validated with experimental data. In addition, nanoindenter-based shear test technique designed specifically for this study is demonstrated. The new test technique can address different mode mixities compared to the other interfacial fracture characterization tests, is sensitive to capture the change in fracture parameter due to changes in local trace pattern variations around the vicinity of bump and the test mimics the forces experienced by the bump during flip-chip assembly reflow process. Through this experimental and theoretical modeling research, guidelines are also developed for the reliable design of BEOL stacks for current and next-generation microelectronic devices.

L’objet de la présente étude est le développement, l’application et la diffusion de la technologie associée à divers types d’alliages de cuivre, en particulier l’alliage du plomb-bronze, en Grèce ancienne, dans ses colonies, ainsi qu’en Étrurie. Le plomb-bronze est un mélange de diverses proportions d’étain, de cuivre et de plomb. Le consensus général chez les archéométallurgistes est que le plomb-bronze n’était pas communément utilisé en Grèce avant la période hellénistique; par conséquent, cet alliage a reçu très peu d’attention dans les documents d’archéologie. Cependant, les analyses métallographiques ont prouvé que les objets composés de plomb ajouté au bronze ont connu une distribution étendue. Ces analyses ont aussi permis de différencier la composition des alliages utilisés dans la fabrication de divers types de bronzes, une preuve tangible que les métallurgistes faisaient la distinction entre les propriétés du bronze d’étain et celles du plomb-bronze. La connaissance de leurs différentes caractéristiques de travail permettait aux travailleurs du bronze de choisir, dans bien des cas, l’alliage approprié pour une utilisation particulière. L’influence des pratiques métallurgiques du Proche-Orient a produit des variations tant dans les formes artistiques que dans les compositions des alliages de bronze grecs durant les périodes géométrique tardive et orientalisante. L’utilisation du plomb-bronze dans des types particuliers d’objets coulés montre une tendance à la hausse à partir de la période orientalisante, culminant dans la période hellénistique tardive, lorsque le bronze à teneur élevée en plomb est devenu un alliage commun. La présente étude analyse les données métallographiques de la catégorie des objets coulés en bronze et en plomb-bronze. Elle démontre que, bien que l’utilisation du plomb-bronze n’était pas aussi commune que celle du bronze d’étain, il s’agissait néanmoins d’un mélange important d’anciennes pratiques métallurgiques. Les ères couvertes sont comprises entre les périodes géométrique et hellénistique. / The subject of this study is the development, application and diffusion of the technology of various types of copper alloys, particularly that of leaded bronze, in ancient Greece, its colonies, and in Etruria. Leaded bronze is a mixture of tin, copper and lead in various proportions. The general consensus among archaeometallurgists is that leaded bronze was not commonly used in Greece until the Hellenistic period, and thus this alloy has not received very much attention in archaeological literature. However, metallographic analyses demonstrate that objects composed of leaded bronze had a wide distribution. The analyses also show differentiation in the composition of alloys that were used in the manufacture of various types of bronzes, a tangible indication that metalworkers distinguished between the properties of both tin bronze and leaded bronze. The knowledge of their different working characteristics is what enabled a bronzeworker to choose, in many cases, the appropriate alloy for a specific application. The influence of Near Eastern metallurgical practices produced variations in both the artistic forms as well as alloy compositions of Greek bronzes during the Late Geometric and Orientalizing periods. The use of leaded bronze for particular types of cast objects shows an increasing tendency from the Orientalizing period onwards, culminating in the late Hellenistic period when high-lead bronze became a common alloy. This study analyzes the metallographic data of specific categories of bronze and leaded bronze cast objects, and it will demonstrate that although the use of leaded bronze was not as prevalent as that of tin bronze, it was nevertheless a significant adjunct of ancient metallurgical practices. The periods surveyed range from the Geometric to the Hellenistic periods.

L’objet de la présente étude est le développement, l’application et la diffusion de la technologie associée à divers types d’alliages de cuivre, en particulier l’alliage du plomb-bronze, en Grèce ancienne, dans ses colonies, ainsi qu’en Étrurie. Le plomb-bronze est un mélange de diverses proportions d’étain, de cuivre et de plomb. Le consensus général chez les archéométallurgistes est que le plomb-bronze n’était pas communément utilisé en Grèce avant la période hellénistique; par conséquent, cet alliage a reçu très peu d’attention dans les documents d’archéologie. Cependant, les analyses métallographiques ont prouvé que les objets composés de plomb ajouté au bronze ont connu une distribution étendue. Ces analyses ont aussi permis de différencier la composition des alliages utilisés dans la fabrication de divers types de bronzes, une preuve tangible que les métallurgistes faisaient la distinction entre les propriétés du bronze d’étain et celles du plomb-bronze. La connaissance de leurs différentes caractéristiques de travail permettait aux travailleurs du bronze de choisir, dans bien des cas, l’alliage approprié pour une utilisation particulière. L’influence des pratiques métallurgiques du Proche-Orient a produit des variations tant dans les formes artistiques que dans les compositions des alliages de bronze grecs durant les périodes géométrique tardive et orientalisante. L’utilisation du plomb-bronze dans des types particuliers d’objets coulés montre une tendance à la hausse à partir de la période orientalisante, culminant dans la période hellénistique tardive, lorsque le bronze à teneur élevée en plomb est devenu un alliage commun. La présente étude analyse les données métallographiques de la catégorie des objets coulés en bronze et en plomb-bronze. Elle démontre que, bien que l’utilisation du plomb-bronze n’était pas aussi commune que celle du bronze d’étain, il s’agissait néanmoins d’un mélange important d’anciennes pratiques métallurgiques. Les ères couvertes sont comprises entre les périodes géométrique et hellénistique. / The subject of this study is the development, application and diffusion of the technology of various types of copper alloys, particularly that of leaded bronze, in ancient Greece, its colonies, and in Etruria. Leaded bronze is a mixture of tin, copper and lead in various proportions. The general consensus among archaeometallurgists is that leaded bronze was not commonly used in Greece until the Hellenistic period, and thus this alloy has not received very much attention in archaeological literature. However, metallographic analyses demonstrate that objects composed of leaded bronze had a wide distribution. The analyses also show differentiation in the composition of alloys that were used in the manufacture of various types of bronzes, a tangible indication that metalworkers distinguished between the properties of both tin bronze and leaded bronze. The knowledge of their different working characteristics is what enabled a bronzeworker to choose, in many cases, the appropriate alloy for a specific application. The influence of Near Eastern metallurgical practices produced variations in both the artistic forms as well as alloy compositions of Greek bronzes during the Late Geometric and Orientalizing periods. The use of leaded bronze for particular types of cast objects shows an increasing tendency from the Orientalizing period onwards, culminating in the late Hellenistic period when high-lead bronze became a common alloy. This study analyzes the metallographic data of specific categories of bronze and leaded bronze cast objects, and it will demonstrate that although the use of leaded bronze was not as prevalent as that of tin bronze, it was nevertheless a significant adjunct of ancient metallurgical practices. The periods surveyed range from the Geometric to the Hellenistic periods.

FA; UTFPR; RENAULT / Linhas robóticas de solda são comuns na indústria automobilística. Durante a produção de um veículo, sua estrutura metálica precisa ser soldada em um único corpo resistente. Isso é feito por meio de centenas de soldas a ponto por resistência, cada uma liga localmente duas ou mais placas metálicas. Distribuir eficientemente esses pontos entre robôs é particularmente desafiador, levando em conta que: cada robôs podem fazer acessar uma parte dos pontos de solda, há tempo de movimentação entre pontos e robôs podem colidir entre si se ocuparem o mesmo espaço físico ao mesmo tempo. Há muitas maneiras factíveis de distribuir pontos de solda. No entanto, cada uma gera um resultado econômico diferente: Se um robô soldar muitos pontos se tornará um gargalo e reduzirá a taxa média de produção.Obter o conjunto de decisões operacionais que gera o melhor desempenho é o objetivo de técnicas de otimização. Há uma ampla variedade de técnicas descritas na literatura de pesquisa operacional e ciência da computação: modelos matemáticos, algoritmos, heurísticas, meta-heurísticas, etc. No contexto industrial, tais técnicas foram adaptadas para diversas variantes de problemas práticos. No entanto, estas adaptações só podem resolver as variantes para as quais foram idealizadas. Se por um lado podem se traçar paralelos entre vários aspectos de linhas robóticas de solda e tais variantes, por outro o conjunto completo de características das linhas estudadas não é tratável por (ou convertível em) nenhuma delas. A presente dissertação desenvolve uma abordagem para otimizar tais linhas, baseada em um modelo de programação linear inteira mista desenvolvido para descrever o problema. Ela também apresenta um estudo de caso para discutir e ilustrar possíveis dificuldades de aplicação e como superá-las. O modelo apresentado foi aplicado a dados de uma linha robótica de solda da fábrica, composta por quarenta e dois robôs, quatro modelos de veículos e mais de setecentos pontos de solda por veículo. A média ponderada da redução em tempo de ciclo obtida pelo modelo foi de 17.5%. Variantes do modelo, concebidas para auxiliar trabalhos futuros, são apresentadas e discutidas. / Robotic welding manufacturing lines are production lines common in automobile industries. During a vehicle's production, the vehicle's metal structure must be welded in a single resistant body. This is made by hundreds of spot-welding points, each of which tie locally two or more metal plates. Efficiently distributing these welding points amongst robots is particularly challenging, taking in account that: not all robots can perform all weld points, robots must move their welding tools between weld points, and robots might interfere with one another if they use the same geometrical space. There are multiple feasible manners to distribute the welding points. However, each of these forms generates different economical results: If a robot performs too many points, it will become a line bottleneck and reduce average throughput. To find the set of operational decisions that yields the best output is the goal of optimization techniques. There are a wide variety of such techniques described in operations research and computer sciences literature: mathematical models, algorithms, heuristics, meta-heuristics, etc. In the industrial context, these techniques were adapted to related line balancing problems. However, these adaptations can only solve the specific variants they were designed to address. While parallels can be drawn between aspects of robotic welding lines and many of such variants, the full combined set of characteristics of the studied lines is not treatable by (or convertible to) any of them. This dissertation develops a framework to optimize such lines, based on mixed-integer linear programing model developed to describe the problem. It also presents a case study to discuss and illustrate possible difficulties and how to overcome them. The presented model was applied to data from the factory's robotic welding lines composed of forty-two robots (divided in thirteen stations), four vehicle models and over seven hundred welding points for each vehicle. The weighted average reduction percentage in cycle time obtained by the model was 17.5%. Model variants, designed to aid further works are presented and discussed.

Le développement de composants de puissance à base de carbure de silicium (SiC) permet la réalisation d’interrupteurs pouvant fonctionner au-delà de 200°C. Le silicium présente plus de limitations au niveau physique du matériau qu’au niveau des technologies d’assemblages. Le SiC est un matériau semi-conducteur grand gap ce qui permet d’obtenir des courants de fuite inverse qui restent faibles à haute température ; d’où un fort intérêt pour des applications haute température. Mise à part son utilisation à des températures pouvant dépasser les 300°C, c’est un matériau qui permet aussi d’augmenter les fréquences de commutation ainsi que la densité de puissance par rapport à des composants à technologie silicium. Ceci en fait un candidat idéal pour des applications forte puissance dans le domaine de la traction, des protections de réseaux électriques ou de la transmission et de la distribution d’énergie. L’utilisation du SiC pour une application haute température pose le problème de son packaging, des choix de matériaux et de sa configuration. Cette thèse a pour but d’effectuer une étude de fiabilité et de durée de vie des briques technologiques d’assemblage et de connexions nécessaires à la réalisation d’un cœur de puissance haute température à base de JFET SiC. Une étude des différentes technologies d’assemblages de convertisseurs de puissance haute température est effectuée afin de définir différentes briques technologiques constitutives de ces systèmes. Cette première étude nous permet de procéder à une sélection de certaines technologies d’assemblages comme le frittage de pâtes d’argent pour la technologie de report de puces. Ces briques technologiques feront l’objet d’études plus approfondies allant de la réalisation de véhicules tests jusqu’à la mise au point des essais de cyclages associés aux techniques d’analyse nécessaires à l’étude de leur défaillance.Les études expérimentales concernent des essais de cyclage passif et de stockage thermique, l’apparition de délaminages en cours de cyclage thermique (scan acoustique, RX), le report par frittage de pâtes d’argent nano et microscopiques et la caractérisation électrique et thermique (Rth, I[V]). / The development of power components based on silicon carbide (SiC) allows for the design of power converter operating at high temperature (above 200 or 300°C). SiC is a semiconductor material with a large band gap that not only can operate in temperatures exceeding 300°C but also offers fast switching speed, high voltage blocking capability and higher thermal conductivity compared to silicon technology components. The classical die attach technology uses high temperature solder alloys which melt at around 300°C. However, even a soldered die attach with such high melting point can only operate up to a much lower temperature. Alternative die attach solutions have recently been proposed: Transient Liquid Phase Bonding, soldering with higher melting point alloys such as ZnSn, or silver sintering.Silver sintering is a very interesting technology, as silver offers very good thermal conductivity (429W/m.K, better than copper), relatively inexpensive (compared to alternative solutions which often use gold), and has a very high melting point (961°C).The implementation of two silver-sintering processes is made: one based on micrometer-scale silver particles, and one on nano-meter-scale particles. Two substrate technologies are investigated: Al2O3 DBC and Si3N4 AMB. After the process optimization, tests vehicles are assembled using nano and micro silver particles paste and a more classical high-temperature die attach technology: AuGe soldering. Multiple analyses are performed, such as thermal resistance measurement, shear tests and micro-sections to follow the evolution of the joint during thermal cycling and high-temperature storage ageing.

This thesis contains a complete description of the design and implementation of a 500W transformer soldering station. This soldering station includes a half-bridge DC/DC converter with a pulse transformer. The device works with a very low voltage and extremely high output current. Therefore some parts have a special design to ensure the proper equipment function. Coaxial transformer with very low leakage inductance (nH units) is unusual. A synchronous rectifier is another special feature working with low voltage and high output current of the transformer. The finished functional prototype consists of a soldering station and a soldering adapter.

De nos jours, la durée de vie des modules d’électronique de puissance est désormais limitée par les technologies standards de conditionnement, telles que le câblage par fils et le brasage. Ainsi une optimisation des technologies actuellement employées n’est pas suffisante pour satisfaire les futures exigences de fiabilité. Pour dépasser ces limites, un nouveau module de puissance remplaçant les fils de connexion par des clips en cuivre a été développé. Ce design innovant vise à améliorer la fiabilité du module puisqu’il empêche la dégradation des fils de connexion, constituant bien souvent la principale source de défaillance. La contrepartie de ce gain de fiabilité réside dans la complexification de la structure interne du module. En effet, l’emploi d’un clip en cuivre nécessite une brasure supplémentaire fixant le clip à la puce. Ainsi, le comportement thermomécanique et les différents modes de rupture auxquels le composant est soumis lors de son utilisation doivent être caractérisés. Cette étude utilise la simulation numérique pour analyser avec précision le comportement de chaque couche de matériaux lors des cycles actifs de puissance. De plus, une étude de sensibilité à la fois expérimentale et numérique concernant les paramètres de tests est réalisée. Les zones critiques du module ainsi que les combinaisons critiques des paramètres de tests pour les différents modes de rupture sont mis en évidence. Par ailleurs, une analyse en mécanique de la rupture est conduite et la propagation des fissures à différentes zones clés est analysée en fonction des différents paramètres de tests. Les résultats obtenus permettent la définition de modèles de prédiction de durée de vie. / Today a point has been reached where safe operation areas and lifetimes of power modules are limited by the standard packaging technologies, such as wire bonding and soft soldering. As a result, further optimization of used technologies will no longer be sufficient to meet future reliability requirements. To surpass these limits, a new power module was designed using Cu clips as interconnects instead of Al wire bonds. This new design should improve the reliability of the module as it avoids wire bond fatigue failures, often the root cause of device failures. The counterpart for an improved reliability is a quite complicated internal structure. Indeed, the use of a Cu clip implies an additional solder layer in order to fix the clip to the die. The thermo-mechanical behavior and failure mechanisms of such a package under application have to be characterized. The present study takes advantage of numerical simulations to precisely analyze the behavior of each material layer under power cycling. Furthermore an experimental and numerical sensitivity study on tests parameters is conducted. Critical regions of the module are pointed out and critical combinations of tests parameters for different failure mechanisms are highlighted. Then a fracture mechanics analysis is performed and the crack growth at different locations is analyzed in function of different tests parameters. Results obtained enable the definition of lifetime prediction models.